OPA300, OPA2300 OPA301, OPA2301 SBOS271B − MAY 2003 − REVISED JUNE 2005 Low-Noise, High-Speed, 16-Bit Accurate, CMOS OPERATIONAL AMPLIFIER FEATURES D D D D D D D D D D DESCRIPTION High Bandwidth: 150MHz 16-Bit Settling in 150ns Low Noise: 3nV/√Hz Low Distortion: 0.003% Low Power: 9.5mA (typ) on 5.5V Shutdown to 5µA Unity-Gain Stable Excellent Output Swing: (V+) − 100mV to (V−) + 100mV Single Supply: +2.7V to +5.5V Tiny Packages: MSOP and SOT23 The OPA300 and OPA301 series high-speed, voltage-feedback, CMOS operational amplifiers are designed for 16-bit resolution systems. The OPA300/OPA301 series are unity-gain stable and feature excellent settling and harmonic distortion specifications. Low power applications benefit from low quiescent current. The OPA300 and OPA2300 feature a digital shutdown (Enable) function to provide additional power savings during idle periods. Optimized for single-supply operation, the OPA300/OPA301 series offer superior output swing and excellent common-mode range. APPLICATIONS D D D D The OPA300 and OPA301 series op amps have 150MHz of unity-gain bandwidth, low 3nV/√Hz voltage noise, and 0.1% settling within 30ns. Single-supply operation from 2.7V (±1.35V) to 5.5V (±2.75V) and an available shutdown function that reduces supply current to 5µA are useful for portable low-power applications. The OPA300 and OPA301 are available in SO-8 and SOT-23 packages. The OPA2300 is available in MSOP-10, and the OPA2301 is available in SO-8 and MSOP-8. All versions are specified over the industrial temperature range of −40°C to +125°C. 16-Bit ADC Input Drivers Low-Noise Preamplifiers IF/RF Amplifiers Active Filtering 130pF (mica) 1820Ω fS = 1.25MSPS f = 10kHz 5V 1820Ω VIN 10Ω 130pF (mica) ADS8401 OPA30x 1.5nF Typical Application Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright 2003−2005, Texas Instruments Incorporated ! ! www.ti.com "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 PACKAGE/ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING OPA300 SO-8 D 300A OPA300 SOT23-6 DBV A52 OPA301 SO-8 D 301A OPA301 SOT23-5 DBV AUP OPA2300 MSOP−10 DGS C01 OPA2301A OPA2301 SO−8 D OPA2301 MSOP−8 DGK C02 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ELECTROSTATIC DISCHARGE SENSITIVITY ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) Power Supply V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Signal Input Terminals(2), Voltage . . . . . . . . . . . 0.5V to (V+) + 0.5V Current . . . . . . . . . . . . . . . . . . . . . ±10mA Open Short-Circuit Current(3) . . . . . . . . . . . . . . . . . . . . Continuous Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +125°C Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . . +300°C ESD Ratings Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4kV Charged-Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . 500V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground; one amplifier per package. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PIN ASSIGNMENTS Top View OPA300 OPA300 1 8 Enable −In 2 7 V+ V− 2 +In 3 6 VOUT +In 3 V− 4 5 Out 1 A52 NC(1) MSOP, SO, SOT OPA2300 6 V+ Out A 1 5 Enable −In A 2 4 −In +In A 3 NC(1) 10 V+ A B V− 4 9 Out B 8 −In B 7 +In B 6 Enable B 8 V+ 7 Out B 6 −In B 5 +In B SOT23−6 (2) Enable A 5 SO−8 OPA301 MSOP−10 OPA301 OPA2301 NC(1) 1 8 NC(1) −In 2 7 V+ +In 3 6 VOUT V− 4 5 NC(1) Out 1 5 V+ Out A 1 V− 2 A +In 3 4 −In −In A 2 +In A 3 SOT23−5 B V− 4 SO−8 SO−8, MSOP−8 NOTE: (1) Not connected. (2) SOT23-6 pin 1 oriented as shown with reference to package marking. 2 "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 ELECTRICAL CHARACTERISTICS: VS = 2.7V to 5.5V Boldface limits apply over the temperature range, TA = −40°C to +125°C. All specifications at TA = +25°C, RL = 2kΩ connected to VS/2, VOUT = VS/2, and VCM = VS/2, unless otherwise noted. OPA300, OPA301 OPA2300, OPA2301 PARAMETER OFFSET VOLTAGE Input Offset Voltage Over Temperature Drift vs. Power Supply Channel Separation, dc f = 5MHz INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio INPUT BIAS CURRENT Input Bias Current Input Offset Current TEST CONDITIONS VOS MIN VS = 5V dVOS/dT PSRR VCM CMRR (V−) − 0.2 66 OPEN-LOOP GAIN Open−Loop Voltage Gain Over Temperature en in NTSC, RL = 150Ω NTSC, RL = 150Ω AOL Over Temperature UNITS 1 5 7 mV mV µV/°C µV/V VS = 5V, RL = 2kΩ, 0.1V < VO < 4.9V VS = 5V, RL = 2kΩ, 0.1V < VO < 4.9V VS = 5V, RL = 100Ω, 0.5V < VO < 4.5V VS = 5V, RL = 100Ω, 0.5V < VO < 4.5V 95 90 95 90 200 dB dB (V+) − 0.9 V dB ±5 ±5 pA pA 80 ±0.1 ±0.5 IB IOS INPUT IMPEDANCE Differential Common-Mode NOISE Input Voltage Noise, f = 0.1Hz to 1MHz Input Voltage Noise Density, f > 1MHz Input Current Noise Density, f < 1kHz Differential Gain Error Differential Phase Error MAX 2.5 50 140 100 VS = 2.7V to 5.5V, VCM < (V+) –0.9V (V−) − 0.2V < VCM < (V+) – 0.9V TYP 1013 || 3 1013 || 6 Ω || pF Ω || pF 40 3 1.5 0.01 0.1 µVPP nV/√Hz fA/√Hz % ° 106 dB dB dB dB 106 OUTPUT Voltage Output Swing from Rail Short-Circuit Current Capacitive Load Drive FREQUENCY RESPONSE Gain-Bandwidth Product Slew Rate Settling Time, 0.01% 0.1% Overload Recovery Time Total Harmonic Distortion + Noise POWER SUPPLY Specified Voltage Range Operating Voltage Range Quiescent Current (per amplifier) Over Temperature RL = 2kΩ, AOL > 95dB RL = 100Ω, AOL > 95dB ISC CLOAD GBW SR tS THD+N SHUTDOWN tOFF tON VL (shutdown) VH (amplifier is active) IQSD (per amplifier) TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SO-8, MSOP−8, MSOP-10 SOT23-5, SOT23-6 150 80 90 30 30 0.003 G = +1 VS = 5V, 2V Step, G = +1 Gain = −1 VS = 5V, VO = 3VPP, G = +1, f = 1kHz VS IQ 75 100 300 500 70 See Typical Characteristics 2.7 IO = 0 MHz V/µs ns ns ns % 5.5 2.7 to 5.5 9.5 12 13 V V mA mA (V−) + 0.8 (V+) + 0.2 10 ns µs V V µA 40 5 (V−) − 0.2 (V−) + 2.5 3 −40 −55 −60 +125 +125 +150 θJA 150 200 mV mV mA °C °C °C °C/W °C/W °C/W 3 "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 TYPICAL CHARACTERISTICS All specifications at TA = 25°C, VS = 5V, and RL = 150Ω connected to VS/2 unless otherwise noted. INVERTING GAIN SMALL−SIGNAL FREQUENCY RESPONSE NONINVERTING GAIN SMALL−SIGNAL FREQUENCY RESPONSE 3 3 VO = 0.1VPP RF = 310Ωfor G > 1 G=1 Normalized Gain (dB) Normalized Gain (dB) 0 −3 G=5 G=2 −9 G = 10 1M G = −10 −9 −15 10M 100M 1M 1G 10M 1G SMALL−SIGNAL STEP RESPONSE Output Voltage (10mV/div) Output Voltage (500mV/div) LARGE−SIGNAL STEP RESPONSE VOUT Time (50ns/div) Time (5ns/div) LARGE−SIGNAL ENABLE/DISABLE RESPONSE Enable Pin Normalized Gain (dB) Output Voltage (500mV/div) 100M Frequency (Hz) Frequency (Hz) Amplifier Output 0.1dB GAIN FLATNESS FOR VARIOUS RF 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 −0.1 −0.2 −0.3 Time (100µs/div) 4 G = −2 G = −5 −6 −12 VO = 0.1VPP RF = 310Ωfor G > 1 −15 G = −1 −3 Gain = 2 VO = 0.1VPP RF = 825Ω RF = 450Ω RF = 205Ω 1 10 Frequency (MHz) 100 "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, VS = 5V, and RL = 150Ω connected to VS/2 unless otherwise noted. HARMONIC DISTORTION vs OUTPUT VOLTAGE −60 HARMONIC DISTORTION vs NONINVERTING GAIN −50 RL = 200Ω f = 1MHz RF = 310Ω G=2 Harmonic Distortion (dBc) Harmonic Distortion (dBc) −50 THD −70 2nd−Harmonic −80 3rd−Harmonic −90 −100 VO = 2VPP RL = 200Ω f = 1MHz RF = 310Ω −60 −70 THD 2nd−Harmonic −80 3rd−Harmonic −90 −100 −110 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 1 10 Gain (V/V) Output Voltage (VPP) HARMONIC DISTORTION vs INVERTING GAIN −70 THD 2nd−Harmonic 3rd−Harmonic −80 −90 −100 −60 −70 VO = 2VPP RL = 200Ω Gain = 2 RF = 310Ω THD −80 2nd−Harmonic −90 3rd−Harmonic −100 −110 −110 1 10 −60 −120 100k 1M 10M Gain (V/V) Frequency (Hz) HARMONIC DISTORTION vs LOAD RESISTANCE INPUT VOLTAGE AND CURRENT NOISE SPECTRAL DENSITY vs FREQUENCY 10k THD −70 2nd−Harmonic −75 VO = 2VPP f = 1MHz Gain = 2 RF = 310Ω Voltage Noise (nV/√Hz) Current Noise (fA/√Hz) −65 −80 −85 −90 HARMONIC DISTORTION vs FREQUENCY −50 Harmonic Distortion (dBc) VO = 2VPP RL = 200Ω f = 1MHz RF = 310Ω −60 Harmonic Distortion (dBc) Harmonic Distortion (dBc) −50 3rd−Harmonic Current Noise 1k Voltage Noise 100 10 −95 −100 100 1k Load Resistance (Ω) 1 10 100 1k 10k 100k 1M 10M Frequency (Hz) 5 "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, VS = 5V, and RL = 150Ω connected to VS/2 unless otherwise noted. FREQUENCY RESPONSE FOR VARIOUS RL Gain = 1 VO = 0.1VPP FREQUENCY RESPONSE vs CAPACITIVE LOAD 3 Normalized Gain (dB) 3 −3 Gain (dB) CLOAD = 1pF, RS = 75Ω RLOAD = 1kΩ RLOAD = 150Ω −9 RLOAD = 50Ω −15 −3 CLOAD = 5pF RS = 55Ω −9 CLOAD = 10pF RS = 40Ω −15 CLOAD = 47pF RS = 30Ω RS −21 −21 10M 100M CL −27 10M 500 100M Frequency (Hz) OPEN−LOOP GAIN AND PHASE vs FREQUENCY 100 PSRR V+ PSRR V− 80 CMRR 60 Gain (dB) PSRR (dB) CMRR (dB) 70 50 40 30 20 10 0 10k 100k 1M 500 Frequency (Hz) COMMON−MODE REJECTION RATIO AND POWER−SUPPLY REJECTION RATIO vs FREQUENCY 90 CLOAD = 100pF RS = 20Ω 10M 100M 1G 110 100 90 80 70 60 50 40 30 20 10 0 −10 100 0 Gain −30 Phase −60 −90 Phase (_) 9 −120 −150 −180 1k 10k 100k 1M 10M 100M 1G Frequency (Hz) Frequency (Hz) COMPOSITE VIDEO DIFFERENTIAL GAIN AND PHASE OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 5.0 1.0 VS = 5V 4.0 Output Voltage (V) 0.8 dP (_ ) dG (%) 25_C 0.6 dP 0.4 −40_ C 3.0 −55_C 125_C 85_ C 2.0 25_ C 1.0 0.2 dG 0 0 1 2 3 Number of 150Ω Loads 6 4 0 10 20 30 40 50 Output Current (mA) 60 70 80 "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, VS = 5V, and RL = 150Ω connected to VS/2 unless otherwise noted. INPUT BIAS CURRENT vs TEMPERATURE OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 