Material Content Data Sheet Sales Product Name ICE2A180Z MA# MA001412072 Package PG-DIP-7-3 Issued 7. October 2015 Weight* 646.19 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7.151 1.11 0.048 0.01 0.194 0.03 300 3.872 0.60 5992 157.218 24.33 24.97 243300 249667 0.260 0.04 0.04 403 403 2.330 0.36 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.11 11066 11066 75 3605 62.904 9.73 400.723 62.01 72.10 620131 721082 6.540 1.01 1.01 10121 10121 1.594 0.25 0.25 2467 2467 0.587 0.09 2.769 0.43 97346 909 0.52 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4285 5194 1000000