MLX81205/07/10/15 Features Microcontroller: MLX16-FX RISC CPU o o o o 16 bit RISC CPU with 20DMIPS and Power-Saving-Modes Co-processor for fast multiplication and division Flash and EEPROM memory with EEC In-circuit debug and emulation Supported bus interfaces: o o o o LIN-Interface with integrated LIN transceiver supporting LIN 2.x, certified LIN protocol software provided by Melexis In-Module-Programming (Flash and EE) via pin LIN using a special Melexis fast protocol PWM-Interface Full duplex SPI, Master/Slave, double-buffered, speed programmable. DMA access. Flash and EEPROM programming also possible via SPI. TruSense Motor Control Technology o o o o o Patented algorithms for sensor-less 3-phase sine and trapezoidal motor control Phase voltage integration filter for BEMF voltage sensing at lowest speeds Position dependent phase inductance sensing via shunt current measurements at stand still and low to medium speeds Support of Star and Delta based motor configurations without the need for center star point Support of 3-phase switched reluctance motor control Voltage Regulator o o o o Direct powered from 12V board net with low voltage detection Operating voltage VS = 5V to 18V Internal voltage regulator with possibility to use external regulator transistor Very low standby current, < 30µA in sleep mode, wake-up possible via LIN or local sources Pre-Driver o o Pre-driver (~25Ω Rdson) for all 3 N-FET half bridges with programmable Inter-Lock-Delay and slope control for optimal EMC and thermal performance during power N-FET switching Monitoring of Drain-Source voltages of the N-FETs Periphery o o o o o o o o o 4 independent 16 bit timer modules with capture and compare, and additional software timer 3 programmable 12 bit PWM units with programmable frequencies 10 bit ADC converter (2µs conversion time) and DMA access On-chip temperature sensor with ±10K accuracy System-clock-independent fully integrated watchdog 32 MHz ±5% internal RC oscillator with PLL Optional crystal oscillator Load dump and brown out interrupt function Integrated shunt current amplifier with programmable gain Product Abstract TFR / CPA Page 1 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 Applications The MLX81205/07/10/15 controls BLDC motors via external FET transistors for: o o o Oil-, water-, fuel-pumps Blowers, compressors Positioning actuators Family Concept MLX81205 MLX81207 MLX81210 MLX81215 Flash Memory [kByte] 32 32 32 64 RAM [kByte] 4 4 8 8 384 384 384 384 QFN32 QFN48 TQFP EP 48 QFN48 TQFP EP 48 QFN48 TQFP EP 48 No Yes Yes Yes High side High side Low side, High side Low side, High side UART Yes Yes Yes Yes SPI No Yes Yes Yes Support of sensor based BLDC motor control No Yes Yes Yes Support of Switched Reluctance (SR) motor control No No No Yes 5V Regulator support for 5V external supplies (CAN support) No No Yes Yes Bonded pins in package 32 37 48 48 EEPROM [Byte] Package Support of active high side reverse polarity protection Current shunt measurement possibility Pin compatibility MLX81210 and MLX81215 are pin compatible Table 1 – Family Options Product Abstract TFR / CPA Page 2 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 Ordering Information Order Code [1] MLX81205 LLQ-xAA-000-TU MLX81205 LLQ-xAA-000-RE MLX81207 LLQ-xAA-000-TU MLX81207 LLQ-xAA-000-RE MLX81207 LPF-xAA-000-TR MLX81207 LPF-xAA-000-RE MLX81210 LLQ-xAA-000-TU MLX81210 LLQ-xAA-000-RE MLX81210 LPF-xAA-000-TR MLX81210 LPF-xAA-000-RE MLX81215 LLQ-xAA-000-TU MLX81215 LLQ-xAA-000-RE MLX81215 LPF-xAA-000-TR MLX81215 LPF-xAA-000-RE Temp. Range -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C -40 - 150 °C Package QFN32 5x5 QFN32 5x5 QFN48 7x7 QFN48 7x7 TQFP EP 48 7x7 TQFP EP 48 7x7 QFN48 7x7 QFN48 7x7 TQFP EP 48 7x7 TQFP EP 48 7x7 QFN48 7x7 QFN48 7x7 TQFP EP 48 7x7 TQFP EP 48 7x7 Delivery Remark Tube Reel Tube Reel Tray Reel Tube Reel Tray Reel Tube Reel Tray Reel Table 2 – Ordering Information [1] .See Marking/Order Code. Product Abstract TFR / CPA Page 3 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 Contents 1. FUNCTIONAL DIAGRAM ........................................................................................................................ 5 2. PIN DESCRIPTION .................................................................................................................................. 6 3. ELECTRICAL CHARACTERISTICS........................................................................................................ 7 3.1 3.2 4. OPERATING CONDITIONS .................................................................................................................... 