1 2.7 VS = 2.7V 2.4 Input Bias Current (pA) Output Voltage (V) 2.1 1.8 1.5 125_ C 85_C 25_ C −40_C −55_ C 1.2 0.9 0.6 0.1 0.3 0.01 0 0 10 20 30 40 50 60 70 −40 80 −20 0 20 40 60 80 100 120 140 Temperature (_ C) Output Current (mA) QUIESCENT CURRENT vs TEMPERATURE INPUT BIAS CURRENT vs COMMON−MODE VOLTAGE 12 2 VS = ±2.5V Input Bias Current (pA) Quiescent Current (mA) 11 10 9 8 1 0 −1 7 −2 6 −40 −20 0 20 40 60 80 100 120 −3 140 −2 Temperature (_ C) POWER−SUPPLY REJECTION RATIO AND COMMON−MODE REJECTION RATIO vs TEMPERATURE 0 1 2 SHORT−CIRCUIT CURRENT vs TEMPERATURE 100 80 95 60 Short−Circuit Current (mA) VS = 5.5V 90 PSRR PSRR (dB) CMRR (dB) −1 Common−Mode Voltage (V) 85 80 CMRR 75 70 40 20 0 −20 −60 60 −40 −80 −40 0 20 40 60 80 Temperature (_C) 100 120 140 VS = 5V VS = 2.7V −40 65 −20 VS = 3.5V VS = 5.5V −20 0 20 40 60 80 100 120 140 Temperature (_C) 7 "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, VS = 5V, and RL = 150Ω connected to VS/2 unless otherwise noted. OUTPUT IMPEDANCE vs FREQUENCY QUIESCENT CURRENT vs SUPPLY VOLTAGE 1000 12 Output Impedance, ZO (Ω) Quiescent Current (mA) 11 10 9 8 7 100 G=2 10 G=1 1 0.1 6 0.01 5 2.5 3 3.5 4 4.5 5 10k 5.5 100k 1M 10M 100M Frequency (Hz) Supply Voltage (V) MAXIMUM OUTPUT VOLTAGE vs FREQUENCY OPEN−LOOP GAIN vs TEMPERATURE 5 120 RLOAD = 2kΩ VS = 5V Open−Loop Gain (dB) Output Voltage (VPP) 4 3 VS = 2.7V 2 110 RLOAD = 2kΩ 100 RLOAD = 100Ω 90 1 0 1 10 80 −40 100 −20 0 20 Frequency (MHz) 0.2 20 0.1 18 0 −0.1 16 Percent of Amplifiers Output Error (%) 60 80 100 120 140 4 5 OFFSET VOLTAGE PRODUCTION DISTRIBUTION OUTPUT SETTLING TIME TO 0.1% −0.2 −0.3 −0.4 −0.5 −0.6 −0.7 14 12 10 8 6 4 −0.8 2 −0.9 −1.0 0 0 20 40 60 Time (ns) 8 40 Temperature (_C) 80 100 −5 −4 −3 −2 −1 0 1 Offset Voltage (mV) 2 3 "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 TYPICAL CHARACTERISTICS (continued) All specifications at TA = 25°C, VS = 5V, and RL = 150Ω connected to VS/2 unless otherwise noted. OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION Percent of Amplifiers 20 15 10 5 0 −10 −8 −6 −4 −2 0 2 4 6 8 10 Offset Voltage Drift (µV/_C) 9 "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 APPLICATIONS INFORMATION The OPA300 and OPA301 series of single-supply CMOS op amps are designed to interface with high-speed 16-bit analog-to-digital converters (ADCs). Featuring wide 150MHz bandwidth, fast 150ns settling time to 16 bits, and high open loop gain, this series offers excellent performance in a small SO-8 and tiny SOT23 packages. PCB LAYOUT As with most high-speed operational amplifiers, board layout requires special attention to maximize AC and DC performance. Extensive use of ground planes, short lead lengths, and high-quality bypass capacitors will minimize leakage that can compromise signal quality. Guard rings applied with potential as near to the input pins as possible help minimize board leakage. INPUT AND ESD PROTECTION THEORY OF OPERATION The OPA300 and OPA301 series op amps use a classic two-stage topology, shown in Figure 1. The differential input pair is biased to maximize slew rate without compromising stability or bandwidth. The