TI1 LM95071 Lm95071/lm95071-q1 spi/microwire 13-bit plus sign temperature sensor Datasheet

LM95071, LM95071-Q1
www.ti.com
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
LM95071/LM95071-Q1 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor
Check for Samples: LM95071, LM95071-Q1
FEATURES
•
1
•
•
23
•
•
•
Small SOT-23 Package Saves Space
Shutdown Mode Conserves Power Between
Temperature Readings
Operates Over a Full −40°C to +150°C Range
SPI and MICROWIRE Bus Interface
LM95071-Q1 is AEC-Q100 Grade 0 qualified
and is manufactured on an Automotive Grade
flow
APPLICATIONS
•
•
•
•
•
•
•
Automotive
System Thermal Management
Portable Electronic Devices
Personal Computers
Disk Drives
Office Electronics
Electronic Test Equipment
•
Temperature Accuracy
– 0°C to 70°C ±1°C (max)
– −40°C to 150°C ±2°C (max)
Temperature Resolution 0.03125 °C
DESCRIPTION
The LM95071/LM95071-Q1 is a low-power, highresolution digital temperature sensor with an SPI and
MICROWIRE compatible interface, available in the 5pin
SOT-23.
The
host
can
query
the
LM95071/LM95071-Q1 at any time to read
temperature. Its low operating current is useful in
systems where low power consumption is critical.
The LM95071/LM95071-Q1 has 13-bit plus sign
temperature resolution (0.03125°C per LSB) while
operating over a temperature range of −40°C to
+150°C.
The LM95071/LM95071-Q1’s 2.4V to 5.5V supply
voltage range, fast conversion rate, low supply
current, and simple SPI interface make it ideal for a
wide range of applications.
KEY SPECIFICATIONS
•
•
Supply Voltage 2.4V to 5.5V
Supply Current
– operating 280 µA (typ)
– shutdown 6 µA (typ)
Simplified Block Diagram
Connection Diagram
VDD
1
5
CS
LM95071/
LM95071-Q1
2
GND
Temperature
Sensor
Circuitry
14-Bit
Delta-Sigma
A/D Converter
3
SI/O
Control
Logic
CS
Manufacturer's
ID Register
LM95071/
LM95071-Q1
4
SC
SOT-23
(TOP VIEW)
See Package Number DBV (R-PDSO-G5)
Temperature
Register
Three-Wire
Serial Interface
VDD
SI/O
SC
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
TRI-STATE is a registered trademark of National Semiconductor Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated
LM95071, LM95071-Q1
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
www.ti.com
Pin Description
Pin
Number
Symbol
Name
Description
1
CS
Chip Select input
This pin receives an active-low signal from the controller to select the device.
2
GND
Ground
This is the power and signal ground return.
3
SI/O
Serial Input/Output
This serial, bidirectional, data bus pin transmits and receives signals to and from the
controller. Schmitt trigger input in the input mode.
4
SC
Serial bus clock
This serial clock signal comes from the controller. Schmitt trigger input.
5
VDD
Positive Supply Voltage
Supply a DC voltage from 2.4V to 5.5V to this pin and bypass with a 0.1 µF ceramic
capacitor to ground.
Typical Application
+3.3V
LM95071/
LM95071-Q1
L0(GPI/O)
National
COP8SA
Microcontroller
CS
0.1 PF
VDD
SI
SI/O
SK
SC
GND
Figure 1. COP Microcontroller Interface
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
−0.3V to 6.0V
Supply Voltage
−0.3V to VDD + 0.3V
Voltage at any Pin
Input Current at any Pin
(2)
5 mA
−65°C to +150°C
Storage Temperature
ESD Susceptibility
(3)
Human Body Model
2000V
Machine Model
200V
Soldering process must comply with Reflow Temperature Profile specifications.
Refer to http://www.ti.com/packaging. (4)
(1)
(2)
(3)
(4)
2
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its rated operating conditions.
When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD) the current at that pin should be limited to
5 mA.
Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin.
Reflow temperature profiles are different for lead-free and non-lead-free packages.
