FUJITSU SEMICONDUCTOR DATA SHEET DS04-23510-2E ASSP 1.0 GHz band Low Power I/Q Modulator For Direct Conversion MB54608L/MB54608B ■ DESCRIPTION The MB54608L/B is an I/Q Modulator for direct conversion method, and is used for up to 1.0 GHz band digital cellular phones such as GSM, PDC and so on. MB54608L consists of a frequency doubler, a Flip-flop type quadrature phase shifter, I/Q modulator and a mixer for frequency offset with a separate power supply. Fujitsu’s advanced Bipolar process has realized very low current operation(ICC = 16.5 mA @3 V). SSOP-20 and BCC-16 package are available.(MB54608L: SSOP-20, MB54608B: BCC-16) ■ FEATURES • Supporting GSM frequency band Output frequency: 1.0 GHz (max.) Output power: –4 dBm(Typical, VBB = 1.0 Vp-p input) • Low voltage operation: VCC = 2.6 V to 3.8 V (Continued) ■ PACKAGES 20-pin plastic SSOP 16-pad plastic BCC (FPT-20P-M03) (LCC-16P-M04) MB54608L/MB54608B (Continued) • Low current: Please refer to below table. • Offset mixer on-chip: The separate power supply control is possible. (only MB54608L) • Output power level switch (Mode) enables high power mode Offset Mixer not used Offset Mixer used Mode = Open Mode = GND Mode = Open Mode = GND Normal operation Icc 16.5 mA 19.0 mA 22.5 mA 25.0 mA Pout(VBB=1.0 Vp–p) –4 dBm –2 dBm –4 dBm –2 dBm Power down Ips 0.22 mA 0.44 mA Note:Typical values Further increase of the output power is possible by attaching a resistor at Pcnt pin. • Operating temperature range: Ta = –20 to +75°C 2 MB54608L/MB54608B ■ PIN ASSIGNMENTS • MB54608L (SSOP-20) (TOP VIEW) RFin 1 20 Pcnt GND 2 19 PSQ IFin 3 18 Out VCCM 4 17 PSM 16 VCC LO 5 LOX 6 15 Mode VCC 7 14 I GND 8 13 XI GND 9 12 XQ GND 10 11 Q (FPT-20P-M03) • MB54608B (BBC-16) (TOP VIEW) XQ 1 XI Q GND 16 15 14 GND 2 13 VCC I 3 12 LOX Mode 4 11 LO VCC 5 10 N.C. Out 6 9 GND 7 8 PSQ N.C. (LCC-16P-M04) Note: MB54608B doesn’t have the off-set Mixer and Pcnt pin. 3 MB54608L/MB54608B ■ PIN DESCRIPTIONS • MB54608L (SSOP-20) 4 Pin no. Symbol I/O Descriptions 1 RFin I 2 GND — 3 IFin I 4 VccM — Power supply for the offset mixer. Power-on/off is possible indepently to the modulator. When the offset mixer is not used, this pin should be switched OFF. 5 Lo I/O Lo input for the I/Q modulator (Output for the offset mixer.) 6 Lox I/O Lo complementary input for the I/Q modulator (Complementary output for the offset mixer.) 7 Vcc — Power supply for the I/Q modulator. 8 GND — Ground. 9 GND — Ground. 10 GND — Ground. 11 Q I Q signal input for the I/Q modulator. 12 XQ I Q signal complementary input for the I/Q modulator. 13 XI I I signal complementary input for the I/Q modulator. 14 I I I signal input for the I/Q modulator. 15 Mode — Output mode switch. Mode = Open: Low power mode. Mode = GND: High power mode. This pin should be connected to ground or left open. 16 Vcc — Power supply for the I/Q modulator. 17 PSM I Power saving control for the offset mixer. When PSM = L(GND), power down mode is selected. When the offset mixer is not used, this pin should be connected to Vcc voltage level or ground. 