folded cascode adds the signal from the input pair and presents a differential signal to the class AB output stage. The class AB output stage allows rail- to-rail output swing, with high-impedance loads (> 2kΩ), typically 100mV from the supply rails. With 10Ω loads, a useful output swing can be achieved and still maintain high open-loop gain. See the typical characteristic Output Voltage Swing vs Output Current. All OPA300/OPA301 series op amps’ pins are staticprotected with internal ESD protection diodes tied to the supplies, as shown in Figure 2. These diodes will provide overdrive protection if the current is externally limited to 10mA, as stated in the Absolute Maximum Ratings. Any input current beyond the Absolute Maximum Ratings, or long-term operation at maximum ratings, will shorten the lifespan of the amplifier. +V External Pin Internal Circuitry +VS −V Figure 2. ESD Protection Diodes VOUT + VIN − VBIAS Figure 1. OPA30x Classic Two-Stage Topology OPERATING VOLTAGE OPA300/OPA301 series op amp parameters are fully specified from +2.7V to +5.5V. Supply voltages higher than 5.5V (absolute maximum) can cause permanent damage to the amplifier. Many specifications apply from –40°C to +125°C. Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristics. 10 ENABLE FUNCTION The shutdown function of the OPA300 and OPA2300 is referenced to the negative supply voltage of the operational amplifier. A logic level HIGH enables the op amp. A valid logic HIGH is defined as 2.5V above the negative supply applied to the enable pin. A valid logic LOW is defined as < 0.8V above the negative supply pin. If dual or split power supplies are used, care should be taken to ensure logic input signals are properly referred to the negative supply voltage. If this pin is not connected to a valid high or low voltage, the internal circuitry will pull the node high and enable the part to function. The logic input is a high-impedance CMOS input. For battery-operated applications, this feature may be used to greatly reduce the average current and extend battery life. The enable time is 10µs; disable time is 1µs. When disabled, the output assumes a high-impedance state. This allows the OPA300 to be operated as a gated amplifier, or to have its output multiplexed onto a common analog output bus. "##$ %"## "#&$ %"#& www.ti.com SBOS271B − MAY 2003 − REVISED JUNE 2005 DRIVING CAPACITIVE LOADS DRIVING A 16-BIT ADC When using high-speed operational amplifiers, it is extremely important to consider the effects of capacitive loading on amplifier stability. Capacitive loading will interact with the output impedance of the operational amplifier, and depending on the capacitor value, may significantly decrease the gain bandwidth, as well as introduce peaking. To reduce the effects of capacitive loading and allow for additional capacitive load drive, place a series resistor between the output and the load. This will reduce available bandwidth, but permit stable operation with capacitive loading. Figure 3 illustrates the recommended relationship between the resistor and capacitor values. The OPA300/OPA301 series feature excellent THD+noise, even at frequencies greater than 1MHz, with a 16-bit settling time of 150ns. Figure 4 shows a total single supply solution for high-speed data acquisition. The OPA300/OPA301 directly drives the ADS8401, a 1.25 mega sample per second (MSPS) 16-bit data converter. The OPA300/OPA301 is configured in an inverting gain of 1, with a 5V single supply. Results of the OPA300/OPA301 performance are summarized in Table 1. 