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
LM95071, LM95071-Q1
www.ti.com
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
Operating Ratings
Specified Temperature Range (1), TMIN to TMAX
−40°C to +150°C
Supply Voltage Range (VDD)
2.4V to +5.5V
The life expectancy of the LM95071/LM95071-Q1 will be reduced when operating at elevated temperatures. LM95071/LM95071-Q1 θJA
(thermal resistance, junction-to-ambient) when attached to a printed circuit board with 2 oz. foil is summarized in the table below.
(1)
Thermal Characteristics
Device Number
Package Number
Thermal Resistance (θJA)
LM95071CIMF
MF05A
250°C/W
Temperature-to-Digital Converter Characteristics
Unless otherwise noted, these specifications apply for VDD = 3.3V . Boldface limits apply for TA = TJ = TMIN to TMAX; all
other limits TA = TJ = +25°C, unless otherwise noted.
Limits (2)
Unit
(Limit)
VDD = 3.0V to 3.6V; TA = 0°C to +70°C
±1.0
°C (max)
VDD = 3.0V to 3.6V; TA = −40°C to +150°C
±2.0
°C (max)
VDD = 3.6V to 5.5V; TA = 0°C to +70°C
+0.3
VDD = 3.0V to 2.4V; TA = 0°C to +70°C
-0.6
Parameter
Temperature Error
Typical (1)
Test Conditions
(3)
Line Regulation
Resolution
14
0.03125
(4)
Temperature Conversion Time
Quiescent Current
Operating, Serial Bus Inactive
Shutdown
(1)
(2)
(3)
(4)
°C/V (max)
Bits
°C
130
228
ms (max)
280
520
µA (max)
6
28
µA (max)
Typicals are at TA = 25°C and represent most likely parametric norm.
Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
The LM95071/LM95071-Q1 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.
This specification is provided only to indicate how often temperature data is updated. The LM95071/LM95071-Q1 can be read at any
time without regard to conversion state (and will yield last conversion result). A conversion in progress will not be interrupted. The output
shift register will be updated at the completion of the read and a new conversion restarted.
LOGIC ELECTRICAL CHARACTERISTICS
DIGITAL DC CHARACTERISTICS
Unless otherwise noted, these specifications apply for VDD = 2.4 to 5.5V
all other limits TA = TJ = +25°C, unless otherwise noted.
Symbol
VIN(1)
VIN(0)
Parameter
Test Conditions
(1)
. Boldface limits apply for TA = TJ = TMIN to TMAX;
Typical (2)
Limits (3)
Logical “1” Input Voltage
Logical “0” Input Voltage
Unit
(Limit)
0.7 × VDD
V (min)
VDD + 0.3
V (max)
−0.3
V (min)
0.3 × VDD
V (max)
Input Hysteresis Voltage
VDD = 3.0V to 3.6V
0.4
0.33
V (min)
IIN(1)
Logical “1” Input Current
VIN = VDD
0.005
3.0
µA (max)
IIN(0)
Logical “0” Input Current
VIN = 0V
−0.005
−3.0
µA (min)
CIN
All Digital Inputs
VOH
High Level Output Voltage
IOH = −400 µA
2.25
V (min)
VOL
Low Level Output Voltage
IOL = +1.6 mA
0.4
V (max)
VO = GND
VO = VDD
−1
+1
µA (min)
µA (max)
IO_TRI-STATE
(1)
(2)
(3)
20
®
TRI-STATE Output Leakage Current
pF
The LM95071/LM95071-Q1 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.
Typicals are at TA = 25°C and represent most likely parametric norm.
Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
Submit Documentation Feedback
3
LM95071, LM95071-Q1
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
www.ti.com
SERIAL BUS DIGITAL SWITCHING CHARACTERISTICS
Unless otherwise noted, these specifications apply for VDD = 2.4V to 5.5V (1); CL (load capacitance) on output lines = 100 pF
unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless
otherwise noted.
Symbol
(1)
(2)
(3)
Test
Conditions
Parameter
Typical (2)
Limits (3)
Unit
(Limit)
µs (min)
(max)
t1
SC (Clock) Period
0.16
DC
t2
CS Low to SC (Clock) High Set-Up Time
100
ns (min)
t3
CS Low to Data Out (SO) Delay
70
ns (max)
t4
SC (Clock) Low to Data Out (SO) Delay
70
ns (max)
t5
CS High to Data Out (SO) TRI-STATE
200
ns (max)
t6
SC (Clock) High to Data In (SI) Hold Time
50
ns (min)
t7
Data In (SI) Set-Up Time to SC (Clock) High
30
ns (min)
t8
SC (Clock) High to CS High Hold Time
50
ns (min)
The LM95071/LM95071-Q1 will operate properly over the VDD supply voltage range of 2.4V to 5.5V.
