Features • High Performance, Low Power 32-bit AVR® Microcontroller • • • • • • • • • • • • • • – Compact Single-Cycle RISC Instruction Set Including DSP Instructions – Read-Modify-Write Instructions and Atomic Bit Manipulation – Performance • Up to 61 DMIPS Running at 48MHz from Flash (1 Flash Wait State) • Up to 34 DMIPS Running at 24MHz from Flash (0 Flash Wait State) Multi-Hierarchy Bus System – High-Performance Data Transfers on Separate Buses for Increased Performance – 7 Peripheral DMA Channels Improve Speed for Peripheral Communication Internal High-Speed Flash – 128Kbytes, and 64Kbytes Versions – Single-Cycle Access up to 24MHz – Prefetch Buffer Optimizing Instruction Execution at Maximum Speed – 4ms Page Programming Time and 8ms Full-Chip Erase Time – 100,000 Write Cycles, 15-year Data Retention Capability – Flash Security Locks and User Defined Configuration Area Internal High-Speed SRAM, Single-Cycle Access at Full Speed – 16Kbytes Interrupt Controller (INTC) – Autovectored Low Latency Interrupt Service with Programmable Priority External Interrupt Controller (EIC) System Functions – Power and Clock Manager – SleepWalking™ Power Saving Control – Internal System RC Oscillator (RCSYS) – 32 KHz Oscillator – Clock Failure Detection – One Multipurpose Oscillator and two Phase Locked Loop (PLL) Windowed Watchdog Timer (WDT) Asynchronous Timer (AST) with Real-Time Clock Capability – Counter or Calendar Mode Supported Frequency Meter (FREQM) for Accurate Measuring of Clock Frequency Universal Serial Bus (USB) – Device 2.0 full speed and low speed – Flexible End-Point Configuration and Management – On-chip Transceivers Including Pull-Ups Three 16-bit Timer/Counter (TC) Channels – External Clock Inputs, PWM, Capture and Various Counting Capabilities 7 PWM Channels (PWMA) – 12-bit PWM up to 150MHz Source Clock Three Universal Synchronous/Asynchronous Receiver/Transmitters (USART) – Independent Baudrate Generator, Support for SPI – Support for Hardware Handshaking One Master/Slave Serial Peripheral Interfaces (SPI) with Chip Select Signals – Up to 15 SPI Slaves can be Addressed 32-bit AVR® Microcontroller ATUC128D3 ATUC64D3 ATUC128D4 ATUC64D4 Summary 32133D–11/2011 UC3D • • • • • • • • • One Master and One Slave Two-Wire Interfaces (TWI), 400kbit/s I2C-compatible One 8-channel Analog-To-Digital Converter (ADC) One Inter-IC Sound Controller (IISC) with Stereo Capabilities Autonomous Capacitive Touch Button (QTouch®) Capture – Up to 25 Touch Buttons – QWheel® and QSlide® Compatible QTouch® Library Support – Capacitive Touch Buttons, Sliders, and Wheels – QTouch® and QMatrix® Acquisition – Hardware assisted QTouch® Acquisition One Programmable Glue Logic Controller(GLOC) for General Purpose PCB Design On-Chip Non-Intrusive Debug System – Nexus Class 2+, Runtime Control – aWire™ Single-Pin Programming and Debug Interface Muxed with Reset Pin – 64-pin and 48-pin TQFP/QFN (51 and 35 GPIO Pins) Four High-Drive I/O Pins Single 3.3V Power Supply or Dual 1.8V-3.3V Power Supply 2 32133D–11/2011 UC3D 1. Description The UC3D is a complete System-On-Chip microcontroller based on the AVR32UC RISC processor running at frequencies up to 48 MHz. AVR32UC is a high-performance 32-bit RISC microprocessor core, designed for cost-sensitive embedded applications, with particular emphasis on low power consumption, high code density, and high performance. The processor implements a fast and flexible interrupt controller for supporting modern operating systems and real-time operating systems. Higher computation capability is achieved using a rich set of DSP instructions. The Peripheral Direct Memory Access (DMA) controller enables data transfers between peripherals and memories without processor involvement. The Peripheral DMA controller drastically reduces processing overhead when transferring continuous and large data streams. The Power Manager improves design flexibility and security. Power monitoring is supported by on-chip Power-On Reset (POR), and Brown-Out Detector (BOD). The device features several oscillators, such as Oscillator 0 (OSC0), 32 KHz Oscillator and system RC oscillator (RCSYS), and two Phase Lock Loop (PLL). Either of these oscillators/PLLs can be used as source for the system clock. The Watchdog Timer (WDT) will reset the device unless it is periodically serviced by the software. This allows the device to recover from a condition that has caused the system to be unstable. The Asynchronous Timer (AST) combined with the 32KHz crystal oscillator supports powerful real-time clock capabilities, with a maximum timeout of up to 136 years. The AST can operate in counter mode or calendar mode. The 32KHz crystal oscillator can operate in a 1- or 2-pin mode, trading pin usage and accuracy. The Frequency Meter (FREQM) allows accurate measuring of a clock frequency by comparing it to a known reference clock. The Full-Speed USB 2.0 Device interface supports several USB Classes at the same time thanks to the rich End-Point configuration. The device includes three identical 16-bit Timer/Counter (TC) channels. Each channel can be independently programmed to perform frequency measurement, event counting, interval measurement, pulse generation, delay timing, and pulse width modulation. The Pulse Width Modulation controller (PWMA) provides 12-bit PWM channels which can be synchronized and controlled from a common timer. Seven PWM channels are available, enabling applications that require multiple PWM outputs, such as LCD backlight control. The PWM channels can operate independently, with duty cycles set independently from each other, or in interlinked mode, with multiple channels changed at the same time. The UC3D also features many communication interfaces for communication intensive applications. In addition to standard serial interfaces like USART, SPI or TWI, USB is available. The USART supports different communication modes, like SPI mode. A general purpose 8-channel ADC is provided; It features a fully configurable sequencer that handles many conversions. Window Mode allows each ADC channel to be used like a simple Analog Comparator. The Inter-IC Sound controller (IISC) provides easy access to digital audio interfaces following I2S stereo standard. 3 32133D–11/2011 UC3D The Capacitive Touch (CAT) module senses touch on external capacitive touch sensors, using the QTouch® technology. Capacitive touch sensors use no external mechanical components, unlike normal push buttons, and therefore demand less maintenance in the user application. The CAT module allows up to 25 touch sensors. One touch sensor can be configured to operate autonomously without software interaction,allowing wakeup from sleep modes when activated. Atmel also offers the QTouch library for embedding capacitive touch buttons, sliders, and wheels functionality into AVR microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and included fully debounced reporting of touch keys and includes Adjacent Key Suppression® (AKS®) technology for unambiguous detection of key events. The easyto-use QTouch Suite toolchain allows you to explore, develop, and debug your own touch applications. The UC3D integrates a class 2+ Nexus 2.0 On-Chip Debug (OCD) System, with full-speed read/write memory access, in addition to basic runtime control. The single-pin aWire interface allows all features available through the JTAG interface to be accessed through the RESET pin, allowing the JTAG pins to be used for GPIO or peripherals. 4 32133D–11/2011 UC3D 2. Overview Block Diagram Block Diagram JTAG INTERFACE DATAOUT NEXUS CLASS 2+ OCD aWire RESET_N UC CPU INSTR INTERFACE DATA INTERFACE M M M LOCAL BUS INTERFACE 16KB SRAM S DP USB FS CONTROLLER DM VBUS HIGH SPEED BUS MATRIX M S GENERALPURPOSE I/Os HSB-PB BRIDGE B REGISTERS BUS PERIPHERAL DMA CONTROLLER HSB-PB BRIDGE A DMA USART0 USART1 USART2 DMA SPI DMA TWI MASTER DMA TWI SLAVE DMA 8-CHANNEL ADC INTERFACE DMA POWER MANAGER CLOCK CONTROLLER INTER-IC SOUND CONTROLLER CAPACITIVE TOUCH SENSOR CONTROLLER SLEEP CONTROLLER RESET CONTROLLER GCLK[2..0] XIN0 XOUT0 OSC0 SYSTEM CONTROL INTERFACE PLL0 PLL1 MISO, MOSI NPCS[3..0] TWCK TWD RC120M OSC32K RXD TXD CLK RTS, CTS SCK RCSYS XIN32 XOUT32 64/128KB FLASH M DMA PA PB S S CONFIGURATION LOCAL BUS TWCK TWD AD[7..0] ADVREF GENERAL PURPOSE I/Os TCK TDO TDI TMS FLASH CONTROLLER Figure 2-1. MEMORY INTERFACE 2.1 PA PB BOD INTERRUPT CONTROLLER EXTINT[8..1] NMI EXTERNAL INTERRUPT CONTROLLER ASYNCHRONOUS TIMER WATCHDOG TIMER DOUT DIN FSYNC CLK MCLK CSA[24..0] CSB[24..0] A[2..0] TIMER/COUNTER B[2..0] CLK[2..0] FREQUENCY METER PWM[6..0] PWM CONTROLLER GLUE LOGIC CONTROLLER OUT[3:0] IN[15..0] 5 32133D–11/2011 UC3D 2.2 Configuration Summary Table 2-1. Configuration Summary Feature ATUC128/64D3 ATUC128/64D4 Flash 128/64KB 128/64KB SRAM 16KB 16KB TQFP64, QFN64 TQFP48, QFN48 51 35 Package GPIO FS USB Device 1 Hi-drive pins 4 External Interrupts 9 TWI Master/Slave 7 1/1 USART 3 Peripheral DMA Channels 7 SPI 1 Asynchronous Timers 1 Timer/Counter Channels 3 PWM channels 7 Inter-IC Sound 1 Frequency Meter 1 Watchdog Timer 1 Power Manager 1 Oscillators 2x Phase Locked Loop 80-240 MHz (PLL) 1x Crystal Oscillator 0.4-20 MHz (OSC0) 1x Crystal Oscillator 32 KHz (OSC32K) 1x RC Oscillator 120MHz (RC120M) 1x RC Oscillator 115 kHz (RCSYS) 10-bit ADC channels 8 6 Capacitive Touch Sensor supported 25 17 16/4 14/4 Glue Logic Control Inputs/Outputs JTAG 1 aWire 1 Max Frequency 48 MHz 6 32133D–11/2011 UC3D 3. Package and Pinout 3.1 Package The device pins are multiplexed with peripheral functions as described in Section 3.2. TQFP48/QFN48 Pinout 36 35 34 33 32 31 30 29 28 27 26 25 VDDIO PA23 PA22 PA21 PA20 PA19 PA18 PA17 PA16 PA15 PA14 PA13 Figure 3-1. GND PB14 - DP PB15 - DM PB16 - VBUS PB17 PB18 PA24 PA25 PA26 PA27 RESET_N VDDIO 37 38 39 40 41 42 43 44 45 46 47 48 24 23 22 21 20 19 18 17 16 15 14 13 VDDIO PA12 PA11 PA10 PA09 GND VDDCORE VDDIN VDDOUT VDDANA ADVREF GNDANA 12 11 10 9 8 7 6 5 4 3 2 1 PA08 PA07 PA06 PA05 PA04 PA03 PB13 PA02 PA01 PA00 PB12 GND 7 32133D–11/2011 UC3D TQFP64/QFN64 Pinout 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 VDDIO PA23 PA22 PA21 PA20 PB07 PA29 PA28 PA19 PA18 PB06 PA17 PA16 PA15 PA14 PA13 Figure 3-2. GND PB14 - DP PB15 - DM PB16-VBUS PB17 PB08 PB09 PB18 PB10 PB11 PA24 PA25 PA26 PA27 RESET_N VDDIO 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VDDIO PA12 PA11 PA10 PA09 PB05 PB04 PB03 PB02 GND VDDCORE VDDIN VDDOUT VDDANA ADVREF GNDANA 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 PA31 PA30 PA08 PA07 PA06 PA05 PA04 PA03 PB13 PB01 PB00 PA02 PA01 PA00 PB12 GND Note: 3.2 On QFN packages, the exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability. Peripheral Multiplexing on I/O lines 3.2.1 Multiplexed signals Each GPIO line can be assigned to one of the peripheral functions.The following table describes the peripheral signals multiplexed to the GPIO lines. Table 3-1. Multiplexed Signals on I/O Pins 48-pin 64-pin Package Package GPIO Function PIN GPIO Supply Pad Type A B C D Other Functions 3 3 PA00 0 VDDIO Normal I/O SPI - MISO PWMA - PWMA[1] GLOC - IN[0] CAT - CSB[0] JTAG-TDI 4 4 PA01 1 VDDIO Normal I/O SPI - MOSI PWMA - PWMA[2] GLOC - IN[1] CAT - CSA[1] JTAG-TDO 5 5 PA02 2 VDDIO Normal I/O SPI - SCK PWMA - PWMA[3] GLOC - IN[2] CAT - CSB[1] JTAG-TMS 7 9 PA03 3 VDDANA Analog I/O PKGANA - ADCIN0 SCIF - GCLK[0] GLOC - IN[5] CAT - CSB[2] 8 10 PA04 4 VDDANA Analog I/O PKGANA - ADCIN1 SCIF - GCLK[1] GLOC - IN[6] CAT - CSA[3] 8 32133D–11/2011 UC3D Table 3-1. Multiplexed Signals on I/O Pins 48-pin 64-pin Package Package GPIO Function PIN GPIO Supply Pad Type A B C D 9 11 PA05 5 VDDANA Analog I/O EIC - EXTINT[8] PKGANA - ADCIN2 GLOC - OUT[1] CAT - CSB[3] 10 12 PA06 6 VDDANA Analog I/O EIC - EXTINT[1] PKGANA - ADCIN3 GLOC - IN[7] CAT - CSA[4] 11 13 PA07 7 VDDANA Analog I/O PWMA - PWMA[0] PKGANA - ADCIN4 GLOC - IN[8] CAT - CSB[4] 12 14 PA08 8 VDDANA Analog I/O PWMA - PWMA[1] PKGANA - ADCIN5 GLOC - IN[9] CAT - CSA[5] 20 28 PA09 9 VDDIO Normal I/O, 5V tolerant TWIMS - TWCK SPI - NPCS[2] USART1 - CTS CAT - CSB[5] TWIMS - TWD SPI - NPCS[3] USART1 - RTS CAT - CSA[6] Other Functions 21 29 PA10 10 VDDIO Normal I/O, 5V tolerant 22 30 PA11 11 VDDIO Normal I/O USART0 - RTS TC - A2 PWMA - PWMA[0] CAT - CSB[6] OSC32 - XIN 23 31 PA12 12 VDDIO Normal I/O USART0 - CTS TC - B2 PWMA - PWMA[1] CAT - CSA[7] OSC32 - XOUT 25 33 PA13 13 VDDIO Normal I/O EIC - EXTINT[0] PWMA - PWMA[2] USART0 - CLK CAT - CSB[7] 26 34 PA14 14 VDDIO Normal I/O SPI - MOSI PWMA - PWMA[3] EIC - EXTINT[2] CAT - CSA[8] 27 35 PA15 15 VDDIO Normal I/O SPI - SCK PWMA - PWMA[4] USART2 - CLK CAT - CSB[8] 28 36 PA16 16 VDDIO Normal I/O SPI - NPCS[0] TC - CLK1 PWMA - PWMA[4] CAT - CSA[9] 29 37 PA17 17 VDDIO Normal I/O SPI - NPCS[1] TC - CLK2 SPI - SCK CAT - CSB[9] 30 39 PA18 18 VDDIO Normal I/O USART0 - RXD PWMA - PWMA[5] SPI - MISO CAT - CSA[10] OSC0 - XIN 31 40 PA19 19 VDDIO Normal I/O USART0 - TXD PWMA - PWMA[6] SPI - MOSI CAT - CSB[10] OSC0 - XOUT 32 44 PA20 20 VDDIO Normal I/O USART1 - CLK TC - CLK0 USART2 - RXD CAT - CSA[11] 33 45 PA21 21 VDDIO Normal I/O PWMA - PWMA[2] TC - A1 USART2 - TXD CAT - CSB[11] 34 46 PA22 22 VDDIO Normal I/O PWMA - PWMA[6] TC - B1 ADCIFD - EXTTRIG CAT - CSA[12] 35 47 PA23 23 VDDIO Normal I/O USART1 - TXD SPI - NPCS[1] EIC - EXTINT[3] CAT - CSB[12] 43 59 PA24 24 VDDIO Normal I/O USART1 - RXD SPI - NPCS[0] EIC - EXTINT[4] CAT - CSB[15] 44 60 PA25 25 VDDIO Normal I/O SPI - MISO PWMA - PWMA[3] EIC - EXTINT[5] CAT - CSA[16] 45 61 PA26 26 VDDIO Normal I/O IISC - IWS USART2 - TXD TC - A0 CAT - CSB[16] 46 62 PA27 27 VDDIO Normal I/O IISC - ISCK USART2 - RXD TC - B0 CAT - CSA[0] 41 PA28 28 VDDIO Normal I/O USART0 - CLK PWMA - PWMA[4] SPI - MISO CAT - CSB[21] 42 PA29 29 VDDIO Normal I/O TC - CLK0 TC - CLK1 SPI - MOSI CAT - CSA[22] 15 PA30 30 VDDANA Analog I/O PKGANA - ADCIN6 EIC - EXTINT[6] SCIF - GCLK[2] CAT - CSA[18] 16 PA31 31 VDDANA Analog I/O PKGANA - ADCIN7 EIC - EXTINT[7] PWMA - PWMA[6] CAT - CSB[18] 6 PB00 32 VDDIO Normal I/O TC - A0 EIC - EXTINT[4] USART2 - CTS CAT - CSA[17] 7 PB01 33 VDDIO Normal I/O TC - B0 EIC - EXTINT[5] USART2 - RTS CAT - CSB[17] 24 PB02 34 VDDIO Normal I/O EIC - EXTINT[6] TC - A1 USART1 - TXD CAT - CSA[19] 25 PB03 35 VDDIO Normal I/O EIC - EXTINT[7] TC - B1 USART1 - RXD CAT - CSB[19] 26 PB04 36 VDDIO Normal I/O USART1 - CTS SPI - NPCS[3] TC - CLK2 CAT - CSA[20] 27 PB05 37 VDDIO Normal I/O USART1 - RTS SPI - NPCS[2] PWMA - PWMA[5] CAT - CSB[20] 38 PB06 38 VDDIO Normal I/O IISC - ISCK PWMA - PWMA[5] GLOC - IN[15] CAT - CSA[21] 43 PB07 39 VDDIO Normal I/O IISC - ISDI EIC - EXTINT[2] GLOC - IN[11] CAT - CSB[22] 54 PB08 40 VDDIO Normal I/O IISC - IWS EIC - EXTINT[0] GLOC - IN[14] CAT - CSA[23] 55 PB09 41 VDDIO Normal I/O IISC - ISCK IISC - IMCK GLOC - IN[3] CAT - CSB[23] 57 PB10 42 VDDIO Normal I/O IISC - ISDO TC - A2 USART0 - RXD CAT - CSA[24] 58 PB11 43 VDDIO Normal I/O IISC - IWS TC - B2 USART0 - TXD CAT - CSB[24] 9 32133D–11/2011 UC3D Table 3-1. Multiplexed Signals on I/O Pins 48-pin 64-pin Package Package GPIO Function PIN GPIO Supply Pad Type A B C D 2 2 PB12 44 VDDIO Normal I/O SPI - NPCS[0] IISC - IMCK GLOC - OUT[0] 6 8 PB13 45 VDDIO Normal I/O CAT - SYNC SCIF - GCLK[2] GLOC - IN[4] CAT - CSA[2] 38 50 PB14 46 VDDIO Normal I/O USBC - DP USART0 - RXD GLOC - OUT[2] CAT - CSA[13] 39 51 PB15 47 VDDIO Normal I/O USBC - DM USART0 - TXD GLOC - IN[12] CAT - CSB[13] 40 52 PB16 48 VDDIO Input only, 5V tolerant USBC - VBUS 41 53 PB17 49 VDDIO Normal I/O IISC - ISDO USART0 - RTS GLOC - IN[13] 42 56 PB18 50 VDDIO Normal I/O IISC - ISDI CAT - SYNC GLOC - OUT[3] Other Functions JTAG-TCK GLOC - IN[10] USB-VBUS CAT - CSA[15] See Section 4. for a description of the various peripheral signals. Refer to ”Electrical Characteristics” on page 37 for a description of the electrical properties of the pad types used. 3.2.2 Peripheral Functions Each GPIO line can be assigned to one of several peripheral functions. The following table describes how the various peripheral functions are selected. The last listed function has priority in case multiple functions are enabled. Table 3-2. 3.2.3 Peripheral Functions Function Description A GPIO peripheral selection A B GPIO peripheral selection B C GPIO peripheral selection C D GPIO peripheral selection D JTAG Port Connections If the JTAG is enabled, the JTAG will take control over a number of pins, irrespective of the I/O Controller configuration. Table 3-3. JTAG Pinout 48-pin or 64-pin Package Pin Name JTAG Pin 2 PB12 TCK 5 PA02 TMS 4 PA01 TDO 3 PA00 TDI 10 32133D–11/2011 UC3D 3.2.4 Oscillator Pinout The oscillators are not mapped to the normal GPIO functions and their muxings are controlled by registers in the System Control Interface (SCIF). Please refer to the SCIF chapter for more information about this. Table 3-4. Oscillator Pinout 48-pin Package 64-pin Package Pin Oscillator Function 30 39 PA18 XIN0 31 40 PA19 XOUT0 22 30 PA11 XIN32 23 31 PA12 XOUT32 3.2.5 Other Functions The functions listed in Table 3-5 are not mapped to the normal GPIO functions.The aWire DATA pin will only be active after the aWire is enabled. The aWire DATAOUT pin will only be active after the aWire is enabled and the 2-pin mode command has been sent. Table 3-5. Other Functions 48-Pin Package 64-Pin Package Pin Function 47 63 RESET_N aWire DATA 2 2 PB12 aWire DATAOUT 11 32133D–11/2011 UC3D 4. Signal Descriptions The following table gives details on signal name classified by peripheral. Table 4-1. Signal Descriptions List Signal Name Function Type Active Level Comments aWire - AW DATA aWire data I/O DATAOUT aWire data output for 2-pin mode I/O External Interrupt Controller - EIC NMI Non-Maskable Interrupt Input EXTINT8 - EXTINT1 External interrupt Input JTAG module - JTAG TCK Test Clock Input TDI Test Data In Input TDO Test Data Out TMS Test Mode Select Output Input Power Manager - PM RESET_N Reset Input Low Basic Pulse Width Modulation Controller - PWMA PWMA6 - PWMA0 PWMA channel waveforms Output System Control Interface - SCIF GCLK2 - GCLK0 Generic clock Output XIN0 Oscillator 0 XIN Pin Analog XOUT0 Oscillator 0 XOUT Pin Analog XIN32 32K Oscillator XIN Pin Analog XOUT32 32K Oscillator XOUT Pin Analog Serial Peripheral Interface - SPI MISO Master In Slave Out I/O MOSI Master Out Slave In I/O NPCS3 - NPCS0 SPI Peripheral Chip Select I/O SCK Clock I/O Low Timer/Counter - TC A0 Channel 0 Line A I/O A1 Channel 1 Line A I/O 12 32133D–11/2011 UC3D Table 4-1. Signal Descriptions List A2 Channel 2 Line A I/O B0 Channel 0 Line B I/O B1 Channel 1 Line B I/O B2 Channel 2 Line B I/O CLK0 Channel 0 External Clock Input Input CLK1 Channel 1 External Clock Input Input CLK2 Channel 2 External Clock Input Input Two Wire Interface Master- TWIM TWCK Two-wire Serial Clock TWD Two-wire Serial Data Two Wire Interface Slave- TWIS TWCK Two-wire Serial Clock TWD Two-wire Serial Data Universal Synchronous/Asynchronous Receiver/Transmitter - USART0/1/2 CLK Clock I/O CTS Clear To Send RTS Request To Send RXD Receive Data Input TXD Transmit Data Output Input Low Output Low Universal Serial Bus 2.0 Full Speed Interface - USBC DM DM for USB FS DP DP for USB FS VBUS VBUS IIS Controller - IISC IBCK IIS Serial Clock I/O ISDI IIS Serial Data In ISDO IIS Serial Data Out IWS IIS Word Select I/O IMCK IIS Master Clock Output Input Output Capacitive Touch Sensor - CAT CSA24 - CSA0 Capacitive Sensor Group A I/O CSB24 - CSB0 Capacitive Sensor Group B I/O SYNC Synchronize signal Input Glue Logic Controller - GLOC IN15 - IN0 Inputs to lookup tables OUT3 - OUT0 Outputs from lookup tables Input Output ADC controller interface - ADCIFD 13 32133D–11/2011 UC3D Table 4-1. Signal Descriptions List EXTTRIG ADCIFD EXTTRIG AD7 - AD0 ADC Inputs Input Analog Power VDDIO Digital I/O Power Supply Power Input 3.0 V to 3.6V. VDDANA Analog Power Supply Power Input 3.0 V to 3.6V ADVREF Analog Reference Voltage Power Input 2.6 V to 3.6 V VDDCORE Core Power Supply Power Input 1.65 V to 1.95 V VDDIN Voltage Regulator Input Power Input 3.0 V to 3.6V VDDOUT Voltage Regulator Output Power Output 1.65 V to 1.95V GNDANA Analog Ground Ground GND Ground Ground General Purpose I/O pin - GPIOA, GPIOB PA31 - PA00 General Purpose I/O Controller GPIO A I/O PB18 - PB00 General Purpose I/O Controller GPIO B I/O 4.1 4.1.1 I/O Line Considerations JTAG Pins The JTAG is enabled if TCK is low while the RESET_N pin is released. The TCK, TMS, and TDI pins have pull-up resistors when JTAG is enabled. TDO pin is an output, driven at VDDIO, and has no pull-up resistor. These JTAG pins can be used as GPIO pins and muxed with peripherals when the JTAG is disabled. 4.1.2 RESET_N Pin The RESET_N pin is a schmitt input and integrates a programmable pull-up resistor to VDDIO. As the product integrates a power-on reset detector, the RESET_N pin can be left unconnected in case no reset from the system needs to be applied to the product. The RESET_N pin is also used for the aWire debug protocol. When the pin is used for debugging, it must not be driven by the application. 4.1.3 TWI Pins When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and inputs with inputs with spike-filtering. When used as GPIO pins or used for other peripherals, the pins have the same characteristics as GPIO pins. 4.1.4 GPIO Pins All the I/O lines integrate a pull-up resistor. Programming of this pull-up resistor is performed 14 32133D–11/2011 UC3D independently for each I/O line through the GPIO Controller. After reset, I/O lines default as inputs with pull-up resistors disabled. 4.1.5 4.2 4.2.1 High drive pins Four I/O lines can be used to drive twice current than other I/O capability (see Electrical Characteristics section). 48-pin Package 64-pin Package Pin Name 32 44 PA20 33 45 PA21 34 46 PA22 35 47 PA23 Power Considerations Power Supplies The UC3D has several types of power supply pins: • VDDIO: Powers Digital I/O lines. Voltage is 3.3V nominal. • VDDIN: Powers the internal regulator. Voltage is 3.3V nominal. • VDDCORE : Powers the internal core digital logic. Voltage is 1.8 V nominal. • VDDANA: Powers the ADC and Analog I/O lines. Voltage is 3.3V nominal. The ground pins GND is dedicated to VDDIO and VDDCORE. The ground pin for VDDANA is GNDANA. Refer to ”Electrical Characteristics” on page 37 for power consumption on the various supply pins. 4.2.2 Voltage Regulator The UC3D embeds a voltage regulator that converts from 3.3V nominal to 1.8V with a load of up to 100 mA. The regulator is intended to supply the logic, memories, oscillators and PLLs. See Section 4.2.3 for regulator connection figures. Adequate output supply decoupling is mandatory on VDDOUT to reduce ripple and avoid oscillations. The best way to achieve this is to use two capacitors in parallell between VDDOUT and GND as close to the chip as possible. Please refer to Section 8.9.1 for decoupling capacitors values and regulator characteristics. VDDOUT can be connected externally to the 1.8V domains to power external components. 15 32133D–11/2011 UC3D Figure 4-1. Supply Decoupling 3.3V VDDIN CIN2 CIN1 1.8V 1.8V Regulator VDDOUT COUT2 COUT1 For decoupling recommendations for VDDIO, VDDANA and VDDCORE, please refer to the Schematic checklist. 4.2.3 Regulator Connection The UC3D supports two power supply configurations: • 3.3V single supply mode • 3.3V - 1.8V dual supply mode 4.2.3.1 3.3V Single Supply Mode In 3.3V single supply mode the internal regulator is connected to the 3.3V source (VDDIN pin). The regulator output (VDDOUT) needs to be externally connected to VDDCORE pin to supply internal logic. Figure 4-2 shows the power schematics to be used for 3.3V single supply mode. 16 32133D–11/2011 UC3D Figure 4-2. 3.3V Single Power Supply mode + 3.0-3.6V - VDDIN VDDIO GND I/O Pins VDDOUT 1.65-1.95V Linear Regulator VDDCORE ADC VDDANA 3.0-3.6V CPU, Peripherals, Memories, SCIF, BOD, RCSYS, PLL + - GNDANA 17 32133D–11/2011 UC3D 4.2.3.2 3.3V + 1.8V Dual Supply Mode In dual supply mode the internal regulator is not used (unconnected), VDDIO is powered by 3.3V supply and VDDCORE is powered by a 1.8V supply as shown in Figure 4-3. Figure 4-3. 