SEMICONDUCTOR TECHNICAL DATA The MC10E/100E122 is a 9-bit buffer. The device contains nine non-inverting buffer gates. • 500ps Max. Propagation Delay • Extended 100E VEE Range of – 4.2V to – 5.46 V • 75kΩ Input Pulldown Resistors 9-BIT BUFFER Pinout: 28-Lead PLCC (Top View) D8 NC NC 25 24 23 VCCO NC 22 21 Q8 VCCO 20 19 D7 26 18 Q7 D6 27 17 Q6 D5 28 16 VCC VEE 1 15 Q5 D4 2 14 Q4 D3 3 13 VCCO D2 4 12 Q3 5 6 7 8 9 10 11 D1 D0 VCCO Q0 Q1 VCCO Q2 FN SUFFIX PLASTIC PACKAGE CASE 776-02 LOGIC DIAGRAM * All VCC and VCCO pins are tied together on the die. PIN NAMES Pin D0 Q0 D1 Q1 D2 Q2 D3 Q3 Function D0 – D8 Data Inputs D4 Q4 Q0 – Q8 Data Outputs D5 Q5 D6 Q6 D7 Q7 D8 Q8 12/93 Motorola, Inc. 1996 2–1 REV 2 MC10E122 MC100E122 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min 85°C typ max 200 min typ 200 max Unit 200 µA Condition mA 41 41 49 49 41 41 49 49 41 47 49 57 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic tPLH tPHL Propagation Delay to Output D to Q tSKEW Within-Device Skew D to Q tr tf Rise/Fall Times 20 - 80% 25°C 85°C min typ max min typ max min typ max 150 350 500 150 350 500 150 350 500 Unit Condition ps ps 75 75 75 1 ps 300 425 800 300 425 800 300 425 800 1. Within-device skew is defined as identical transitions on similar paths through a device. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E122 MC100E122 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E122 MC100E122 Motorola reserves the right to make changes without further notice to any products herein. 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