TI1 DAC5686IPZP 16-bit, 500-msps, 216 interpolating dual-channel digital-to-analog converter Datasheet

DAC5686
www.ti.com ............................................................................................................................................................ SLWS147F – APRIL 2003 – REVISED JUNE 2009
16-BIT, 500-MSPS, 2×–16× INTERPOLATING DUAL-CHANNEL
DIGITAL-TO-ANALOG CONVERTER
FEATURES
1
• 500-MSPS Maximum-Update-Rate DAC
• WCDMA ACPR
– 1 Carrier: 76 dB Centered at 30.72-MHz IF,
245.76 MSPS
– 1 Carrier: 73 dB Centered at 61.44-MHz IF,
245.76 MSPS
– 2 Carrier: 72 dB Centered at 30.72-MHz IF,
245.76 MSPS
– 4 Carrier: 64 dB Centered at 92.16-MHz IF,
491.52 MSPS
• Selectable 2×, 4×, 8×, and 16× Interpolation
– Linear Phase
– 0.05-dB Pass-Band Ripple
– 80-dB Stop-Band Attenuation
– Stop-Band Transition 0.4–0.6 fDATA
• 32-Bit Programmable NCO
• On-Chip 2×–16× PLL Clock Multiplier With
Bypass Mode
• Differential Scalable Current Outputs: 2 mA to
20 mA
• On-Chip 1.2-V Reference
234
•
•
•
•
1.8-V Digital and 3.3-V Analog Supplies
1.8-V/3.3-V CMOS-Compatible Interface
Power Dissipation: 950 mW at Full Maximum
Operating Conditions
Package: 100-Pin HTQFP
APPLICATIONS
•
•
•
•
•
•
Cellular Base Transceiver Station Transmit
Channel
– CDMA: W-CDMA, CDMA2000, IS-95
– TDMA: GSM, IS-136, EDGE/UWC-136
Baseband I and Q Transmit
Input Interface: Quadrature Modulation for
Interfacing With Baseband Complex Mixing
ASICs
Single-Sideband Up-Conversion
Diversity Transmit
Cable Modem Termination System
DESCRIPTION
The DAC5686 is a dual-channel 16-bit high-speed digital-to-analog converter (DAC) with integrated 2×, 4×, 8×,
and 16× interpolation filters, a numerically controlled oscillator (NCO), onboard clock multiplier, and on-chip
voltage reference. The DAC5686 has been specifically designed to allow for low input data rates between the
DAC and ASIC, or FPGA, and high output transmit intermediate frequencies (IF). Target applications include
high-speed digital data transmission in wired and wireless communication systems and high-frequency
direct-digital synthesis DDS.
The DAC5686 provides three modes of operation: dual-channel, single-sideband, and quadrature modulation. In
dual-channel mode, interpolation filtering increases the DAC update rate, which reduces sinx/x rolloff and
enables the use of relaxed analog post-filtering.
Single-sideband mode provides an alternative interface to the analog quadrature modulators. Channel carrier
selection is performed at baseband by mixing in the ASIC/FPGA. Baseband I and Q from the ASIC/FPGA are
input to the DAC5686, which in turn performs a complex mix resulting in Hilbert transform pairs at the outputs of
the DAC5686's two DACs. An external RF quadrature modulator then performs the final single-sideband
up-conversion. The DAC5686's complex mixing frequencies are flexibly chosen with the 32-bit programmable
NCO.
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Excel is a trademark of Microsoft Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2009, Texas Instruments Incorporated
DAC5686
SLWS147F – APRIL 2003 – REVISED JUNE 2009 ............................................................................................................................................................ www.ti.com
Unmatched gains and offsets at the RF quadrature modulator result in unwanted sideband and local oscillator
feedthrough. Each DAC in the DAC5686 has an 11-bit offset adjustment and 12-bit gain adjustment, which
compensate for quadrature modulator input imbalances, thus reducing RF filtering requirements.
In quadrature modulation mode, on-chip mixing provides baseband-to-IF up-conversion. Mixing frequencies are
flexibly chosen with a 32-bit programmable NCO. Channel carrier selection is performed at baseband by complex
mixing in the ASIC/FPGA. Baseband I and Q from the ASIC/FPGA are input to the DAC5686, which interpolates
the low data-rate signal to higher data rates. The single DAC output from the DAC5686 is the final IF
single-sideband spectrum presented to RF.
The 2×, 4×, 8×, and 16× interpolation filters are implemented as a cascade of half-band 2× interpolation filters.
Unused filters for interpolation rates of less than 16× are shut off to reduce power consumption. The DAC5686
provides a full bypass mode, which enables the user to bypass all the interpolation and mixing.
The DAC5686 PLL clock multiplier controls all internal clocks for the digital filters and the DAC cores. The
differential clock input and internal clock circuitry provides for optimum jitter performance. Sine wave clock input
signal is supported. The PLL can be bypassed by an external clock running at the DAC core update rate. The
clock divider of the PLL ensures that the digital filters operate at the correct clock frequencies.
The DAC5686 operates with an analog supply voltage of 3.3 V and a digital supply voltage of 1.8 V. Digital I/Os
are 1.8-V and 3.3-V CMOS compatible. Power dissipation is 950 mW at maximum operating conditions. The
DAC5686 provides a nominal full-scale differential current output of 20 mA, supporting both single-ended and
differential applications. The output current can be directly fed to the load with no additional external output buffer
required. The device has been specifically designed for a differential transformer-coupled output with a 50-Ω
doubly terminated load. For a 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output
power of 4 dBm) and 1:1 impedance ratio transformer (–2-dBm output power) are supported.
The DAC5686 operational modes are configured by programming registers through a serial interface. The serial
interface can be configured to either a 3- or 4-pin interface allowing it to communicate with many
industry-standard microprocessors and microcontrollers. Data (I and Q) can be input to the DAC5686 as
separate parallel streams on two data buses, or as a single interleaved data stream on one data bus.
An accurate on-chip 1.2-V temperature-compensated band-gap reference and control amplifier allows the user to
adjust the full-scale output current from 20 mA down to 2 mA. This provides 20-dB gain range control
capabilities. Alternatively, an external reference voltage can be applied for maximum flexibility. The device
features a SLEEP mode, which reduces the standby power to approximately 10 mW, thereby minimizing the
system power consumption.
The DAC5686 is available in a 100-pin HTQFP package. The device is characterized for operation over the
industrial temperature range of –40C to 85C.
ORDERING INFORMATION
TA
PACKAGE DEVICES
100 HTQFP
–40C to 85C
(1)
2
(1)
(PZP) PowerPAD™ plastic quad flatpack
DAC5686IPZP
Thermal pad size: 6 mm × 6 mm
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DAC5686
www.ti.com ............................................................................................................................................................ SLWS147F – APRIL 2003 – REVISED JUNE 2009
FUNCTIONAL BLOCK DIAGRAM
Block Diagram of the DAC5686
CLKVDD
CLKGND
PLLLOCK
PLLGND
LPF
PLLVDD
PHSTR
SLEEP
DVDD
CLK1
1.2-V
Reference
CLK1C
CLK2C
A
Offset
FIR1
FIR2
FIR3
y2
y2
y2
y2
y2
y2
y2
A Gain
FIR5
FIR4
y2
EXTLO
BIASJ
fDATA
DEMUX
EXTIO
2y–16y fDATA
Internal Clock Generation
2y–16y PLL Clock Multiplier
CLK2
DA[15:0]
DGND
DB[15:0]
x
sin(x)
16-Bit
DAC
x
sin(x)
16-Bit
DAC
IOUTA1
IOUTA2
IOUTB1
IOUTB2
TXENABLE
cos
RESETB
QFLAG
SIF
sin
B
Offset
IOGND
B Gain
IOVDD
NCO
100-Pin HTQFP
SDIO
SDO SDENB SCLK
AVDD
AGND
B0019-01
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DAC5686
SLWS147F – APRIL 2003 – REVISED JUNE 2009 ............................................................................................................................................................ www.ti.com
PIN ASSIGNMENTS FOR THE DAC5686
DB7
DB6
DB5
76
79
78
IOGND
80
77
DGND
IOVDD
81
DB8
DVDD
83
82
DB10
DB9
DB11
85
DB12
87
86
84
DVDD
DGND
89
88
DB14
DB15 (MSB or LSB)
DB13
DGND
93
92
91
PHSTR
94
90
SLEEP
RESETB
TESTMODE
98
97
95
QFLAG
99
96
DVDD
DGND
100
PZP PACKAGE
(TOP VIEW)
AGND
1
75
DB4
AVDD
2
74
DB3
AVDD
3
73
DB2
AGND
4
72
DB1
IOUTB1
5
71
DB0 (LSB or MSB)
IOUTB2
6
70
PLLLOCK
AGND
7
69
DGND
AVDD
8
68
DVDD
AGND
9
67
PLLVDD
AVDD
10
66
LPF
EXTIO
11
65
PLLGND
AGND
12
64
CLKGND
BIASJ
13
63
CLK2C
AVDD
14
62
CLK2
EXTLO
15
61
CLKVDD
AVDD
16
60
CLK1C
AGND
17
59
CLK1
AVDD
18
58
CLKGND
AGND
19
57
DGND
IOUTA2
20
56
DVDD
IOUTA1
21
55
DA0 (LSB or MSB)
AGND
22
54
DA1
AVDD
23
53
DA2
AVDD
24
52
DA3
AGND
25
51
DA4
48
49
50
DA7
DA5
47
IOGND
DA6
45
46
DGND
IOVDD
43
DA9
44
DA10
DA8
41
42
DA11
DVDD
39
40
DA12
37
38
DVDD
35
36
DA14
DA13
DGND
33
34
TXENABLE
32
DVDD
DA15 (MSB or LSB)
30
31
SDO
SCLK
SDIO
28
29
SDENB
26
27
DVDD
DGND
DAC5686
P0011-01
4
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DAC5686
www.ti.com ............................................................................................................................................................ SLWS147F – APRIL 2003 – REVISED JUNE 2009
DEVICE INFORMATION
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
AGND
1, 4, 7, 9,
12, 17, 19,
22, 25
I
Analog ground return
AVDD
2, 3, 8, 10,
14, 16, 18,
23, 24
I
Analog supply voltage
BIASJ
13
CLK1
59
I
External clock input; data clock input
CLK1C
60
I
Complementary external clock input; data clock input
CLK2
62
I
External clock input; sample clock for the DAC (optional if PLL disabled)
CLK2C
63
I
Complementary external clock input; sample clock for the DAC (optional if PLL disabled)
CLKGND
58, 64
CLKVDD
61
DA[15:0]
34–36,
39–43,
48–55
I
A-channel data bits 0 through 15
DA15 is most significant data bit (MSB).
DA0 is least significant data bit (LSB). Internal pulldown
DB[15:0]
92–90,
87–83,
78–71
I
B-channel data bits 0 through 15
DB15 is most significant data bit (MSB).
DB0 is least significant data bit (LSB). Internal pulldown
Note: The order of the B data bus can be reversed by register rev_bbus.
DGND
27, 38, 45,
57, 69, 81,
88, 93, 99
Digital ground return
DVDD
26, 32, 37,
44, 56, 68,
82, 89, 100
Digital supply voltage
EXTIO
11
EXTLO
IOUTA1
I/O Full-scale output current bias
Ground return for internal clock buffer
Internal clock buffer supply voltage
I
Used as external reference input when internal reference is disabled (i.e., EXTLO connected to AVDD).
Used as internal reference output when EXTLO = AGND, requires a 0.1-µF decoupling capacitor to
AGND when used as reference output
15
I
Internal reference ground. Connect to AVDD to disable the internal reference
21
O
A-channel DAC current output. Full scale when all input bits are set to 1
IOUTA2
20
O
A-channel DAC complementary current output. Full scale when all input bits are set to 0
IOUTB1
5
O
B-channel DAC current output. Full scale when all input bits are set to 1
IOUTB2
6
O
B-channel DAC complementary current output. Full scale when all input bits are set to 0
IOGND
47, 79
Digital I/O ground return
IOVDD
46, 80
Digital I/O supply voltage
LPF
66
PHSTR
94
PLLGND
65
Ground return for internal PLL
PLLVDD
67
PLL supply voltage. When PLLVDD is 0 V, the PLL is disabled.
PLLLOCK
70
O
PLL lock status bit. In PLL clock mode, PLLLOCK is high when PLL is locked to the input clock. In
external clock mode, PLLLOCK outputs the input rate clock.