3.3V + 1.8V Dual Power Supply Mode. + 3.0-3.6V - VDDIN VDDIO GND I/O Pins VDDOUT Linear Regulator VDDCORE 1.65-1.95V + - VDDANA ADC 3.0-3.6V 4.2.4 CPU, Peripherals, Memories, SCIF, BOD, RCSYS, PLL + - GNDANA Power-up Sequence 4.2.4.1 Maximum Rise Rate To avoid risk of latch-up, the rise rate of the power supplies must not exceed the values described in Supply Characteristics table in the Electrical Characteristics chapter. Recommended order for power supplies is also described in this table. 4.2.4.2 Minimum Rise Rate The integrated Power-Reset circuitry monitoring the VDDIN powering supply requires a minimum rise rate for the VDDIN power supply. 18 32133D–11/2011 UC3D See Supply Characteristics table in the Electrical Characteristics chapter for the minimum rise rate value. If the application can not ensure that the minimum rise rate condition for the VDDIN power supply is met, one of the following configuration can be used: •A logic “0” value is applied during power-up on pin RESET_N until VDDIN rises above 1.2V. 19 32133D–11/2011 UC3D 5. Processor and Architecture Rev: 2.1.2.0 This chapter gives an overview of the AVR32UC CPU. AVR32UC is an implementation of the AVR32 architecture. A summary of the programming model, and instruction set is presented. For further details, see the AVR32 Architecture Manual and the AVR32UC Technical Reference Manual. 5.1 Features • 32-bit load/store AVR32A RISC architecture – – – – – 15 general-purpose 32-bit registers 32-bit Stack Pointer, Program Counter and Link Register reside in register file Fully orthogonal instruction set Privileged and unprivileged modes enabling efficient and secure operating systems Innovative instruction set together with variable instruction length ensuring industry leading code density – DSP extension with saturating arithmetic, and a wide variety of multiply instructions • 3-stage pipeline allowing one instruction per clock cycle for most instructions – Byte, halfword, word, and double word memory access – Multiple interrupt priority levels 5.2 AVR32 Architecture AVR32 is a new, high-performance 32-bit RISC microprocessor architecture, designed for costsensitive embedded applications, with particular emphasis on low power consumption and high code density. In addition, the instruction set architecture has been tuned to allow a variety of microarchitectures, enabling the AVR32 to be implemented as low-, mid-, or high-performance processors. AVR32 extends the AVR family into the world of 32- and 64-bit applications. Through a quantitative approach, a large set of industry recognized benchmarks has been compiled and analyzed to achieve the best code density in its class. In addition to lowering the memory requirements, a compact code size also contributes to the core’s low power characteristics. The processor supports byte and halfword data types without penalty in code size and performance. Memory load and store operations are provided for byte, halfword, word, and double word data with automatic sign- or zero extension of halfword and byte data. The C-compiler is closely linked to the architecture and is able to exploit code optimization features, both for size and speed. In order to reduce code size to a minimum, some instructions have multiple addressing modes. As an example, instructions with immediates often have a compact format with a smaller immediate, and an extended format with a larger immediate. In this way, the compiler is able to use the format giving the smallest code size. Another feature of the instruction set is that frequently used instructions, like add, have a compact format with two operands as well as an extended format with three operands. The larger format increases performance, allowing an addition and a data move in the same instruction in a single cycle. Load and store instructions have several different formats in order to reduce code size and speed up execution. 20 32133D–11/2011 UC3D The register file is organized as sixteen 32-bit registers and includes the Program Counter, the Link Register, and the Stack Pointer. In addition, register R12 is designed to hold return values from function calls and is used implicitly by some instructions. 5.3 The AVR32UC CPU The AVR32UC CPU targets low- and medium-performance applications, and provides an advanced On-Chip Debug (OCD) system, and no caches. Java acceleration hardware is not implemented. AVR32UC provides three memory interfaces, one High Speed Bus master for instruction fetch, one High Speed Bus master for data access, and one High Speed Bus slave interface allowing other bus masters to access data RAMs internal to the CPU. Keeping data RAMs internal to the CPU allows fast access to the RAMs, reduces latency, and guarantees deterministic timing. Also, power consumption is reduced by not needing a full High Speed Bus access for memory accesses. A dedicated data RAM interface is provided for communicating with the internal data RAMs. A local bus interface is provided for connecting the CPU to device-specific high-speed systems, such as floating-point units and I/O controller ports. This local bus has to be enabled by writing a one to the LOCEN bit in the CPUCR system register. The local bus is able to transfer data between the CPU and the local bus slave in a single clock cycle. The local bus has a dedicated memory range allocated to it, and data transfers are performed using regular load and store instructions. Details on which devices that are mapped into the local bus space is given in the CPU Local Bus section in the Memories chapter. Figure 5-1 on page 22 displays the contents of AVR32UC. 21 32133D–11/2011 UC3D OCD interface Reset interface Overview of the AVR32UC CPU Interrupt controller interface Figure 5-1. OCD system P ow er/ R eset control A V R 32U C C P U pipeline 5.3.1 H igh S peed B us slave C P U Local B us m aster CPU Local Bus High Speed Bus High Speed Bus H igh S peed B us m aster H igh S peed B us m aster High Speed Bus D ata m em ory controller Instruction m em ory controller CPU RAM Pipeline Overview AVR32UC has three pipeline stages, Instruction Fetch (IF), Instruction Decode (ID), and Instruction Execute (EX). The EX stage is split into three parallel subsections, one arithmetic/logic (ALU) section, one multiply (MUL) section, and one load/store (LS) section. Instructions are issued and complete in order. Certain operations require several clock cycles to complete, and in this case, the instruction resides in the ID and EX stages for the required number of clock cycles. Since there is only three pipeline stages, no internal data forwarding is required, and no data dependencies can arise in the pipeline. Figure 5-2 on page 23 shows an overview of the AVR32UC pipeline stages. 22 32133D–11/2011 UC3D Figure 5-2. The AVR32UC Pipeline Multiply unit MUL IF ID Prefetch unit Decode unit Regfile Read ALU LS 5.3.2 Regfile write ALU unit Load-store unit AVR32A Microarchitecture Compliance AVR32UC implements an AVR32A microarchitecture. The AVR32A microarchitecture is targeted at cost-sensitive, lower-end applications like smaller microcontrollers. This microarchitecture does not provide dedicated hardware registers for shadowing of register file registers in interrupt contexts. Additionally, it does not provide hardware registers for the return address registers and return status registers. Instead, all this information is stored on the system stack. This saves chip area at the expense of slower interrupt handling. 5.3.2.1 Interrupt Handling Upon interrupt initiation, registers R8-R12 are automatically pushed to the system stack. These registers are pushed regardless of the priority level of the pending interrupt. The return address and status register are also automatically pushed to stack. The interrupt handler can therefore use R8-R12 freely. Upon interrupt completion, the old R8-R12 registers and status register are restored, and execution continues at the return address stored popped from stack. The stack is also used to store the status register and return address for exceptions and scall. Executing the rete or rets instruction at the completion of an exception or system call will pop this status register and continue execution at the popped return address. 5.3.2.2 Java Support AVR32UC does not provide Java hardware acceleration. 5.3.2.3 Unaligned Reference Handling AVR32UC does not support unaligned accesses, except for doubleword accesses. AVR32UC is able to perform word-aligned st.d and ld.d. Any other unaligned memory access will cause an address exception. Doubleword-sized accesses with word-aligned pointers will automatically be performed as two word-sized accesses. 23 32133D–11/2011 UC3D The following table shows the instructions with support for unaligned addresses. All other instructions require aligned addresses. Table 5-1. 5.3.2.4 Instructions with Unaligned Reference Support Instruction Supported Alignment ld.d Word st.d Word Unimplemented Instructions The following instructions are unimplemented in AVR32UC, and will cause an Unimplemented Instruction Exception if executed: • All SIMD instructions • All coprocessor instructions if no coprocessors are present • retj, incjosp, popjc, pushjc • tlbr, tlbs, tlbw • cache 5.3.2.5 CPU and Architecture Revision Three major revisions of the AVR32UC CPU currently exist. The device described in this datasheet uses CPU revision 3. The Architecture Revision field in the CONFIG0 system register identifies which architecture revision is implemented in a specific device. AVR32UC CPU revision 3 is fully backward-compatible with revisions 1 and 2, ie. code compiled for revision 1 or 2 is binary-compatible with revision 3 CPUs. 24 32133D–11/2011 UC3D 5.4 5.4.1 Programming Model Register File Configuration The AVR32UC register file is shown below. Figure 5-3. The AVR32UC Register File Application Supervisor INT0 Bit 31 Bit 31 Bit 31 Bit 0 Bit 0 INT1 Bit 0 INT2 Bit 31 Bit 0 INT3 Bit 31 Bit 0 Bit 31 Bit 0 Exception NMI Bit 31 Bit 31 Bit 0 Secure Bit 0 Bit 31 Bit 0 PC LR SP_APP R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SYS R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 PC LR SP_SEC R12 R11 R10 R9 R8 INT0PC R7 INT1PC R6 FINTPC R5 SMPC R4 R3 R2 R1 R0 SR SR SR SR SR SR SR SR SR SS_STATUS SS_ADRF SS_ADRR SS_ADR0 SS_ADR1 SS_SP_SYS SS_SP_APP SS_RAR SS_RSR 5.4.2 Status Register Configuration The Status Register (SR) is split into two halfwords, one upper and one lower, see Figure 5-4 and Figure 5-5. The lower word contains the C, Z, N, V, and Q condition code flags and the R, T, and L bits, while the upper halfword contains information about the mode and state the processor executes in. Refer to the AVR32 Architecture Manual for details. Figure 5-4. The Status Register High Halfword B it 3 1 B it 1 6 - LC 1 - - DM D - M2 M1 M0 EM I3M I2M FE I1M I0M GM 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 1 B it n a m e Initia l valu e G lob a l In terrupt M ask In te rrup t Level 0 M ask In te rrup t Level 1 M ask In te rrup t Level 2 M ask In te rrup t Level 3 M ask E xce p tion M a sk M o de B it 0 M o de B it 1 M o de B it 2 R e serve d D e b ug S tate D e b ug S tate M a sk R e serve d R e serve d 25 32133D–11/2011 UC3D Figure 5-5. The Status Register Low Halfword Bit 15 Bit 0 - T - - - - - - - - L Q V N Z C Bit name 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Initial value Carry Zero Sign Overflow Saturation Lock Reserved Scratch Reserved 5.4.3 Processor States 5.4.3.1 Normal RISC State The AVR32 processor supports several different execution contexts as shown in Table 5-2. Table 5-2. Overview of Execution Modes, their Priorities and Privilege Levels. Priority Mode Security Description 1 Non Maskable Interrupt Privileged Non Maskable high priority interrupt mode 2 Exception Privileged Execute exceptions 3 Interrupt 3 Privileged General purpose interrupt mode 4 Interrupt 2 Privileged General purpose interrupt mode 5 Interrupt 1 Privileged General purpose interrupt mode 6 Interrupt 0 Privileged General purpose interrupt mode N/A Supervisor Privileged Runs supervisor calls N/A Application Unprivileged Normal program execution mode Mode changes can be made under software control, or can be caused by external interrupts or exception processing. A mode can be interrupted by a higher priority mode, but never by one with lower priority. Nested exceptions can be supported with a minimal software overhead. When running an operating system on the AVR32, user processes will typically execute in the application mode. The programs executed in this mode are restricted from executing certain instructions. Furthermore, most system registers together with the upper halfword of the status register cannot be accessed. Protected memory areas are also not available. All other operating modes are privileged and are collectively called System Modes. They have full access to all privileged and unprivileged resources. After a reset, the processor will be in supervisor mode. 5.4.3.2 Debug State The AVR32 can be set in a debug state, which allows implementation of software monitor routines that can read out and alter system information for use during application development. This implies that all system and application registers, including the status registers and program counters, are accessible in debug state. The privileged instructions are also available. All interrupt levels are by default disabled when debug state is entered, but they can individually be switched on by the monitor routine by clearing the respective mask bit in the status register. 