TI CY74FCT2245TQCT 8-bit transceiver Datasheet

Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT2245T
8-Bit Transceiver
SCCS037 - July 1994 - Revised March 2000
Features
Functional Description
• Function and pinout compatible with FCT and F logic
• 25Ω output series resistors to reduce transmission line
reflection noise
• FCT-C speed at 4.1 ns max.
FCT-A speed at 4.6 ns max.
• Edge-rate control circuitry for significantly improved
noise characteristics
• Power-off disable feature
• Fully compatible with TTL input and output logic levels
• ESD > 2000V
• Sink current
12 mA
Source current
15 mA
• Extended commercial temp. range of –40˚C to +85˚C
• Three-state outputs
Logic Block Diagram
The FCT2245T contains eight non-inverting, bidirectional buffers
with three-state outputs intended for bus oriented applications.
On-chip termination resistors have been added to the outputs to
reduce system noise caused by reflections. For this reason, the
FCT2245T can be used in an existing design to replace the
FCT245T. The FCT2245T current sinking capability is 12 mA at the
A and B ports.
The Transmit/Receive (T/R) input determines the direction of data
flow through the bidirectional transceiver. Transmit (Active HIGH)
enables data from A ports to B ports; receive (Active LOW) enables
data from B ports to A ports. The output enable (OE) input, when
HIGH, disables both the A and B ports by putting them in a High Z
condition.
The outputs are designed with a power-off disable feature to
allow for live insertion of boards.
Pin Configurations
T/R
OE
DIP/SOIC/QSOP
Top View
A0
B0
A1
B1
A2
B2
A3
B3
T/R
1
20
VCC
A0
2
19
OE
A1
3
18
B0
A2
4
17
B1
A3
5
16
B2
A4
6
15
B3
A5
7
14
B4
A6
8
13
B5
A7
9
12
B6
10
11
B7
GND
A4
FCT2245T–3
B4
A5
B5
A6
B6
A7
B7
FCT2245T–1
Function Table[1]
Inputs
OE
T/R
Output
L
L
Bus B Data to Bus A
L
H
Bus A Data to Bus B
H
X
High Z State
Note:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.
Copyright
© 2000, Texas Instruments Incorporated
CY74FCT2245T
Maximum Ratings[2,3]
DC Output Current (Maximum Sink Current/Pin) ...... 120 mA
Power Dissipation .......................................................... 0.5W
(Above which the useful life may be impaired. For user guidelines, not tested.)
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied .............................................–65°C to +135°C
Operating Range
Range
Range
Ambient
Temperature
VCC
Commercial
T, AT, CT
–40°C to +85°C
5V ± 5%
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
DC Input Voltage............................................ –0.5V to +7.0V
DC Output Voltage ......................................... –0.5V to +7.0V
Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
Min.
Typ.[5]
2.4
3.3
VOH
Output HIGH Voltage
VCC=Min., IOH=–15 mA
Com’l
VOL
Output LOW Voltage
VCC=Min., IOL=12 mA
Com’l
ROUT
Output Resistance
VCC=Min., IOL=12 mA
Com’l
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VH
Hysteresis[6]
All inputs
0.2
VIK
Input Clamp Diode Voltage
VCC=Min., IIN=–18 mA
–0.7
II
Input HIGH Current
IIH
20
Max.
Unit
V
0.3
0.55
V
25
40
Ω
2.0
V
0.8
V
V
–1.2
V
VCC=Max., VIN=VCC
5
µA
Input HIGH Current
VCC=Max., VIN=2.7V
±1
µA
IIL
Input LOW Current
VCC=Max., VIN=0.5V
IOS
Output Short Circuit Current[7]
VCC=Max., VOUT=0.0V
IOFF
Power-Off Disable
VCC=0V, VOUT=4.5V
–60
±1
µA
–225
mA
±1
µA
Typ.[5]
Max.
