Burr-Brown DRV134UA/1KE4 Audio balanced line driver Datasheet

®
DRV134
DRV135
DRV
134
DRV
134
DRV
135
AUDIO BALANCED LINE DRIVERS
FEATURES
DESCRIPTION
●
●
●
●
●
●
●
●
●
The DRV134 and DRV135 are differential output
amplifiers that convert a single-ended input to a
balanced output pair. These balanced audio drivers
consist of high performance op amps with on-chip
precision resistors. They are fully specified for high
performance audio applications and have excellent
ac specifications, including low distortion (0.0005%
at 1kHz) and high slew rate (15V/µs).
The on-chip resistors are laser-trimmed for accurate
gain and optimum output common-mode rejection. Wide
output voltage swing and high output drive capability
allow use in a wide variety of demanding applications.
They easily drive the large capacitive loads associated
with long audio cables. Used in combination with the
INA134 or INA137 differential receivers, they offer a
complete solution for transmitting analog audio signals
without degradation.
The DRV134 is available in 8-pin DIP and SOL-16
surface-mount packages. The DRV135 comes in a
space-saving SO-8 surface-mount package. Both are
specified for operation over the extended industrial
temperature range, –40°C to +85°C and operate from
–55°C to +125°C.
BALANCED OUTPUT
LOW DISTORTION: 0.0005% at f = 1kHz
WIDE OUTPUT SWING: 17Vrms into 600Ω
HIGH CAPACITIVE LOAD DRIVE
HIGH SLEW RATE: 15V/µs
WIDE SUPPLY RANGE: ±4.5V to ±18V
LOW QUIESCENT CURRENT: ±5.2mA
8-PIN DIP, SO-8, AND SOL-16 PACKAGES
COMPANION TO AUDIO DIFFERENTIAL
LINE RECEIVERS: INA134 and INA137
● IMPROVED REPLACEMENT FOR SSM2142
APPLICATIONS
●
●
●
●
●
●
●
●
●
AUDIO DIFFERENTIAL LINE DRIVER
AUDIO MIX CONSOLES
DISTRIBUTION AMPLIFIER
GRAPHIC/PARAMETRIC EQUALIZERS
DYNAMIC RANGE PROCESSORS
DIGITAL EFFECTS PROCESSORS
TELECOM SYSTEMS
HI-FI EQUIPMENT
INDUSTRIAL INSTRUMENTATION
V+
50Ω
+VO
A2
+Sense
10kΩ
–Sense
VIN
A1
50Ω
Gnd
–VO
A3
10kΩ
All resistors 30kΩ unless otherwise indicated.
V–
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
©1998 Burr-Brown Corporation
SBOS094
PDS-1451A
Printed in U.S.A. October, 1998
SPECIFICATIONS: VS = ±18V
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
DRV134PA, UA
DRV135UA
PARAMETER
CONDITIONS
AUDIO PERFORMANCE
Total Harmonic Distortion + Noise
THD+N
Noise Floor, RTO(1)
Headroom, RTO(1)
INPUT
Input Impedance(2)
Input Current
ZIN
IIN
FREQUENCY RESPONSE
Small-Signal Bandwidth
Slew Rate
Settling Time: 0.01%
Overload Recovery
POWER SUPPLY
Rated Voltage
Voltage Range
Quiescent Current
TYP
f = 20Hz to 20kHz,VO = 10Vrms
f = 1kHz, VO = 10Vrms
20kHz BW
THD+N < 1%
0.001
0.0005
–98
+27
VIN = ±7.07V
10
±700
5.8
UNITS
%
%
dBu
dBu
±1000
kΩ
µA
6
±0.1
±10
±2
dB
%
ppm/°C
VIN = ±5V
5.8
OCMR
SBR
See OCMR Test Circuit, Figure 4
See SBR Test Circuit, Figure 5
VOCM(3)
VIN = 0
VOD(4)
VIN = 0
PSRR
VS = ±4.5V to ±18V
No Load(5)
No Load(5)
CL
ISC
46
35
80
(V+) – 3
(V–) + 2