QFLAG
98
I
Used in the interleaved data input mode: When the qflag register bit is 1, the QFLAG pin is used as an
input to identify the interleaved data sequence. QFLAG high identifies the data as channel B. Pin can
be left open when not used. Internal pulldown
RESETB
95
I
Resets the chip when low. Internal pullup
SCLK
29
I
Serial interface clock. Internal pulldown
SDENB
28
I
Active-low serial data enable, always an input to the DAC5686. Internal pulldown
I/O PLL loop filter connection. Can be left open or connected to GND if PLL is not used (PLLVDD = 0 V).
I
The PHSTR pin has two functions. When the sync_phstr register is 0, a high on the PHSTR pin resets
the NCO phase accumulator. When the sync_phstr register is 1, a PHSTR pin low-to-high transition
sets the divided clock phase in external clock mode, and a high on the PHSTR pin resets the NCO
phase accumulator. Internal pulldown
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DAC5686
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Terminal Functions (continued)
TERMINAL
NAME
NO.
I/O
DESCRIPTION
SDIO
30
I/O Bidirectional serial-port data in the three-pin serial interface mode. Input-only serial data in the four-pin
serial interface mode. Internal pulldown
SDO
31
O
High-impedance state (the pin is not used) in the three-pin serial interface mode. Serial-port output data
in the four-pin serial interface mode.
SLEEP
96
I
Asynchronous hardware power-down input. Active high. Internal pulldown
TESTMODE
97
I
TESTMODE is DGND for the user.
TxENABLE
33
I
TxENABLE is used in interleaved mode. The rising edge of TxENABLE synchronizes the data of
channels A and B. The first data after the rising edge of TxENABLE is treated as A data, while the next
data is treated as B data and so on. In any mode, TxENABLE being low sets DAC outputs to midscale.
Internal pulldown
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
AVDD
(2)
–0.5 V to 4 V
DVDD (3)
Supply voltage range
–0.5 V to 2.3 V
CLKVDD (2)
IOVDD
–0.5 V to 4 V
(2)
–0.5 V to 4 V
PLLVDD (2)
–0.5 V to 4 V
Voltage between AGND, DGND, CLKGND, PLLGND, and IOGND
–0.5 V to 0.5 V
AVDD to DVDD
–0.5 V to 2.6 V
DA[15:0] (3)
–0.5 V to IOVDD + 0.5 V
DB[15:0] (3)
–0.5 V to IOVDD + 0.5 V
SLEEP (3)
Supply voltage range
CLK1, CLK2, CLK1C, CLK2C
–0.5 V to IOVDD + 0.5 V
(3)
RESETB (3)
LPF (3)
–0.5 V to CLKVDD + 0.5 V
–0.5 V to IOVDD + 0.5 V
–0.5 V to PLLVDD + 0.5 V
IOUT1, IOUT2 (2)
–1 V to AVDD + 0.5 V
EXTIO, BIASJ (2)
–0.5 V to AVDD + 0.5 V
EXTLO (2)
–0.5 V to IOVDD + 0.5 V
Peak input current (any input)
20 mA
Operating free-air temperature range, TA: DAC5686I
–40C to 85C
Storage temperature range
–65C to 150C
Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds
(1)
(2)
(3)
6
260C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Measured with respect to AGND
Measured with respect to DGND
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www.ti.com ............................................................................................................................................................ SLWS147F – APRIL 2003 – REVISED JUNE 2009
ELECTRICAL CHARACTERISTICS (DC SPECIFICATIONS) (1)
over operating free-air temperature range, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 3.3 V, IOVDD = 3.3 V,
DVDD = 1.8 V, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Resolution
MIN
TYP
MAX
UNIT
16
DC Accuracy (2)
INL
Integral nonlinearity
DNL
Differential nonlinearity
1 LSB = IOUTFS/216, TMIN to TMAX
12
LSB
1.84e–4
IOUTFS
9
LSB
1.37e–4
IOUTFS
Analog Output
Coarse gain linearity (INL)
LSB = 1/10th of full scale
Fine gain linearity (INL)
Offset error
Gain error
Gain mismatch
Mid-code offset
LSB
3
LSB
0.003
Without internal reference
0.7
With internal reference
0.7
With internal reference, dual DAC,
SSB mode
Full-scale output current (3)
Output compliance range (4)
0.016
IOUTFS = 20 mA
–2
%FSR
%FSR
2
%FSR
2
20
mA
AVDD – 0.5
AVDD + 0.5
Output resistance
Output capacitance
V
300
kΩ
5
pF
Reference Output
Reference voltage
1.14
Reference output current (5)
1.2
1.26
100
V
nA
Reference Input
VEXTIO
Input voltage range
0.1
Input resistance
1.25
V
1
MΩ
Small-signal bandwidth
2.5
kHz
Input capacitance
100
pF
Temperature Coefficients
Offset drift
Gain drift
3
Without internal reference
15
With internal reference
40
ppm of
FSR/C
25
ppm/C
Reference voltage drift
(1)
(2)
(3)
(4)
(5)
ppm of
FSR/C
Specifications subject to change without notice.
Measured differential across IOUTA1 and IOUTA2 or IOUTB1 and IOUTB2 with 25 Ω each to AVDD
Nominal full-scale current, IOUTFS , equals 16× the IBIAS current.
The upper limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown,
resulting in reduced reliability of the DAC5686 device. The lower limit of the output compliance is determined by the load resistors and
full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity.
Use an external buffer amplifier with high-impedance input to drive any external load.
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DAC5686
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ELECTRICAL CHARACTERISTICS (DC SPECIFICATIONS) (continued)
over operating free-air temperature range, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 3.3 V, IOVDD = 3.3 V,
DVDD = 1.8 V, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Power Supply
AVDD
Analog supply voltage
DVDD
Digital supply voltage
CLKVDD Clock supply voltage
IOVDD
I/O supply voltage
PLLVDD
PLL supply voltage
IAVDD
Analog supply current
IDVDD
Digital supply current
ICLKVDD
Clock supply current
IPLLVDD
PLL supply current
IIOVDD
IO supply current
IAVDD
3
3.3
3.6
V
1.65
1.8
1.95
V
3
3.3
3.6
V
3.6
V
3.6
V
1.65
3
Single (quad) DAC mode;
including output current through
load resistor, mode 7
3.3
30
mA
Dual DAC mode; including output
current through load resistor,
mode 11
55
242
mA
10
mA
28
mA
<3
mA
Sleep mode, AVDD supply current
1
mA
IDVDD
Sleep mode, DVDD supply current
4
mA
ICLKVDD
Sleep mode, CLKVDD supply
current
2
mA
0.5
mA
0.25
mA
IPLLVDD
Sleep mode, PLLVDD supply
current
IIOVDD
Sleep mode, IOVDD supply current
fDATA = 125 MSPS, SSB mode,
fDAC = 500 MSPS, 40-MHz IF
Sleep mode
Mode 1 (6) AVDD = 3.3 V,
DVDD = 1.8 V
215
(7)
PD
Power dissipation
Mode 2 AVDD = 3.3 V,
DVDD = 1.8 V
495
Mode 5 (8) AVDD = 3.3 V,
DVDD = 1.8 V
445
mW
(9)
Mode 7 AVDD = 3.3 V,
DVDD = 1.8 V
754
Mode 9 (10) AVDD = 3.3 V,
DVDD = 1.8 V
547
(11)
Mode 11
AVDD = 3.3 V,
DVDD = 1.8 V
855
950
APSRR
Power supply rejection ratio
–0.2
0.2
%FSR/V
DPSRR
Power supply rejection ratio
–0.2
0.2
%FSR/V
(6)
(7)
(8)
(9)
(10)
(11)
8
Mode 1: Dual DAC mode, fully bypassed, fDAC = 160 MSPS, fOUT = 20 MHz
Mode 2: Dual DAC mode, 2× interpolation, fDAC = 320 MSPS, fOUT = 20 MHz
Mode 5: Quadrature modulation mode, 4× interpolation, fDAC/4 mixing, fDAC = 320 MSPS, fOUT = 100 MHz
Mode 7: Quadrature modulation mode, 4× interpolation, NCO running at 320 MHz, fDAC = 320 MSPS, fOUT = 100 MHz
Mode 9: SSB modulation mode, 4× interpolation, fDAC/4 mixing, fDAC = 320 MSPS, fOUT = 100 MHz
Mode 11: SSB modulation mode, 4× interpolation, NCO running at 320 MHz, fOUT = 100 MHz, maximum operating condition
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www.ti.com ............................................................................................................................................................ SLWS147F – APRIL 2003 – REVISED JUNE 2009
ELECTRICAL CHARACTERISTICS (AC SPECIFICATIONS) (1)
over operating free-air temperature range, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 0 V, IOVDD = 3.3 V, DVDD = 1.8 V,
IOUTFS = 20 mA, external clock mode, differential transformer-coupled output, 50-Ω doubly terminated load (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Analog Output
fCLK
Maximum output update rate
ts(DAC)
Output settling time to 0.1%
tpd
tr(IOUT) (2)
tf(IOUT) (2)
500
Mid-scale transition
MSPS
12
ns
Output propagation delay
2.5
ns
Output rise time 10% to 90%
2.5
ns
Output fall time 90% to 10%
2.5
ns
AC Performance—1:1 Impedance-Ratio Transformer
First Nyquist zone < fDATA/2 (3), 4× interpolation, dual DAC
mode, fDATA = 52 MSPS, fOUT = 14 MHz, TA = 25C,
IOVDD = 1.8 V
SFDR
SNR
ACLR
(1)
(2)
(3)
First Nyquist zone < fDATA/2 (3), 4× interpolation, dual DAC
mode, fDATA = 160 MSPS, fOUT = 20 MHz, full bypass,
TA = TMIN to TMAX and PLLVDD = 3.3 V for MIN, 25C for TYP,
Spurious free dynamic range IOVDD = 1.8 V for TYP
First Nyquist zone < fDATA/2 (3), 2× interpolation, dual DAC
mode, fDATA = 160 MSPS, fOUT = 41 MHz, TA = 25C,
IOVDD = 1.8 V
Signal-to-noise ratio
Adjacent-channel power
ratio
89
68
79
dBc
72
First Nyquist zone < fDATA/2 (3), 2× interpolation, dual DAC
mode, fDATA = 160 MSPS, fOUT = 61 MHz, TA = 25C,
IOVDD = 1.8 V
68
First Nyquist zone < fDATA/2, fDATA = 100 MSPS,
fOUT = 5 MHz, IOVDD = 1.8 V, fDAC = 400 MSPS
80
First Nyquist zone < fDATA/2, fDATA = 78 MSPS,
fOUT = 15.6 MHz, 15.8 MHz, 16.2 MHz, 16.4 MHz,
IOVDD = 1.8 V, fDAC = 314 MSPS
72
Single carrier W-CDMA with 3.84-MHz BW, 5-MHz spacing,
centered at IF, TESTMODEL 1, 10 ms, fDATA = 122.88 MSPS,
baseband, dual DAC, 2× interpolation,
fOUT = 245 MSPS
72
Single carrier W-CDMA with 3.84-MHz BW, 5-MHz spacing,
centered at IF, TESTMODEL 1, 10 ms, fDATA = 76.8 MSPS, IF
= 19.2 MHz, dual DAC, 2× interpolation,
fOUT = 153.6 MSPS
77
Single carrier W-CDMA with 3.84-MHz BW, 5-MHz spacing,
centered at IF, TESTMODEL 1, 10 ms, fDATA = 122.88 MSPS,
IF = 30.72 MHz, dual DAC, 2× interpolation, fDAC = 245 MSPS
76
Single carrier W-CDMA with 3.84-MHz BW, 5-MHz spacing,
centered at IF, TESTMODEL 1, 10 ms, fDATA = 61.44 MSPS,
IF = 61.44 MHz, quad mode, fDAC/4, 4×
interpolation, fDAC = 245 MSPS
73
Two-carrier W-CDMA with 3.84-MHz BW, 5-MHz spacing,
centered at IF, TESTMODEL 1, 10 ms, fDATA = 122.88 MSPS,
IF = 30.72 MHz, dual DAC, 2× interpolation, fDAC = 245 MSPS
72
Four-carrier W-CDMA with 3.84-MHz BW, 5-MHz spacing,
centered at IF, TESTMODEL 1, 10 ms, fDATA = 121.88 MSPS,
complex IF - 30.72 MHz, quad mode, fDAC/4, 4× interpolation,
IF = 92.16 MHz
64
dB
dB
Specifications subject to change without notice
Measured single-ended into 50-Ω load
See the Non-Harmonic Clock-Related Spurious Signals section for information on spurious products out of band (> fDATA/2).