7 ABSOLUTE MAXIMUM RATINGS ............................................................................................................ 7 APPLICATION EXAMPLES..................................................................................................................... 8 4.1 SENSOR-LESS BLDC MOTOR CONTROL ON THE LIN-BUS OR VIA PWM-INTERFACE WITH REVERSE POLARITY PROTECTION AND CURRENT SENSING ................................................................................................. 8 4.2 SENSOR-LESS BLDC MOTOR CONTROL ON THE LIN-BUS OR VIA PWM-INTERFACE WITH REVERSE POLARITY PROTECTION IN THE HIGH SIDE PATH ................................................................................................ 10 4.3 SENSOR BASED BLDC MOTOR CONTROL .......................................................................................... 11 4.4 SENSOR-LESS BLDC MOTOR CONTROL WITH ABSOLUTE POSITION SENSING ....................................... 12 4.5 SENSOR-LESS BLDC MOTOR CONTROL VIA A CAN-BUS-INTERFACE .................................................. 13 5. MECHANICAL SPECIFICATION ........................................................................................................... 14 5.1 QFN ................................................................................................................................................ 14 5.1.1. QFN32 5x5 (32 leads)............................................................................................................................... 14 5.1.2. QFN48 7x7 (48 leads)............................................................................................................................... 14 5.2 TQFP EP 48 7X7 (48 LEADS) ........................................................................................................... 15 6. MARKING/ORDER CODE ..................................................................................................................... 16 6.1 6.2 MARKING MLX81205/07/10/15 ........................................................................................................ 16 ORDER CODE MLX81205/07/10/15 ................................................................................................. 16 7. ASSEMBLY INFORMATION.................................................................................................................. 17 8. DISCLAIMER.......................................................................................................................................... 18 Product Abstract TFR / CPA Page 4 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 1. Functional Diagram RTG VDDA CLKO OSC1 OSC2 VREF VBAT_S1 VS VDDD VBAT_S2 fmain V5IN V5R IOHV VS VREF ISENSH ISENSL TEMP VBAT_S1 VBAT_S2 GND_S1 GND_S2 U V W T PHASEINT IOHV IO1 ... IO9 ...... GND_S1 GND_S2 fmain ...... IO1 CP0 HS0 IO2 LS0 IO3 U SHU IO4 IO5 CP1 HS1 IO6 ADC SPI IO7 LS1 V IO8 SHV IO9 CP2 HS2 LS2 LIN W GNDA SHW GNDD T GNDCAP GNDDRV TI0 TI1 TO Figure 1 - Block Diagram Black: common for all versions, Blue: additional pins / functionality for MLX81207, Blue + red: additional pins / functionality for MLX81210 / MLX81215 Product Abstract TFR / CPA Page 5 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 2. Pin Description Name Type Function VS P Battery Supply X X X X RTG O 3.3V External MOS Gate Control X X X X VDDA P 3.3V Supply X X X X V5R P 5V Regulator Output for external NFET X X V5IN I 5V Regulator Input X X VDDD P 1.8V Regulator output X X X X GNDD GND Digital ground X X X X GNDCAP GND Digital ground X X X GNDDRV GND Driver ground X X X X GNDA GND Analog ground X X X X LIN HVIO Connection to LIN bus or PWM interface X X X X IOHV HVIO General purpose IO pin X X X X TI0 I Test input, debug interface X X X X TI1 I Test input, debug interface X X X X TO O Test output, debug interface X X X X OSC1 I Quarz interface input X X X X OSC2 O Quarz interface ouput X X X X IO1 LVIO General purpose IO pin (Low voltage 3.3V) X X X X IO2 LVIO General purpose IO pin (Low voltage 3.3V) X X X X IO3 LVIO General purpose IO pin (Low voltage 3.3V) X X X IO4 LVIO General purpose IO pin (Low voltage 3.3V) X X X IO5 LVIO General purpose IO pin (Low voltage 3.3V) X X X IO6 LVIO General purpose IO pin (Low voltage 3.3V) X X IO7 LVIO General purpose IO pin (Low voltage 3.3V) X X IO8 LVIO General purpose IO pin (Low voltage 3.3V) X X IO9 LVIO General purpose IO pin (Low voltage 3.3V) X X CLKO HVO Switchable 250kHz clock output to VREF level X X SHU HVI Phase U input to BEMF sensing blocks X X SHV HVI Phase V input to BEMF sensing blocks X X SHW HVI Phase W input to BEMF sensing blocks X X T HVI Reference input to BEMF sensing blocks X X X X VREF P Clamped 8V or 12V ref. voltage for bootstrap X X X X CP2 HVIO High side bootstrap capacitor driver 2 X X X X HS2 HVIO N-FET high side gate driver 2 X X X X W HVI Phase W input to HS2 buffer and BEMF sensing blocks X X X X LS2 HVO N-FET low side gate driver 2 X X X X CP1 HVIO High side bootstrap capacitor driver 1 X X X X HS1 HVIO N-FET high side gate driver 1 X X X X V HVI Phase V input to HS1 buffer and BEMF sensing blocks X X X X LS1 HVO N-FET low side gate driver 1 X X X X CP0 HVIO High side bootstrap capacitor driver 0 X X X X HS0 HVIO N-FET high side gate driver 0 X X X X U HVI Phase U input to HS0 buffer and BEMF sensing blocks X X X X LS0 HVO N-FET low side gate driver 0 X X X X VBAT_S1 HVI VS high side input for current sensing X X X X VBAT_S2 HVI VS low side input for current sensing X X X X Product Abstract TFR / CPA MLX81205 MLX81207 X Page 6 of 18 MLX81210 MLX81215 Rev 3.9 11-May-2012 MLX81205/07/10/15 GND_S1 LVI GND high side input for current sensing X X GND_S2 LVI GND low side input for current sensing X X 48 48 Pin count 32 37 Table 3 - Pin Description MLX81205 / MLX81207 / MLX81210 / MLX81215 3. Electrical Characteristics All voltages are referenced to ground (GND). Positive currents flow into the IC. The absolute maximum ratings given in the table below are limiting values that do not lead to a permanent damage of the device but exceeding any of these limits may do so. Long term exposure to limiting values may affect the reliability of the device. Reliable operation of the MLX81205/07/10/15 is only specified within the limits shown in Operating conditions. 3.1 Operating Conditions Parameter Symbol Min Max Unit IC supply voltage VS 5 18 V Tamb -40 +150 [1] °C Operating ambient temperature Table 4 - Operating Conditions [1] Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time, customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant. 3.2 Absolute Maximum Ratings Parameter Symbol Condition Min Unit DC voltage on drivers CP<2:0>, HS<2:0> pins -0.3 -0.3 -0.3 -0.3 -0.3 28 45 +10 +10 VDDA+0.3 VS+0.3 18 VREF+0.3 VS + VREF mA mA V V V V V DC voltage on phases related pins (U, V, W, SHU, SHV, SHW, T, VBAT_S<2:1>) -0.3 VS+1.5 V VS IC supply voltage T = 2 min -0.3 Max T < 500 ms -10 Maximum reverse current into any pin Maximum sum of reverse currents into all pins DC voltage on LVIO pins, OSC<2:1>, GND_S<2:1> DC voltage on HV I/O pin, V5R pin DC voltage on drivers supply pin VREF DC voltage on drivers control pins (CLKO, LS<2:0>) V ESDBUSHB Human body model, equivalent to discharge 100pF with 1.5kΩ, -6 +6 kV ESD capability of any other pins ESDHB Human body model, equivalent to discharge 100pF with 1.5kΩ, -2 +2 kV Maximum latch–up free current at any Pin ILATCH Tvj Tstg -250 +250 +155 +150 mA °C °C K/W K/W K/W ESD capability of pin LIN Junction temperature [1] Storage temperature -55 10 5 5.5 Rthjc QFN32 Rthjc QFN48 Rthjc Rthjc TQFP48 Table 5 - Absolute Maximum Ratings Product Abstract TFR / CPA Page 7 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 [1] Target temperature specification after qualification. With temperature applications at TA>125°C a reduction of chip internal power dissipation with external supply transistor is mandatory. The extended temperature range is only allowed for a limited period of time, customer’s mission profile has to be agreed by Melexis as a mandatory part of the Part Submission Warrant. 4. Application Examples The following sections show typical application examples[1]. 4.1 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface with reverse polarity protection and current sensing In the sample application of Figure 2, the MLX81205 can realize the sensor-less driving of a BLDC motor via three external power N-FET half bridges with only a few external components. The high side N-FET driving is done with a bootstrap output stage. Reverse polarity protection of the bridge is realized with an external power FET in the ground path. An external temperature sensor is connected to the 10 bit ADC via pin IO1. The integrated watchdog with a dedicated separate RC-oscillator is monitoring application integrity. The communication interface could be LIN or a PWM interface. The pin LIN can also be used as wake-up source and to program the Flash memory. The motor currents are measured by a shunt resistor in the high side path. In case the current exceeds the programmed threshold, the bridge can be switched off automatically and / or a software interrupt can be generated. The motor current can also be measured by the 10-bit ADC converter. The patented Melexis TruSense technology combines two methods to determine the rotor position: - The measurement of the induced BEMF voltage at medium and high speeds. - The measurement of position dependent coil inductance variations at stand-still and low speeds. As a result TruSense allows operation of the motor in the widest dynamic speed range. The motor can be driven with block, trapezoidal or sine-wave currents. The motor start-up can be made independent of the load conditions according to the application requirements. In this example application the motor star point is not available. It is modeled with external resistors from the motor phases and connected to T input. Alternatively an artificial IC internal reference point can be chosen as shown in the block diagram of the MLX81205/07/10/15. [1] The application examples are principal application schematics only. The details need to be worked out for each application schematic separately, depending on the application requirements. Product Abstract TFR / CPA Page 8 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 Figure 2 - Typical Sensor-less BLDC Motor Control Application Example with MLX81205 Product Abstract TFR / CPA Page 9 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 4.2 Sensor-less BLDC Motor Control on the LIN-Bus or via PWM-Interface with reverse polarity protection in the high side path In the sample application of Figure 3, the MLX81207 has been selected in order to benefit from the external high side reverse polarity protection possibility compared to the application shown in section 4.1. All other remarks from the previous application example remain valid. Figure 3 – Typical Sensor-less BLDC Motor Control Application Example with MLX81207 Product Abstract TFR / CPA Page 10 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 4.3 Sensor based BLDC Motor Control In the sample application of, Figure 4, the MLX81207 can realize the driving of a BLDC motor with three Hall sensors. An external P-FET is used to derive the 3.3V supply with a higher current capability in order to bring power consumption outside the MLX81207. VBAT CLKO VS VHIGH VCC3 RTG VBAT_S1 VDDA VBAT_S2 SHUNT VREF VPROT CP2 VDDD CP1 CP0 VCC3 HS0 IO1 U U LIN / PWM LIN IO2 LS0 MLX81207 IO3 VPROT HS1 V V IOHV OSC1 LS1 VPROT OSC2 HS2 IO4 IO5 W W LS2 TI0 TI1 TO VCC3 T VCCHALL HALL1 HALL2 HALL3 GND GNDA GNDD GNDCAP GNDDRV GND Figure 4 – Typical Sensor based BLDC Motor Control Application Example with MLX81207 Product Abstract TFR / CPA Page 11 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 4.4 Sensor-less BLDC Motor Control with absolute position sensing In the sample application of Figure 5, the MLX81210 is working with an absolute position sensor in order to measure the position of the gear shaft in throttle valve application systems or any other similar applications, where absolute precise position sensing is requested. Figure 5 – Typical Sensor-less BLDC Motor Control Application Example with MLX81210 and Triaxis® absolute position sensing Product Abstract TFR / CPA Page 12 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 4.5 Sensor-less BLDC Motor Control via a CAN-Bus-Interface In this sample application the MLX81215 can realize the sensor-less driving of a BLDC motor via a CAN-Bus Interface. System wake-up on CAN-bus traffic is possible. The 5V and a 3.3V voltage supply needed for the CAN-Bus, is generated via external N-FET control in order to limit the power dissipation in the package. The motor current can be monitored via shunt resistors in the ground and battery path in case the application requests a double side monitoring for security reasons. Application programming on module level via the CAN-Bus is supported by the SPI-Interface. Figure 6 – Typical BLDC Motor Control Application Example on the CAN-Bus with MLX81215 Product Abstract TFR / CPA Page 13 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 5. Mechanical Specification 5.1 QFN Figure 7 – QFN Drawing 5.1.1. QFN32 5x5 (32 leads) Symbol [1][2] QFN32 A A1 A3 b D D2 E E2 e L N [3] 0.18 3.50 3.50 0.35 Min 0.80 0.00 Nom 0.85 0.02 0.20 0.25 5.00 3.60 5.00 3.60 0.50 0.40 Max 0,90 0.05 0.30 3.70 3.70 0.45 32 ND [4] NE [4] 8 8 Table 6 – QFN32 5x5 Package Dimensions 5.1.2. QFN48 7x7 (48 leads) Symbol [1][2] QFN48 A A1 A3 b D D2 E E2 e L 0.18 5.00 5.00 0.45 Min 0.80 0 Nom 0.85 0.02 0.20 0.25 7.00 5.10 7.00 5.10 0.50 0.50 Max 0.90 0.05 0.30 5.20 5.20 0.55 N [3] 48 ND [4] NE [4] 12 12 Table 7 - QFN48 7x7 Package Dimensions [1] [2] [3] [4] Dimensions and tolerances conform to ASME Y14.5M-1994 All dimensions are in Millimeters. All angels are in degrees N is the total number of terminals ND and NE refer to the number of terminals on each D and E side respectively Product Abstract TFR / CPA Page 14 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 5.2 TQFP EP 48 7x7 (48 leads) Exposed pad need best possible contact to ground for exlectrical and thermal reasons Figure 8 – TQFP EP 7x7 Drawing Min Nom Max A 1.20 A1 0.05 0.15 A2 0.95 1.00 1.05 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 D D1 D2 E E1 E2 e 9.00 7.00 4.00 9.00 7.00 4.00 0.50 L 0.45 0.60 0.75 N 48 Ccc 0.08 ddd 0.08 Table 8 – TQFP EP 7x7 Package Dimensions Notes: 1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994, ∆2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line. ∆3. Datum [A-B] and [-D-] to be determined at centerline between leads where leads exist, plastic body at datum plane [-|-|-] ∆4. To be determined at seating plane [-C-] ∆5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould protrusion is 0.254 mm on D1 and E1 dimensions. 6. 'N' is the total number of terminals ∆7. These dimensions to be determined at datum plane [-|-|-] 8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. ∆9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition, dam bar can not be located on the lower radius of the foot. 10. Controlling dimension millimeter. 11. Maximum allowable die thickness to be assembled in this package family is 0.38mm 12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD. ∆13. A1 is defined as the distance from the seating plane to the lowest point of the package body. ∆14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and are independent from die size. 15. Exposed pad shall be coplanar with bottom of package within 0.05. Product Abstract TFR / CPA Page 15 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 6. Marking/Order Code 6.1 Marking MLX81205/07/10/15 IC Version: 07/10 or 15 Silicon Revision: Character [A...Z] Lot Number Assembly Date Code: Week number Firmware Revision: Characters [AA...ZZ] 1 Assembly Date Code: Year Silicon Revision: Character [A...Z] Lot Number Assembly Date Code: Week number 1 Firmware Revision: Characters [AA...ZZ] Assembly Date Code: Year 6.2 Order Code MLX81205/07/10/15 Product Abstract TFR / CPA Page 16 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 7. Assembly Information This Melexis device is classified and qualified regarding soldering technology, solder ability and moisture sensitivity level, as defined in this specification, according to following test methods: • • • • • • IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification For No hermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of No hermetic Surface Mount Devices Prior to Reliability Testing (Reflow profiles according to table 2) CECC00802 Standard Method For The specification of Surface Mounting Components (SMD’s) of Assessed Quality EIA/JEDEC JESD22-B106 Resistance to soldering temperature for through-hole mounted devices EN60749-15 Resistance to soldering temperature for through-hole mounted devices MIL 883 Method 2003 / EIA/JEDEC JESD22-B102 Solder ability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Based on Melexis commitment to environmental responsibility, European legislation (Directive on the restriction of the use of certain hazardous substances, RoHS) and customer requests, Melexis has installed a roadmap to qualify their package families for lead free processes also. Various lead free generic qualifications are running, current results on request. For more information on Melexis lead free statement see quality page at our website: http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf Product Abstract TFR / CPA Page 17 of 18 Rev 3.9 11-May-2012 MLX81205/07/10/15 8. Disclaimer The product abstract just provides an overview of the described devices. Please consult the complete product specification/datasheet in its latest revision for any detailed information. Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © Melexis NV. All rights reserved For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: Phone: +32 1367 0495 E-mail: [email protected] America: Phone: +1 248 306 5400 E-mail: [email protected] ISO/TS16949 and ISO14001 Certified Product Abstract TFR / CPA Page 18 of 18 Rev 3.9 11-May-2012