CL Tied to Ground (each output)
6
±0.7
±10
0.0003
VOUT = 10V Step
Output Overdriven 10%
68
54
±50
±150
±1
±5
110
(V+) – 2.5
(V–) + 1.5
50
1
±85
±5.2
IO = 0
–40
–55
–55
θJA
100
150
80
dB
%
ppm/°C
% of FS
dB
dB
±250
±10
mV
µV/°C
mV
µV/°C
dB
V
V
Ω
µF
mA
MHz
V/µs
µs
µs
±18
±4.5
IQ
±2
1.5
15
2.5
3
SR
VS
TEMPERATURE RANGE
Specification Range
Operation Range
Storage Range
Thermal Resistance
8-Pin DIP
SO-8 Surface Mount
SOL-16 Surface Mount
MAX
[(+VO) – (–VO)]/VIN
VIN = ±10V
GAIN
Differential
Initial
Error
vs Temperature
Single-Ended
Initial
Error
vs Temperature
Nonlinearity
OUTPUT
Common-Mode Rejection, f = 1kHz
Signal Balance Ratio, f = 1kHz
Output Offset Voltage
Offset Voltage, Common-Mode
vs Temperature
Offset Voltage, Differential
vs Temperature
vs Power Supply
Output Voltage Swing, Positive
Negative
Impedance
Load Capacitance, Stable Operation
Short-Circuit Current
MIN
±18
±5.5
V
V
mA
+85
+125
+125
°C
°C
°C
°C/W
°C/W
°C/W
NOTES: (1) dBu = 20log (Vrms /0.7746). (2) Resistors are ratio matched but have ±20% absolute value. (3) VOCM = [(+VO) + (–VO)]/ 2. (4) VOD = (+VO) – (–VO).
(5) Guarantees linear operation. Includes common-mode offset.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
DRV134, 135
2
PIN CONFIGURATIONS
Top View
Top View
8-Pin DIP/SO-8
–VO
1
8
+VO
–Sense
2
7
+Sense
Gnd
3
6
V+
VIN
4
5
V–
SOL-16
NC
1
16
NC
NC
2
15
NC
–VO
3
14
+VO
–Sense
4
13
+Sense
Gnd
5
12
V+
VIN
6
11
V–
NC
7
10
NC
NC
8
9
NC
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage, V+ to V– .................................................................... 40V
Input Voltage Range .................................................................... V– to V+
Output Short-Circuit (to ground) .............................................. Continuous
Operating Temperature .................................................. –55°C to +125°C
Storage Temperature ..................................................... –55°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ELECTROSTATIC
DISCHARGE SENSITIVITY
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may affect
device reliability.
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING
NUMBER(1)
DRV134PA
DRV134UA
"
DRV135UA
"
8-Pin DIP
SOL-16 Surface Mount
"
SO-8 Surface Mount
"
006
211
"
182
"
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER(2)
TRANSPORT
MEDIA
–40°C to +85°C
–40°C to +85°C
"
–40°C to +85°C
"
DRV134PA
DRV134UA
DRV134UA/1K
DRV135UA
DRV135UA/2K5
Rails
Rails
Tape and Reel
Rails
Tape and Reel
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. For detailed Tape and Reel
mechanical information refer to Appendix B of Burr-Brown IC Data Book. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated
(e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “DRV135UA/2K5” will get a single 2500-piece Tape and Reel. For detailed Tape and Reel
mechanical information, refer to Appendix B of Burr-Brown IC Data Book.
®
3
DRV134, 135
TYPICAL PERFORMANCE CURVES
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
0.01
0.01
Differential Mode
VO = 10Vrms
No Cable
A
B
0.001
Differential Mode
VO = 10Vrms
500 feet cable
See Figure 3 for Test Circuit
A: R1 = R2 = RL = ∞ (no load)
B: R1 = R2 = 600Ω, RL = ∞
C: R1 = R2 = ∞, RL = 600Ω
THD+N (%)
THD+N (%)
See Figure 3 for Test Circuit
A: R1 = R2 = RL = ∞ (no load)
B: R1 = R2 = 600Ω, RL = ∞
C: R1 = R2 = ∞, RL = 600Ω
A
B
0.001
C
C
DRV134 Output
DRV134 Output
0.0001
0.0001
20
100
1k
10k 20k
20
1k
10k 20k
Frequency (Hz)
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
SYSTEM TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
0.1
0.01
Single-Ended Mode
VO = 10Vrms
–VO or +VO Grounded
A: R1 = 600Ω (250 ft cable)
B: R1 = ∞ (no cable)
See Figure 3 for Test Circuit
A: R1 = R2 = RL = ∞ (no load)
B: R1 = R2 = ∞ RL = 600Ω
THD+N (%)
0.01
THD+N (%)
100
Frequency (Hz)
A
B
Differential Mode
VO = 10Vrms
A (no cable)
0.001
0.001
B (500ft cable)
INA137 Output
DRV134 Output
0.0001
0.0001
20
100
1k
10k 20k
20
1k
10k
Frequency (Hz)
HEADROOM—TOTAL HARMONIC DISTORTION+NOISE
vs OUTPUT AMPLITUDE
DIM INTERMODULATION DISTORTION
vs OUTPUT AMPLITUDE
1
f = 1kHz
Single-Ended
Mode
Differential
Mode
500 ft Cable
RL = 600Ω
500 ft Cable
RL = 600Ω
20k
1
Differential Mode
0.1
0.1
DIM (%)
THD+N (%)
100
Frequency (Hz)
0.01
0.001
500 ft Cable
RL = 600Ω
0.01
0.001
0.0001
5
10
15
20
25
0.0001
30
5
Output Amplitude (dBu)
10
15
20
Output Amplitude (dBu)
®
DRV134, 135
No Cable
RL = ∞
BW = 30kHz
No Cable
RL = ∞
DRV134 Output
4
25
30
TYPICAL PERFORMANCE CURVES
(CONT)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
HARMONIC DISTORTION PRODUCTS
vs FREQUENCY
0.01
5
Voltage Gain (dB)
0.001
2nd Harmonic
0.0001
3rd Harmonic
0.00001
20
100
1k
10k
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
OUTPUT VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
OUTPUT VOLTAGE NOISE
vs NOISE BANDWIDTH
10M
100
Voltage Noise (µVrms)
Voltage Noise (nV/√Hz)
–5
–10
1k
100
10
10
1
0.1
1
10
100
1k
10k
100k
1M
1
10
100
1k
10k
Frequency (Hz)
Frequency (Hz)
POWER SUPPLY REJECTION vs FREQUENCY
MAXIMUM OUTPUT VOLTAGE SWING
vs FREQUENCY
100k
20
100
Output Voltage Swing (Vrms)
120
+PSRR
80
60
–PSRR
40
20
0
20k
10k
Power Supply Rejection (dB)
Amplitude (% of Fundamental)
GAIN vs FREQUENCY
10
No Cable, RL = ∞
500 ft Cable,
RL = 600Ω
Differential Mode
VS = ±4.5V to ±18V
0
16
0.1% Distortion
12
10
0.01% Distortion
8
4
RL = 600Ω
Diff Mode
0
10
100
1k
10k
100k
1M
10k
20k
50k
80k 100k
Frequency (Hz)
Frequency (Hz)
®
5
DRV134, 135
TYPICAL PERFORMANCE CURVES
(CONT)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
THD+N ≤ 0.1%
OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT
OUTPUT VOLTAGE SWING
vs SUPPLY VOLTAGE
18
20
Differential Output Voltage (Vrms)
THD+N ≤ 0.1%
16
16
+25°C
Output Voltage Swing (V)
14
12
1
8
4
12
8
–8
+25°C
–10
–55°C
+125°C
–12
–14
–16
0
–18
±4
±6
±8
±10
±12
±14
±16
±18
±20
0
QUIESCENT CURRENT
vs SUPPLY VOLTAGE
±60
±80
±100
SHORT-CIRCUIT CURRENT vs TEMPERATURE
±5.6
±120
Short-Circuit Current (mA)
±5.4
T = –55°C
±5.2
T = +25°C
±5
T = +125°C
±4.8
±100
±4
±6
±8
±10
±12
±14
±16
+ISC
±80
–ISC
±60
±40
±4.6
±20
±18
–75
–50
–25
0
25
50
75
Supply Voltage (V)
Temperature (°C)
DIFFERENTIAL OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
COMMON-MODE OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
45
100
125
35
Typical production
distribution of packaged
units. All package types
included.
35
30
Percent of Units (%)
40
30
25
20
15
10
25
15
10
5
0
0
–250
–225
–200
–175
–150
–125
–100
–75
–50
–25
0
25
50
75
100
125
150
175
200
225
250
Differential Offset Voltage (mV)
Common-Mode Offset Voltage (mV)
®
DRV134, 135
Typical production
distribution of packaged
units. All package types
included.
20
5
–10
–9
–8
–7
–6
–5
–4
–3
–2
–1
0
1
2
3
4
5
6
7
8
9
10
Percent of Units (%)
±40
Output Current (mA)
Supply Voltage
Quiescent Current (mA)
–55°C
+125°C
10
6
TYPICAL PERFORMANCE CURVES
(CONT)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
SMALL-SIGNAL STEP RESPONSE
CL = 100pF
CL = 1000pF
50mV/div
50mV/div
SMALL-SIGNAL STEP RESPONSE
2µs/div
LARGE-SIGNAL STEP RESPONSE
LARGE-SIGNAL STEP RESPONSE
CL = 100pF
CL = 1000pF
5V/div
5V/div
2µs/div
2µs/div
2µs/div
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
40
100mV Step
Overshoot (%)
30
20
10
0
10
100
1k
10k
Load Capacitance (pF)
®
7
DRV134, 135
APPLICATIONS INFORMATION
resistors. Characterized by low differential-mode output
impedance (50Ω) and high common-mode output impedance (1.6kΩ), the DRV134 is ideal for audio applications.
Normally, +VO is connected to +Sense, –VO is connected to
–Sense, and the outputs are taken from these junctions as
shown in Figure 1. For applications with large dc cable
offset errors, a 10µF electrolytic nonpolarized blocking
capacitor at each sense pin is recommended as shown in
Figure 2.
The DRV134 (and DRV135 in SO-8 package) converts a
single-ended, ground-referenced input to a floating differential output with +6dB gain (G = 2). Figure 1 shows the
basic connections required for operation. Decoupling capacitors placed close to the device pins are strongly recommended in applications with noisy or high impedance power
supplies.
The DRV134 consists of an input inverter driving a crosscoupled differential output stage with 50Ω series output
V–
V+
1µF
1µF
5
6 (12)
(11)
DRV134
DRV135
50Ω
8
A2
+VO
(14)
7
(13)
+Sense
10kΩ
VIN
4
G = +6dB
(6)
2
Gnd
A1
3
(4)
1
50Ω
A3
(5)
(3)
–Sense
–VO
10kΩ
All resistors 30kΩ unless otherwise indicated.
SOL-16 pin numbers in parentheses.
FIGURE 1. Basic Connections.
DRIVER
DRV134
DRV135
RECEIVER
50Ω
8
A2
7
10µF(1)
+VO
BALANCED
CABLE PAIR
–VO
5
2
10kΩ
VIN
4
6
2
Gnd
A1
3
50Ω
10µF(1)
1
A3
3
1
+VO
INA134, INA137
INA134 (G = 1): VO = 2VIN
INA137 (G = 1/2): VO = VIN
10kΩ
All resistors 30kΩ unless otherwise indicated.
Pin numbers shown for DIP and SO-8 versions.
NOTE: (1) Optional 10µF electrolytic (nonpolarized) capacitors reduce common-mode offset errors.
FIGURE 2. Complete Audio Driver/Receiver Circuit.
®
DRV134, 135
–VO
8
VO
Excellent internal design and layout techniques provide low
signal distortion, high output level (+27dBu), and a low
noise floor (–98dBu). Laser trimming of thin film resistors
assures excellent output common-mode rejection (OCMR)
and signal balance ratio (SBR). In addition, low dc voltage
offset reduces errors and minimizes load currents.
Up to approximately 10kHz, distortion is below the measurement limit of commonly used test equipment. Furthermore, distortion remains relatively constant over the wide
output voltage swing range (approximately 2.5V from the
positive supply and 1.5V from the negative supply). A
special output stage topology yields a design with minimum
distortion variation from lot-to-lot and unit-to-unit. Furthermore, the small and large signal transient response curves
demonstrate the DRV134’s stability under load.
For best system performance, it is recommended that a high
input-impedance difference amplifier be used as the receiver. Used with the INA134 (G = 0dB) or the INA137 (G
= ±6dB) differential line receivers, the DRV134 forms a
complete solution for driving and receiving audio signals,
replacing input and output coupling transformers commonly
used in professional audio systems (Figure 2). When used
with the INA137 (G = –6dB) overall system gain is unity.
OUTPUT COMMON-MODE REJECTION
Output common-mode rejection (OCMR) is defined as the
change in differential output voltage due to a change in
output common-mode voltage. When measuring OCMR,
VIN is grounded and a common-mode voltage, VCM, is
applied to the output as shown in Figure 4. Ideally no
differential mode signal (VOD) should appear. However, a
small mode-conversion effect causes an error signal whose
magnitude is quantified by OCMR.
AUDIO PERFORMANCE
The DRV134 was designed for enhanced ac performance.
Very low distortion, low noise, and wide bandwidth provide
superior performance in high quality audio applications.
Laser-trimmed matched resistors provide optimum output
common-mode rejection (typically 68dB), especially when
compared to circuits implemented with op amps and discrete
precision resistors. In addition, high slew rate (15V/µs) and
fast settling time (2.5µs to 0.01%) ensure excellent dynamic
response.
+18V
1µF
VIN
The DRV134 has excellent distortion characteristics. As
shown in the distortion data provided in the typical performance curves, THD+Noise is below 0.003% throughout the
audio frequency range under various output conditions. Both
differential and single-ended modes of operation are shown.
In addition, the optional 10µF blocking capacitors used to
minimize VOCM errors have virtually no effect on performance. Measurements were taken with an Audio Precision
System One (with the internal 80kHz noise filter) using the
THD test circuit shown in Figure 3.
6
4
7
8
VOD
DRV134
Gnd
1
2
5
3
300Ω(1)
+VO
300Ω(1)
–VO
600Ω
1µF
VCM = 10Vp-p
–18V
OCMR = –20 Log
(
VOD
VCM
)
at f = 1kHz, VOD = (+VO) – (–VO)
NOTE: (1) Matched to 0.1%.
FIGURE 4. Output Common-Mode Rejection Test Circuit.
+18V
+18V
1µF
VIN
4
6
1µF
Test Point
or
+VO
7
–In
DRV134
5
INA137
RL
1
2
3
7
2
8
–VO
1
+In
3
R1
5
6
VOUT
4
R2
1µF
1µF
–18V
–18V
NOTE: Cable loads, where indicated, are Belden 9452 cable.
FIGURE 3. Distortion Test Circuit.
®
9
DRV134, 135
SIGNAL BALANCE RATIO
Signal balance ratio (SBR) measures the symmetry of the
output signals under loaded conditions. To measure SBR an
input signal is applied and the outputs are summed as shown
in Figure 5. VOUT should be zero since each output ideally
is exactly equal and opposite. However, an error signal
results from any imbalance in the outputs. This error is
quantified by SBR. The impedances of the DRV134’s out
put stages are closely matched by laser trimming to minimize SBR errors. In an application, SBR also depends on the
balance of the load network.
For best rejection of line noise and hum differential mode
operation is recommended. However, single-ended performance is adequate for many applications. In general singleended performance is comparable to differential mode (see
THD+N typical performance curves), but the commonmode and noise rejection inherent in balanced-pair systems
is lost.
CABLE
The DRV134 is capable of driving large signals into 600Ω
loads over long cables. Low impedance shielded audio
cables such as the standard Belden 8451 or 9452 (or similar)
are recommended, especially in applications where long
cable lengths are required.
+18V
1µF
VIN = 10Vp-p
6
4
+VO
7
THERMAL PERFORMANCE
The DRV134 and DRV135 have robust output drive capability and excellent performance over temperature. In most
applications there is no significant difference between the
DIP, SOL-16, and SO-8 packages. However, for applications with extreme temperature and load conditions, the
SOL-16 (DRV134UA) or DIP (DRV134PA) packages are
recommended. Under these conditions, such as loads greater
than 600Ω or very long cables, performance may be degraded in the SO-8 (DRV135UA) package.
300Ω(1)
8
DRV134
Gnd
1
2
5
3
300Ω(1)
VOUT
–VO
600Ω
1µF
–18V
SBR = –20 Log
(
VOUT
VIN
)
at f = 1kHz
LAYOUT CONSIDERATIONS
A driver/receiver balanced-pair (such as the DRV134 and
INA137) rejects the voltage differences between the grounds
at each end of the cable, which can be caused by ground
currents, supply variations, etc. In addition to proper bypassing, the suggestions below should be followed to achieve
optimal OCMR and noise rejection.
NOTE: (1) Matched to 0.1%.
FIGURE 5. Signal Balance Ratio Test Circuit.
SINGLE-ENDED OPERATION
The DRV134 can be operated in single-ended mode without
degrading output drive capability. Single-ended operation
requires that the unused side of the output pair be grounded
(both the VO and Sense pins) to a low impedance return path.
Gain remains +6dB. Grounding the negative outputs as
shown in Figure 6 results in a noninverted output signal
(G = +2) while grounding the positive outputs gives an
inverted output signal (G = –2).
• The DRV134 input should be driven by a low impedance
source such as an op amp or buffer.
• As is the case for any single-ended system, the source’s
common should be connected as close as possible to the
DRV134’s ground. Any ground offset errors in the source
will degrade system performance.
• Symmetry on the outputs should be maintained.
V+
VOUT = 2VIN
6
VIN
• Shielded twisted-pair cable is recommended for all applications. Physical balance in signal wiring should be maintained. Capacitive differences due to varying wire lengths
may result in unequal noise pickup between the pair and
degrade OCMR. Follow industry practices for proper system grounding of the cables.
7
4
8
600Ω
DRV134
1
2
3
5
G = +6dB
V–
FIGURE 6. Typical Single-Ended Application.
®
DRV134, 135
10
PACKAGE OPTION ADDENDUM
www.ti.com
6-Nov-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
DRV134PA
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
DRV134PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
DRV134UA
ACTIVE
SOIC
DW
16
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV134UA/1K
ACTIVE
SOIC
DW
16
1000
Pb-Free
(RoHS)
CU NIPDAU
Level-3-260C-168 HR
DRV134UA/1KE4
ACTIVE
SOIC
DW
16
1000
Pb-Free
(RoHS)
CU NIPDAU
Level-3-260C-168 HR
DRV134UAE4
ACTIVE
SOIC
DW
16
48
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV135UA
ACTIVE
SOIC
D
8
100
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV135UA/2K5
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV135UA/2K5E4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
DRV135UAG4
ACTIVE
SOIC
D
8
100
CU NIPDAU
Level-3-260C-168 HR
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated
Similar pages