CPC2317N Dual Single-Pole 8-Pin SOIC OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 60 120 16 1 Units VP mArms / mADC mA Features • • • • • • • • This device uses IXYS Integrated Circuits Division’s state of the art, double-molded vertical construction packaging to produce one of the world’s smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays. Applications • Security • Passive Infrared Detectors (PIR) • Data Signaling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Medical Equipment—Patient/Equipment Isolation • Aerospace • Industrial Controls Pin Configuration Load 2 7 – Control 3 Ordering Information Part # CPC2317N CPC2317NTR 6 Form-B IF IF Pb DS-CPC2317N-R03 ILOAD 90% Form-A - Normally Open 4 Switching Characteristics of Normally Closed (Form-B) Devices Form-A Load ILOAD 5 – Control Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Form-B - Normally Closed Load + Control Approvals • UL Certified Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Switching Characteristics of Normally Open (Form-A) Devices 8 + Control The CPC2317N is a miniature device with one independent normally open (1-Form-A) solid state relay and one independent normally closed (1-Form-B) solid state relay in an 8-pin SOIC package. It employs optically coupled MOSFET technology to provide 1500Vrms of input/output isolation. The optically coupled outputs, which use IXYS Integrated Circuits Division's patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. 1500Vrms Input/Output Isolation TTL/CMOS Compatible input Arc-Free With No Snubbing Circuits No EMI/RFI Generation Immune to radiated EM fields SMD Pick & Place, Wave Solderable Small 8-Pin SOIC Package Tape & Reel Version Available 1 Description ton 90% 10% 10% toff toff ton Load e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC2317N Absolute Maximum Ratings @ 25°C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature Soldering Temperature (10 Seconds) 1 Ratings 60 5 50 1 600 1500 -40 to +85 -40 to +125 260 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW Vrms °C °C °C Derate linearly 5mW / ºC Electrical Characteristics @ 25°C Parameter Output Characteristics Load Current Normally Open (Form-A) Continuous 1 Normally Closed (Form-B) Continuous 1 Peak On-Resistance 2 Switching Speeds Turn-On Turn-Off Off-State Leakage Current Output Capacitance Normally Open (Form-A) Normally Closed (Form-B) Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IL - - 120 mArms / mADC ILPK RON - - ±350 16 mAP IF=5mA, VL=10V ton toff VL=60VP ILEAK - - 3 3 1 COUT - 25 - pF IL=100mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.40 0.35 1.2 - 1 1.4 10 mA mA V µA - - - 1 - pF IF=1mA IF=0mA t =10ms IL=120mA IF=0mA, VL=50V, f=1MHz IF=5mA, VL=50V, f=1MHz ms µA Load current derates linearly from 120mA @ 25oC to 60mA @ 85oC, and must be derated for both poles operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a LED drive current of 3mA is recommended. www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC2317N COMMON PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25ºC) 25 Device Count (N) Device Count (N) 30 25 20 15 10 5 1.17 15 10 5 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) 0.35 0.40 0.45 0.50 0.55 80 2.0 1.5 1.0 -40 -20 0 20 40 60 Temperature (ºC) Load Current (A) Blocking Voltage (VP) 92 110 100 90 80 87 85 83 81 79 77 20 40 60 Temperature (ºC) 80 100 80 100 60 -40 -20 0 20 40 60 Temperature (ºC) 80 100 1.0 89 0 90 Energy Rating Curve 91 -20 88 70 Typical Blocking Voltage vs. Temperature (N=50, TA=25ºC) (Form-A IF=0mA, Form-B IF=2mA) -40 86 120 Load Current (mA) LED Current (mA) 100 84 Maximum Load Current vs. Temperature (Form-A IF=2mA, Form-B IF=0mA) 130 0 20 40 60 Temperature (ºC) 82 Blocking Voltage (VP) 0.5 0 80 0.60 2.5 IF=5mA IF=2mA IF=1mA -20 10 Typical IF for Switch Operation vs. Temperature (IL=80mA) 3.0 IF=50mA IF=20mA IF=10mA 1.2 1.0 -40 15 LED Current (mA) 1.3 1.1 20 0 0.30 1.6 1.4 25 5 Typical LED Forward Voltage Drop vs. Temperature 1.5 Typical Blocking Voltage Distribution (N=50, TA=25ºC) (Form-A IF=0mA, Form-B IF=2mA) 30 20 0 0 LED Forward Voltage Drop (V) 35 Device Count (N) 35 Typical IF for Switch Operation (N=50, IL=100mA, TA=25ºC) 0.8 0.6 0.4 0.2 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2317N FORM-A PERFORMANCE