Unit
–120
Capacitance[6]
Parameter
Description
Test Conditions
CIN
Input Capacitance
5
10
pF
COUT
Output Capacitance
9
12
pF
Notes:
2. Unless otherwise noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
4. TA is the “instant on” case temperature.
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
2
CY74FCT2245T
Power Supply Characteristics
Parameter
Description
Test Conditions
Typ.[5]
Max.
Unit
ICC
Quiescent Power Supply Current
VCC=Max., VIN < 0.2V,
VIN > VCC–0.2V
0.1
0.2
mA
∆ICC
Quiescent Power Supply Current
(TTL inputs)
VCC=Max., VIN=3.4V,[8]
f1=0, Outputs Open
0.5
2.0
mA
ICCD
Dynamic Power Supply
Current[9]
VCC=Max., One Input Toggling,
50% Duty Cycle, Outputs Open,
T/R=OE=GND,
VIN < 0.2V or VIN > VCC–0.2V
0.06
0.12
mA/MHz
IC
Total Power Supply Current[10]
VCC=Max., 50% Duty Cycle,
Outputs Open,
One Bit Toggling at f1=10 MHz,
T/R=OE=GND,
VIN < 0.2V or VIN > VCC–0.2V
0.7
1.4
mA
VCC=Max.,
50% Duty Cycle, Outputs Open,
One Bit Toggling at f1=10 MHz,
T/R=OE=GND,
VIN=3.4V or VIN=GND
1.0
2.4
mA
VCC=Max.,
50% Duty Cycle, Outputs Open,
Eight Bits Toggling at f1=2.5 MHz,
T/R=OE=GND,
VIN < 0.2V or VIN > VCC–0.2V
1.3
2.6[11]
mA
VCC=Max.,
50% Duty Cycle, Outputs Open,
Eight Bits Toggling at f1=2.5 MHz,
T/R=OE=GND,
VIN=3.4V or VIN=GND
3.3
10.6[11]
mA
Notes:
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
= IQUIESCENT + IINPUTS + IDYNAMIC
10. IC
IC
= ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
= Duty Cycle for TTL inputs HIGH
DH
= Number of TTL inputs at DH
NT
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
f0
= Input signal frequency
f1
= Number of inputs changing at f1
N1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
3
CY74FCT2245T
]
Switching Characteristics—Over the Operating Range[12]
Parameter
Description
FCT2245T
FCT2245AT
FCT2245CT
Commercial
Commercial
Commercial
Min.
Max.
Min.
Max.
Min.
Max.
Unit
Fig.
No.[13]
tPLH
tPHL
Propagation Delay
An to Bn or Bn to An
1.5
7.0
1.5
4.6
1.5
4.1
ns
1, 3
tPZH
tPZL
Output Enable Time
1.5
9.5
1.5
6.2
1.5
5.8
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1.5
7.5
1.5
5.0
1.5
4.5
ns
1, 7, 8
Ordering Information—FCT2245T
Speed
(ns)
4.1
4.6
7.5
Ordering Code
Package
Name
Package Type
CY74FCT2245CTQCT
Q5
20-Lead (150-Mil) QSOP
CY74FCT2245CTSOC/SOCT
S5
20-Lead (300-Mil) Molded SOIC
CY74FCT2245ATPC
P5
20-Lead (300-Mil) Molded DIP
CY74FCT2245ATQCT
Q5
20-Lead (150-Mil) QSOP
CY74FCT2245ATSOC/SOCT
S5
20-Lead (300-Mil) Molded SOIC
CY74FCT2245TQCT
Q5
20-Lead (150-Mil) QSOP
CY74FCT2245TSOC/SOCT
S5
20-Lead (300-Mil) Molded SOIC
Notes:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
4
Operating
Range
Commercial
Commercial
Commercial
CY74FCT2245T
Package Diagrams
20-Lead (300-Mil) Molded DIP P5
20-Lead Quarter Size Outline Q5
5
CY74FCT2245T
Package Diagrams (continued)
20-Lead (300-Mil) Molded SOIC S5
6
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  2000, Texas Instruments Incorporated
Similar pages