26 32133D–11/2011 UC3D Debug state can be entered as described in the AVR32UC Technical Reference Manual. Debug state is exited by the retd instruction. 5.4.4 System Registers The system registers are placed outside of the virtual memory space, and are only accessible using the privileged mfsr and mtsr instructions. The table below lists the system registers specified in the AVR32 architecture, some of which are unused in AVR32UC. The programmer is responsible for maintaining correct sequencing of any instructions following a mtsr instruction. For detail on the system registers, refer to the AVR32UC Technical Reference Manual. Table 5-3. System Registers Reg # Address Name Function 0 0 SR Status Register 1 4 EVBA Exception Vector Base Address 2 8 ACBA Application Call Base Address 3 12 CPUCR CPU Control Register 4 16 ECR Exception Cause Register 5 20 RSR_SUP Unused in AVR32UC 6 24 RSR_INT0 Unused in AVR32UC 7 28 RSR_INT1 Unused in AVR32UC 8 32 RSR_INT2 Unused in AVR32UC 9 36 RSR_INT3 Unused in AVR32UC 10 40 RSR_EX Unused in AVR32UC 11 44 RSR_NMI Unused in AVR32UC 12 48 RSR_DBG Return Status Register for Debug mode 13 52 RAR_SUP Unused in AVR32UC 14 56 RAR_INT0 Unused in AVR32UC 15 60 RAR_INT1 Unused in AVR32UC 16 64 RAR_INT2 Unused in AVR32UC 17 68 RAR_INT3 Unused in AVR32UC 18 72 RAR_EX Unused in AVR32UC 19 76 RAR_NMI Unused in AVR32UC 20 80 RAR_DBG Return Address Register for Debug mode 21 84 JECR Unused in AVR32UC 22 88 JOSP Unused in AVR32UC 23 92 JAVA_LV0 Unused in AVR32UC 24 96 JAVA_LV1 Unused in AVR32UC 25 100 JAVA_LV2 Unused in AVR32UC 26 104 JAVA_LV3 Unused in AVR32UC 27 108 JAVA_LV4 Unused in AVR32UC 27 32133D–11/2011 UC3D Table 5-3. 5.5 System Registers (Continued) Reg # Address Name Function 28 112 JAVA_LV5 Unused in AVR32UC 29 116 JAVA_LV6 Unused in AVR32UC 30 120 JAVA_LV7 Unused in AVR32UC 31 124 JTBA Unused in AVR32UC 32 128 JBCR Unused in AVR32UC 33-63 132-252 Reserved Reserved for future use 64 256 CONFIG0 Configuration register 0 65 260 CONFIG1 Configuration register 1 66 264 COUNT Cycle Counter register 67 268 COMPARE Compare register 68 272 TLBEHI Unused in AVR32UC 69 276 TLBELO Unused in AVR32UC 70 280 PTBR Unused in AVR32UC 71 284 TLBEAR Unused in AVR32UC 72 288 MMUCR Unused in AVR32UC 73 292 TLBARLO Unused in AVR32UC 74 296 TLBARHI Unused in AVR32UC 75 300 PCCNT Unused in AVR32UC 76 304 PCNT0 Unused in AVR32UC 77 308 PCNT1 Unused in AVR32UC 78 312 PCCR Unused in AVR32UC 79 316 BEAR Bus Error Address Register 90-102 360-408 Reserved Reserved for future use 103-111 412-444 Reserved Reserved for future use 112-191 448-764 Reserved Reserved for future use 192-255 768-1020 IMPL IMPLEMENTATION DEFINED Exceptions and Interrupts In the AVR32 architecture, events are used as a common term for exceptions and interrupts. AVR32UC incorporates a powerful event handling scheme. The different event sources, like Illegal Op-code and interrupt requests, have different priority levels, ensuring a well-defined behavior when multiple events are received simultaneously. Additionally, pending events of a higher priority class may preempt handling of ongoing events of a lower priority class. When an event occurs, the execution of the instruction stream is halted, and execution is passed to an event handler at an address specified in Table 5-4 on page 32. Most of the handlers are placed sequentially in the code space starting at the address specified by EVBA, with four bytes between each handler. This gives ample space for a jump instruction to be placed there, jumping to the event routine itself. A few critical handlers have larger spacing between them, allowing 28 32133D–11/2011 UC3D the entire event routine to be placed directly at the address specified by the EVBA-relative offset generated by hardware. All interrupt sources have autovectored interrupt service routine (ISR) addresses. This allows the interrupt controller to directly specify the ISR address as an address relative to EVBA. The autovector offset has 14 address bits, giving an offset of maximum 16384 bytes. The target address of the event handler is calculated as (EVBA | event_handler_offset), not (EVBA + event_handler_offset), so EVBA and exception code segments must be set up appropriately. The same mechanisms are used to service all different types of events, including interrupt requests, yielding a uniform event handling scheme. An interrupt controller does the priority handling of the interrupts and provides the autovector offset to the CPU. 5.5.1 System Stack Issues Event handling in AVR32UC uses the system stack pointed to by the system stack pointer, SP_SYS, for pushing and popping R8-R12, LR, status register, and return address. Since event code may be timing-critical, SP_SYS should point to memory addresses in the IRAM section, since the timing of accesses to this memory section is both fast and deterministic. The user must also make sure that the system stack is large enough so that any event is able to push the required registers to stack. If the system stack is full, and an event occurs, the system will enter an UNDEFINED state. 5.5.2 Exceptions and Interrupt Requests When an event other than scall or debug request is received by the core, the following actions are performed atomically: 1. The pending event will not be accepted if it is masked. The I3M, I2M, I1M, I0M, EM, and GM bits in the Status Register are used to mask different events. Not all events can be masked. A few critical events (NMI, Unrecoverable Exception, TLB Multiple Hit, and Bus Error) can not be masked. When an event is accepted, hardware automatically sets the mask bits corresponding to all sources with equal or lower priority. This inhibits acceptance of other events of the same or lower priority, except for the critical events listed above. Software may choose to clear some or all of these bits after saving the necessary state if other priority schemes are desired. It is the event source’s responsability to ensure that their events are left pending until accepted by the CPU. 2. When a request is accepted, the Status Register and Program Counter of the current context is stored to the system stack. If the event is an INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also automatically stored to stack. Storing the Status Register ensures that the core is returned to the previous execution mode when the current event handling is completed. When exceptions occur, both the EM and GM bits are set, and the application may manually enable nested exceptions if desired by clearing the appropriate bit. Each exception handler has a dedicated handler address, and this address uniquely identifies the exception source. 3. The Mode bits are set to reflect the priority of the accepted event, and the correct register file bank is selected. The address of the event handler, as shown in Table 5-4 on page 32, is loaded into the Program Counter. The execution of the event handler routine then continues from the effective address calculated. The rete instruction signals the end of the event. When encountered, the Return Status Register and Return Address Register are popped from the system stack and restored to the Status Register and Program Counter. If the rete instruction returns from INT0, INT1, INT2, or INT3, registers R8-R12 and LR are also popped from the system stack. The restored Status Register 29 32133D–11/2011 UC3D contains information allowing the core to resume operation in the previous execution mode. This concludes the event handling. 5.5.3 Supervisor Calls The AVR32 instruction set provides a supervisor mode call instruction. The scall instruction is designed so that privileged routines can be called from any context. This facilitates sharing of code between different execution modes. The scall mechanism is designed so that a minimal execution cycle overhead is experienced when performing supervisor routine calls from timecritical event handlers. The scall instruction behaves differently depending on which mode it is called from. The behaviour is detailed in the instruction set reference. In order to allow the scall routine to return to the correct context, a return from supervisor call instruction, rets, is implemented. In the AVR32UC CPU, scall and rets uses the system stack to store the return address and the status register. 5.5.4 Debug Requests The AVR32 architecture defines a dedicated Debug mode. When a debug request is received by the core, Debug mode is entered. Entry into Debug mode can be masked by the DM bit in the status register. Upon entry into Debug mode, hardware sets the SR.D bit and jumps to the Debug Exception handler. By default, Debug mode executes in the exception context, but with dedicated Return Address Register and Return Status Register. These dedicated registers remove the need for storing this data to the system stack, thereby improving debuggability. The Mode bits in the Status Register can freely be manipulated in Debug mode, to observe registers in all contexts, while retaining full privileges. Debug mode is exited by executing the retd instruction. This returns to the previous context. 