18 Out O Output for the I/Q modulator. (Open collector) Open is prohibited when power is supplied to Vcc pin. 19 PSQ I Power saving control for the I/Q modulator. When PSQ = L(GND), power down mode is selected. 20 Pcnt — RF input for the offset mixer. When the offset mixer is not used, this pin should be opened. Ground. IF input for the offset mixer. When the offset mixer is not used, this pin should be opened. Further, increasing the output power level is possible by attaching a resistor between Pcnt pin and ground externally. MB54608L/MB54608B • MB54608B (BCC-16) Pin no. Pin nane I/O Descriptions 1 XQ I Q signal complementary input for the I/Q modulator. 2 XI I I signal complementary input for the I/Q modulator. 3 I I I signal input for the I/Q modulator. 4 Mode — Output mode switch. Mode=Open: Low power mode. Mode=GND: High power mode. This pin should be connected to ground or left open. 5 Vcc — Power supply for the I/Q modulator. 6 Out O Output for the I/Q modulator. (Open collector) Open is prohibited when power is supplied to Vcc pin. 7 PSQ I Power saving control for the I/Q modulator. When PSQ = L(GND), power down mode is selected. 8 N.C. — No connection. 9 GND — Ground. 10 N.C. — No connection. 11 Lo I/O Lo input for the I/Q modulator (Output for the offset mixer.) 12 Lox I/O Lo complementary input for the I/Q modulator (Complementary output for the offset mixer.) 13 Vcc — Power supply for the I/Q modulator. 14 GND — Ground. 15 GND — Ground. 16 Q I Q signal input for the I/Q modulator. 5 MB54608L/MB54608B ■ BLOCK DIAGRAM VCCM PSM Offset Mixer LO I XI PSQ VCC I/Q Modulator 0° ×2 RFin φ 1/2 Σ −90° Out Pcnt Mode IFin LOX GND Q XQ Note: MB54608B doesn’t have VCCM, PSM, RFin, IFin and Pcnt pins. 6 MB54608L/MB54608B ■ ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Min. Max. Unit Power supply voltage VCC –0.5 +5.0 V Output voltage VO –0.5 VCC + 0.5 (<5.0) V Input voltage VI –0.5 VCC + 0.5 (<5.0) V VOC VCC – 0.3 (–0.5) VCC + 0.3 (5.0) V IO 0 +10 mA Tstg –55 +125 °C Allowed voltage on the open collector pin Output current Storage temperature Remarks Out pin, Open is prohibited. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS Parameter Symbol Value Unit Remarks Min. Typ. Max. VCC 2.6 3.0 3.8 V VI GND — VCC V Allowed voltage on the open collector pin VOC VCC – 0.2 — VCC + 0.2 V Out pin. Open is prohibited. Operating temperature Ta –20 — +75 V Ambient temperature. Power supply voltage Input voltage WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 7 MB54608L/MB54608B ■ ELECTRICAL CHARACTERISTICS 1. DC CHARACTERISTICS (MB54608L, MB54608B) (Ta = +25°C, VCC = 3.0 V) Parameter Power supply current Power down current Power down pin input voltage Power down pin input current Pcnt pin load resistance Symbol Value Min. Typ. Max. Unit Remarks Offset mix. Mode pin 12.0 16.5 24.5 mA Not used Open 13.5 19.0 28.0 mA Not used GND 16.0 22.5 33.5 mA Used Open 18.0 25.0 37.0 mA Used GND — 220 310 µA Not used — 440 620 µA Used Don’t care VIHPS VCC × 0.7 — — V VILPS — — VCC × 0.3 V IIHPS — — 5.0 µA VIH = VCC IILPS –50 — — µA VIL = GND Rcnt 50 — — Ω ICC IPS DC. No AC signal input. PSM, PSQ Value Note: MB54608B doesn’t have Offset mix., so please refer to “offset mix. = Not used” column in regard to power supply current. 