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ELECTRICAL CHARACTERISTICS (AC SPECIFICATIONS) (continued)
over operating free-air temperature range, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 0 V, IOVDD = 3.3 V, DVDD = 1.8 V,
IOUTFS = 20 mA, external clock mode, differential transformer-coupled output, 50-Ω doubly terminated load (unless otherwise
noted)
PARAMETER
Third-order two-tone
intermodulation
IMD3
IMD
Four-tone intermodulation
TEST CONDITIONS
MIN
TYP
fDATA = 160 MSPS, fOUT = 60.1 and 61.1 MHz,
2× interpolation, 320 MSPS, IOVDD = 1.8 V,
each tone at –6 dBFS
74
fDATA = 100 MSPS, fOUT = 15.1 and 16.1 MHz,
2× interpolation, 200 MSPS, IOVDD = 1.8 V,
each tone at –6 dBFS
84
fDATA = 100 MSPS, fOUT = 15.6 MHz, 15.8 MHz, 16.2 MHz,
16.4 MHz, 4× interpolation, 400 MSPS, IOVDD = 1.8 V, each
tone at –12 dBFS
85
MAX
UNIT
dBc
dBc
ELECTRICAL CHARACTERISTICS (DIGITAL SPECIFICATIONS) (1)
over operating free-air temperature range, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 3.3 V, IOVDD = 3.3 V, DVDD = 1.8
V, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CMOS Interface
VIH
High-level input voltage
2
3
VIL
Low-level input voltage
0
0
IIH
High-level input current
IIL
Low-level input current
V
0.8
V
–40
40
A
–40
40
Input capacitance
5
A
pF
VOH
High-level output voltage,
PLLLOCK, SDO, SDIO (I/O)
IL = –100 A
IOVDD – 0.2
IL = –8 mA
0.8 × IOVDD
VOL
Low-level output voltage,
PLLLOCK, SDO, SDIO (I/O)
IL = 100 A
0.2
IL = 8 mA
0.22 × IOVDD
V
V
PLL (2)
Input data rate supported
Phase noise
1
160
At 600-kHz offset, measured at
DAC output, 25-MHz 0-dBFS tone,
fDATA = 125 MSPS, 4× interpolation
128
At 6-MHz offset, measured at DAC
output, 25-MHz 0-dBFS tone, fDATA
= 125 MSPS, 4× interpolation
151
VCO minimum frequency
PLL_rng = 00 (nominal)
VCO maximum frequency
PLL_rng = 00 (nominal)
MSPS
dBc/Hz
120
500
MHz
MHz
NCO
NCO clock (DAC update rate)
320
MHz
Serial Port Timing
tsu(SDENB)
Setup time, SDENB to rising edge
of SCLK
20
ns
tsu(SDIO)
Setup time, SDIO valid to rising
edge of SCLK
10
ns
th(SDIO)
Hold time, SDIO valid to rising
edge of SCLK
5
ns
tSCLK
Period of SCLK
100
ns
tSCLKH
High time of SCLK
40
ns
tSCLKL
Low time of SCLK
40
ns
(1)
(2)
10
Specifications subject to change without notice.
See the Non-Harmonic Clock-Related Spurious Signals section for information on spurious products generated in PLL clock mode.
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ELECTRICAL CHARACTERISTICS (DIGITAL SPECIFICATIONS) (continued)
over operating free-air temperature range, AVDD = 3.3 V, CLKVDD = 3.3 V, PLLVDD = 3.3 V, IOVDD = 3.3 V, DVDD = 1.8
V, IOUTFS = 20 mA (unless otherwise noted)
PARAMETER
td(DATA)
TEST CONDITIONS
MIN
Data output delay after falling
edge of SCLK
TYP
MAX
UNIT
10
ns
Parallel Data Input Timing, CLK1 Latching (PLL Mode and Dual Clock Mode)
tsu(DATA)
Setup time, data valid to rising
edge of CLK1
0.3
–0.4
ns
th(DATA)
Hold time, data valid after rising
edge of CLK1
1.2
0.6
ns
Timing Parallel Data Input (External Clock Mode, CLK2 Input)
tsu(DATA)
Setup time, DATA valid to rising
edge of PLLLOCK
High-impedance load on PLLLOCK.
Note that tsu increases with a
lower-impedance load.
4.6
3
ns
th(DATA)
Hold time, DATA valid after rising
edge of PLLLOCK
High-impedance load on PLLLOCK.
Note that th decreases (becomes
more negative) with a
lower-impedance load.
–0.8
–2.4
ns
td(PLLLock)
Delay from CLK2 rising edge to
PLLLOCK rising edge
High-impedance load on PLLLOCK.
Note that PLLLOCK delay
increases with a lower-impedance
load.
2.5
4.2
6.5
ns
TYPICAL CHARACTERISTICS
INL – Integral Nonlinearity Error – LSB
INTEGRAL NONLINEARITY ERROR
vs
INPUT CODE
10
8
6
4
2
0
–2
–4
–6
–8
–10
0
10000
20000
30000
40000
50000
60000
70000
Input Code
G001
Figure 1.
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TYPICAL CHARACTERISTICS (continued)
DNL – Differential Nonlinearity Error – LSB
DIFFERENTIAL NONLINEARITY ERROR
vs
INPUT CODE
15
13
11
9
7
5
3
1
–1
0
10000
20000
30000
40000
50000
60000
70000
Input Code
G002
Figure 2.
IN-BAND SPURIOUS-FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY
fDATA = 125 MSPS
fIN = 20 MHz
Dual DAC Mode
4y Interpolation
PLLVDD = 0 V
0
−10
Power – dBm
−20
−30
−40
−50
−60
−70
−80
−90
0
50
100
150
200
250
SFDR – In-Band Spurious-Free Dynamic Range – dBc
SINGLE-TONE SPECTRUM
10
90
85
80
0 dBfS
75
70
65
fDATA = 125 MSPS
Dual DAC Mode
4y Interpolation
In-band = 0–62.5 MHz
PLLVDD = 0 V
60
55
50
10
15
f – Frequency – MHz
G003
Figure 3.
12
–6 dBfS
–12 dBfS
20
25
30
35
40
fO – Output Frequency – MHz
45
50
G004
Figure 4.
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TYPICAL CHARACTERISTICS (continued)
SINGLE-TONE SPECTRUM
80
10
fDATA = 75 MSPS
fIN = None
NCO On
fOUT = 100 MHz
Quad Mode
4y Interpolation
PLLVDD = 0 V
0
75
−10
70
−20
0 dBfS
65
Power – dBm
SFDR – Out-of-Band Spurious-Free Dynamic Range – dBc
OUT-OF-BAND SPURIOUS-FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY
–6 dBfS
60
–12 dBfS
55
−30
−40
−50
−60
fDATA = 125 MSPS
Dual DAC Mode
4y Interpolation
Out-of-Band = 62.5–250 MHz
PLLVDD = 0 V
50
45
−70
−80
40
−90
10
15
20
25
30
35
40
45
fO – Output Frequency – MHz
50
0
25
50
G005
100
125
150
G006
Figure 5.
Figure 6.
TWO-TONE IMD3
vs
OUTPUT FREQUENCY
TWO-TONE IMD PERFORMANCE
0
95
−10
90
−20
± 0.5 MHz
85
80
−30
Power – dBm
Two-Tone IMD3 – dBc
75
f – Frequency – MHz
± 2 MHz
75
fDATA = 150 MSPS
fIN1 = 19.5 MHz
fIN2 = 20.5 MHz
Dual DAC Mode
2y Interpolation
PLLVDD = 0 V
−40
−50
−60
−70
fDATA = 150 MSPS
Dual DAC Mode
2y Interpolation
PLLVDD = 0 V
70
−80
−90
65
10
15
20
25
30
35
40
45
50
fO – Output Frequency – MHz
55
60
−100
10
15
20
25
30
f – Frequency – MHz
G007
Figure 7.
G008
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
TWO-TONE IMD3
vs
OUTPUT FREQUENCY
TWO-TONE IMD PERFORMANCE
0
90
fDATA = 80 MSPS
NCO On
Quad Mode
4y Interpolation
PLLVDD = 0 V
80
−20
−30
Power – dBm
Two-Tone IMD3 – dBc
85
fDATA = 80 MSPS
fIN1 = –0.5 MHz
fIN2 = 0.5 MHz
NCO = 70 MHz
Quad Mode
4y Interpolation
PLLVDD = 0 V
−10
75
± 0.5 MHz
70
± 2 MHz
−40
−50
−60
−70
65
−80
60
−90
−100
60
55
10
30
50
70
90
110
130
150
65
70
fO – Output Frequency – MHz
G010
Figure 10.
TWO-TONE IMD PERFORMANCE
WCDMA TEST MODEL 1: SINGLE CARRIER
0
Power – dBm
−30
−40
−20
fDATA = 80 MSPS
fIN1 = –0.5 MHz
fIN2 = 0.5 MHz
NCO = 150 MHz
Quad Mode
4y Interpolation
PLLVDD = 0 V
−30
−40
−50
Power – dBm
−20
−50
−60
−70
fDATA = 122.88 MSPS
fIN = 30.72 MHz
ACLR = 78.6 dB
4y Interpolation
Dual DAC Mode
PLLVDD = 0 V
−60
−70
−80
−90
−100
−80
−110
−90
−100
140
−120
145
150
155
160
−130
18
f – Frequency – MHz
G011
Figure 11.
14
80
G009
Figure 9.
−10
75
f – Frequency – MHz
22
26
30
34
38
42
f – Frequency – MHz
G012
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
WCDMA TEST MODEL 1: DUAL CARRIER
WCDMA TEST MODEL 1: DUAL CARRIER
−20
−30
−40
fDATA = 122.88 MSPS
fIN = 30.72 MHz
ACLR = 71.69 dB
4y Interpolation
Dual DAC Mode
PLLVDD = 0 V
−30
−40
−50
−60
Power – dBm
Power – dBm
−50
−20
−70
−80
−90
−60
−70
−80
−90
−100
−110
−100
−120
−110
−130
15
fDATA = 122.88 MSPS
fIN = Baseband Complex
ACLR = 69.08 dB
2y Interpolation
Quad Mode
PLLVDD = 0 V
20
25
30
35
40
−120
46
45
51
f – Frequency – MHz
56
61
66
71
f – Frequency – MHz
G013
G014
Figure 13.
Figure 14.
WCDMA TEST MODEL 1: FOUR CARRIER
WCDMA TEST MODEL 1: DUAL CARRIER
−10
−10
−30
Power – dBm
−40
fDATA = 122.88 MSPS
fIN = –30.72 MHz Complex
ACLR = 63.29 dB
4y Interpolation
Quad Mode
PLLVDD = 0 V
−30
Power – dBm
−20
76
−50
−60
−70
fDATA = 122.88 MSPS
fIN = 30.72 MHz Complex
ACLR = 58.58 dB
4y Interpolation
Quad Mode
PLLVDD = 0 V
−50
−70
−80
−90
−90
−100
−110
72
77
82
87
92
97
102
107
112
−110
138
143
148
153
158
163
168
f – Frequency – MHz
f – Frequency – MHz
G016
G015
Figure 15.
Figure 16.
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TYPICAL CHARACTERISTICS (continued)
VCO GAIN
vs
VCO FREQUENCY
600
Boost for 0%
GVCO – VCO Gain – MHz/V
500
400
300
Boost for 45%
200
100
Boost for 30%
Boost for 15%
0
0
100
200
300
400
500
fVCO – VCO Frequency – MHz
600
700
G017
Figure 17.
16
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DETAILED DESCRIPTION
Dual-Channel Mode
In dual-channel mode, interpolation filtering increases the DAC update rate, thereby reducing sinx/x rolloff and
enabling relaxed analog post-filtering, and is useful for baseband I and Q modulation or two-channel low-IF
signals. The dual-channel mode is set by mode[1:0] = 00 in the config_lsb register. Figure 18 shows the data
path architecture in dual-channel mode. The A- and B-data paths, which are independent, consist of four
cascaded half-band interpolation filters, followed by an optional inverse sinc filter. Interpolation filtering is
selected as 2×, 4×, 8×, or 16× by sel[1:0] in the config_lsb register. Magnitude spectral responses of each filter
are presented following in the section on digital filtering. Full bypass of all the interpolation filters is selected by
fbypass in the config_lsb register. The inverse sinc filter is intended for use in single-sideband and quadrature
modulation modes and is of limited benefit in dual-channel mode.
A
Offset
fDATA
DEMUX
FIR1
FIR2
2fDATA
DA[15:0]
FIR3
4fDATA
FIR4
FIR5
16fDATA
8fDATA
2y–16y fDATA
y2
x
sin(x)
16-Bit
DAC
IOUTA1
16-Bit
DAC
IOUTB1
IOUTA2
A Gain
B Gain
FIR1
FIR2
2fDATA
DB[15:0]
FIR3
4fDATA
FIR4
8fDATA
FIR5
16fDATA
y2
x
sin(x)
IOUTB2
B
Offset
B0020-01
Figure 18. Data Path in Dual-Channel Mode
Single-Sideband Mode
Single-sideband (SSB) mode provides optimum interfacing to analog quadrature modulators. The SSB mode is
selected by mode[1:0] = 01 in the config_lsb register. Figure 19 shows the data path architecture in
single-sideband mode. Complex baseband I and Q are input to the DAC5686, which in turn performs a complex
mix, resulting in Hilbert transform pairs at the outputs of the DAC5686's two DACs. NCO mixing frequencies are
programmed through 32-bit freq (4 registers); 16-bit phase adjustments are programmed through phase (2
registers). The NCO operates at the DAC update rate; thus, increased amounts of interpolation allow for higher
IFs. More details for the NCO are provided as follows. For mixing to fDAC/4, DAC5686 provides a specific
architecture that exploits the {… –1 0 1 0 …} resultant streams from sin and cos; the NCO is shut off in this mode
to conserve power. fDAC/4 mix mode is implemented by deasserting nco in register config_msb while in
single-sideband or quadrature modulation mode.
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fDATA
cos
DEMUX
A
Offset
+
DA[15:0]
2y–16y fDATA
FIR5
y2–y16
A
sin
DB[15:0]
x
sin(x)
+/−
A Gain
+
B Gain
16-Bit
DAC
IOUTA1
16-Bit
DAC
IOUTB1
IOUTA2
y2–y16
sin
B
cos
x
sin(x)
IOUTB2
+
B
Offset
B0021-01
Figure 19. Data Path in SSB Mode
Figure 20 shows the DAC5686 interfaced to an RF quadrature modulator. The outputs of the complex mixer
stage can be expressed as:
A(t) = I(t)cos(ωct) – Q(t)sin(ωct) = m(t)
B(t) = I(t)sin(ωct) + Q(t)cos(ωct) = mh(t)
where m(t) and mh(t) connote a Hilbert transform pair. Upper single-sideband up-conversion is achieved at the
output of the analog quadrature modulator, whose output is expressed as:
IF(t) = I(t)cos(ωc+ ωLO)t – Q(t)sin(ωc+ ωLO)t
Flexibility is provided to the user by allowing for the selection of –B(t) out, which results in lower-sideband
up-conversion. This option is selected by ssb in the config_msb register. Figure 21 depicts the magnitude
spectrum along the signal path during single-sideband up-conversion for real input. Further flexibility is provided
to the user by allowing for the inverse of sin to be used in the complex mixer by programming rspect in the
config_usb register. The four combinations of rspect and ssb allow the user to select one of four complex
spectral bands to input to a quadrature modulator (see Figure 22).
18
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DAC5686
cos(wct)
I
A(t) = I(t)cos(wct) – Q(t)sin(wct)
+
A
sin(wct)
–
DAC
Q
cos(wLOt)
IF(t) = I(t)cos(wc + wLO)t
– Q(t)sin(wc + wLO)t
sin(wct)
DAC
+
cos(wct)
B
sin(wLOt)
0°
90°
Quadrature
Modulator
+
LO
B(t) = I(t)sin(wct) + Q(t)cos(wct)
B0022–01
Figure 20. DAC5686 in SSB Mode With Quadrature Modulator
Real Input
Spectrum
to DAC5686
ω
0
Complex Input
Spectrum
to Quadrature Modulator
ωc
ω
ωLO + ωc
ω
0
Output Spectrum
to Quadrature Modulator
ωLO – ωc
ωLO
M0016-01
Figure 21. Spectrum After First and Second Up-Converson for Real Input
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Complex Input
Spectrum
to DAC5686
0
–ωc
Complex Input
Spectra to
Quadrature
Modulator
–ωc
–ωc
–ωc
0
0
0
0
ω
ωc
ωc
ωc
ωc
ω
ω
ω
ω
rspect = 0
ssb = 0
rspect = 0
ssb = 1
rspect = 1
ssb = 1
rspect = 1
ssb = 0
M0017-01
Figure 22. Complex Input Spectrum and DAC Output Spectra
To compensate for the sinx/x rolloff of the zero-order hold of the DACs, the DAC5686 provides an inverse sinc
FIR, which provides high-frequency boost. The magnitude spectral response of this filter is presented in the
Digital Filters section.
DAC Gain and Offset Control
Unmatched gains and offsets at the RF quadrature modulator result in unwanted sideband and local-oscillator
feedthrough. Gain and offset imbalances between the two DACs are compensated for by programming
daca_gain, dacb_gain, daca_offset, and dacb_offset in registers 0x0A through 0x0F (see the following
register descriptions). The DAC gain value controls the full-scale output current. The DAC offset value adds a
digital offset to the digital data before digital-to-analog conversion. Care must be taken when using the offset by
restricting the dynamic range of the digital signal to prevent saturation when the offset value is added to the
digital signal.
Dual-Channel Real Up-Conversion With NCO Set to fDAC/2
The final interpolation filter in the DAC5686 can be converted from a low-pass filter to a high-pass filter by
multiplying the interpolation filter output by the (–1)N = 1, –1, 1, –1, … sequence generated by the NCO in
single-sideband mode. The high-pass filter selects a spectrally inverted image at fDAC/2 – fIF, where fIF is the
center frequency of the input spectrum. Note that in this mode fDAC is limited by the 320-MHz maximum
frequency for NCO operation.
20
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The output of the mixer for the Nth sample is
Aout(N) = Ain(N)cos(2π(Nf + f0)/fDAC + φ) – Bin(N)sin(2π(Nf + f0)/fDAC + φ)
Bout(N) = Ain(N)sin(2π(Nf + f0)/fDAC + φ) + Bin(N)cos(2π(Nf + f0)/fDAC + φ)
where f = freq × fDAC/232 and φ = phase × π/215 and f0 is the initial value of the NCO accumulator. When
f = fDAC/2, f0 = 0, and φ = 0, the sine term is 0 and the equations simplify to
Aout(N) = Ain(N) × (–1)N
Bout(N) = Bin(N) × (–1)N
resulting in two independent, real up-conversion paths.
It is essential that the NCO accumulator initial value f0 = 0 to eliminate the cross-terms between the A and B
channels. The accumulator is reset to 0 when the NCO is running by raising the PHSTR pin to IOVDD (when
sync_phstr is set to 0). Note that the accumulator remains at 0 until the PHSTR pin is lowered to GND. The
following steps ensure that the accumulator does not have a non-zero starting value:
1. Program the frequency register to 231.
2. Enable the NCO by asserting register bit nco in config_msb.
3. Raise PHSTR to IOVDD.
4. Lower PHSTR to GND.
Quadrature Modulation Mode
In quadrature modulation mode, on-chip mixing of complex I and Q inputs provides the final baseband-to-IF
up-conversion. Quadrature modulation mode is selected by mode[1:0] = 10 in the config_lsb register. Figure 23
shows the data path architecture in quadrature modulation mode. Complex baseband I and Q from the
ASIC/FPGA are input to the DAC5686, which in turn quadrature modulates I and Q to produce the final IF
single-sideband spectrum. DAC A is held constant, while DAC B presents the DAC5686 quadrature modulator
mode output.
NCO mixing frequencies are programmed through 32-bit freq (4 registers); 16-bit phase adjustments are
programmed through phase (2 registers). The NCO operates at the DAC update rate; thus, increased amounts
of interpolation allow for higher IFs. More details for the NCO are provided in the NCO section. For mixing to
fDAC/4, the DAC5686 provides a specific architecture that exploits the {… –1 0 1 0 …} resultant streams from sin
and cos; the NCO is shut off in this mode to conserve power. The fDAC/4 mix mode is implemented by
deasserting nco in register config_msb while in single-sideband or quadrature modulation mode.
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cos
sin
fDATA
FIR1
DEMUX
FIR2
FIR3
FIR4
2y–16y fDATA
y2
DA[15:0]
y2
y2
y2
+
FIR5
x
sin(x)
FIR1
FIR2
FIR3
FIR4
16-Bit
DAC
B
Offset
y2
y2
IOUTB2
+/−
DB[15:0]
y2
IOUTB1
B Gain
y2
sin
cos
B0023-01
Figure 23. Data Path in Quadrature Modulation Mode
In quadrature modulation mode, only one output from the complex mixer stage is routed to the B DAC. The
output can be expressed as:
B(t) = I(t)sin(ωct) + Q(t)cos(ωct)
or
B(t) = I(t)cos(ωct) – Q(t)sin(ωct)
Single-sideband up-conversion is achieved when I and Q are Hilbert transform pairs. Upper- or lower-sideband
up-conversion is selected by ssb in the config_msb register, which selects the output from the mixer stage that
is routed out.
The offset and gain features for the B DAC, as previously described, are functional in the quadrature mode.
Serial Interface
The serial port of the DAC5686 is a flexible serial interface that communicates with industry-standard
microprocessors and microcontrollers. The interface provides read/write access to all registers used to define the
operating modes of the DAC5686. It is compatible with most synchronous transfer formats and can be configured
as a 3- or 4-pin interface by sif4 in register config_msb. In both configurations, SCLK is the serial-interface
input clock and SDENB is the serial-interface enable. For the 3-pin configuration, SDIO is a bidirectional pin for
both data-in and data-out. For the 4-pin configuration, SDIO is data-in only and SDO is data-out only.
Each read/write operation is framed by signal SDENB (serial data enable bar) asserted low for 2 to 5 bytes,
depending on the data length to be transferred (1–4 bytes). The first frame byte is the instruction cycle, which
identifies the following data transfer cycle as read or write, how many bytes to transfer, and the address to/from
which to transfer the data. Table 1 indicates the function of each bit in the instruction cycle and is followed by a
detailed description of each bit. Frame bytes 2 through 5 comprise the data to be transferred.
Table 1. Instruction Byte of the Serial Interface
MSB
Bit
22
7
LSB
6
5
4
3
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1
0
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Table 1. Instruction Byte of the Serial Interface (continued)
MSB
Description
R/W
LSB
N1
N0
–
A3
A2
A1
A0
R/W: Identifies the following data transfer cycle as a read or write operation. A high indicates a read operation
from the DAC5686 and a low indicates a write operation to the DAC5686.
N[1:0]: Identifies the number of data bytes to be transferred per Table 2. Data is transferred MSB-first.
Table 2. Number of Transferred Bytes Within One
Communication Frame
N1
N0
0
0
DESCRIPTION
Transfer 1 byte
0
1
Transfer 2 bytes
1
0
Transfer 3 bytes
1
1
Transfer 4 bytes
A4: Unused
A[3:0]: Identifies the address of the register to be accessed during the read or write operation. For multibyte
transfers, this address is the starting address and the address decrements. Note that the address is written to the
DAC5686 MSB-first.
Serial-Port Timing Diagrams
Figure 24 shows the serial-interface timing diagram for a DAC5686 write operation. SCLK is the serial-interface
clock input to the DAC5686. Serial data enable SDENB is an active-low input to the DAC5686. SDIO is serial
data-in. Input data to the DAC5686 is clocked on the rising edges of SCLK.
Instruction Cycle
SDENB
Data Transfer Cycle(s)
SCLK
SDIO
R/W N1 N0
−
A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
ts(SDENB)
t(SCLK)
SDENB
SCLK
SDIO
ts(SDIO)
th(SDIO)
t(SCLKL)
t(SCLKH)
T0037-01
Figure 24. Serial-Interface Write Timing Diagram
Figure 25 shows the serial-interface timing diagram for a DAC5686 read operation. SCLK is the serial-interface
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clock input to the DAC5686. Serial data enable SDENB is an active-low input to the DAC5686. SDIO is serial
data-in during the instruction cycle. In the 3-pin configuration, SDIO is data-out from the DAC5686 during the
data transfer cycle(s), while SDO is in a high-impedance state. In the 4-pin configuration, SDO is data-out from
the DAC5686 during the data transfer cycle(s). SDO is never placed in the high-impedance state in the four-pin
configuration.
Data Transfer Cycle(s)
Instruction Cycle
SDENB
SCLK
SDIO
R/W N1 N0
−
A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 0
D7 D6 D5 D4 D3 D2 D1 D0 0
SDO
4-Pin Configuration
Output
3-Pin Configuration
Output
SDENB
SCLK
SDIO
SDO
Data n
Data n−1
td(DATA)
T0038-01
Figure 25. Serial-Interface Read Timing Diagram
Clock Generation
In the DAC5686, the internal clocks (1×, 2×, 4×, 8×, and 16×, as needed) for the logic, FIR interpolation filters,
and DAC are derived from a clock at either the input data rate using an internal PLL (PLL clock mode) or the
DAC output sample rate (external clock mode). Power for the internal PLL blocks (PLLVDD and PLLGND) is
separate from power for the other clock generation blocks (CLKVDD and CLKGND), thus minimizing phase noise
within the PLL.
The DAC5686 has three clock modes for generating the internal clocks (1×, 2×, 4×, 8×, and 16×, as needed) for
the logic, FIR interpolation filters, and DACs. The clock mode is set using the PLLVDD pin and dual_clk in
register config_usb. A block diagram for the clock generation circuit is shown in Figure 27.
1. PLLVDD = 0 V and dual_clk = 0: EXTERNAL CLOCK MODE
In EXTERNAL CLOCK MODE, the user provides a clock signal at the DAC output sample rate through
CLK2/CLK2C. CLK1/CLK1C and the internal PLL are not used, so the LPF circuit is not applicable. The input
data rate clock and interpolation rate are selected by the registers sel[1:0], and are output through the
PLLLOCK pin. It is common to use the PLLLOCK clock to drive the chip that sends the data to the DAC;
otherwise, there is phase ambiguity regarding how the DAC divides down to the input sample rate clock and
an external clock divider divides down. (For a divide-by-N, there are N possible phases.) The phase
ambiguity can also be solved by using PHSTR pin with a synchronization signal.
2. PLLVDD = 3.3 V (dual_clk can be 0 or 1 and is ignored): PLL CLOCK MODE
Power for the internal PLL blocks (PLLVDD and PLLGND) is separate from power for the other clock
generation blocks (CLKVDD and CLKGND), thus minimizing PLL phase noise.
24
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In PLL CLOCK MODE, the DAC is driven at the input sample rate (unless the data is multiplexed) through
CLK1/CLK1C. CLK2/CLK2C is not used. In this case, there is no phase ambiguity on the clock. The DAC
generates the higher-speed DAC sample-rate clock using an internal PLL/VCO. In PLL clock mode, the user
provides a differential external reference clock on CLK1/CLK1C.
A type-4 phase-frequency detector (PFD) in the internal PLL compares this reference clock to a feedback
clock and drives the PLL to maintain synchronization between the two clocks. The feedback clock is
generated by dividing the VCO output by 1×, 2×, 4×, or 8× as selected by the prescaler (div[1:0]). The
output of the prescaler is the DAC sample rate clock and is divided down to generate clocks at ÷2, ÷4, ÷8,
and ÷16. The feedback clock is selected by the registers sel[1:0], and then is fed back to the PFD for
synchronization to the input clock. Because the feedback clock is also used for the data input rate, the
interpolation rate of the DAC5686 is the ratio of DAC output clock to the feedback clock. The PLLLOCK pin
is an output that indicates when the PLL has achieved lock. An external RC low-pass PLL filter is provided
by the user at pin LPF. See the low-pass filter section for filter-setting calculations. This is the only mode
where the LPF filter applies.
Use of the internal PLL/VCO generally results in higher phase noise than if an externally generated DAC
clock is used. At low frequencies, such as baseband signals, use of the internal PLL/VCO likely has a
minimal effect on signal quality. For higher IF frequencies, such as in single sideband or quadrature
modulation mode, the PLL/VCO phase noise can result in degradation of the signal. Note that most of the
DAC5686 plots and typical specifications are in external clock mode (PLLVDD = 0). Use of the DAC5686
PLL/VCO also can result in higher out-of-band spurious signals (see the Non-Harmonic Clock-Related
Spurious Signals section).
3. PLLVDD = 0 V and dual_clk = 1: DUAL CLOCK MODE
In DUAL CLOCK MODE, the DAC is driven at the DAC sample rate through CLK2/CLK2C and at the input
data rate through CLK1/CLK1C. The DUAL CLOCK MODE has the advantage of a clean external clock for
DAC sampling without the phase ambiguity. The edges of CLK1 and CLK2 must be aligned to within talign
(See Figure 26), defined as
1
t align =
- 0.5 ns
2fCLK2
where fCLK2 is the clock frequency of CLK2. For example, talign = 0.5 ns at fCLK2 = 500 MHz and 1.5 ns at fCLK2
= 250 MHz.
CLK2
CLK1
∆ < talign
DA[15:0]
DB[15:0]
th
ts
T0002−01
Figure 26. DAC and Data Clock Mode
The CDC7005 from Texas Instruments is recommended for providing phase-aligned clocks at different
frequencies for this application.
Table 3 provides a summary of the clock configurations with corresponding data rate ranges.
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LPF
DIV[1:0]
PLLVDD
CLK1
CLK1C
Clk Buffer
Charge
Pump
PFD
/1
/2
/4
/8
VCO
CLK2
CLK2C
clk_16y
DAC
Sample
Clock
Clk Buffer
/2
clk_8y
/2
clk_4y
/2
clk_2y
/2
clk_1y
PLLVDD
PLLGND
0
CLKVDD
CLKGND
1
s
PLLLOCK
PLLVDD
Data
D[15:0]
SEL[1:0]
B0024-01
Figure 27. Clock-Generation Architecture
Table 3. Clock-Mode Configuration
CLOCK MODE
PLLVDD
DIV[1:0]
SEL[1:0]
DATA RATE (MSPS)
PLLLOCK PIN FUNCTION
Non-interleaved input data; internal PLL off; DA[15:0] data rate matches DB[15:0] data rate.
External 2×
0V
XX
00
DC to 160
External clk2/clk2c clock ÷ 2
External 4×
0V
XX
External 8×
0V
XX
01
DC to 125
External clk2/clk2c clock ÷ 4
10
DC to 62.5
External 16×
0V
External clk2/clk2c clock ÷ 8
XX
11
DC to 31.25
External clk2/clk2c clock ÷ 16
External dual clock 2×
External dual clock 4×
0V
XX
00
DC to 160
None - held low
0V
XX
01
DC to 125
None - held low
External dual clock 8×
0V
XX
10
DC to 62.5
None - held low
External dual clock 16×
0V
XX
11
DC to 31.25
None - held low
External 2×
0V
XX
00
DC to 80
External clk2/clk2c clock ÷ 2
External 4×
0V
XX
01
DC to 80
External clk2/clk2c clock ÷ 4
Interleaved input data on the DA[15:0] input pins; internal PLL off
26
External 8×
0V
XX
10
DC to 62.5
External clk2/clk2c clock ÷ 8
External 16×
0V
XX
11
DC to 31.25
External clk2/clk2c clock ÷ 16
External dual clock 2×
0V
XX
00
DC to 80
None - held low
External dual clock 4×
0V
XX
01
DC to 62.5
None - held low
External dual clock 8×
0V
XX
10
DC to 31.25
None - held low
External dual clock 16×
0V
XX
11
DC to 15.625
None - held low
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Table 3. Clock-Mode Configuration (continued)
CLOCK MODE
PLLVDD
DIV[1:0]
SEL[1:0]
DATA RATE (MSPS)
PLLLOCK PIN FUNCTION
Non-interleaved input data; internal PLL on; DA[15:0] data rate matches DB[15:0] data rate.
Internal 2×
3.3 V
00
00
125 to 160
Internal PLL lock indicator
Internal 2×
3.3 V
01
00
62.5 to 125
Internal PLL lock indicator
Internal 2×
3.3 V
10
00
31.25 to 62.5
Internal PLL lock indicator
Internal 2×
3.3 V
11
00
15.63 to 31.25
Internal PLL lock indicator
Internal 4×
3.3 V
00
01
62.5 to 125
Internal PLL lock indicator
Internal 4×
3.3 V
01
01
31.25 to 62.5
Internal PLL lock indicator
Internal 4×
3.3 V
10
01
15.63 to 31.25
Internal PLL lock indicator
Internal 4×
3.3 V
11
01
7.8125 to 15.625
Internal PLL lock indicator
Internal 8×
3.3 V
00
10
31.25 to 62.5
Internal PLL lock indicator
Internal 8×
3.3 V
01
10
15.63 to 31.25
Internal PLL lock indicator
Internal 8×
3.3 V
10
10
7.8125 to 15.625
Internal PLL lock indicator
Internal 8×
3.3 V
11
10
3.9 to 7.8125
Internal PLL lock indicator
Internal 16×
3.3 V
00
11
15.625 to 31.25
Internal PLL lock indicator
Internal 16×
3.3 V
01
11
7.8125 to 15.625
Internal PLL lock indicator
Internal 16×
3.3 V
10
11
3.9062 to 7.8125
Internal PLL lock indicator
Internal 2×
3.3 V
00
00
Not recommended
Internal PLL lock indicator
Internal 2×
3.3 V
01
00
62.5 to 80
Internal PLL lock indicator
Internal 2×
3.3 V
10
00
31.25 to 62.5
Internal PLL lock indicator
Internal 2×
3.3 V
11
00
15.625 to 31.25
Internal PLL lock indicator
Internal 4×
3.3 V
00
01
62.5 to 80
Internal PLL lock indicator
Internal 4×
3.3 V
01
01
31.25 to 62.5
Internal PLL lock indicator
Internal 4×
3.3 V
10
01
15.625 to 31.25
Internal PLL lock indicator
Internal 4×
3.3 V
11
01
7.8125 to 15.625
Internal PLL lock indicator
Internal 8×
3.3 V
00
10
31.25 to 62.5
Internal PLL lock indicator
Internal 8×
3.3 V
01
10
15.625 to 31.25
Internal PLL lock indicator
Internal 8×
3.3 V
10
10
7.8125 to 15.625
Internal PLL lock indicator
Internal 8×
3.3 V
11
10
3.9062 to 7.8125
Internal PLL lock indicator
Internal 16×
3.3 V
00
11
15.625 to 31.25
Internal PLL lock indicator
Internal 16×
3.3 V
01
11
7.8125 to 15.625
Internal PLL lock indicator
Internal 16×
3.3 V
10
11
3.9062 to 7.8125
Internal PLL lock indicator
Internal 16×
3.3 V
11
11
1.9531 to 3.9062
Internal PLL lock indicator
Interleaved input data on the DA[15:0] input pins; internal PLL on
Non-Harmonic Clock-Related Spurious Signals
In interpolating DACs, imperfect isolation between the digital and DAC clock circuits generates spurious signals
at frequencies related to the DAC clock rate. The digital interpolation filters in these DACs run at sub-harmonic
frequencies of the output rate clock, where these frequencies are fDAC/2N, N = 1–4. For example, for 2×
interpolation there is only one interpolation filter running at fDAC/2; for 4× interpolation, on the other hand, there
are two interpolation filters running at fDAC/2 and fDAC/4. These lower-speed clocks for the interpolation filter mix
with the DAC clock circuit and create spurious images of the wanted signal and second Nyquist-zone image at
offsets of fDAC/2N.
The location of these spurious signals is determined by whether the DAC5686 output is used as a complex
signal to be feed to an analog quadrature modulator or as a real IF signal. Figure 28(a) shows the location of the
largest spurious signals for fDAC = 500 MSPS and 4× interpolation for a complex output signal. At the output of
the analog quadrature modulator, the spurious signals with negative frequencies appear on the opposite
sideband from the wanted signal. The closest spurious signal results from the wanted signal mixing with the
fDAC/4 interpolation-filter clock, which in this example is 125 MHz from the wanted signal for all IF frequencies.
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Figure 28(b) shows the location of the largest spurious signals for fDAC = 500 MSPS and 4× interpolation for a
real output signal. With a real output signal, there is no distinction between negative and positive frequencies,
and therefore the signals that appear at negative frequencies with a complex signal potentially fall near the
wanted signal. In particular, at IFs near fDAC/8, fDAC/4, and fDAC × 3/4 (62.5 MHz, 125 MHz and 187.5 MHz in this
example) the mixing effect results in spurious signals falling near the wanted signal, which may present a
problem depending on the system application. For a frequency-symmetric signal (such as a single WCDMA or
CDMA carrier), operating at exactly fDAC/8, fDAC/4 and fDAC × 3/4, the spurious signal falls completely inside the
wanted signal, which produces a clean spectrum but may result in degradation of the signal quality.
(a)
(b)
250
250
IF
IF + fDAC/4
200
200
150
IF
IF − fDAC y 3/4
50
fimage − MHz
fimage − MHz
100
IF − fDAC/4
0
−50
IF − fDAC/2
150
IF + fDAC/4
IF − fDAC/4
100
−100
IF − fDAC/2
50
−150
IF − fDAC y 3/4
−200
−250
0
0
25
50
75 100 125 150 175 200 225 250
fO − Output Frequency − MHz
0
25
G018
50
75 100 125 150 175 200 225 250
fO − Output Frequency − MHz
G019
Figure 28. Spurious Frequency vs IF
The offset between wanted and spurious signals is maximized at low IFs (< fDAC/8) and at fDAC × 3/16, fDAC ×
5/16 and fDAC × 7/16. For example, with fDATA = 122.88 MSPS and 4× interpolation, operating with IF = fDAC ×
5/16 = 153.6 MHz results in spurious signals at offsets of 60 MHz from the wanted signal.
Figure 29(a) shows the amplitude of each spurious signal as a function of IF in external-clock mode (CLK2
input). The dominant spurious signal is IF – fDAC/2. The amplitudes of the IF + fDAC/4 and IF – fDAC/4 are the
next-highest spurious signals and are approximately at the same amplitude. Finally, at IF frequencies greater
than 100 MHz, small spurious signals at IF fDAC/8 and IF – fDAC × 3/4 are measurable.
Figure 29(b) shows the amplitude of each spurious signal as a function of IF in PLL clock mode (CLK1 input).
Generating the DAC clock with the onboard PLL/VCO increases the IF – fDAC/2 by 10 dB and the amplitude of
the IF fDAC/4 and IF – fDAC × 3/4 by 25 dB compared to the external-clock mode. The IF fDAC/8 spurs are the
same as in the external-clock mode.
28
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(b)
0
0
−10
−10
−20
−20
Amplitude − dBc
Amplitude − dBc
(a)
−30
IF − fDAC/2
−40
IF ± fDAC/4
−50
IF − fDAC/2
−30
IF ± fDAC/4
−40
IF − fDAC y 3/4
−50
IF − fDAC y 3/4
IF ± fDAC/8
IF ± fDAC/8
−60
−60
−70
−70
0
25
50
75
100
125
150
fO − Output Frequency − MHz
0
175
25
50
75
100
125
150
fO − Output Frequency − MHz
G020
175
G021
Figure 29. Typical Amplitude of Clock-Related Spurious Signals in (a) External-Clock Mode and (b) PLL
Mode
The amplitudes in Figure 29 are typical values and will vary by a few dB across different parts, supply voltages,
and temperatures. Figure 28 and Figure 29 can be used to estimate the non-harmonic clock-related harmonic
signals. Take the example for using the DAC5686 in external-clock mode, fDAC = 500 MHz, 4× interpolation, and
IF = 85 MHz with a real output. Figure 28(b) and Figure 29(a) predict the spurious signals shown in Table 4.
Table 4. Predicted Frequency and Amplitude for
fDAC – 500 MHz, 4× Interpolation, IF = 85 MHz in
External-Clock Mode
Spurious Signal
Frequency (MHz)
Amplitude (dBc)
IF – fDAC/2
165
–47
IF + fDAC/4
210
–64
IF – fDAC/4
40
–64
IF – fDAC × 3/4
> 250
N/A
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Figure 30 shows the DAC5686 output spectrum for the preceding example. The amplitudes of the clock-related
spurs agree quite well with the predicted amplitudes in Table 4.
0
−10
Amplitude − dBc
−20
−30
IF − fDAC/2
−40
−50
IF + fDAC/4
IF − fDAC/4
−60
−70
−80
0
25
50
75 100 125 150 175 200 225 250
f − Frequency − MHz
G022
Figure 30. DAC5686 Output Spectrum With fDAC = 500 MSPS, 4× Interpolation, IF = 85 MHz, and
External-Clock Mode
Dual-Bus Mode
In dual-bus mode, two separate parallel data streams (I and Q) are input to the DAC5686 on data bus DA and
data bus DB. Dual-bus mode is selected by setting INTERL to 0 in the config_msb register. Figure 31 shows
the DAC5686 data path in dual-bus mode. The dual-bus mode timing diagram is shown in Figure 32 for the PLL
clock mode and in Figure 33 for the external clock mode.
2y–16y fDATA
fDATA
DEMUX
FIR1
2fDATA
DA[15:0]
•••
16-Bit
DAC
IOUTA1
16-Bit
DAC
IOUTB1
y2
IOUTA2
Edge Triggered
Input Latches
2fDATA
DB[15:0]
•••
y2
IOUTB2
B0025-01
Figure 31. Dual-Bus Mode Data Path
30
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CLK1
ts(DATA)
th(DATA)
DA[15:0]
A0
A1
A2
A3
AN
AN+1
DB[15:0]
B0
B1
B2
B3
BN
BN+1
T0039-01
Figure 32. Dual-Bus Mode Timing Diagram (PLL Mode)
PLLLOCK
td(PLLLOCK)
CLK2
ts(DATA)
th(DATA)
DA[15:0]
A0
A1
A2
A3
AN
AN+1
DB[15:0]
B0
B1
B2
B3
BN
BN+1
T0040-01
Figure 33. Dual-Bus Mode Timing Diagram (External Clock Mode)
Interleave Bus Mode
In interleave bus mode, one parallel data stream with interleaved data (I and Q) is input to the DAC5686 on data
bus DA. Interleave bus mode is selected by setting INTERL to 1 in the config_msb register. Figure 34 shows
the DAC5686 data path in interleave bus mode. The interleave bus mode timing diagram is shown in Figure 35.
2y–16y fDATA
fDATA
FIR1
2fDATA
DEMUX
•••
16-Bit
DAC
IOUTA1
16-Bit
DAC
IOUTB1
IOUTA2
y2
DA[15:0]
Edge Triggered
Input Latches
2fDATA
•••
IOUTB2
y2
B0025-02
Figure 34. Interleave Bus Mode Data Path
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TXENABLE
ts(TXENABLE)
CLK1 or
PLLLOCK
ts(DATA)
th(DATA)
DA[15:0]
A0
B0
A1
B1
AN
BN
T0041-01
Figure 35. Interleave Bus Mode Timing Diagram Using TxENABLE
Interleaved user data on data bus DA is alternately multiplexed to internal data channels A and B. Data channels
A and B can be synchronized using either the QFLAG pin or the TxENABLE pin. When qflag in register
config_usb is 0, transitions on TxENABLE identify the interleaved data sequence. The first data after the rising
edge of TxENABLE is latched with the rising edge of CLK as channel-A data. Data is then alternately distributed
to B and A channels with successive rising edges of CLK. When qflag is 1, the QFLAG pin is used as an input
by the user to identify the interleaved data sequence. QFLAG high identifies data as channel B (see Figure 36).
QFLAG
CLK1 or
PLLLOCK
th(DATA)
ts(DATA)
DA[15:0]
A0
B0
A1
B1
AN
BN
T0001-01
Figure 36. Interleave Bus Mode Timing Diagram Using QFLAG
When using interleaved input mode with the PLL enabled, the input clock CLK1 is at 2× the frequency of the
input to FIR1. The divider that generates the clock for the FIR1 input cannot be synchronized between multiple
DAC5686s, which can result in a one-CLK1-period output time difference between devices that have
synchronized input data. Dual-clock mode is recommended in applications where multiple DAC5686s must be
synchronized in interleaved input mode.
The dual-clock mode is selected by setting dualclk high in the config_usb register. In this mode, the DAC5686
uses both clock inputs; CLK1/CLK1C is the input data clock, and CLK2/CLK2C is the external clock. The edges
of the two input clocks must be phase-aligned within 500 ps to function properly.
Clock Synchronization Using the PHSTR Pin in External Clock Mode
In external clock mode, the DAC5686 is clocked at the DAC output sample frequency (CLK2 and CLK2C). For an
interpolation rate N, there are N possible phases for the DAC input clock on the PLLLOCK pin (see Figure 37 for
N = 4).
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CLK2
CLK2C
PLLLOCK
T0003-01
Figure 37. Four Possible PLLLOCK Phases for N = 4 in External Clock Mode
To synchronize PLLLOCK input clocks across multiple DAC5686 chips, a synchronization signal on the PHSTR
pin is used. During configuration of the DAC5686 chips, address sync_phstr in config_msb is set high to
enable the PHSTR input pin as a synchronization input to the clock dividers generating the input clock. A
simultaneous low-to-high transition on the PHSTR pin for each DAC5686 then forces the input clock on
PLLLOCK to start in phase on each DAC. See Figure 38.
1/fPLLLOCK = N/fCLK2
CLK2
CLK2C
PHSTR
th(PHSTR)
td(CLK)
ts(PHSTR)
PLLLOCK
DAC1
DA[15:0]
DB[15:0]
th
ts
T0004−01
Figure 38. Using PHSTR to Synchronize PLLLOCK Input Clock for Multiple DACs in External Clock Mode
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The PHSTR transition has a setup and hold time relative to the DAC output sample clock (ts_PHSTR and th_PHSTR)
equal to 50% of the DAC output sample clock period up to a maximum of 1 ns. At 500 MHz, the setup and hold
times are therefore 0.5 ns. The PHSTR signal can remain high after synchronization, or can return low. A new
low-to-high transition resynchronizes the input clock. Note that the PHSTR transition also resets the NCO
accumulator.
Digital Filters
Figure 39 through Figure 42 show magnitude spectrum responses for 2×, 4×, 8×, and 16× FIR interpolation
filtering. The transition band is from 0.4 to 0.6 fDATA with < 0.002-dB pass-band ripple and > 80-dB stop-band
attenuation for all four configurations. The filters are linear phase. The sel field in register config_lsb selects the
interpolation filtering rate as 2×, 4×, 8×, or 16×; interpolation filtering can be completely bypassed by setting
fullbypass in register config_lsb.
Figure 43 shows the spectral correction of the DAC sinx/x rolloff achieved with use of inverse sinc filtering.
Pass-band ripple from 0 to 0.4 fDATA is < 0.03 dB. Inverse sinc filtering is enabled by sinc in register
config_msb.
MAGNITUDE
vs
FREQUENCY
20
20
0
0
−20
−20
−40
−40
Magnitude – dB
Magnitude – dB
MAGNITUDE
vs
FREQUENCY
−60
−80
−100
−60
−80
−100
−120
−120
−140
−140
−160
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
−160
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
f/fDATA
G023
Figure 39. Magnitude Spectrum for
2× Interpolation (dB)
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f/fDATA
G024
Figure 40. Magnitude Spectrum for
4× Interpolation (dB)
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MAGNITUDE
vs
FREQUENCY
20
20
0
0
−20
−20
−40
−40
Magnitude – dB
Magnitude – dB
MAGNITUDE
vs
FREQUENCY
−60
−80
−100
−60
−80
−100
−120
−120
−140
−140
−160
0.0
−160
0.5
1.0
1.5
2.0
2.5
3.0
3.5
f/fDATA
0
4.0
1
2
3
4
5
6
7
f/fDATA
G025
Figure 41. Magnitude Spectrum for
8× Interpolation (dB)
8
G026
Figure 42. Magnitude Spectrum for
16× Interpolation (dB)
MAGNITUDE
vs
FREQUENCY
5
4
3
FIR
Magnitude – dB
2
Corrected
1
0
−1
−2
Rolloff
−3
−4
−5
0.0
0.1
0.2
0.3
f/fDAC
0.4
0.5
G027
Figure 43. Magnitude Spectrum for Inverse sinc Filtering
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The filter taps for interpolation filters FIR1–FIR4 and inverse sinc filter FIR5 are listed in Table 5.
Table 5. Filter Taps for FIR1–FIR5
FIR1
FIR2
FIR3
FIR4
FIR5 (INVSINC)
8
9
31
-33
1
–3
0
0
0
0
–24
–58
–219
289
9
0
0
0
512
–34
58
214
1212
289
400
–34
0
0
2048
0
–120
–638
1212
–33
0
0
0
–3
221
2521
–219
1
0
4096
0
–380
2521
31
0
0
619
–638
0
0
-971
214
0
0
1490
–58
0
0
–2288
9
9
0
3649
0
–6628
0
20750
32768
20750
0
–6628
0
3649
0
–2288
0
1490
0
–971
0
619
0
–380
0
221
0
–120
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Table 5. Filter Taps for FIR1–FIR5 (continued)
FIR1
FIR2
FIR3
FIR4
FIR5 (INVSINC)
0
58
0
–24
0
8
NCO
The DAC5686 uses a numerically controlled oscillator (NCO) with a 32-bit frequency register and a 16-bit phase
register. The NCO is used in quadrature-modulation and single-sideband modes to provide sin and cos for
mixing. The NCO tuning frequency is programmed in registers 0x1 through 0x4. Phase offset is programmed in
registers 0x5 and 0x6. A block diagram of the NCO is shown in Figure 44.
32
16
32
Frequency
Register
32
Σ
Accumulator
32
16
16
Σ
sin
Look-Up
Table
16
cos
CLK RESET
16
fDAC
PHSTR
Phase
Register
B0026-01
Figure 44. Block Diagram of the NCO
The NCO accumulator is reset to zero when the PHSTR pin is high and remains at zero until PHSTR is set low.
Frequency word freq in the frequency register is added to the accumulator every clock cycle. The output
frequency of the NCO is:
freq f DAC
f NCO +
2 32
While the maximum clock frequency of the DACs is 500 MSPS, the maximum clock frequency the NCO can
operate at is 320 MHz; mixing at DAC rates higher than 320 MSPS requires using the fDAC/4 mixing option.
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Register Bit Allocation Map
NAME
R/W
ADDRE
SS
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
chip_ver
R/W
0x00
freq_lsb
R/W
0x01
freq_lmidsb
R/W
0x02
freq_int[15:8]
freq_umidsb
R/W
0x03
freq_int[23:16]
freq_msb
R/W
0x04
freq_int[31:24]
phase_lsb
R/W
0x05
phase_int[7:0]
phase_msb
R/W
0x06
phase_int[15:8]
config_lsb
R/W
0x07
config_msb
R/W
0x08
ssb
config_usb
R/W
0x09
dual_clk
daca_offset_lsb
R/W
0x0A
daca_gain_lsb
R/W
0x0B
daca_offset_gain_
msb
R/W
0x0C
dacb_offset_lsb
R/W
0x0D
dacb_gain_lsb
R/W
0x0E
dacb_offset_gain_
msb
R/W
0x0F
BIT 2
atest[4:0]
BIT 1
BIT 0
version[2:0] read only
freq_int[7:0]
mode[1:0]
div[1:0]
interl
sinc
DDS_gain[1:0]
sel[1:0]
dith
sync_phstr
rspect
qflag
counter
nco
sif4
PLL_rng[1:0]
full_
bypass
twos
rev_bbus
daca_offset[7:0]
daca_gain[7:0]
daca_offset[10:8]
sleepa
daca_gain[11:8]
dacb_offset[7:0]
dacb_gain[7:0]
dacb_offset[10:8]
sleepb
dacb_gain[11:8]
REGISTER DESCRIPTIONS
Register Name: chip_ver
MSB
0
LSB
0
atest[4:0]
0
0
0
1
chip_ver[2:0] read only
0
1
chip_ver[3:0]: chip_ver [3:0] stores the device version, initially 0x5. The user can find out which version of the
DAC5686 is in the system by reading this byte.
a_test[4:0]: must be 0 for proper operation.
Register Name: freq_lsb
MSB
LSB
freq_int[7:0]
0
0
0
0
0
0
0
0
freq_int[7:0]: The lower 8 bits of the frequency register in the DDS block
Register Name: freq_lmidsb
MSB
LSB
freq_int[15:8]
0
0
0
0
0
0
0
0
freq_int[15:8]: The lower mid 8 bits of the frequency register in the DDS block
Register Name: freq_umidsb
MSB
LSB
freq_int[23:16]
0
38
0
0
0
0
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0
0
0
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freq_int[23:16]: The upper mid 8 bits of the frequency register in the DDS block
Register Name: freq_msb
MSB
LSB
freq_int[31:24]
0
0
1
0
0
0
0
0
freq_int[31:24]: The most significant 8 bits of the frequency register in the DDS block
Register Name: phase_lsb
MSB
LSB
phase_int[7:0]
0
0
0
0
0
0
0
0
phase_int[7:0]: The lower 8 bits of the phase register in the DDS block
Register Name: phase_msb
MSB
LSB
phase_int[15:8]
0
0
0
0
0
0
0
0
counter
0
Full_bypass
1
phase_int[15:8]: The most significant 8 bits of the phase register in the DDS block
Register Name: config_lsb
MSB
LSB
mode[1:0]
0
div[1:0]
0
0
sel[1:0]
0
0
0
mode[1:0]: Controls the mode of the DAC5686; summarized in Table 6.
Table 6. DAC5686 Modes
mode[1:0]
DAC5686 MODE
00
Dual-DAC
01
Single-sideband
10
Quadrature
11
Dual-DAC
div[1:0]: Controls the PLL divider value; summarized in Table 7.
Table 7. PLL Divide Ratios
div[1:0]
PLL DIVIDE RATIO
00
1× divider
01
2× divider
10
4× divider
11
8× divider
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sel[1:0]: Controls the selection of interpolating filters used; summarized in Table 8.
Table 8. DAC5686 Filter Configuration
sel[1:0]
INTERP. FIR SETTING
00
×2
01
×4
10
×8
11
×16
counter: When asserted, the DAC5686 goes into counter mode and uses an internal counter as a ramp input to
the DAC. The count range is determined by the A-side input data DA[2:0], as summarized in Table 9.
Table 9. DAC5686 Counter Mode Count Range
DA[2:0]
COUNT RANGE
000
All bits D[15:0]
001
Lower 7 bits D[6:0]
010
Mid 4 bits D[10:7]
100
Upper 5 bits D[15:11]
full_bypass: When asserted, the interpolation filters and mixer logic are bypassed, and the data inputs DA[15:0]
and DB[15:0] go straight to the DAC inputs.
Register Name: config_msb
MSB
ssb
0
LSB
interl
0
sinc
0
dith
0
sync_phstr
0
nco
0
sif4
0
twos
0
ssb: In single-sideband mode, assertion inverts the B data; in quadrature modulation mode, assertion routes the
A data path to DACB instead of the B data path.
interl: When asserted, data input to the DAC5686 on channel DA[15:0] is interpreted as a single interleaved
stream (I/Q); channel DB[15:0] is unused.
sinc: Assertion enables the INVSINC filter.
dith: Assertion enables dithering in the PLL.
sync_phstr: Assertion enables the PHSTR input as a sync input to the clock dividers in external single-clock
mode.
nco: Assertion enables the NCO.
sif4: When asserted, the sif interface becomes a 4-pin interface instead of a 3-pin interface. The SDIO pin
becomes an input only, and the SDO is the output.
twos: When asserted, the chip interprets the input data as 2s complement form instead of binary offset.
Register Name: config_usb
MSB
dualclk
0
LSB
DDS_gain[1:0]
0
0
rspect
0
qflag
0
pll_rng[1:0]
0
0
rev_bbus
0
dual_clk: When asserted, the DAC5686 uses both clock inputs; CLK1/CLK1C is the input data clock and
CLK2/CLK2C is the DAC output clock. These two clocks must be phase-aligned within 500 ps to function
properly. When deasserted, CLK2/CLK2C is the DAC output clock and is divided down to generate the input data
clock, which is output on PLLLOCK. Dual clock mode is only available when PLLVDD = 0.
DDS_gain[1:0]: Controls the gain of the DDS so that the overall gain of the DDS is unity. It is important to
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ensure that max(abs(cos(ωt) + sin(ωt))) < 1. At different frequencies, the summation produces different maximum
outputs and must be reduced. The simplest is fDAC/4 mode where the maximum is 1 and the gain multiply should
be 1 to maintain unity. However, due to the fact that the digital logic does a divide-by-two in this summation, the
gain necessary to achieve unity must be double (DDS_gain[1:0] = 01). Table 10 shows the digital gain necessary
and the actual signal gain needed to make the above equation have a maximum value of 1.
Table 10. Digital Gain for DDS
DDS_gain [1:0]
DIGITAL GAIN
SIGNAL GAIN FOR UNITY
00
1.40625
0.703125
01
2
1
10
1.59375
0.7936
11
1.40625
0.703125
rspect: When asserted, the sin term is negated before being used in mixing. This gives the reverse spectrum in
single-sideband mode.
qflag: When asserted, the QFLAG pin is used by the user as an input indicator during interleaved data input
mode to identify the Q sample. When deasserted, the TxENABLE pin transition is used to start an internal
toggling signal, which is used to interpret the interleaved data sequence; the first sample clocked into the
DAC5686 after TxENABLE goes high is routed through the A data path.
PLL_rng[1:0]: Increases the PLL VCO VtoI current, summarized in Table 11. See Figure 17 for the effect on
VCO gain and range.
Table 11. PLL VCO Vtol Current Increase
PLL_rng[1:0]
VtoI CURRENT INCREASE
00
nominal
01
15%
10
30%
11
45%
rev_bbus[1:0]: When asserted, pin 92 changes from DB15 to DB0, pin 91 changes from DB14 to DB1, etc.,
reversing the order of the DB[15:0] pins.
Register Name: daca_offset_lsb (2s complement)
MSB
LSB
daca_offset[7:0]
0
0
0
0
0
0
0
0
daca_offset[7:0]: The lower 8 bits of the DACA offset
Register Name: daca_gain_lsb (2s complement)
MSB
LSB
daca_gain[7:0]
0
0
0
0
0
0
0
0
daca_gain[7:0]: The lower 8 bits of the DACA gain control register. These lower 8 bits are for fine gain control.
This word is a 2s complement value that adjusts the full-scale output current over an approximate 4% to –4%
range.
Register Name: daca_offset_gain_msb (2s complement)
MSB
0
LSB
daca_offset[10:8]
0
0
sleepa
0
daca_gain[11:8]
0
0
0
0
daca_offset[10:8]: The upper 3 bits of the DACA _offset
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sleepa: When asserted, DACA is put into the sleep mode.
daca_gain[11:8]: Coarse gain control for DACA; the full-scale output current is:
I fullscale +
ƪ
16ǒVextioǓ
R biasj
Ǔƫ
ǒ
(GAINCODE ) 1)
B 1 * FINEGAIN
16
3072
where GAINCODE is the decimal equivalent of daca_gain [11:8] {0…15} and the FINEGAIN is daca_gain [7:0] as
2s complement {–127…128}.
Register Name: dacb_offset_lsb (2s complement)
MSB
LSB
dacb_offset[7:0]
0
0
0
0
0
0
0
0
dacb_offset[7:0]: The lower 8 bits of the DACB offset
Register Name: dacb_gain_lsb (2s complement)
MSB
LSB
dacb_gain[7:0]
0
0
0
0
0
0
0
0
dacb_gain[7:0]: The lower 8 bits of the DACB gain control register. These lower 8 bits are for fine gain control.
This word is a 2s complement value that adjusts the full-scale output current over an approximate 4% to –4%
range.
Register Name: dacb_offset_gain_msb (2s complement)
MSB
0
LSB
dacb_offset[10:8]
0
0
sleepb
0
dacb_gain[11:8]
0
0
0
0
dacb_offset[10:8]: The upper 3 bits of the DACA _offset
sleepb: When asserted, DACB is put into the sleep mode.
dacb_gain[11:8]: Coarse gain control for DACB; the full-scale output current is:
I fullscale +
ƪ
16ǒVextioǓ
R biasj
ǒ
Ǔƫ
(GAINCODE ) 1)
B 1 * FINEGAIN
16
3072
where GAINCODE is the decimal equivalent of dacb_gain [11:8] {0…15} and the FINEGAIN is dacb_gain [1:0] as
2s complement {–127…128}.
DIGITAL INPUTS
Figure 45 shows a schematic of the equivalent CMOS digital inputs of the DAC5686. DA[15:0], DB[15:0], SLEEP,
PHSTR, TxENABLE, QFLAG, SDIO, SCLK, and SDENB have pulldown resistors and RESETB has a pullup
resistor internal to the DAC5686. The pullup and pulldown circuitry is approximately equivalent to 100 kΩ. See
the specification table for logic thresholds.
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IOVDD
DA[15:0]
DB[15:0]
SLEEP
PHSTR
TXENABLE
QFLAG
SDIO
SCLK
SDENB
IOVDD
100
kW
400 W
400 W
Internal
Digital In
Internal
Digital In
RESETB
100
kW
IOGND
IOGND
S0027–02
Figure 45. CMOS/TTL Digital Equivalent Input
CLOCK INPUT AND TIMING
Figure 46 shows an equivalent circuit for the clock input.
CLKVDD
CLKVDD
R1
10 kΩ
Internal
Digital In
CLKVDD
R1
10 kΩ
CLK
CLKC
R2
10 kΩ
R2
10 kΩ
CLKGND
S0028-01
Figure 46. Clock Input Equivalent Circuit
Figure 47, Figure 48, and Figure 49 show various input configurations for driving the differential clock input
(CLK/CLKC).