5.5.5 Entry Points for Events Several different event handler entry points exist. In AVR32UC, the reset address is 0x80000000. This places the reset address in the boot flash memory area. TLB miss exceptions and scall have a dedicated space relative to EVBA where their event handler can be placed. This speeds up execution by removing the need for a jump instruction placed at the program address jumped to by the event hardware. All other exceptions have a dedicated event routine entry point located relative to EVBA. The handler routine address identifies the exception source directly. All interrupt requests have entry points located at an offset relative to EVBA. This autovector offset is specified by an interrupt controller. The programmer must make sure that none of the autovector offsets interfere with the placement of other code. The autovector offset has 14 address bits, giving an offset of maximum 16384 bytes. Special considerations should be made when loading EVBA with a pointer. Due to security considerations, the event handlers should be located in non-writeable flash memory. If several events occur on the same instruction, they are handled in a prioritized way. The priority ordering is presented in Table 5-4 on page 32. If events occur on several instructions at different locations in the pipeline, the events on the oldest instruction are always handled before any events on any younger instruction, even if the younger instruction has events of higher priority than the oldest instruction. An instruction B is younger than an instruction A if it was sent down the pipeline later than A. 30 32133D–11/2011 UC3D The addresses and priority of simultaneous events are shown in Table 5-4 on page 32. Some of the exceptions are unused in AVR32UC since it has no MMU, coprocessor interface, or floatingpoint unit. 31 32133D–11/2011 UC3D Table 5-4. Priority and Handler Addresses for Events Priority Handler Address Name Event source Stored Return Address 1 0x80000000 Reset External input Undefined 2 Provided by OCD system OCD Stop CPU OCD system First non-completed instruction 3 EVBA+0x00 Unrecoverable exception Internal PC of offending instruction 4 EVBA+0x04 5 EVBA+0x08 Bus error data fetch Data bus First non-completed instruction 6 EVBA+0x0C Bus error instruction fetch Data bus First non-completed instruction 7 EVBA+0x10 NMI External input First non-completed instruction 8 Autovectored Interrupt 3 request External input First non-completed instruction 9 Autovectored Interrupt 2 request External input First non-completed instruction 10 Autovectored Interrupt 1 request External input First non-completed instruction 11 Autovectored Interrupt 0 request External input First non-completed instruction 12 EVBA+0x14 Instruction Address CPU PC of offending instruction 13 EVBA+0x50 14 EVBA+0x18 15 EVBA+0x1C Breakpoint OCD system First non-completed instruction 16 EVBA+0x20 Illegal Opcode Instruction PC of offending instruction 17 EVBA+0x24 Unimplemented instruction Instruction PC of offending instruction 18 EVBA+0x28 Privilege violation Instruction PC of offending instruction 19 EVBA+0x2C Floating-point UNUSED 20 EVBA+0x30 Coprocessor absent Instruction PC of offending instruction 21 EVBA+0x100 Supervisor call Instruction PC(Supervisor Call) +2 22 EVBA+0x34 Data Address (Read) CPU PC of offending instruction 23 EVBA+0x38 Data Address (Write) CPU PC of offending instruction 24 EVBA+0x60 25 EVBA+0x70 26 EVBA+0x3C 27 EVBA+0x40 28 EVBA+0x44 32 32133D–11/2011 UC3D 6. Memories 6.1 Embedded Memories • Internal High-Speed Flash – 128Kbytes (ATUC128D) – 64Kbytes (ATUC64D) • 0 Wait State Access at up to 24 MHz in Worst Case Conditions • 1 Wait State Access at up to 48 MHz in Worst Case Conditions • Pipelined Flash Architecture, allowing burst reads from sequential Flash locations, hiding penalty of 1 wait state access • 100 000 Write Cycles, 15-year Data Retention Capability • 4ms Page Programming Time, 8 ms Chip Erase Time • Sector Lock Capabilities, Bootloader Protection, Security Bit • 32 Fuses, Erased During Chip Erase • User Page For Data To Be Preserved During Chip Erase • Internal High-Speed SRAM, Single-cycle access at full speed – 16Kbytes 6.2 Physical Memory Map The system bus is implemented as a bus matrix. All system bus addresses are fixed, and they are never remapped in any way, not even in boot. Note that AVR32UC CPU uses unsegmented translation, as described in the AVR32 Architecture Manual. The 32-bit physical address space is mapped as follows: Table 6-1. UC3D Physical Memory Map Device Embedded SRAM Embedded Flash HSB-PB Bridge A HSB-PB Bridge B Start Address 0x0000_0000 0x8000_0000 0xFFFF_0000 0xFFFE_0000 ATUC128D 16 Kbytes 128 Kbytes 64 Kbytes 64 Kbytes ATUC64D 16 Kbytes 64 Kbytes 64 Kbytes 64 Kbytes Size 6.3 Peripheral Address Map Table 6-2. Peripheral Address Mapping Address 0xFFFE0000 0xFFFE1000 0xFFFE1400 0xFFFF0000 0xFFFF1000 Peripheral Name USBC HMATRIX FLASHCDW USB 2.0 Interface - USBC HSB Matrix - HMATRIX Flash Controller - FLASHCDW PDCA Peripheral DMA Controller - PDCA INTC Interrupt controller - INTC 33 32133D–11/2011 UC3D Table 6-2. Peripheral Address Mapping 0xFFFF1400 0xFFFF1800 0xFFFF1C00 0xFFFF2000 0xFFFF2800 0xFFFF3000 0xFFFF3400 0xFFFF3800 0xFFFF3C00 0xFFFF4000 0xFFFF4400 0xFFFF4800 0xFFFF4C00 0xFFFF5000 0xFFFF5400 0xFFFF5800 0xFFFF5C00 0xFFFF6000 PM Power Manager - PM AST Asynchronous Timer - AST WDT Watchdog Timer - WDT EIC External Interrupt Controller - EIC GPIO General Purpose Input/Output Controller - GPIO USART0 Universal Synchronous/Asynchronous Receiver/Transmitter - USART0 USART1 Universal Synchronous/Asynchronous Receiver/Transmitter - USART1 USART2 Universal Synchronous/Asynchronous Receiver/Transmitter - USART2 SPI Serial Peripheral Interface - SPI TWIM Two-wire Master Interface - TWIM TWIS Two-wire Slave Interface - TWIS PWMA IISC TC ADCIFD SCIF FREQM CAT Pulse Width Modulation Controller - PWMA Inter-IC Sound (I2S) Controller - IISC Timer/Counter - TC ADC controller interface - ADCIFD System Control Interface - SCIF Frequency Meter - FREQM Capacitive Touch Module - CAT 34 32133D–11/2011 UC3D Table 6-2. Peripheral Address Mapping 0xFFFF6400 GLOC 0xFFFF6800 6.4 AW Glue Logic Controller - GLOC aWire - AW CPU Local Bus Mapping Some of the registers in the GPIO module are mapped onto the CPU local bus, in addition to being mapped on the Peripheral Bus. These registers can therefore be reached both by accesses on the Peripheral Bus, and by accesses on the local bus. Mapping these registers on the local bus allows cycle-deterministic toggling of GPIO pins since the CPU and GPIO are the only modules connected to this bus. Also, since the local bus runs at CPU speed, one write or read operation can be performed per clock cycle to the local busmapped GPIO registers. The following GPIO registers are mapped on the local bus: Table 6-3. Local Bus Mapped GPIO Registers Port Register Mode Local Bus Address Access A Output Driver Enable Register (ODER) WRITE 0x40000040 Write-only SET 0x40000044 Write-only CLEAR 0x40000048 Write-only TOGGLE 0x4000004C Write-only WRITE 0x40000050 Write-only SET 0x40000054 Write-only CLEAR 0x40000058 Write-only TOGGLE 0x4000005C Write-only Pin Value Register (PVR) - 0x40000060 Read-only Output Driver Enable Register (ODER) WRITE 0x40000140 Write-only SET 0x40000144 Write-only CLEAR 0x40000148 Write-only TOGGLE 0x4000014C Write-only WRITE 0x40000150 Write-only SET 0x40000154 Write-only CLEAR 0x40000158 Write-only TOGGLE 0x4000015C Write-only - 0x40000160 Read-only Output Value Register (OVR) B Output Value Register (OVR) Pin Value Register (PVR) 35 32133D–11/2011 UC3D 7. Boot Sequence This chapter summarizes the boot sequence of the UC3D. The behavior after power-up is controlled by the Power Manager. For specific details, refer to the Power Manager chapter. 7.1 Starting of Clocks After power-up, the device will be held in a reset state by the Power-On Reset circuitry for a short time to allow the power to stabilize throughout the device. After reset, the device will use the System RC Oscillator (RCSYS) as clock source. On system start-up, all clocks to all modules are running. No clocks have a divided frequency; all parts of the system receive a clock with the same frequency as the System RC Oscillator. 7.2 Fetching of Initial Instructions After reset has been released, the AVR32UC CPU starts fetching instructions from the reset address, which is 0x80000000. This address points to the first address in the internal Flash. The code read from the internal Flash is free to configure the system to divide the frequency of the clock routed to some of the peripherals, and to gate the clocks to unused peripherals. 36 32133D–11/2011 UC3D 8. Electrical Characteristics 8.1 Disclaimer All values in this chapter are preliminary and subject to change without further notice. 8.2 Absolute Maximum Ratings* Table 8-1. Absolute Maximum Ratings Operating temperature .................................... -40°C to +85°C *NOTICE: Storage temperature ...................................... -60°C to +150°C Voltage on input pins (except for 5V pins) with respect to ground .................................................................-0.3V to VVDD(2)+0.3V Voltage on 5V tolerant(1) pins with respect to ground ............... .............................................................................-0.3V to 5.5V Total DC output current on all I/O pins - VDDIO ........... 152mA Total DC output current on all I/O pins - VDDANA........ 152mA Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum operating voltage VDDCORE......................... 1.95V Maximum operating voltage VDDIO, VDDIN .................... 3.6V Notes: 1. 5V tolerant pins, see Section 3.2 ”Peripheral Multiplexing on I/O lines” on page 8 2. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2 on page 8 for details. 8.3 Supply Characteristics The following characteristics are applicable to the operating temperature range: TA = -40°C to 85°C, unless otherwise specified and are certified for a junction temperature up to TJ = 100°C. Table 8-2. Supply Characteristics Voltage 8.4 Symbol Parameter Min Max Unit VVDDIO DC supply peripheral I/Os 3.0 3.6 V VVDDIN DC supply internal regulator, 3.3V single supply mode 3.0 3.6 V VVDDCORE DC supply core 1.65 1.95 V VVDDANA Analog supply voltage 3.0 3.6 V VADVREFP Analog reference voltage 2.6 VVDDANA V Maximum Clock Frequencies These parameters are given in the following conditions: • VVDDCORE = 1.65 to 1.95V 37 32133D–11/2011 UC3D • Temperature = -40°C to 85°C Table 8-3. 8.5 Clock Frequencies Symbol Parameter fCPU Conditions Min Max Units CPU clock frequency 48 MHz fPBA PBA clock frequency 48 MHz fPBB PBB clock frequency 48 MHz fGCLK0 GCLK0 clock frequency GLOC, GCLK0 pin 48 MHz fGCLK1 GCLK1 clock frequency GCLK1 pin 48 MHz fGCLK2 GCLK2 clock frequency GCLK2 pin 48 MHz fGCLK3 GCLK3 clock frequency USB 48 MHz fGCLK4 GCLK4 clock frequency PWMA 150 MHz fGCLK5 GCLK5 clock frequency IISC 48 MHz fGCLK6 GCLK6 clock frequency AST 80 MHz fGCLK8 GCLK8 clock frequency ADCIFB 48 MHz Power Consumption The values in Table 8-4 are measured values of power consumption under the following conditions, except where noted: • Operating conditions internal core supply (Figure 8-1) - this is the default configuration – VVDDIN = 3.3V – VVDDCORE = 1.8V, supplied by the internal regulator – Corresponds to the 3.3V supply mode with 1.8 V regulated I/O lines, please refer to the Supply and Startup Considerations section for more details – The following peripheral clocks running • TA = 25°C • Oscillators – OSC0 running (external clock)as reference – PLL running at 48MHz with OSC0 as reference • Clocks – PLL used as main clock source – CPU, HSB, and PBB clocks undivided – PBA clock divided by 4 – The following peripheral clocks running • PM, SCIF, AST, FLASHCDW, PBA bridge – All other peripheral clocks stopped • I/Os are inactive with internal pull-up 38 32133D–11/2011 UC3D Table 8-4. Mode Active Idle Frozen Standby Stop Deepstop Static Power Consumption for Different Operating Modes Conditions Consumption Typ Unit 0.3105xf(MHz) + 0.2707 mA/MHz Same conditions at 48MHz 15.17 mA See Active mode conditions 0.1165xf(MHz) + 0.1457 mA/MHz Same conditions at 48MHz 5.74 mA See Active mode conditions 0.0718xf(MHz) + 0.0903 mA/MHz Same conditions at 48MHz 3.54 mA See Active mode conditions 0.0409xf(MHz) + 0.0935 mA/MHz Same conditions at 48MHz 2.06 mA Voltage Regulator On 60 µA Voltage Regulator Off 51 µA Voltage Regulator On 26 µA Voltage Regulator Off 17 µA Voltage Regulator On 13 µA Voltage Regulator Off 3.5 µA - CPU running a recursive Fibonacci Algorithm from flash and clocked from PLL0 at f MHz. - Voltage regulator is on. - XIN0: external clock. - All peripheral clocks activated with a division by 4. - GPIOs are inactive with internal pull-up, JTAG unconnected with external pull-up and Input pins are connected to GND - CPU running in sleep mode - XIN0, Xin1 and XIN32 are stopped. - All peripheral clocks are desactived. - GPIOs are inactive with internal pull-up, JTAG unconnected with external pull-up and Input pins are connected to GND. See Stop mode conditions See Stop mode conditions 39 32133D–11/2011 UC3D Figure 8-1. Measurement