DATA* 25 20 20 15 10 5 30 15 10 5 25 20 15 10 5 0 Turn-On (ms) Turn-Off (ms) 7.0 7.1 7.2 On-Resistance (:) Typical Turn-On vs. LED Forward Current (IL=100mA) Typical Turn-Off vs. LED Forward Current (IL=100mA) Typical Load Current vs. Load Voltage (TA=25ºC, IF=5mA) 1.1 1.2 1.3 1.4 1.5 0.26 1.6 Turn-Off (ms) 3.0 2.7 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0 0.28 0.30 0.32 0.34 0.36 0.7 150 0.6 100 0.5 0.4 0.3 0.2 0 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 Typical Turn-On vs. Temperature (IL=50mA) 3.0 Turn-Off (ms) IF=2mA 2.5 2.0 IF=5mA 1.5 1.0 -40 -20 0 20 40 60 Temperature (ºC) 80 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 -50 -150 -1.5 LED Forward Current (mA) -0.5 0 0.5 Load Voltage (V) Typical Turn-Off vs. Temperature (IL=50mA) Typical On-Resistance vs. Temperature (IL=Max Rated @ Temperature) 5 10 15 20 25 30 35 40 45 50 14 -1.0 1.0 1.5 IF=2mA IF=5mA 12 IF=5mA 10 Steady State 8 Instantaneous IF=5mA 6 4 IF=2mA -40 100 50 On-Resistance (:) 3.5 5 7.4 7.3 -100 0.1 0 6.9 6.8 0.38 Load Current (mA) 1.0 Turn-On (ms) 35 0 0 Turn-On (ms) Typical On-Resistance Distribution (N=50, IL=100mA, TA=25ºC) Typical Turn-Off Time (N=50, IL=100mA, IF=5mA, TA=25ºC) Device Count (N) 25 Device Count (N) Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=100mA, TA=25ºC) 0.016 -20 0 20 40 60 Temperature (ºC) 80 100 2 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Leakage vs. Temperature (Measured Across Pins 5&6) (IF=0mA, VL=60V) Leakage (PA) 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC2317N FORM-B PERFORMANCE DATA* Typical Turn-On Time (N=50, IF=2mA, IL=150mA, TA=25ºC) 25 15 10 5 0.30 0.32 0.34 0.36 Turn-On (ms) 0.38 10 5 25 20 15 10 5 0.6 Time (ms) 0.5 0.4 0.3 0.2 0.1 0 10 15 20 25 30 35 40 45 50 0.34 0.36 0.38 Turn-Off (ms) 0.40 0.42 5.0 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 5.1 5.2 5.3 5.4 5.5 5.6 On-Resistance (:) 150 Typical Load Current vs. Load Voltage (TA=25ºC) 100 50 0 -50 -100 0 5 10 15 20 25 30 35 40 45 50 -150 -1.00 -0.66 -0.33 0 0.33 0.66 1.00 LED Forward Current (mA) LED Forward Current (mA) Load Voltage (V) Typical Turn-On vs. Temperature (IF=2mA, IL=50mA) Typical Turn-Off vs. Temperature (IF=2mA, IL=50mA) Typical On-Resistance vs. Temperature (IF=0mA, IL=150mA) -20 0 20 40 60 80 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 7 6 5 4 3 2 -40 100 8 On-Resistance (:) Turn-Off (ms) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -40 5 0.32 Typical Turn-Off vs. LED Forward Current (TA=25ºC, IL=50mA) 0.7 0 0 0.30 0.40 Typical Turn-On vs. LED Forward Current (TA=25ºC, IL=50mA) Time (ms) 15 Load Current (mA) 0.28 Typical On-Resistance Distribution (N=50, IL=150mA, TA=25ºC) 30 20 0 0 Turn-On (ms) 35 Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical Turn-Off Time (N=50, IF=2mA, IL=150mA, TA=25ºC) -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) -40 -20 0 20 40 60 80 100 Temperature (ºC) Typical Leakage vs. Temperature Measured Across Pins 7&8 (IF=2mA, VL=60V) 0.40 Leakage (µA) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2317N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC2317N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC2317N 260ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb 6 e3 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION CPC2317N MECHANICAL DIMENSIONS CPC2317N 1.016 ± 0.025 (0.040 ± 0.001) 9.347 ± 0.203 (0.368 ± 0.008) Pin 1 2.184 MAX (0.086 MAX) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) 0.203 ± 0.025 (0.008 ± 0.001) 0.432 ± 0.127 (0.017 ± 0.005) 2.54 (0.100) 0.55 (0.022) Lead to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 ± 0.102 (0.033 ± 0.004) Dimensions mm (inches) 0.381 ± 0.051 (0.015 ± 0.002) CPC2317NTR Tape & Reel 1.75 ± 0.10 330.2 DIA. (13.00 DIA.) 4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 ± 0.10 Ø1.50 +0.1, -0 6.50 9.65 ± 0.10 16.00 ± 0.30 Embossed Carrier 3.50 6.55 ± 0.10 Ø1.50 MIN Embossment 2.35 ± 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. 4. Tape material : Black Conductive Polystyrene Alloy. 2.85 ± 0.10 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. 7. Component load per 13” reel : 2000 pcs. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-CPC2317N-R03 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/17/2012