4 Pad Ceramic Package, 2.5 mm x 3.2 mm Product Features: ILCX13 Series Applications: SMD Package Small package Foot Print Supplied in Tape and Reel Compatible with Leadfree Processing PCMCIA Cards Storage PC’s Wireless Lan 3.2 +/-0.15 3 4 2.5 +/-0.15 1 Frequency 2 12 MHz to 150 MHz 0.9 Max. ESR (Equivalent Series Resistance) 12.0 MHz – 15.9 MHz 16.0 MHz – 19.9 MHz 20.0 MHz – 23.9 MHz 24.0 MHz – 60.0 MHz rd 60.0 MHz – 150.0 MHz (3 O/T) 100 Max. 80 Max. 60 Max. 40 Max. 100 Max. Shunt Capacitance (C0) 3.5 pF Max. Frequency Tolerance @ 25 C 30 ppm Standard (see Part Number Guide for more options) Frequency Stability over Temperature 50 ppm Standard (see Part Number Guide for more options) 1.2 1 0.8 2 0.7 4 3 0.9 Connection Diagram 3 4 2 1 Crystal Cut AT Cut Load Capacitance 18 pF Standard (see Part Number Guide for more options) Drive Level 100 µW Max. Recommended Pad Layout 1.3 1.3 1.7 5 ppm Max. / Year Standard Aging Temperature 2.1 0 C to +70 C Standard (see Part Number Guide for more options) Operating Storage -40 C to +85 C Standard Part Number Guide Package ILCX13 - Dimension Units: mm Sample Part Number: ILCX13 - FB1F18 - 20.000 Tolerance (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range Mode (overtone) B = ±50 ppm B = ±50 ppm 0 = 0°C to +50°C F = Fundamental F = ±30 ppm F = ±30 ppm 1 = 0°C to +70°C 3 = 3rd overtone G = ±25 ppm G = ±25 ppm 2 = -10°C to +60°C H = ±20 ppm H = ±20 ppm 3 = -20°C to +70°C I = ±15 ppm I = ±15 ppm** 5 = -40°C to +85°C J = ±10 ppm* J = ±10 ppm** Load Capacitance (pF) 18 pF Standard Or Specify 9 = -10°C to +50°C D = -10°C to +105°C* E = -40°C to +105°C* * Not available at all frequencies. ** Not available for all temperature ranges. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/20/12_E Specifications subject to change without notice Page 1 Frequency - 20.000 MHz 4 Pad Ceramic Package, 2.5 mm x 3.2 mm ILCX13 Series Pb Free Solder Reflow Profile: Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metal). Tape and Reel Information: Quantity per Reel A B C D E F 1000 8.0+/-.2 4.0 +/-.2 3.5 +/-.2 16.5 +/-2 50 / 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I-Date Code (YWW) Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/20/12_E Specifications subject to change without notice Page 2