Schematic, External Core Supply VDDANA VDDIO Amp0 VDDIN Internal Voltage Regulator VDDOUT Amp1 8.5.1 VDDCORE Peripheral Power Consumption The values in Table 8-5 are measured values of power consumption under the following conditions. • Operating conditions external core supply (Figure 8-1) – VVDDIN = 3.3V – VVDDCORE = 1.8V, supplied by the internal regulator – Corresponds to the 3.3V + 1.8V dual supply mode , please refer to the Supply and Startup Considerations section for more details • TA = 25°C • Oscillators – OSC0 on external clock running – PLL running at 48MHz with OSC0 as reference • Clocks – OSC0 external clock used as main clock source – CPU, HSB, and PB clocks undivided 40 32133D–11/2011 UC3D • I/Os are inactive with internal pull-up Consumption idle is the added current consumption when turning the module clock on and the module is uninitialized. Consumption active is the added current consumption when the module clock is turned on and when the module is doing a typical set of operations. Table 8-5. Typical Current Consumption by Peripheral Peripheral ADCIFD Unit 3.6 AST 4.5 AW USART 9.8 CAT 14 EIC 2.3 FREQM 1.1 GLOC 1.3 GPIO 10.6 IISC 4.7 PWMA 5.6 SPI 6.3 TC 7.3 TWIM 4.5 TWIS 2.8 USART 3.9 WDT 1.8 Notes: 8.6 Typ Consumption Active (1) µA/MHz 1. Includes the current consumption on VDDANA and ADVREFP. I/O Pin Characteristics Table 8-6. Normal I/O Pin Characteristics(1) Symbol Parameter RPULLUP Pull-up resistance VIL Input low-level voltage Condition VVDD = 3.0V VIH Input high-level voltage VVDD = 3.6V VOL Output low-level voltage VVDD = 3.0V, IOL = 4mA VOH Output high-level voltage VVDD = 3.0V, IOH = 4mA Min Typ Max Units 9 15 25 kOhm (3) -0.3 +0.8 V (4) -0.3 +0.4 V (3) +2 VVDD + 0.3 V (4) +1.6 VVDD + 0.3 V 0.4 V VVDD - 0.4 V 41 32133D–11/2011 UC3D Table 8-6. Symbol IOL Normal I/O Pin Characteristics(1) Parameter Output low-level current IOH Output high-level current Condition Min VVDD = 3.0V VVDD = 3.0V VVDD = 3.0V, load = 10 pF Output frequency(2) FMAX VVDD = 3.0V, load = 30 pF VVDD = 3.0V, load = 10 pF Rise time(2) tRISE VVDD = 3.0V, load = 30 pF VVDD = 3.0V, load = 10 pF Fall time(2) tFALL VVDD = 3.0V, load = 30 pF ILEAK Input leakage current Input capacitance, CIN Notes: Max Units (5) Typ 4 mA (6) 8 mA (5) 4 mA (6) 8 mA (5) 195 MHz (6) 348 MHz (5) 78 MHz (6) 149 MHz (5) 2.21 ns (6) 1.26 ns (5) 5.45 ns (6) 2.88 ns (5) 2.57 ns (6) 1.44 ns (5) 6.41 ns (6) 3.35 ns 1 µA Pull-up resistors disabled (7) 2 pF PA09, PA10 16.5 pF PA11, PA12, PA18, PA19 18.5 pF PB14, PB15 5 pF 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2 on page 8 for details. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 3. This applies to all normal drive pads except PB13, PB17 and PB18. 4. This applies to PB13, PB17 and PB18 pads only. 5. This applies to all normal drive pad except PA00, PA01, PA02, PA03, PA04, PA05, PA06, PA07, PA08, PA09, PA10, PA11, PA12, PA13, PA18, PA19, PA27, PA30, PA31, PB13, PB16 and RESET_N. 6. This applies to PA00, PA01, PA02, PA03, PA04, PA05, PA06, PA07, PA08, PA09, PA10, PA11, PA12, PA13, PA18, PA19, PA27, PA30, PA31, PB13, PB16 and RESET_N pads only. 7. This applies to all normal drive pads except PA09, PA10, PA11, PA12, PA18, PA19, PB14, PB15. Table 8-7. High-drive I/O Pin Characteristics(1) Symbol Parameter Condition RPULLUP Pull-up resistance VIL Input low-level voltage VVDD = 3.0V VIH Input high-level voltage VVDD = 3.6V VOL Output low-level voltage VVDD = 3.0V, IOL = 6mA Min Typ Max Units 9 15 25 kOhm -0.3 +0.8 V +2 VVDD + 0.3 V 0.4 V 42 32133D–11/2011 UC3D Table 8-7. High-drive I/O Pin Characteristics(1) Symbol Parameter Condition VOH Output high-level voltage VVDD = 3.0V, IOH = 6mA IOL Output low-level current VVDD = 3.0V 16 mA IOH Output high-level current VVDD = 3.0V 16 mA FMAX Output frequency VVDD = 3.0V, load = 10 pF 471 MHz VVDD = 3.0V, load = 30 pF 249 MHz tRISE Rise time, all High-drive I/O pins VVDD = 3.0V, load = 10 pF 0.86 ns VVDD = 3.0V, load = 30 pF 1.70 ns tFALL Fall time VVDD = 3.0V, load = 10 pF 1.06 ns VVDD = 3.0V, load = 30 pF 2.01 ns ILEAK Input leakage current Pull-up resistors disabled 1 µA CIN Input capacitance, TQFP48 package Notes: Min Typ Max VVDD - 0.4 Units V 2 pF 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2 on page 8 for details. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. Table 8-8. PB14-DP, PB15-DM Pins Characteristics Symbol Parameter RPULLUP Pull-up resistance Table 8-9. Symbol (3) Condition Min Typ Max Units 50 100 150 kOhm Min Typ Max Units PB16-VBUS Pin Characteristics(1) Parameter Condition RPULLUP Pull-up resistance VIL Input low-level voltage VVDD = 3.0V -0.3 +0.8 V VIH Input high-level voltage VVDD = 3.6V +2 VVDD + 0.3 V ILEAK Input leakage current 5.5V, pull-up resistors disabled 1 µA CIN Input capacitance 48 pin packages Notes: kOhm 0.6 pF 1. VVDD corresponds to either VVDDIN or VVDDIO, depending on the supply for the pin. Refer to Section 3.2 on page 8 for details. 2. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 3. PB16-VBUS pad has no pull-up resistance 43 32133D–11/2011 UC3D 8.7 Oscillator Characteristics 8.7.1 Oscillator 0 (OSC0) Characteristics 8.7.1.1 Digital Clock Characteristics The following table describes the characteristics for the oscillator when a digital clock is applied on XIN. Table 8-10. Digital Clock Characteristics Symbol Parameter fCPXIN XIN clock frequency tCPXIN XIN clock duty cycle 8.7.1.2 Conditions Min Typ Max 40 Units 50 MHz 60 % Crystal Oscillator Characteristics The following table describes the characteristics for the oscillator when a crystal is connected between XIN and XOUT as shown in Figure 8-2. The user must choose a crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact value of CL can be found in the crystal datasheet. The capacitance of the external capacitors (CLEXT) can then be computed as follows: C LEXT = 2 ( C L – C i ) – C PCB where CPCB is the capacitance of the PCB. Table 8-11. Crystal Oscillator Characteristics Symbol Parameter 1/(tCPMAIN) Crystal oscillator frequency CL Crystal load capacitance Ci Internal equivalent load capacitance tSTARTUP Notes: Startup time Conditions Min Typ Max Unit 0.4 20 MHz 6 18 pF 1.7 400 KHz Resonator SCIF.OSCCTRL.GAIN = 0(1) 198 2 MHz Quartz SCIF.OSCCTRL.GAIN = 0(1) 4666 8 MHz Quartz SCIF.OSCCTRL.GAIN = 1(1) 975 12 MHz Quartz SCIF.OSCCTRL.GAIN = 2(1) 615 16 MHz Quartz SCIF.OSCCTRL.GAIN = 2(1) 1106 20 MHz Quartz SCIF.OSCCTRL.GAIN = 3(1) 1109 pF µs 1. Please refer to the SCIF chapter for details. 44 32133D–11/2011 UC3D Figure 8-2. Oscillator Connection C LE X T XO U T U C 3D Ci CL XIN C LEX T 8.7.2 32KHz Crystal Oscillator (OSC32K) Characteristics 8.7.2.1 Table 8-12. Digital Clock Characteristics The following table describes the characteristics for the oscillator when a digital clock is applied on XIN32. Digital Clock Characteristics Symbol Parameter fCPXIN XIN32 clock frequency tCPXIN XIN32 clock duty cycle Conditions Min Typ Max 32.768 40 Units 5000 KHz 60 % Figure 8-2 and the equation above also applies to the 32 KHz oscillator connection. The user must choose a crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact value of CL can then be found in the crystal datasheet. Table 8-13. 32 KHz Crystal Oscillator Characteristics Symbol Parameter 1/(tCP32KHz) Crystal oscillator frequency tST Startup time CL Crystal load capacitance Ci Internal equivalent load capacitance Conditions Min RS = 50kOhm, CL = 9pF Typ Max Unit 32.768 5000 KHz 2 6 s 15 1.4 pF pF 45 32133D–11/2011 UC3D 8.7.3 Phase Locked Loop (PLL) Characteristics Table 8-14. Phase Lock Loop Characteristics Symbol Parameter FOUT VCO Output Frequency FIN Input Frequency IPLL Current Consumption tSTARTUP Startup time, from enabling the PLL until the PLL is locked 8.7.4 Conditions Symbol Max. Unit 80 240 MHz 4 16 MHz Active mode FVCO@80 MHz 240 Active mode FVCO@240 MHz 600 Wide Bandwith mode disabled 15 Wide Bandwith mode enabled 45 µA µs Internal 120MHz RC Oscillator Characteristics Parameter Conditions (1) fOUT Output frequency IRC120M Current consumption tSTARTUP Startup time Min Typ Max Unit 88 120 152 MHz 1.85 mA 3 µs 1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same process technology. These values are not covered by test limits in production. 8.7.5 System RC Oscillator (RCSYS) Characteristics Table 8-16. Symbol System RC Oscillator Characteristics Parameter Output frequency fOUT 8.8 Typ. 120MHz RC Oscillator (RC120M) Characteristics Table 8-15. Note: Min. Conditions Min Typ Max Unit Calibrated point Ta = 85°C 110 115.2 116 kHz Ta = 25°C 105 109 115 kHz Ta = -40°C 100 104 108 kHz Flash Characteristics Table 8-17 gives the device maximum operating frequency depending on the number of flash wait states and the flash read mode. The FSW bit in the FLASHCDW FSR register controls the number of wait states used when accessing the flash memory. Table 8-17. Maximum Operating Frequency Flash Wait States Maximum Operating Frequency 1 48MHz 0 24MHz 46 32133D–11/2011 UC3D Table 8-18. Flash Characteristics Symbol Parameter TFPP Page programming time TFPE Page erase time TFFP Fuse programming time TFEA Full chip erase time (EA) TFCE JTAG chip erase time (CHIP_ERASE) Table 8-19. Conditions Min Typ Max Unit 5 5 fCLK_HSB= 48MHz 1 ms 6 fCLK_HSB= 115kHz 310 Flash Endurance and Data Retention Symbol Parameter NFARRAY Array endurance (write/page) 100k cycles NFFUSE General Purpose fuses endurance (write/bit) 10k cycles tRET Data retention 15 years 8.9 Conditions Min Typ Max Unit Analog Characteristics 8.9.1 Voltage Regulator Characteristics 8.9.1.1 Electrical Characteristics Table 8-20. Electrical Characteristics Symbol Parameter VVDDIN Input voltage range VVDDCORE Output voltage VVDDIN >= 3V Output voltage accuracy IOUT = 0.1mA to 100mA, VVDDIN>3V IOUT DC output current VVDDIN=3.3V IVREG Static current of internal regulator Low power mode 8.9.1.2 Condition Min Typ Max Units 3 3.3 3.6 V 1.75 1.8 1.85 V 2 % 100 10 mA µA Decoupling Requirements Table 8-21. Decoupling Requirements Symbol Parameter CIN1 Input regulator capacitor 1 Condition Typ Techno. Units 1 NPO nF 47 32133D–11/2011 UC3D Table 8-21. Decoupling Requirements Symbol Parameter CIN2 Typ Techno. Units Input regulator capacitor 2 4.7 X7R nF COUT1 Output regulator capacitor 1 470 NPO nF COUT2 Output regulator capacitor 2 2.2 X7R µF 8.9.2 Condition ADC Characteristics Table 8-22. Channel Conversion Time and ADC Clock Parameter Conditions Min. Typ. Max. Unit 5 MHz 8-bit resolution mode 8 MHz Return from Idle Mode 20 µs 10-bit resolution mode ADC Clock Frequency Startup Time Track and Hold Acquisition Time 600 ns ADC Clock = 5 MHz Conversion Time Throughput Rate 2 µs ADC Clock = 8 MHz 1.25 µs ADC Clock = 5 MHz 384 (1) kSPS ADC Clock = 8 MHz 533 (2) kSPS 1. Corresponds to 13 clock cycles: 3 clock cycles for track and hold acquisition time and 10 clock cycles for conversion. 