Typicals are at TA = 25°C and represent most likely parametric norm.
Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
SC
tr
t1
t2
tf
t4
t4
CS
t3
SO
Figure 2. Data Output Timing Diagram
SC
SC
CS
CS
t5
SO
t5
SO
Figure 3. TRI-STATE Data Output Timing Diagram
4
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
LM95071, LM95071-Q1
www.ti.com
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
SC
SC
t7
t7
t8
t6
t6
CS
CS
SI
SI
t8
Figure 4. Data Input Timing Diagram
Electrical Characteristics
01,0010,1100,0000
Output Code
+25°C
+0.03125°C
00,0011,0010,0000
00,0000,0000,0001
Temperature
00,0000,0000,0000
0°C
-40°C
11,1111,1111,1111
-0.03125°C
+150°C
11,1100,1110,0000
-25°C
11,1011,0000,0000
Figure 5. Temperature-to-Digital Transfer Function (Non-linear scale for clarity)
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
Submit Documentation Feedback
5
LM95071, LM95071-Q1
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
www.ti.com
TRI-STATE Test Circuit
+3.3V
IOL = 1.6 mA
To LM95071/
LM95071-Q1
SI/O Pin
80 pF
1.4V
IOH = -1.6 mA
6
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
LM95071, LM95071-Q1
www.ti.com
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Static Supply Current vs. Temperature
Maximum Temperature Error
Figure 6.
Figure 7.
Conversion Time vs Temperature
Typical Output Noise at 30°C
Figure 8.
Figure 9.
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
Submit Documentation Feedback
7
LM95071, LM95071-Q1
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
www.ti.com
FUNCTIONAL DESCRIPTION
The LM95071/LM95071-Q1 temperature sensor incorporates a temperature sensor and 13-bit-plus-sign ΔΣ ADC
(Delta-Sigma Analog-to-Digital Converter). Compatibility of the LM95071/LM95071-Q1's three-wire serial
interface with SPI and MICROWIRE allows simple communications with common microcontrollers and
processors. Shutdown mode can be used to optimize current drain for different applications. A
Manufacturer/Device ID register identifies the LM95071/LM95071-Q1 as a Texas Instruments product.
POWER UP AND POWER DOWN
The LM95071/LM95071-Q1 always powers up in a known state and in the continuous conversion mode.
Immediately after power up, the LM95071/LM95071-Q1 will output an erroneous code until the first temperature
conversion has completed.
When the supply voltage is less than about 1.6V (typical), the LM95071/LM95071-Q1 is considered powered
down. As the supply voltage rises above the nominal 1.6V power up threshold, the internal registers are reset to
the power up default state described above.
SERIAL BUS INTERFACE
The LM95071/LM95071-Q1 operates as a slave and is compatible with SPI or MICROWIRE bus specifications.
Data is clocked out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC.
A complete communication is framed by falling and rising chip select (CS) signal. The CS signal should be held
high for at least one clock cycle (160 ns minimum) between communications. The transmit-only communication
(register read) consists of 16 clock cycles. A complete transmit/receive communication will consist of 32 serial
clocks (see SERIAL BUS TIMING DIAGRAMS). The first 16 clocks comprise the transmit phase of
communication, while the second 16 clocks are the receive phase.
When CS is high SI/O will be in TRI-STATE. Communication should be initiated by taking chip select (CS) low.
This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O)
will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of
the data will be clocked out by the falling edge of SC. CS can be taken high at any time during the transmit
phase. If CS is brought low in the middle of a conversion the LM95071/LM95071-Q1 will complete the conversion
and the output shift register will be updated after CS is brought back high.
The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The
LM95071/LM95071-Q1 will read the data available on the SI/O line on the rising edge of the serial clock. Input
data is to an 8-bit shift register. The part will detect the last eight bits shifted into the register. The receive phase
can last up to 16 SC periods. All ones must be shifted in order to place the part into shutdown. All zeros must be
shifted in order to place the LM95071/LM95071-Q1 into continuous conversion mode. Only the following codes
should be transmitted to the LM95071/LM95071-Q1:
• 00 hex for continuous conversion
• FF hex for shutdown
Another code may place the part into a test mode. Test modes are used by Texas Instruments to thoroughly test
the function of the LM95071/LM95071-Q1 during production testing. Only eight bits have been defined above
since only the last eight transmitted are detected by the LM95071/LM95071-Q1, before CS is taken HIGH.