8 MB54608L/MB54608B 2. AC CHARACTERISTICS • A case of the offset mixer is used. (only MB54608L) (Ta = +25°C, VCC = 3.0 V) Parameter Baseband input Min. Typ. Max. Unit Remarks fBB DC — 10 MHz Input amplitude VBB 0.3 1.0 1.3 Vp-p Single ended input Offset voltage VOS 1.4 1.5 1.6 V Offset current IOS — 3.0 4.0 µA fRF — 1078.5 1100 MHz fIF — 130.5 500 MHz fLO 800 948 1000 MHz Output Input power level PRF –15 –10 0 dBm PIF –15 –10 0 dBm Operating band fOUT 800 948 1000 MHz –8 –4 – dBm Mode pin is opened –6 –2 – dBm Mode pin is grounded Offset Mixer Modulation accuracy Value Operating band Operating band RF output Symbol External offset voltage SSB output power level POUT Amplitude error AERR — 2.0 3.0 % RMS value Phase error PERR — 1.5 2.0 deg. RMS value Vector error VERR — 3.0 4.0 % RMS value External offset. No offset adjustment. Carrier suppression CS — –35 –27 dBc Image rejection IR — –40 –28 dBc Adjucent channel power ACP — –65 –60 dB IF × 7 spurious IF × 7 — –65 –60 dBc VBB = 1.0 Vp-p (single ended input) fRF = 1078.5 MHz PRF = –10 dBm fIF = 130.5 MHz PIF = –10 dBm fOUT = 948 MHz ∆f = 50 kHz 9 MB54608L/MB54608B • A case of the offset mixer is not used. (MB54608L, MB54608B) (Ta = +25°C, VCC = 3.0 V) Parameter Baseband input Lo input RF output Modulation accuracy Symbol Value Min. Typ. Max. Unit Remarks Operating band fBB DC — 10 MHz Input amplitude VBB 0.3 1.0 1.3 Vp-p Single ended input Offset voltage VOS 1.4 1.5 1.6 V Offset current IOS — 3.0 4.0 µA Operating band fLO 800 948 1000 Input power PLO –15 –10 0 dBm Operating band fOUT 800 948 1000 MHz –8 –4 — dBm Mode pin is opened –6 –2 — dBm Mode pin is grounded External offset voltage MHz Differential input with balun. SSB output power level POUT Amplitude error AERR — 2.0 3.0 % RMS value Phase error PERR — 1.5 2.0 deg. RMS value Vector error VERR — 3.0 4.0 % RMS value External offset. No offset ajustment. Carrier suppression CS — –35 –27 dBc Image rejection IR — –40 –28 dBc ACP — –65 –60 dB Adjucent channel power VBB = 1.0 Vp-p (single ended input) fLO = 948 MHz PLO = –10 dBm (Differential input with balun). ∆f = 50 kHz Notes: • Spec. of MB54608B is identical with MB54608L. • When the offset mixer is not used, using a differential balun is recommended for input. (When the balun is not used, the changing carrier suppression may happen depending on the timing of powering up.) 10 MB54608L/MB54608B ■ APPLICATION EXAMPLE (MB54608L) 1) A case of the offset mixer is used. Output 15 nH 10 pF 0.1 µF 18 nH Vbi I Vbix Open VCC Pcnt VCC PSQ 20 19 Out PSM 18 17 100 µF 1 kΩ Mode VCC 16 100 µF 15 Vbqx Q Vbq 100 µF 1 kΩ I 1 kΩ XQ XI 100 µF 1 kΩ Q 14 13 12 11 7 8 9 10 MB54608L 1 2 fRF = 1078.5 MHz 3 RFin 4 GND IFin 5 6 LO 3.9 nH VCCM LOX GND VCC GND GND S.G. 1000 pF 3.0 V fRF = 130.5 MHz 1.5-5 pF S.G.100 pF 0.1 µF 0.1 µF 2) A case of the