2. Corresponds to 15 clock cycles: 5 clock cycles for track and hold acquisition time and 10 clock cycles for conversion. Table 8-23. ADC Power Consumption Parameter Conditions Current Consumption on VDDANA (1) Min. Typ. On 13 samples with ADC clock = 5 MHz Max. Unit 1.25 mA Max. Unit VDDANA V 1 µA 1. Including internal reference input current Table 8-24. Analog Inputs Parameter Conditions Input Voltage Range Min. Typ. 0 Input Leakage Current Input Capacitance 7 Input Resistance 370 810 Ohm Typ. Max. Unit ADC Clock = 5 MHz 0.8 LSB ADC Clock = 8 MHz 1.5 LSB Table 8-25. Transfer Characteristics in 8-bit mode Parameter Conditions Resolution Absolute Accuracy Integral Non-linearity Min. pF 8 Bit ADC Clock = 5 MHz 0.35 0.5 LSB ADC Clock = 8 MHz 0.5 1.0 LSB 48 32133D–11/2011 UC3D Table 8-25. Transfer Characteristics in 8-bit mode Parameter Conditions Differential Non-linearity Min. Typ. Max. Unit ADC Clock = 5 MHz 0.3 0.5 LSB ADC Clock = 8 MHz 0.5 1.0 LSB Offset Error ADC Clock = 5 MHz -0.5 0.5 LSB Gain Error ADC Clock = 5 MHz -0.5 0.5 LSB Max. Unit 3 LSB Table 8-26. Transfer Characteristics in 10-bit mode Parameter Conditions Min. Typ. Resolution 10 Bit Absolute Accuracy ADC Clock = 5 MHz Integral Non-linearity ADC Clock = 5 MHz 1.5 2 LSB ADC Clock = 5 MHz 1 2 LSB 0.6 Differential Non-linearity 1 LSB Offset Error ADC Clock = 5 MHz -2 2 LSB Gain Error ADC Clock = 5 MHz -2 2 LSB 8.9.3 ADC Clock = 2.5 MHz BOD The values in Table 8-27 describe the values of the BODLEVEL in the flash General Purpose Fuse register. Table 8-27. BODLEVEL Values BODLEVEL Value Table 8-28. Min Typ Max Units 000000b (00) 1.44 V 010111b (23) 1.52 V 011111b (31) 1.61 V 100111b (39) 1.71 V BOD Characteristics Symbol Parameter Condition Min Typ Max Units VHYST BOD hysteresis T=25C° 10 mV tDET Detection time Time with VDDCORE < BODLEVEL necessary to generate a reset signal 1 µs IBOD Current consumption 16 µA tSTARTUP Startup time 5 µs 49 32133D–11/2011 UC3D 8.9.4 Reset Sequence Table 8-29. Electrical Characteristics Symbol Parameter Conditions VDDRR VDDCORE rise rate to ensure poweron-reset 2.5 VDDFR VDDCORE fall rate to ensure poweron-reset 0.01 VPOR+ Rising threshold voltage: voltage up to which device is kept under reset by POR on rising VDDCORE Rising VDDCORE: VRESTART -> VPOR+ 1.4 VPOR- Falling threshold voltage: voltage when POR resets device on falling VDDCORE Falling VDDCORE: 1.8V -> VPOR+ 1.2 VRESTART On falling VDDCORE, voltage must go down to this value before supply can rise again to ensure reset signal is released at VPOR+ Falling VDDCORE: 1.8V -> VRESTART -0.1 TPOR Minimum time with VDDCORE < VPOR- Falling VDDCORE: 1.8V -> 1.1V TRST Time for reset signal to be propagated to system TSSU1 Time for Cold System Startup: Time for CPU to fetch its first instruction (RCosc not calibrated) TSSU2 Time for Hot System Startup: Time for CPU to fetch its first instruction (RCosc calibrated) Figure 8-3. VDDCORE Min. Typ. Max. Unit V/ms 400 V/ms 1.55 1.65 V 1.3 1.4 V 0.5 V 15 200 480 420 µs 400 µs 960 µs µs MCU Cold Start-Up RESET_N tied to VDDIN VPOR- VPOR+ VRESTART RESET_N Internal POR Reset TPOR TRST TSSU1 Internal MCU Reset 50 32133D–11/2011 UC3D Figure 8-4. VDDCORE MCU Cold Start-Up RESET_N Externally Driven VPOR- VPOR+ VRESTART RESET_N Internal POR Reset TPOR TRST TSSU1 Internal MCU Reset Figure 8-5. MCU Hot Start-Up VDDCORE RESET_N BOD Reset WDT Reset TSSU2 Internal MCU Reset In dual supply configuration, the power up sequence must be carefully managed to ensure a safe startup of the device in all conditions. The power up sequence must ensure that the internal logic is safely powered when the internal reset (Power On Reset) is released and that the internal Flash logic is safely powered when the CPU fetch the first instructions. Therefore VDDCORE rise rate (VDDRR) must be equal or superior to 2.5V/ms and VDDIO must reach VDDIO mini value before 500 us (< TRST + TSSU1) after VDDCORE has reached VPOR+ min value. 51 32133D–11/2011 UC3D Figure 8-6. Dual Supply Configuration V D D IO m in 2. 5 V V DD /m R sm R ini m um V D D IO V p or+ m in VDDCORE < 50 0 u s TSSU1 TRST Interna l POR (a ctive lo w ) F irst ins tructio n fe tch ed in fla sh 8.9.5 RESET_N Characteristics Table 8-30. RESET_N Waveform Parameters Symbol Parameter tRESET RESET_N minimum pulse width 8.10 Conditions Min. Typ. Max. 10 Unit ns USB Transceiver Characteristics 8.10.1 Electrical Characteristics Electrical Parameters Symbol Parameter Conditions REXT Recommended External USB Series Resistor In series with each USB pin with ±5% Min. Typ. 39 Max. Unit Ω The USB on-chip buffers comply with the Universal Serial Bus (USB) v2.0 standard. All AC parameters related to these buffers can be found within the USB 2.0 electrical specifications. 52 32133D–11/2011 UC3D 9. Mechanical Characteristics 9.1 9.1.1 Thermal Considerations Thermal Data Table 9-1 summarizes the thermal resistance data depending on the package. Table 9-1. 9.1.2 Thermal Resistance Data Symbol Parameter Condition Package Typ θJA Junction-to-ambient thermal resistance Still Air TQFP48 65.1 θJC Junction-to-case thermal resistance TQFP48 23.4 θJA Junction-to-ambient thermal resistance QFN48 29.2 θJC Junction-to-case thermal resistance QFN48 2.7 θJA Junction-to-ambient thermal resistance TQFP64 63.1 θJC Junction-to-case thermal resistance TQFP64 23.0 θJA Junction-to-ambient thermal resistance QFN64 26.9 θJC Junction-to-case thermal resistance QFN64 2.7 Still Air Still Air Still Air Unit ⋅C/W ⋅C/W ⋅C/W ⋅C/W Junction Temperature The average chip-junction temperature, TJ, in °C can be obtained from the following: 1. T J = T A + ( P D × θ JA ) 2. T J = T A + ( P D × ( θ HEATSINK + θ JC ) ) where: • θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 9-1. • θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in Table 9-1. • θHEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet. • PD = device power consumption (W) estimated from data provided in the Section 8.5 on page 38. • TA = ambient temperature (°C). From the first equation, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting average chip-junction temperature TJ in °C. 53 32133D–11/2011 UC3D 9.2 Package Drawings Figure 9-1. TQFP-64 package drawing Table 9-2. Device and Package Maximum Weight Weight Table 9-3. 300 mg Package Characteristics Moisture Sensitivity Level Table 9-4. Jedec J-STD-20D-MSL3 Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification e3 54 32133D–11/2011 UC3D Figure 9-2. TQFP-48 package drawing Table 9-5. Device and Package Maximum Weight Weight Table 9-6. 100 mg Package Characteristics Moisture Sensitivity Level Table 9-7. Jedec J-STD-20D-MSL3 Package Reference JEDEC Drawing Reference MS-026 JESD97 Classification e3 55 32133D–11/2011 UC3D Figure 9-3. QFN-48 Package Drawing Table 9-8. Device and Package Maximum Weight Weight Table 9-9. 100 mg Package Characteristics Moisture Sensitivity Level Table 9-10. Jedec J-STD-20D-MSL3 Package Reference JEDEC Drawing Reference M0-220 JESD97 Classification e3 56 32133D–11/2011 UC3D Figure 9-4. QFN-64 package drawing Table 9-11. Device and Package Maximum Weight Weight Table 9-12. 200 mg Package Characteristics Moisture Sensitivity Level Table 9-13. Jedec J-STD-20D-MSL3 Package Reference JEDEC Drawing Reference M0-220 JESD97 Classification e3 57 32133D–11/2011 UC3D 9.3 Soldering Profile Table 9-14 gives the recommended soldering profile from J-STD-20. Table 9-14. Soldering Profile Profile Feature Green Package Average Ramp-up Rate (217°C to Peak) 3°C/s max Preheat Temperature 175°C ±25°C 150°C min, 200°C max Temperature Maintained Above 217°C 60-150 s Time within 5⋅C of Actual Peak Temperature 30 s Peak Temperature Range 260°C Ramp-down Rate 6°C/s max Time 25⋅C to Peak Temperature 8 minutes max A maximum of three reflow passes is allowed per component. 58 32133D–11/2011 UC3D 10. Ordering Information Table 10-1. Device ATUC128D3 ATUC128D4 ATUC64D3 ATUC64D4 Ordering Information Ordering Code Carrier Type Package ATUC128D3-A2UT Tray TQFP 64 ATUC128D3-A2UR Tape & Reel TQFP 64 ATUC128D3-Z2UT Tray QFN 64 ATUC128D3-Z2UR Tape & Reel QFN 64 ATUC128D4-AUT Tray TQFP 48 ATUC128D4-AUR Tape & Reel TQFP 48 ATUC128D4-Z1UT Tray QFN 48 ATUC128D4-Z1UR Tape & Reel QFN 48 ATUC64D3-A2UT Tray TQFP 64 ATUC64D3-A2UR Tape & Reel TQFP 64 ATUC64D3-Z2UT Tray QFN 64 ATUC64D3-Z2UR Tape & Reel QFN 64 ATUC64D4-AUT Tray TQFP 48 ATUC64D4-AUR Tape & Reel TQFP 48 ATUC64D4-Z1UT Tray QFN 48 ATUC64D4-Z1UR Tape & Reel QFN 48 Package Type Temperature Operating Range JESD97 Classification E3 Industrial (-40⋅C to 85⋅C) JESD97 Classification E3 Industrial (-40⋅C to 85⋅C) 59 32133D–11/2011 UC3D 11. Errata 11.1 Rev. C 11.1.1 SPI 1. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). 2. PCS field in receive data register is inaccurate The PCS field in the SPI_RDR register does not accurately indicate from which slave the received data is read. Fix/Workaround None. 3. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. 8 4. Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. 5. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 6. Timer Counter 7. Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 60 32133D–11/2011 UC3D 11.1.2 TWIS 1. Clearing the NAK bit before the BTF bit is set locks up the TWI bus When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to attempt to continue transmitting data, thus locking up the bus. Fix/Workaround Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been set. 11.1.3 PWMA 1. The SR.READY bit cannot be cleared by writing to SCR.READY The Ready bit in the Status Register will not be cleared when writing a one to the corresponding bit in the Status Clear register. The Ready bit will be cleared when the Busy bit is set. Fix/Workaround Disable the Ready interrupt in the interrupt handler when receiving the interrupt. When an operation that triggers the Busy/Ready bit is started, wait until the ready bit is low in the Status Register before enabling the interrupt. 11.2 11.2.1 Rev. B Power Manager 1. TWIS may not wake the device from sleep mode If the CPU is put to a sleep mode (except Idle and Frozen) directly after a TWI Start condition, the CPU may not wake upon a TWIS address match. The request is NACKed. Fix/Workaround When using the TWI address match to wake the device from sleep, do not switch to sleep modes deeper than Frozen. Another solution is to enable asynchronous EIC wake on the TWIS clock (TWCK) or TWIS data (TWD) pins, in order to wake the system up on bus events. 11.2.2 SPI 1. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). 2. PCS field in receive data register is inaccurate The PCS field in the SPI_RDR register does not accurately indicate from which slave the received data is read. Fix/Workaround None. 3. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. 8 61 32133D–11/2011 UC3D 4. Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. 5. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 6. Timer Counter 7. Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 11.2.3 TWIS 1. Clearing the NAK bit before the BTF bit is set locks up the TWI bus When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to attempt to continue transmitting data, thus locking up the bus. Fix/Workaround Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been set. 11.2.4 PWMA 1. The SR.READY bit cannot be cleared by writing to SCR.READY The Ready bit in the Status Register will not be cleared when writing a one to the corresponding bit in the Status Clear register. The Ready bit will be cleared when the Busy bit is set. Fix/Workaround Disable the Ready interrupt in the interrupt handler when receiving the interrupt. When an operation that triggers the Busy/Ready bit is started, wait until the ready bit is low in the Status Register before enabling the interrupt. 62 32133D–11/2011 UC3D 11.3 11.3.1 Rev. A GPIO 1. Clearing Interrupt flags can mask other interrupts When clearing interrupt flags in a GPIO port, interrupts on other pins of that port, happening in the same clock cycle will not be registered. Fix/Workaround Read the PVR register of the port before and after clearing the interrupt to see if any pin change has happened while clearing the interrupt. If any change occurred in the PVR between the reads, they must be treated as an interrupt. 11.3.2 Power Manager 1. Clock Failure Detector (CFD) can be issued while turning off the CFD While turning off the CFD, the CFD bit in the Status Register (SR) can be set. This will change the main clock source to RCSYS. Fix/Workaround Solution 1: Enable CFD interrupt. If CFD interrupt is issues after turning off the CFD, switch back to original main clock source. Solution 2: Only turn off the CFD while running the main clock on RCSYS. 2. Requesting clocks in idle sleep modes will mask all other PB clocks than the requested In idle or frozen sleep mode, all the PB clocks will be frozen if the TWIS or the AST needs to wake the CPU up. Fix/Workaround Disable the TWIS or the AST before entering idle or frozen sleep mode. 3. SPI 4. SPI disable does not work in SLAVE mode SPI disable does not work in SLAVE mode. Fix/Workaround Read the last received data, then perform a software reset by writing a one to the Software Reset bit in the Control Register (CR.SWRST). 