The following communication can be used to determine the Manufacturer's/Device ID and then immediately place
the part into continuous conversion mode. With CS continuously low:
• Read 16 bits of temperature data
• Write 16 bits of data commanding shutdown
• Read 16 bits of Manufacture's/Device ID data
• Write 8 to 16 bits of data commanding Conversion Mode
• Take CS HIGH.
Note that 228 ms (max) will have to pass for a conversion to complete before the LM95071/LM95071-Q1 actually
transmits temperature data.
8
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
LM95071, LM95071-Q1
www.ti.com
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
TEMPERATURE DATA FORMAT
Temperature data is represented by a 14-bit, two's complement word with an LSB (Least Significant Bit) equal to
0.03125°C:
Digital Output
Temperature
Binary
Hex
+150°C
0100 1011 0000 0011
4B03
+125°C
0011 1110 1000 0011
3E83
+25°C
0000 1100 1000 0011
0C83
+0.03125°C
0000 0000 0000 0111
0007
0°C
0000 0000 0000 0011
0003
−0.03125°C
1111 1111 1111 1111
FFFF
−25°C
1111 0011 1000 0011
F383
−40°C
1110 1100 0000 0011
EC03
The first data byte is the most significant byte with most significant bit first, permitting only as much data as
necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature
data indicate an overtemperature condition, the host processor could immediately take action to remedy the
excessive temperatures.
SHUTDOWN MODE/MANUFACTURER ID
The master controller may enable the shutdown mode for the purpose of reducing power consumption or for
reading the Manufacturer/Device ID information. The shutdown mode is enabled by writing XX FF hex to the
LM95071/LM95071-Q1 as shown in Figure 13c. The serial bus is still active when the LM95071/LM95071-Q1 is
in shutdown. When in shutdown mode the LM95071/LM95071-Q1 always will output 1000 0000 0000 1111. This
is the Manufacturer/Device ID information. The first 5-bits of the field (1000 0XXX) are reserved for the
manufacturer ID.
INTERNAL REGISTER STRUCTURE
The LM95071/LM95071-Q1 has three registers: the temperature register, the configuration register and the
Manufacturer/Device identification register. The temperature and Manufacturer/Device identification registers are
read only. The configuration register is write only.
Configuration Register
(Selects shutdown or continuous conversion modes):
Table 1. (Write Only):
D15
D14
D13
D12
D11
D10
D9
D8
X
X
X
X
X
X
X
X
D7
D6
D5
D4
D3
D2
D1
D0
Shutdown
D0–D15 set to XX FF hex enables shutdown mode.
D0–D15 set to XX 00 hex sets continuous-conversion mode.
Note: setting D0-D15 to any other values may place the LM95071/LM95071-Q1 into a manufacturer's test mode,
upon which the LM95071/LM95071-Q1 will stop responding as described. These test modes are to be used for
Texas Instruments production testing only. See SERIAL BUS INTERFACE for a complete discussion.
Temperature Register
Table 2. (Read Only):
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
MSB
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit1
LSB
1
1
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
Submit Documentation Feedback
9
LM95071, LM95071-Q1
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
www.ti.com
D0–D1: Logic 1 will be output on SI/0.
D2–D15: Temperature Data. One LSB = 0.03125°C. Two's complement format.
Manufacturer/Device ID Register
Table 3. (Read Only):
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
D0–D1: Logic 1 will be output on SI/0.
D2–D15: Manufacturer/Device ID Data. This register is accessed whenever the LM95071/LM95071-Q1 is in
shutdown mode.