offset mixer is not used. Output 15 nH 0.1 µF 18 nH 10 pF Vbi I Vbix Open VCC Pcnt 20 VCC PSQ 19 Out 18 PSM 17 15 100 µF 100 µF 1 kΩ 1 kΩ Mode VCC 16 100 µF Vbqx Q Vbq I 14 100 µF 1 kΩ XQ XI 1 kΩ Q 13 12 11 8 9 10 MB54608L 1 2 RFin 3 GND 4 IFin 5 VCCM 100 pF LDB25C201A0950 fLO = 948 MHz S.G. 6 LO 7 LOX 100 pF VCC GND GND GND 3.0 V 0.1 µF Note: LDB25C201A0950: Murata Mfg. Co., Ltd. (Continued) 11 MB54608L/MB54608B (Continued) (MB54608L) VCC = 3.0 V 0.1 µF fLO = 948 MHz 100 pF 100 pF 14 13 12 11 10 9 GND VCC LOX LO N.C. GND 15 N.C. 8 GND MB54608B 16 Q Vbq PSQ 7 Q 100 µF XI XQ 1 kΩ 1 Out 5 6 1 kΩ Vbix I Vbi 22 nH 0.1 µF Open 1 kΩ 4 VCC 30 pF 100 µF Vbqx Mode 3 100 µF 100 µF 1 kΩ 2 I Output 18 nH ■ ORDERING INFORMATION Part number 12 Package Remarks MB54608L PFV 20-pin, Plastic SSOP (FPT-20P-M03) MB54608L MB54608L PV1 16-pad, Plastic BCC (LCC-16P-M04) MB54608B MB54608L/MB54608B ■ PACKAGE DIMENSION Note 1) *:This dimension does not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. 20-pin Plastic SSOP (FPT-20P-M03) * 6.50±0.10(.256±.004) 0.17±0.03 (.007±.001) 20 11 * 4.40±0.10 6.40±0.20 (.173±.004) (.252±.008) INDEX Details of "A" part +0.20 1.25 –0.10 +.008 .049 –.004 LEAD No. 1 10 0.65(.026) "A" 0.24±0.08 (.009±.003) 0.10(.004) C (Mounting height) 1999 FUJITSU LIMITED F20012S-3C-5 0.13(.005) M 0~8° 0.50±0.20 (.020±.008) 0.45/0.75 (.018/.030) 0.10±0.10 (Stand off) (.004±.004) 0.25(.010) Dimensions in mm (inches) (Continued) 13 MB54608L/MB54608B (Continued) 16-pad Plastic BCC (LCC-16P-M04) 4.55±0.10 (.179±.004) 0.80(.031)MAX Mounting height 3.40(.134)TYP 0.65(.026) TYP 14 9 0.325±0.10 (.013±.004) 9 14 0.80(.031) REF INDEX AREA 4.20±0.10 (.165±.004) 3.25(.128) TYP "A" 0.40±0.10 (.016±.004) 1 6 0.075±0.025 (.003±.001) (Stand off) 6 Details of "A" part 0.75±0.10 (.030±.004) 1.55(.061) REF "B" 1.725(.068) REF 1 Details of "B" part 0.60±0.10 (.024±.004) 0.05(.002) 0.40±0.10 (.016±.004) C 14 1999 FUJITSU LIMITED C16015S-1C-1 0.60±0.10 (.024±.004) Dimensions in mm (inches) MB54608L/MB54608B FUJITSU LIMITED For further information please contact: Japan FUJITSU LIMITED Corporate Global Business Support Division Electronic Devices KAWASAKI PLANT, 4-1-1, Kamikodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa 211-8588, Japan Tel: +81-44-754-3763 Fax: +81-44-754-3329 http://www.fujitsu.co.jp/ North and South America FUJITSU MICROELECTRONICS, INC. 3545 North First Street, San Jose, CA 95134-1804, USA Tel: +1-408-922-9000 Fax: +1-408-922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: +1-800-866-8608 Fax: +1-408-922-9179 http://www.fujitsumicro.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Am Siebenstein 6-10, D-63303 Dreieich-Buchschlag, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://www.fujitsu-fme.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD #05-08, 151 Lorong Chuan, New Tech Park, Singapore 556741 Tel: +65-281-0770 Fax: +65-281-0220 http://www.fmap.com.sg/ F0001 FUJITSU LIMITED Printed in Japan All Rights Reserved. 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