130pF (mica) 100 Series Resistance (Ω) 1820Ω 75 fS = 1.25MSPS f = 10kHz 5V 1820Ω VIN 50 10Ω 130pF (mica) ADS8401 OPA30x 1.5nF 25 Figure 4. The OPA30x Drives the 16-Bit ADS8401 0 1 10 100 Capacitive Load (pF) Figure 3. Recommended RS and CL Combinations Amplifiers configured in unity gain are most susceptible to stability issues. The typical characteristic, Frequency Response vs Capacitive Load, describes the relationship between capacitive load and stability for the OPA300/OPA301 series. In unity gain, the OPA300/OPA301 series is capable of driving a few picofarads of capacitive load without compromising stability. Board level parasitic capacitance can often fall into the range of a picofarad or more, and should be minimized through good circuit-board layout practices to avoid compromising the stability of the OPA300/OPA301. For more information on detecting parasitics during testing, see the Application Note Measuring Board Parasitics in High-Speed Analog Design (SBOA094), available at the TI web site www.ti.com. PARAMETER RESULTS (f = 10kHz) THD −99.3dB SFDR 101.2dB THD+N 84.2dB SNR 84.3dB Table 1. OPA30x Performance Results Driving a 1.25MSPS ADS8401 11 PACKAGE OPTION ADDENDUM www.ti.com 22-Nov-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty OPA2300AIDGSR ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2300AIDGSRG4 ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2300AIDGST ACTIVE MSOP DGS 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2300AIDGSTG4 ACTIVE MSOP DGS 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2301AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2301AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2301AIDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2301AIDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2301AIDGKT ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2301AIDGKTG4 ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2301AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2301AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Lead/Ball Finish MSL Peak Temp (3) OPA300AID ACTIVE SOIC D 8 100 TBD CU NIPDAU Level-3-235C-168 HR OPA300AIDBVR ACTIVE SOT-23 DBV 6 3000 TBD CU SNPB Level-2-240C-1 YEAR OPA300AIDBVT ACTIVE SOT-23 DBV 6 250 TBD CU SNPB Level-2-240C-1 YEAR OPA300AIDR ACTIVE SOIC D 8 2500 TBD CU NIPDAU Level-3-235C-168 HR OPA301AID ACTIVE SOIC D 8 100 TBD CU NIPDAU Level-3-240C-168 HR OPA301AIDBVR ACTIVE SOT-23 DBV 5 3000 TBD CU NIPDAU Level-1-235C-UNLIM OPA301AIDBVT ACTIVE SOT-23 DBV 5 250 TBD CU NIPDAU Level-1-235C-UNLIM OPA301AIDR ACTIVE SOIC D 8 2500 TBD CU NIPDAU Level-3-240C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 22-Nov-2005 temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated