CC3000 www.ti.com SWRS127 – OCTOBER 2012 SimpleLink™ Wi-Fi® CC3000 Module from Texas Instruments FEATURES 1 • • • • • Wireless Network Processor – IEEE 802.11 b/g – Embedded IPv4 TCP/IP Stack Best-in-class Radio Performance: – Tx Power: +18dBm at 11Mbps, CCK – Rx Sensitivity: –86dBm, 8% PER, 11Mbps Works with low MIPS, Low Cost Microcontrollers with Compact Memory Footprint: – 2KBytes Flash – 250Bytes RAM FCC, IC and CE Certified with Chip Antenna HW Design Files and Design Guide Available from TI Integrated Crystal and Power Management • • • • Small Form Factor 16.3mm x 13.5mm x 2mm Operating Temperature Range: –20°C to 70°C Based in TI's 7th Generation of Proven Wi-Fi Solutions Complete Platform Solution Including User and Porting Guides, API Guide, Sample Applications, and Support Community APPLICATIONS • • • • • Home Automation Home Security Connected Appliances Smart Energy M2M Communication DESCRIPTION The CC3000 is a self-contained wireless network processor that simplifies the process of implementing Internet connectivity. SimpleLink™ Wi-Fi minimizes host microcontroller (MCU) software requirements making it the ideal solution for embedded applications using any low-cost and low-power MCU. The CC3000 is provided as a module by TI to reduce development time, lower manufacturing costs, save board space, ease certification and minimize RF expertise required. Additionally, it is provided as a complete platform solution including software drivers, sample applications, API guide, user documentation and a world-class support community. More information on TI’s wireless platform solutions for Wi-Fi can be found on TI's Wireless Connectivity Wiki (www.ti.com/connectivitywiki). 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2012, Texas Instruments Incorporated PRODUCT PREVIEW • 2 PACKAGE OPTION ADDENDUM www.ti.com 8-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) CC3000MOD ACTIVE 46 84 TBD Call TI Call TI -20 to 70 CC3000MODR ACTIVE 46 1200 TBD Call TI Call TI -20 to 70 XCC3000MOD PREVIEW 46 TBD Call TI Call TI -20 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. 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