TECHNICAL DATA IN74HC299A 8-Bit Bidirectional Universal Shift Register with Parallel I/O High-Performance Silicon-Gate CMOS The IN74HC299A is identical in pinout to the LS/ALS299. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALSTTL outputs. The IN74HC299A features a multiplexed parallel input/output data port to achieve full 8-bit handling in a 20 pin package. Due to the large output drive capability and the 3-state feature, this device is ideally suited for interface with bus lines in a bus-oriented system. Two Mode-Select inputs and two Output Enable inputs are used to choose the mode of operation as listed in the Function Table. Synchronous parallel loading is accomplished by taking both ModeSelect lines, S1 and S2, high. This places the outputs in the highimpedance state, which permits data applied to the data port to be clocked into the register. Reading out of the register can be accomplished when the outputs are enabled. The active-low asynchronous Reset overrides all other inputs. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 µA • High Noise Immunity Characteristic of CMOS Devices ORDERING INFORMATION IN74HC299AN Plastic IN74HC299ADW SOIC TA = -55° to 125° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM PIN 20=VCC PIN 10 = GND Rev. 00 IN74HC299A MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Current, per Pin ±35 mA ICC DC Supply Current, VCC and GND Pins ±75 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V Min Max Unit 2.0 6.0 V 0 VCC V -55 +125 °C 0 0 0 1000 500 400 ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. I/O pins must be connected to a properly terminated line or bus. Rev. 00 IN74HC299A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limit V 25 °C to -55°C ≤85 °C ≤125 °C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢≤ 20 µA 2.0 4.5 6.0 1.5 3.15 4.2 1.5 3.15 4.2 1.5 3.15 4.2 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V ⎢IOUT⎢ ≤ 20 µA 2.0 4.5 6.0 0.3 0.9 1.2 0.3 0.9 1.2 0.3 0.9 1.2 V VOH Minimum HighLevel Output Voltage VIN=VIH or VIL ⎢IOUT⎢ ≤ 20 µA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V VIN=VIH or VIL ⎢IOUT⎢ ≤ 6.0 mA (P/Q) ⎢IOUT⎢ ≤ 7.8 mA (P/Q) 4.5 6.0 3.98 5.48 3.84 5.34 3.7 5.2 VIN=VIH or VIL ⎢IOUT⎢ ≤ 4.0 mA (Q’) ⎢IOUT⎢ ≤ 5.2 mA (Q’) 4.5 6.0 3.98 5.48 3.84 5.34 3.7 5.2 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 VIN=VIH or VIL ⎢IOUT⎢ ≤ 6.0 mA (P/Q) ⎢IOUT⎢ ≤ 7.8 mA (P/Q) 4.5 6.0 0.26 0.26 0.33 0.33 0.4 0.4 VIN=VIH or VIL ⎢IOUT⎢ ≤ 4.0 mA (Q’) ⎢IOUT⎢ ≤ 5.2 mA (Q’) 4.5 6.0 0.26 0.26 0.33 0.33 0.4 0.4 VOL Maximum LowLevel Output Voltage VIN= VIL or VIH ⎢IOUT⎢ ≤ 20 µA V IIN Maximum Input Leakage Current VIN=VCC or GND 6.0 ±0.1 ±1.0 ±1.0 µA IOZ Maximum ThreeState Leakage Current (QA thru QH) Output in High-Impedance State VIN= VIL or VIH VOUT=VCC or GND 6.0 ±0.5 ±5.0 ±10 µA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND IOUT=0µA 6.0 8.0 80 160 µA Rev. 00 IN74HC299A AC ELECTRICAL CHARACTERISTICS(CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit VCC Symbol Parameter V 25 °C to -55°C ≤85°C ≤125°C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 5) 2.0 4.5 6.0 5.0 25 29 4.0 20 24 3.4 17 20 MHz tPLH, tPHL Maximum Propagation Delay, Clock to QA’ or QH’ (Figures 1 and 5) 2.0 4.5 6.0 170 34 29 215 43 37 255 51 43 ns tPLH, tPHL Maximum Propagation Delay, Clock to QA thru QH (Figures 1 and 5) 2.0 4.5 6.0 160 32 27 200 40 34 240 48 41 ns tPHL Maximum Propagation Delay, Reset to QA’ or QH’ (Figures 2 and 5) 2.0 4.5 6.0 175 35 30 220 44 37 265 53 45 ns tPHL Maximum Propagation Delay, Reset to QA thru QH (Figures 2 and 5) 2.0 4.5 6.0 190 38 32 240 48 41 285 57 48 ns tPLZ, tPHZ Maximum Propagation Delay , OE1, OE2, S1, or S2 to QA thru QH (Figures 3 and 6) 2.0 4.5 6.0 150 30 26 190 38 33 225 45 38 ns tPZL, tPZH Maximum Propagation Delay , OE1, OE2, S1, or S2 to QA thru QH (Figures 3 and 6) 2.0 4.5 6.0 150 30 26 190 38 33 225 45 38 ns tTLH, tTHL Maximum Output Transition Time, QA thru QH (Figures 1 and 5) 2.0 4.5 6.0 60 12 10 75 15 13 90 18 15 ns tTLH, tTHL Maximum Output Transition Time, QA’ thru QH’ (Figures 1 and 5) 2.0 4.5 6.0 75 15 13 95 19 16 110 22 19 ns Maximum Input Capacitance) - 10 10 10 pF Maximum Three-State I/O Capacitance (I/O in High-Impedance State), QA thru QH - 15 15 15 pF CIN COUT CPD Power Dissipation Capacitance (Per Package), Output Enable Typical @25°C,VCC=5.0 V Used to determine the no-load dynamic power consumption: PD=CPDVCC2f+ICCVCC 240 pF Rev. 00 IN74HC299A TIMING REQUIREMENTS (CL=50pF,Input tr=tf=6.0 ns) Guaranteed Limit VCC Symbol Parameter V 25 °C to-55°C ≤85°C ≤125°C Unit tsu Minimum Setup Time, Mode Select S1 or S2 to Clock (Figure 4) 2.0 4.5 6.0 100 20 17 125 25 21 150 30 26 ns tsu Minimum Setup Time, Data Inputs SA, SH, PA thru PH to Clock (Figure 4) 2.0 4.5 6.0 100 20 17 125 25 21 150 30 26 ns th Minimum Hold Time, Clock to Mode Select S1 or S2 (Figure 4) 2.0 4.5 6.0 120 24 20 150 30 26 180 36 31 ns th Minimum Hold Time, Clock to Data Inputs, SA, SH, PA thru PH (Figure 4) 2.0 4.5 6.0 5 5 5 5 5 5 5 5 5 ns trec Minimum Recovery Time, Reset Inactive to Clock (Figure 2) 2.0 4.5 6.0 50 10 9 65 13 11 75 15 13 ns tw Minimum Pulse Width, Clock (Figure 1) 2.0 4.5 6.0 80 16 14 100 20 17 120 24 20 ns tw Minimum Pulse Width, Reset (Figure 2) 2.0 4.5 6.0 80 16 14 100 20 17 120 24 20 ns tr, tf Maximum Input Rise and Fall Times (Figure 1) 2.0 4.5 6.0 1000 500 400 1000 500 400 1000 500 400 ns Rev. 00 IN74HC299A FUNCTION TABLE Inputs Mode Reset Mode Select Response Output Enables Clock Serial Inputs PA/ PB/ PC/ PD/ PE/ PF/ PG/ PH/ QA’ QH’ QA QB QC QD QE QF QG QH S2 S1 OE1 OE2 L X L L L X X X L L L L L L L L L L L L X L L X X X L L L L L L L L L L L H H X X X X X QA through QH=Z L L H L H H X D X Shift Right: QA through QH=Z; F A; F A FB; etc DA D QG H L H X H D X Shift Right: QA through QH=Z; FA; FA FB; etc DA D QG H L H L L D X Shift Right: DA FA =QA; FB =QB; etc FA D QG H H L H X X D Shift Left: QA through QH=Z; F H; F H FG; etc DH QB D H H L X H X D Shift Left: QA through QH=Z; F H; F H FG; etc DH QB D H H L L L X D Shift Left: DH FH =QH; FG =QG; etc FH QB D Parallel Load H H H X X X X PA PH Hold H L L H X X X X Hold: QA through QH=Z; FN=FN PA PH H L L X H X X X Hold: QA through QH=Z; FN=FN PA PH H L L L L X X X Hold: QN =QH PA PH Reset Shift Right Shift Left DA D H Parallel Load:PN FN Z = high impedance D = data on serial input F = flip-flop (see Logic Diagram) When one or both output controls are high the eight input/output terminals are disabled to the highimpedance state; however, sequential operation or clearing of the register is not affected. Rev. 00 IN74HC299A Figure 1. Switching Waveforms Figure 2. Switching Waveforms Figure 3a. Switching Waveforms Figure 3b. Switching Waveforms Figure 4. Switching Waveforms Figure 5. Test Circuit Figure 6. Test Circuit Rev. 00 IN74HC299A EXPANDED LOGIC DIAGRAM Rev. 00 IN74HC299A N SUFFIX PLASTIC DIP (MS - 001AD) A Dimension, mm 11 20 B 1 10 Symbol MIN MAX A 24.89 26.92 B 6.1 7.11 5.33 C F L C -T- SEATING PLANE D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 N G K M J H D 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 013AC) A 20 11 H Dimension, mm B 1 P 10 G R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 12.6 13 B 7.4 7.6 C 2.35 2.65 D 0.33 0.51 F 0.4 1.27 G 1.27 H 9.53 J 0° 8° K 0.1 0.3 M 0.23 0.32 P 10 10.65 R 0.25 0.75 Rev. 00