FCI BZT52C6V8 1/2 watt zeber diodes planar die construction Datasheet

Mechanical Dimensions
BZT52C2V4~C39
Description
SOD-123
*
*
*
*
Dimensions in mm
Features:
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Process
Characteristic
Forward Voltage @ If=10mA
Power Dissipation
Thermal Resistance, Junction to Ambient air
Operating and Storage Temperature Range
Symbol
VF
Pd
Rthja
Tj/Tstg
Value
0.9
500
305
-65 ~ +150
Unit
V
mW
C/W
C
Electrical Characteristics Ta=25C unless otherwise specified
500 mW
Nominal
Test
Maximum
Maximum
Forward
Zener Voltage
Current
Zener ImpedanceVzt @
Reverse Current
Voltage
FCI
@ Izt
Izt (mA)
Izt;Vzk@ Izk=1.0mA
Ir(uA) @ Vr(V)
VF (V)
Part #
Vz (V)
Vzt / Vzk(ohm)
Marking
IF (mA)
BZT52C2V4
2.4
5
85/600
100/1.0
0.9 / 10
WX
BZT52C2V7
2.7
5
83/600
75/1.0
0.9 / 10
W1
BZT52C3V0
3.0
5
95/500
50/1.0
0.9 / 10
W2
BZT52C3V3
3.3
5
95/500
25/1.0
0.9 / 10
W3
BZT52C3V6
3.6
5
95/500
15/1.0
0.9 / 10
W4
BZT52C3V9
3.9
5
95/500
10/1.0
0.9 / 10
W5
5
95/500
5/1.0
0.9 / 10
W6
5
78/500
5/1.0
0.9 / 10
W7
W8
BZT52C4V3
BZT52C4V7
4.3
4.7
BZT52C5V1
5.1
5
60/480
0.1/0.8
0.9 / 10
BZT52C5V6
5.6
5
40/400
0.1/1.0
0.9 / 10
W9
BZT52C6V2
6.2
5
10/200
0.1/2.0
0.9 / 10
WA
BZT52C6V8
6.8
5
8/150
0.1/3.0
0.9 / 10
WB
BZT52C7V5
7.5
5
7/50
0.1/5.0
0.9 / 10
WC
BZT52C8V2
8.2
5
7/50
0.1/6.0
0.9 / 10
WD
BZT52C9V1
9.1
5
10/50
0.1/7.0
0.9 / 10
WE
0.1/7.5
0.9 / 10
WF
BZT52C10
10
5
15/70
BZT52C11
11
5
20/70
0.1/8.5
0.9 / 10
WG
5
20/90
0.1/9.0
0.9 / 10
WH
WI
BZT52C12
12
BZT52C13
13
5
25/110
0.1/10
0.9 / 10
BZT52C15
15
5
30/110
0.1/11
0.9 / 10
WJ
BZT52C16
16
5
40/170
0.1/12
0.9 / 10
WK
BZT52C18
18
5
50/170
0.1/14
0.9 / 10
WL
BZT52C20
20
5
50/220
0.1/15
0.9 / 10
WM
BZT52C22
22
5
55/220
0.1/17
0.9 / 10
WN
BZT52C24
24
5
80/220
0.1/18
0.9 / 10
WO
5
80/250
0.1/20
0.9 / 10
WP
5
80/250
0.1/22.5
0.9 / 10
WQ
5
80/250
0.1/25
0.9 / 10
WR
0.1/27
0.9 / 10
WS
0.1/29
0.9 / 10
WT
BZT52C27
BZT52C30
BZT52C33
27
30
33
BZT52C36
36
5
90/250
BZT52C39
39
5
90/300
Package
SOD-123
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