10
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
LM95071, LM95071-Q1
www.ti.com
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
SERIAL BUS TIMING DIAGRAMS
1
8
SC
CS
SO
D15
D14
D8
Figure 10. Reading Continuous Conversion - Single Eight-Bit Frame
1
8
1
8
SC
CS
SO
D15
D14
D7
TRI-STATE
D2
Figure 11. Reading Continuous Conversion - Two Eight-Bit Frames
1
8
1
8
1
8
1
8
SC
CS
SI/O
D15 D14
D7
D15 D14
D2
Data from the LM95071/
LM95071-Q1
TRISTATE
D8
D7
D0
D6
Data from the Controller
Figure 12. Writing Shutdown Mode
1
8
1
8
1
8
1
8
SC
CS
SI/O
D15 D14
D7
D15 D14
D2
Data from the LM95071/
LM95071-Q1
TRISTATE
D8
D7
D6
D0
Data from the Controller
Figure 13. Writing Conversion Mode
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
Submit Documentation Feedback
11
LM95071, LM95071-Q1
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
www.ti.com
APPLICATION HINTS
THERMAL PATH CONSIDERATIONS
To get the expected results when measuring temperature with an integrated circuit temperature sensor like the
LM95071/LM95071-Q1, it is important to understand that the sensor measures its own die temperature. For the
LM95071/LM95071-Q1, the best thermal path between the die and the outside world is through the
LM95071/LM95071-Q1's pins. In the SOT-23 package, all the pins on the LM95071/LM95071-Q1 will have an
equal effect on the die temperature. Because the pins represent a good thermal path to the LM95071/LM95071Q1 die, the LM95071/LM95071-Q1 will provide an accurate measurement of the temperature of the printed circuit
board on which it is mounted. There is a less efficient thermal path between the plastic package and the
LM95071/LM95071-Q1 die. If the ambient air temperature is significantly different from the printed circuit board
temperature, it will have a small effect on the measured temperature.
OUTPUT CONSIDERATIONS: TIGHT ACCURACY, FINE RESOLUTION AND LOW NOISE
The LM95071/LM95071-Q1 is well suited for applications that require tight temperature measurement accuracy.
In many applications, from process control to HVAC, the low temperature error can mean better system
performance and, by eliminating a system calibration step, lower production cost.
With it's fine digital resolution the LM95071/LM95071-Q1 senses and reports very small changes in its
temperature, making it ideal for applications where temperature sensitivity is important. For example, the
LM95071/LM95071-Q1 enables the system to quickly identify the direction of temperature change, allowing the
processor to take compensating action before the system reaches a critical temperature.
The LM95071/LM95071-Q1 has very low output noise (see Figure 9 in the Typical Performance section), which
makes it ideal for applications where stable thermal compensation is a priority. For example, in a temperaturecompensated oscillator application, the very small deviation in successive temperature readings translates to a
stable frequency output from the oscillator.
Typical Applications
+5V
GPI/O
Intel
196
MicroController
LM95071/
LM95071-Q1
V+
CS
RXD
SI/O
TXD
SC
0.1 PF
GND
Figure 14. Temperature monitor using Intel 196 processor
12
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
LM95071, LM95071-Q1
www.ti.com
SNIS137D – AUGUST 2004 – REVISED SEPTEMBER 2013
+5V
68HC11
Microcontroller
LM95071/
LM95071-Q1
GPI/O1
10k
GPI/O2
MISO
CS
0.1 PF
VDD
SI/O
SC
GND
SC
Figure 15. LM95071/LM95071-Q1 digital input control using microcontroller's general purpose I/O.
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LM95071 LM95071-Q1
Submit Documentation Feedback
13
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM95071CIMF
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 150
T18C
LM95071CIMF/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 150
T18C
LM95071CIMFX
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 150
T18C
LM95071CIMFX/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 150
T18C
LM95071QIMF/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 150
T18Q
LM95071QIMFX/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 150
T18Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM95071, LM95071-Q1 :
• Catalog: LM95071
• Automotive: LM95071-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM95071CIMF
SOT-23
DBV
5
1000
178.0
8.4
LM95071CIMF/NOPB
SOT-23
DBV
5
1000
178.0
LM95071CIMFX
SOT-23
DBV
5
3000
178.0
LM95071CIMFX/NOPB
SOT-23
DBV
5
3000
LM95071QIMF/NOPB
SOT-23
DBV
5
LM95071QIMFX/NOPB
SOT-23
DBV
5
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM95071CIMF
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM95071CIMF/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM95071CIMFX
SOT-23
DBV
5
3000
210.0
185.0
35.0
LM95071CIMFX/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LM95071QIMF/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM95071QIMFX/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated