ON NCP698SQ50T1G 150 ma cmos ultra low iq and ignd ldo regulator with enable Datasheet

NCP698
150 mA CMOS Ultra Low Iq
and IGND LDO Regulator
with Enable
This series of fixed output low-dropout linear regulators are
designed for handheld communication equipment and portable battery
powered applications which require low quiescent and ground current.
This series features an ultra-low quiescent current of 2.5 A. Each
device contains a voltage reference unit, an error amplifier, a PMOS
power transistor, resistors for setting output voltage, current limit, and
temperature limit protection circuits. The NCP698 series provides an
enable pin for ON/OFF control.
The NCP698 has been designed to be used with low cost ceramic
capacitors and requires a minimum output capacitor of 0.1 F. The
device is housed in the micro-miniature SC82-AB surface mount
package. Standard voltage versions are 1.3, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3,
3.5 and 5.0 V. Other voltages are available in 100 mV steps.
http://onsemi.com
4
1
SC82-AB (SC70-4)
SQ SUFFIX
CASE 419C
Features
PIN CONNECTIONS &
MARKING DIAGRAMS
•Ultra Low Quiescent Current of 2.5 A Typical
•Output Voltage Accuracy of 2.0%
•Operating Temperature Range of -40°C to 85°C
•Enable Function
•This is a Pb-Free Device
GND 1
xxxMG
G
Vin 2
Typical Applications
•Battery Powered Instruments
•Hand-Held Instruments
•Camcorders and Cameras
xxx
M
G
OFF
Input
= Specific Device Code
= Month Code*
= Pb-Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position and
underbar may vary depending upon manu‐
facturing location.
GND Enable
Output
C1
3 Vout
Top View)
ON
Vin
4 Enable
Vout
+
+
ORDERING INFORMATION
C2
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
This device contains 28 active transistors
Figure 1. Typical Application Diagram
© Semiconductor Components Industries, LLC, 2007
November, 2007 - Rev. 0
1
Publication Order Number:
NCP698/D
NCP698
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
1
GND
Description
2
Vin
Positive power supply input voltage.
3
Vout
Regulated output voltage.
4
Enable
-
N/C
Power supply ground.
This input is used to place the device into low-power standby. When this input is pulled low, the
device is disabled. If this function is not used, Enable should be connected to Vin.
No internal connection.
MAXIMUM RATINGS
Rating
Symbol
Input Voltage
Value
Unit
Vin
6.0
V
Enable Voltage
Enable
-0.3 to Vin +0.3
V
Output Voltage
Vout
-0.3 to Vin +0.3
V
Power Dissipation and Thermal Characteristics (Note 1)
Power Dissipation
Thermal Resistance, Junction-to-Ambient (1 oz copper, 1 in2 copper area)
PD
RJA
Internally Limited
235
W
°C/W
Operating Junction Temperature
TJ
+150
°C
Operating Ambient Temperature
TA
-40 to +85
°C
Storage Temperature
Tstg
-55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to Electrical Characteristics and Application Information for Safe Operating Area.
2. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL-STD-883, Method 3015
Machine Model Method 200 V
3. Latch up capability (85°C) "100 mA DC with trigger voltage.
http://onsemi.com
2
NCP698
ELECTRICAL CHARACTERISTICS
(Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TA = 25°C, unless otherwise noted. Note 4)
Characteristic
Symbol
Min
Typ
Max
1.261
1.455
1.746
2.425
2.744
2.940
3.234
3.430
4.900
1.3
1.5
1.8
2.5
2.8
3.0
3.3
3.5
5.0
1.339
1.545
1.854
2.575
2.856
3.060
3.366
3.570
5.100
1.261
1.455
1.746
2.425
2.716
2.910
3.201
3.430
4.900
1.3
1.5
1.8
2.5
2.8
3.0
3.3
3.5
5.0
1.339
1.545
1.854
2.575
2.884
3.090
3.399
3.570
5.100
-
10
10
20
20
-
20
60
150
150
280
280
-
-
750
550
400
250
200
140
1200
800
550
400
350
200
-
1050
870
700
520
370
280
1500
1070
900
700
525
400
IDIS
-
0.1
1.0
A
IQ
-
2.5
-
A
IGND
-
2.5
6.0
Output Voltage (Iout = 1.0 mA)
1.3 V
1.5 V
1.8 V
2.5 V
2.8 V
3.0 V
3.3 V
3.5 V
5.0 V
Vout
Output Voltage (TA = -40 to +85°C, Iout = 1.0 mA)
1.3 V
1.5 V
1.8 V
2.5 V
2.8 V
3.0 V
3.3 V
3.5 V
5.0 V
Vout
Line Regulation
1.5 V-4.4 V (Vin = Vo(nom.) + 1.0 V to 6.0 V
4.5 V-5.0 V (Vin = 5.5 V to 6.0 V)
Regline
Load Regulation (Iout = 10 mA to 150 mA)
Regload
Output Current (Vout = (Vout at Iout = 150 mA) -3.0%)
1.3 V to 3.9 V (Vin = Vout(nom.) + 2.0 V)
4.0 V-5.0 V (Vin = 6.0 V)
Io(nom.)
Dropout Voltage (TA = -40°C to 85°C, Iout = 80 mA, Measured at Vout -3.0%)
1.3 V
1.5 V
1.8 V
2.5 V-2.8 V
3.0 V-3.5 V
5.0 V
Vin-Vout
Dropout Voltage (TA = -40°C to 85°C, Iout = 150 mA, Measured at Vout -3.0%)
1.3 V
1.5 V
1.8 V
2.5 V-2.8 V
3.0 V-3.5 V
5.0 V
Vin-Vout
Disable Current (Enable Input = 0 V)
Quiescent Current (Enable Input = Vin, Iout = 0 mA)
Ground Current (Enable Input = Vin, Iout = 1.0 mA to 150 mA)
Output Short Circuit Current
1.3 V to 3.9 V (Vin = Vnom + 2.0 V)
4.0 V-5.0 V (Vin = 6.0 V)
V
V
mV
Vn
http://onsemi.com
3
mV
mA
mV
mV
Iout(max)
Output Voltage Noise (f = 100 Hz to 100 kHz, Vout = 3.0 V)
Unit
A
mA
150
150
300
300
600
600
-
100
-
Vrms
NCP698
ELECTRICAL CHARACTERISTICS (continued)
(Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TA = 25°C, unless otherwise noted. Note 4)
Enable Input Threshold Voltage
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Off, Logic Low)
Vth(en)
Output Voltage Temperature Coefficient
TC
V
1.3
-
-
0.3
-
"100
-
ppm/°C
4. Performance guaranteed over the indicated operating temperature range by design and/or characterization, production tested at TJ = TA =
25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
5. Maximum package power dissipation limits must be observed.
T
*TA
PD + J(max)
RJA
http://onsemi.com
4
NCP698
3
VIN = 4.0 V
VOUT = 3.0 V
IOUT = 0 mA
2.7
IQ, QUIESCENT CURRENT (A)
IQ, QUIESCENT CURRENT (A)
2.9
2.5
2.3
2.1
1.9
1.7
-60
VOUT = 3.0 V
2.5
2
1.5
1
0.5
0
-40
-20
0
20
40
60
80
100
0
1
3.5
3.015
3
VIN = 6.0 V
5
6
3.010
3.005
3.000
VIN = 4.0 V
IOUT = 30 mA
2.5
2
1.5
1
0.5
0
-40
-20
0
20
40
60
100
80
0
1
2
3
4
5
T, TEMPERATURE (°C)
VIN, INPUT VOLTAGE (V)
Figure 4. Output Voltage versus Temperature
Figure 5. Output Voltage versus Input Voltage
6
4
300
ENABLE
VOLTAGE (V)
VIN - VOUT, DROPOUT VOLTAGE (mV)
VOUT, OUTPUT VOLTAGE (V)
3.020
2.990
-60
4
Figure 3. Quiescent Current versus Input
Voltage
VOUT(nom) = 3.0 V
250
80 mA LOAD
200
150
2
VIN = 4.0 V
CIN = 1.0 F
0
3
VOUT, OUTPUT
VOLTAGE (V)
VOUT, OUTPUT VOLTAGE (V)
Figure 2. Quiescent Current versus Temperature
2.995
3
VIN, INPUT VOLTAGE (V)
T, TEMPERATURE (°C)
VOUT(nom) = 3.0 V
IOUT = 10 mA
2
40 mA LOAD
100
50
10 mA LOAD
0
-50
-25
0
25
50
75
100
COUT = 0.1 F
IOUT = 10 mA
2
1
0
125
0
T, TEMPERATURE (°C)
50
100
150
200
250
300
t, TIME (s)
Figure 6. Dropout Voltage versus Temperature
Figure 7. Turn-On Response
http://onsemi.com
5
350 400
IOUT, OUTPUT
CURRENT (mA)
6
5
4
3
1
OUTPUT VOLTAGE
DEVIATION (mV)
OUTPUT VOLTAGE
DEVIATION (V)
VIN, INPUT
VOLTAGE (V)
NCP698
0.5
0
VOUT = 3.0 V
COUT = 0.1 F
IOUT = 10 mA
-0.5
-1
0
50
100 150 200 250 300 350 400
t, TIME (s)
60
IOUT = 1 mA to 30 mA
VIN = 4.0 V
30
0
-30
1
VOUT = 3.0 V
COUT = 0.1 F
0.5
0
-0.5
-1
450 500
0
60
IOUT = 1 mA to 30 mA
VIN = 4.0 V
30
0
-30
400
200
0
COUT = 1.0 F
VOUT = 3.0 V
-200
-400
0
100 200
100 150 200 250 300 350 400
t, TIME (s)
450 500
Figure 9. Load Transient Response
Vn, OUTPUT VOLTAGE NOISE (mV/√Hz )
OUTPUT VOLTAGE
DEVIATION (mV)
IOUT, OUTPUT
CURRENT (mA)
Figure 8. Line Transient Response
50
3.5
VIN = 5.0 V
VOUT = 3.0 V
IOUT = 50 mA
COUT = 0.1 F
3
2.5
2
1.5
1
0.5
0
300 400 500 600 700 800 900 1000
t, TIME (s)
0.01
Figure 10. Load Transient Response
0.1
1
10
f, FREQUENCY (kHz)
100
1000
Figure 11. Output Voltage Noise
DEFINITIONS
Load Regulation
Line Regulation
The change in output voltage for a change in output current
at a constant temperature.
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low dissipation
or by using pulse technique such that the average chip
temperature is not significantly affected.
Dropout Voltage
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 3.0% below
its nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Line Transient Response
Typical over and undershoot response when input voltage
is excited with a given slope.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 160°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Maximum Power Dissipation
The maximum total dissipation for which the regulator
will operate within its specifications.
Quiescent Current
The quiescent current is the current which flows through
the ground when the LDO operates without a load on its
output: internal IC operation, bias, etc. When the LDO
becomes loaded, this term is called the Ground current. It is
actually the difference between the input current (measured
through the LDO input pin) and the output current.
Maximum Package Power Dissipation
The maximum power package dissipation is the power
dissipation level at which the junction temperature reaches its
maximum operating value, i.e. 125°C. Depending on the
ambient power dissipation and thus the maximum available
output current.
http://onsemi.com
6
NCP698
APPLICATIONS INFORMATION
A typical application circuit for the NCP698 is shown in
Figure 1.
on the PCB, the board material and also the ambient
temperature effect the rate of temperature rise for the part.
This is stating that when the devices have good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
The maximum dissipation the package can handle is
given by:
Input Decoupling (C1)
A 1.0 F capacitor either ceramic or tantalum is
recommended and should be connected close to the NCP698
package. Higher values and lower ESR will improve the
overall line transient response.
TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K
T
*TA
PD + J(max)
RJA
Output Decoupling (C2)
If junction temperature is not allowed above the
maximum 125°C, then the NCP698 can dissipate up to
250 mW @ 25°C.
The power dissipated by the NCP698 can be calculated
from the following equation:
The NCP698 is a very stable regulator and does not
require any specific Equivalent Series Resistance (ESR) or
a minimum output current. Capacitors exhibiting ESRs
ranging from a few m up to 10 can thus safely be used.
The minimum decoupling value is 0.1 F and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors as well as
tantalum devices. Larger values improve noise rejection and
load regulation transient response.
TDK capacitor: C2012X5R1C105K, C1608X5R1A105K,
or C3216X7R1C105K
Ptot + [Vin * Ignd(Iout)] ) [Vin * Vout] * Iout
or
P ) Vout * Iout
VinMAX + tot
Ignd ) Iout
If an 80 mA output current is needed then the ground
current from the data sheet is 2.5 A. For an NCP698
(3.0 V), the maximum input voltage will then be 6.0 V.
Enable Operation
The enable pin will turn on the regulator when pulled high
and turn off the regulator when pulled low. These limits of
threshold are covered in the electrical specification section
of this data sheet. If the enable is not used, then the pin
should be connected to Vin.
350
330
310
290
JA (C/W)
Hints
Please be sure the Vin and GND lines are sufficiently
wide. When the impedance of these lines is high, there is a
chance to pick up noise or cause the regulator to
malfunction.
Place external components, especially the output
capacitor, as close as possible to the circuit, and make leads
as short as possible.
270
No pin connected to Cu Plane
250
230
210
190
Pin 2 connected to Cu Plane
170
150
0
Thermal
100
200
300
400
500
PCB COPPER AREA (mm2)
As power across the NCP698 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
Figure 12. RqJA vs. Pad Copper Area
(1 oz Cu thickness)
http://onsemi.com
7
600
700
NCP698
ORDERING INFORMATION
Nominal
Output Voltage
Marking
NCP698SQ13T1G
1.3
LJW
NCP698SQ15T1G
1.5
LJX
NCP698SQ18T1G
1.8
LJY
NCP698SQ25T1G
2.5
LJZ
NCP698SQ28T1G
2.8
LKD
NCP698SQ30T1G
3.0
LKA
NCP698SQ33T1G
3.3
LKB
NCP698SQ35T1G
3.5
LKE
NCP698SQ50T1G
5.0
LKC
Device
Package
Shipping†
SC82-AB
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
8
NCP698
PACKAGE DIMENSIONS
SC-82AB
CASE 419C-02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C-01 OBSOLETE. NEW STANDARD IS
419C-02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
C
D 3 PL
N
4
K
B
S
1
2
H
J
F
L
MILLIMETERS
MIN
MAX
1.8
2.2
1.15
1.35
0.8
1.1
0.2
0.4
0.3
0.5
1.1
1.5
0.0
0.1
0.10
0.26
0.1
--0.05 BSC
0.2 REF
1.8
2.4
DIM
A
B
C
D
F
G
H
J
K
L
N
S
3
0.05 (0.002)
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.008
0.016
0.012
0.020
0.043
0.059
0.000
0.004
0.004
0.010
0.004
--0.002 BSC
0.008 REF
0.07
0.09
SOLDERING FOOTPRINT*
1.30
0.0512
0.65
0.026
1.90
0.95 0.075
0.037
0.90
0.035
0.70
0.028
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
.PO. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81-3-5773-3850
http://onsemi.com
9
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP698/D
Similar pages