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Optional, May Be Bypassed
for Sine Wave Input
Swing Limitation
CAC
0.1 µF
1:4
CLK
RT
200 Ω
CLKC
Termination Resistor
S0029-01
Figure 47. Preferred Clock Input Configuration
Ropt
22 Ω
CAC
0.01 µF
Ropt
22 Ω
1:1
TTL/CMOS
Source
TTL/CMOS
Source
CLK
Optional, Reduces
Clock Feedthrough
CLKC
CLK
CLKC
0.01 µF
Node CLKC Internally Biased
to CLKVDDń2
S0030-01
Figure 48. Driving the DAC5686 With a Single-Ended TTL/CMOS Clock Source
CAC
0.1 µF
Differential
ECL
or
(LV)PECL
Source
CLK
+
CAC
0.1 µF
–
100 Ω
CLKC
RT
130 Ω
RT
130 Ω
RT
82.5 Ω
RT
82.5 Ω
VTT
S0031-01
Figure 49. Driving the DAC5686 With a Differential ECL/PECL Clock Source
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DAC Transfer Function
The CMOS DAC’s consist of a segmented array of NMOS current sinks, capable of sinking a full-scale output
current up to 20 mA. Differential current switches direct the current of each current source through either one of
the complementary output nodes IOUT1 or IOUT2. Complementary output currents enable differential operation,
thus canceling out common mode noise sources (digital feed-through, on-chip and PCB noise), dc offsets, even
order distortion components, and increasing signal output power by a factor of two.
The full-scale output current is set using external resistor RBIAS in combination with an on-chip bandgap voltage
reference source (1.2 V) and control amplifier. Current IBIAS through resistor RBIAS is mirrored internally to provide
a full-scale output current equal to 16 times IBIAS. The full-scale current IOUTFS can be adjusted from 20 mA
down to 2 mA.
The relation between IOUT1 and IOUT2 can be expressed as:
IOUT1 = –IOUTFS – IOUT2
We denote current flowing into a node as – current and current flowing out of a node as + current. Because the
output stage is a current sink, the current can only flow from AVDD into the IOUT1 and IOUT2 pins. If IOUT2 =
–5 mA and IO(FS) = 20 mA then:
IOUT1 = –20 – (–5) = –15 mA
The output current flow in each pin driving a resistive load can be expressed as:
IOUT1 = IOUTFS × (65535 – CODE) / 65536
IOUT2 = IOUTFS × CODE / 65536
where CODE is the decimal representation of the DAC data input word.
For the case where IOUT1 and IOUT2 drive resistor loads RL directly, this translates into single ended voltages
at IOUT1 and IOUT2:
VOUT1 = AVDD – I IOUT1 I × RL
VOUT2 = AVDD – I IOUT2 I × RL
Assuming that the data is full scale (65535 in offset binary notation) and the RL is 25 Ω, the differential voltage
between pins IOUT1 and IOUT2 can be expressed as:
VOUT1 = AVDD – I -20 mA I x 25 Ω = 2.8 V
VOUT2 = AVDD – I -0 mA I x 25 Ω = 3.3 V
VDIFF = VOUT1 – VOUT2 = 0.5 V
Note that care should be taken not to exceed the compliance voltages at node IOUT1 and IOUT2, which would
lead to increased signal distortion.
Reference Operation
The DAC5686 comprises a band-gap reference and control amplifier for biasing the full-scale output current. The
full-scale output current is set by applying an external resistor RBIAS. The bias current IBIAS through resistor RBIAS
is defined by the on-chip band-gap reference voltage and control amplifier. The full-scale output current equals
16 times this bias current. The full-scale output current IOUTFS can thus be expressed as (coarse gain = 15, fine
gain = 0):
16 V EXTIO
IOUT FS +
R BIAS
where VEXTIO is the voltage at terminal EXTIO. The band-gap reference voltage delivers an accurate voltage of
1.2 V. This reference is active when terminal EXTLO is connected to AGND. An external decoupling capacitor
CEXT of 0.1 µF should be connected externally to terminal EXTIO for compensation. The band-gap reference
additionally can be used for external reference operation. In that case, an external buffer with a high-impedance
input should be used in order to limit the band-gap load current to a maximum of 100 nA. The internal reference
can be disabled and overridden by an external reference by connecting EXTLO to AVDD. Capacitor CEXT may
hence be omitted. Terminal EXTIO serves as either input or output node.
The full-scale output current can be adjusted from 20 mA down to 2 mA by varying resistor RBIAS or changing the
externally applied reference voltage. The internal control amplifier has a wide input range supporting the
full-scale output current range of 20 dB.
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Analog Current Outputs
Figure 50 shows a simplified schematic of the current source array with corresponding switches. Differential
switches direct the current of each individual NMOS current source to either the positive output node IOUT1 or
its complementary negative output node IOUT2. The output impedance is determined by the stack of the current
sources and differential switches and is typically >300 kΩ in parallel with an output capacitance of 5 pF.
The external output resistors are terminated to AVDD. The maximum output compliance at nodes IOUT1 and
IOUT2 is limited to AVDD + 0.5 V, determined by the CMOS process. Beyond this value, transistor breakdown
can occur, resulting in reduced reliability of the DAC5686 device. The minimum output compliance voltage at
nodes IOUT1 and IOUT2 equals AVDD – 0.5 V. Exceeding the minimum output compliance voltage adversely
affects distortion performance and integral nonlinearity. The optimum distortion performance for a single-ended
or differential output is achieved when the maximum full-scale signal at IOUT1 and IOUT2 does not exceed
0.5 V.
AVDD
RLOAD
IOUT1
S(1)
RLOAD
IOUT2
S(1)C
S(2)
S(2)C
S(N)
S(N)C
S0032-01
Figure 50. Equivalent Analog Current Output
The DAC5686 can be easily configured to drive a doubly terminated 50-Ω cable using a properly selected RF
transformer. Figure 51 and Figure 52 show the 50-Ω doubly terminated transformer configuration with 1:1 and
4:1 impedance ratios, respectively. Note that the center tap of the primary input of the transformer must be
connected to AVDD to enable a dc current flow. Applying a 20-mA full-scale output current would lead to a
0.5-Vpp output for a 1:1 transformer and a 1-Vpp output for a 4:1 transformer.
46
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AVDD (3.3 V)
50 Ω
1:1
IOUT1
RLOAD
50 Ω
100 Ω
IOUT2
50 Ω
AVDD (3.3 V)
S0033-01
Figure 51. Driving a Doubly Terminated 50-Ω Cable Using a 1:1 Impedance-Ratio Transformer
AVDD (3.3 V)
100 Ω
4:1
IOUT1
RLOAD
50 Ω
IOUT2
100 Ω
AVDD (3.3 V)
S0033-02
Figure 52. Driving a Doubly Terminated 50-Ω Cable Using a 4:1 Impedance-Ratio Transformer
SLEEP MODE
The DAC5686 features a power-down mode that turns off the output current and reduces the supply current to
less than 5 mA over the supply range of 3 V to 3.6 V and temperature range of –40C to 85C. The power-down
mode is activated by applying a logic level 1 to the SLEEP pin (e.g., by connecting pin SLEEP to IOVDD). An
internal pulldown circuit at node SLEEP ensures that the DAC5686 is enabled if the input is left disconnected.
Power-up and power-down activation times depend on the value of the external capacitor at node SLEEP. For a
nominal capacitor value of 0.1 mF, it takes less than 5 ms to power down and approximately 3 ms to power up.
POWER-UP SEQUENCE
In all conditions, bring up DVDD first. If PLLVDD is powered (PLL on), CLKVDD should be powered before or
simultaneously with PLLVDD. AVDD, CLKVDD and IOVDD can be powered simultaneously or in any order.
Within AVDD, the multiple AVDD pins should be powered simultaneously.
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DAC5686 EVALUATION BOARD
There is a combination EVM board for the DAC5686 digital-to-analog converter for evaluation. This board allows
the user the flexibility to operate the DAC5686 in various configurations. Possible output configurations include
transformer-coupled, resistor-terminated, inverting/non-inverting and differential amplifier outputs. The digital
inputs are designed to be driven directly from various pattern generators with the onboard option to add a
resistor network for proper load termination.
APPENDIX A. PLL LOOP FILTER COMPONENTS
DESIGNING THE PLL LOOP FILTER
The DAC5686 contains an external loop filter to set the bandwidth and phase margin of the PLL. For the external
second-order filter shown in Figure 53, the components R1, C1, and C2 are set by the user to optimize the PLL
for the application. The resistance R3 = 200 Ω and the capacitance C3 = 8 pF are internal to the DAC5686. Note
that the positions of R1 and C1 can be reversed, relative to each other.
External
Internal
R3
C1
C2
C3
R1
S0006-01
Figure 53. DAC5686 Loop Filter
The typical VCO gain (Gvco) (the slope of VCO frequency vs voltage) as a function of VCO frequency for the
DAC5686 is shown in Figure 17. The VCO frequency range can be extended to higher frequencies by setting the
pll_rng[1:0] registers to increase the VCO Vtol current (see Table 11). However, only the range for PLL_rng = 00
(nominal) is specified.
For the lowest possible phase noise, the VCO frequency should be chosen so Gvco is minimized, where
fvco = fdata × Interpolation × PLL Divider
For example, if fdata = 125 MSPS and 2× interpolation is used, the PLL divider should be set to 2 to lock the VCO
at 500 MHz for a typical Gvco of 200 MHz/V.
The external loop filter components C1, C2, and R1 are determined by choosing Gvco, N = fvco/fdata, the loop
phase margin φd, and the loop bandwidth ωd. Except for applications where abrupt clock frequency changes
require a fast PLL lock time, it is suggested that φd be set to at least 80 degrees for stable locking and
suppression of the phase-noise side lobes. Phase margins of 60 degrees or less occasionally have been
sensitive to board layout and decoupling details.
The optimum loop bandwidth ωd depends on both the VCO phase noise, which is largely a function of Gvco, and
the application. For the example above with Gvco = 200 MHz/V, an ωd = 1 MHz would be typical, but lower or
higher loop bandwidths may provide better phase noise characteristics. For a higher Gvco, for example
Gvco = 400 MHz/V, an ωd ~ 7 MHz would be typical. However, it is suggested that customers experiment with
varying the loop bandwidth at least from × to 2× to verify the optimum setting.
48
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C1, C2, and R1 are then calculated by the following equations:
ǒ
Ǔ
C1 + t1 1 * t2
t3
t1´ t2
t3
t3 2
R1 +
t1(t3 * t2)
C2 =
where
t1 +
K dKVCO
(tan f d ) sec f d)
w 2d
t2 +
1
w d(tan f d ) sec f d)
t3 +
tan f d ) sec f d
wd
and
Charge pump current:
iqp = 1 mA
VCO gain:
KVCO = 2π × GVCO rad/A
fvco/fdata:
N = {2, 4, 8, 16, 32}
Phase detector gain:
Kd = iqp × (2πN)–1 A/rad
An Excel™ spreadsheet is available on the TI Web site at http://www-s.ti.com/sc/psheets/scac057/scac057.zip
for automatically calculating the values for C1, C2, and R1.
Completing the preceding example with
PARAMETER
VALUE
UNIT
Gvco
2.00E+02
MHz/V
ωd
1.00E+00
MHz
N
4
φd
80
the component values are
C1 (F)
1.44E–08
C2 (F)
1.11E–10
R1 (Ω)
1.27E+02
Because the PLL characteristics are not sensitive to these components, the closest 20%-tolerance capacitor and
1%-tolerance resistor values can be used. If the calculation results in a negative value for C2 or an unrealistically
large value for C1, then the phase margin must be reduced slightly.
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Revision History
Changes from Revision E (June 2006) to Revision F ..................................................................................................... Page
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Changed DA[15:0] pin description ......................................................................................................................................... 5
Changed DB[15:0] pin description ......................................................................................................................................... 5
Changed PHSTR pin descripton............................................................................................................................................ 5
Changed QFLAG pin description ........................................................................................................................................... 5
Changed RESETB pin description......................................................................................................................................... 5
Changed SCLK pin description.............................................................................................................................................. 5
Changed SDENB pin description........................................................................................................................................... 5
Changed SDIO pin description .............................................................................................................................................. 6
made changes per input markup ......................................................................................................................................... 18
Changed terms in Equation 1 .............................................................................................................................................. 18
Changed signs of inputs and formula for lower DAC in Figure 20 ...................................................................................... 19
Made corrections to Equation 2 and Equation 3.................................................................................................................. 21
Added values to resistors in Figure 45 ................................................................................................................................ 43
Swapped definitions of IOUT1 and IOUT2 in the corresponding equations........................................................................ 45
Changes from Revision D (January 2006) to Revision E ............................................................................................... Page
•
•
•
•
50
For QFLAG description, changed O to I and output to input ................................................................................................. 5
Changed QFLAG description from output to input .............................................................................................................. 32
New paragraph describing problem with synchronization in PLL clock mode with interleaved input.................................. 32
Added "by the user as an input indicator" to first sentence of qflag register description .................................................... 41
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DAC5686IPZP
ACTIVE
HTQFP
PZP
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC5686IPZP
DAC5686IPZPG4
ACTIVE
HTQFP
PZP
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC5686IPZP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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