5. PCS field in receive data register is inaccurate The PCS field in the SPI_RDR register does not accurately indicate from which slave the received data is read. Fix/Workaround None. 6. SPI data transfer hangs with CSR0.CSAAT==1 and MR.MODFDIS==0 When CSR0.CSAAT==1 and mode fault detection is enabled (MR.MODFDIS==0), the SPI module will not start a data transfer. Fix/Workaround Disable mode fault detection by writing a one to MR.MODFDIS. 8 7. Disabling SPI has no effect on the SR.TDRE bit Disabling SPI has no effect on the SR.TDRE bit whereas the write data command is filtered when SPI is disabled. Writing to TDR when SPI is disabled will not clear SR.TDRE. If SPI is disabled during a PDCA transfer, the PDCA will continue to write data to TDR until its buffer is empty, and this data will be lost. 63 32133D–11/2011 UC3D Fix/Workaround Disable the PDCA, add two NOPs, and disable the SPI. To continue the transfer, enable the SPI and PDCA. 8. SPI bad serial clock generation on 2nd chip_select when SCBR=1, CPOL=1, and NCPHA=0 When multiple chip selects (CS) are in use, if one of the baudrates equal 1 while one (CSRn.SCBR=1) of the others do not equal 1, and CSRn.CPOL=1 and CSRn.NCPHA=0, then an additional pulse will be generated on SCK. Fix/Workaround When multiple CS are in use, if one of the baudrates equals 1, the others must also equal 1 if CSRn.CPOL=1 and CSRn.NCPHA=0. 9. I/O Pins 10. Current leakage through pads PA09, PA10 and PB16 Pads PA09 (TWI), PA10 (TWI) and PB16 (USB VBUS) are not fully 5V tolerant. A leakage current can be observed when a 5V voltage is applied onto those pads inputs. Their behavior is normal at 3.3V Fix/Workaround None for pads PA09 and PA10. A voltage divider can be used for PB16 (VBUS) to bring the input voltage down into the 3.3V range. 11. Current leakage through pads PB13, PB17 and PB18 For applications in which UC3D is considered as a drop in replacement solution to UC3B, pads PB13, PB17 and PB18 can no longer be used as VDDCORE supply pins.Maintaining a 1.8V voltage on those inputs will however lead to a current over consumption through the pins. Fix/Workaround Do not connect PB13, PB17 and PB18 when using UC3D as a drop in replacement for a UC3B specific application. 12. IO drive strength mismatch with UC3B specification for pads PA11, PA12, PA18 and PA19 For applications in which UC3D is considered as a drop in replacement solution to UC3B, GPIOs PA11, PA12, PA18 and PA19 are not completely compatible in terms of drive strength. Those pads have a 8 mA current capability on UC3B, while this is limited to 4 mA in UC3D. Fix/Workaround None. 13. WDT 14. Clearing the Watchdog Timer (WDT) counter in second half of timeout period will issue a Watchdog reset If the WDT counter is cleared in the second half of the timeout period, the WDT will immediately issue a Watchdog reset. Fix/Workaround Use twice as long timeout period as needed and clear the WDT counter within the first half of the timeout period. If the WDT counter is cleared after the first half of the timeout period, you will get a Watchdog reset immediately. If the WDT counter is not cleared at all, the time before the reset will be twice as long as needed. 64 32133D–11/2011 UC3D 11.3.3 Timer Counter 1. Channel chaining skips first pulse for upper channel When chaining two channels using the Block Mode Register, the first pulse of the clock between the channels is skipped. Fix/Workaround Configure the lower channel with RA = 0x1 and RC = 0x2 to produce a dummy clock cycle for the upper channel. After the dummy cycle has been generated, indicated by the SR.CPCS bit, reconfigure the RA and RC registers for the lower channel with the real values. 11.3.4 TWIS 1. TWIS stretch on Address match error When the TWIS stretches TWCK due to a slave address match, it also holds TWD low for the same duration if it is to be receiving data. When TWIS releases TWCK, it releases TWD at the same time. This can cause a TWI timing violation. Fix/Workaround None. 2. Clearing the NAK bit before the BTF bit is set locks up the TWI bus When the TWIS is in transmit mode, clearing the NAK Received (NAK) bit of the Status Register (SR) before the end of the Acknowledge/Not Acknowledge cycle will cause the TWIS to attempt to continue transmitting data, thus locking up the bus. Fix/Workaround Clear SR.NAK only after the Byte Transfer Finished (BTF) bit of the same register has been set. 3. CAT 4. CAT module does not terminate QTouch burst on detect The CAT module does not terminate a QTouch burst when the detection voltage is reached on the sense capacitor. This can cause the sense capacitor to be charged more than necessary. Depending on the dielectric absorption characteristics of the capacitor, this can lead to unstable measurements. Fix/Workaround Use the minimum possible value for the MAX field in the ATCFG1, TG0CFG1, and TG1CFG1 registers. 11.3.5 PWMA 1. The SR.READY bit cannot be cleared by writing to SCR.READY The Ready bit in the Status Register will not be cleared when writing a one to the corresponding bit in the Status Clear register. The Ready bit will be cleared when the Busy bit is set. Fix/Workaround Disable the Ready interrupt in the interrupt handler when receiving the interrupt. When an operation that triggers the Busy/Ready bit is started, wait until the ready bit is low in the Status Register before enabling the interrupt. 2. 65 32133D–11/2011 UC3D 12. Datasheet Revision History Please note that the referring page numbers in this section are referred to this document. The referring revision in this section are referring to the document revision. 12.1 Rev. A – 11/2009 1. 12.2 Rev. B – 04/2011 1. 12.3 Minor. Rev. C – 07/2011 1. 12.4 Initial revision. Final revision. Rev. D – 11/2011 1. 2. Adding errata for silicon Revision C . Fixed PLLOPT field description in SCIF chapter 66 32133D–11/2011 UC3D Table of Contents Features ..................................................................................................... 1 1 Description ............................................................................................... 3 2 Overview ................................................................................................... 5 3 4 5 6 7 8 2.1 Block Diagram ...................................................................................................5 2.2 Configuration Summary .....................................................................................6 Package and Pinout ................................................................................. 7 3.1 Package .............................................................................................................7 3.2 Peripheral Multiplexing on I/O lines ...................................................................8 Signal Descriptions ............................................................................... 12 4.1 I/O Line Considerations ...................................................................................14 4.2 Power Considerations .....................................................................................15 Processor and Architecture .................................................................. 20 5.1 Features ..........................................................................................................20 5.2 AVR32 Architecture .........................................................................................20 5.3 The AVR32UC CPU ........................................................................................21 5.4 Programming Model ........................................................................................25 5.5 Exceptions and Interrupts ................................................................................28 Memories ................................................................................................ 33 6.1 Embedded Memories ......................................................................................33 6.2 Physical Memory Map .....................................................................................33 6.3 Peripheral Address Map ..................................................................................33 6.4 CPU Local Bus Mapping .................................................................................35 Boot Sequence ....................................................................................... 36 7.1 Starting of Clocks ............................................................................................36 7.2 Fetching of Initial Instructions ..........................................................................36 Electrical Characteristics ...................................................................... 37 8.1 Disclaimer ........................................................................................................37 8.2 Absolute Maximum Ratings* ...........................................................................37 8.3 Supply Characteristics .....................................................................................37 8.4 Maximum Clock Frequencies ..........................................................................37 8.5 Power Consumption ........................................................................................38 8.6 I/O Pin Characteristics .....................................................................................41 67 32133D–11/2011 UC3D 9 8.7 Oscillator Characteristics .................................................................................44 8.8 Flash Characteristics .......................................................................................46 8.9 Analog Characteristics .....................................................................................47 8.10 USB Transceiver Characteristics .....................................................................52 Mechanical Characteristics ................................................................... 53 9.1 Thermal Considerations ..................................................................................53 9.2 Package Drawings ...........................................................................................54 9.3 Soldering Profile ..............................................................................................58 10 Ordering Information ............................................................................. 59 11 Errata ....................................................................................................... 60 11.1 Rev. C ..............................................................................................................60 11.2 Rev. B ..............................................................................................................61 11.3 Rev. A ..............................................................................................................63 12 Datasheet Revision History .................................................................. 66 12.1 Rev. A – 11/2009 .............................................................................................66 12.2 Rev. B – 04/2011 .............................................................................................66 12.3 Rev. C – 07/2011 .............................................................................................66 12.4 Rev. D – 11/2011 .............................................................................................66 Table of Contents.................................................................................... 67 68 32133D–11/2011 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature 115413 Disclaimer: The information in this document is provided in connection with Atmel products. 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