Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM27761 SNVSA85 – OCTOBER 2015 LM27761 Low-Noise Regulated Switched-Capacitor Voltage Inverter 1 Features 3 Description • • • The LM27761 low-noise regulated switched-capacitor voltage inverter delivers a very low-noise adjustable output for an input voltage in the range of 2.7 V to 5.5 V. Four low-cost capacitors are used in the application solution to provide up to 250 mA of output current. The regulated output for the device is adjustable between −1.5 V and −5 V. The LM27761 operates at 2-MHz (typical) switching frequency to reduce output resistance and voltage ripple. With an operating current of only 370 µA (charge-pump power efficiency greater than 80% with most loads) and 7-µA typical shutdown current, the LM27761 provides ideal performance when driving power amplifiers, DAC bias rails, and other high-current, low-noise voltage applications. • • • • • • • • Inverts and Regulates the Input Supply Voltage Low Output Ripple Shutdown Lowers Quiescent Current to 7 µA (Typical) Up to 250-mA Output Current 2.5-Ω Inverter Output Impedance, VIN = 5 V ±4% Regulation at Peak Load 370-µA Quiescent Current 2-MHz (typical) Low-Noise Fixed-Frequency Operation 35-dB (typical) LDO PSRR at 2 MHz With 80-mA Load Current 30-mV LDO Dropout Voltage at 100 mA, VOUT = –5 V Current Limit and Thermal Protection Device Information(1) PART NUMBER LM27761 2 Applications • • • • • • • PACKAGE WSON (8) BODY SIZE (NOM) 2.00 mm × 2.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Operational Amplifier Power Wireless Communication Systems Cellular Phone Power Amplifier Biasing Interface Power Supplies Handheld Instrumentation Hi-Fi Headphone Amplifiers Powering Data Converters Typical Application LM27761 VIN C1 2.2 µF VOUT R1 EN VFB C1+ C4 2.2 µF R2 CPOUT C3 4.7 µF C2 1 µF C1- GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW 1 LM27761 SNVSA85 – OCTOBER 2015 www.ti.com 4 Device and Documentation Support 4.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. PRODUCT PREVIEW 4.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LM27761 LM27761 www.ti.com SNVSA85 – OCTOBER 2015 PACKAGE OUTLINE DSG0008B WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD 2.1 1.9 A B (0.08) (0.05) PIN 1 INDEX AREA SECTION A-A SECTION A-A 2.1 1.9 SCALE 30.000 TYPICAL PRODUCT PREVIEW 0.3 0.2 0.4 0.2 OPTIONAL TERMINAL TYPICAL C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 C EXPOSED THERMAL PAD (0.2) TYP 0.9±0.1 5 4 6X 0.5 SEE OPTIONAL TERMINAL A A 2X 1.5 1.6±0.1 8 1 PIN 1 ID (OPTIONAL) 8X 0.4 8X 0.2 0.3 0.2 0.1 0.05 C A C B 4222124/A 06/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LM27761 3 LM27761 SNVSA85 – OCTOBER 2015 www.ti.com EXAMPLE BOARD LAYOUT DSG0008B WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.9) 8X (0.5) ( 0.2) VIA TYP 1 8 8X (0.25) (0.55) SYMM (1.6) 6X (0.5) 5 PRODUCT PREVIEW 4 SYMM (R0.05) TYP (1.9) LAND PATTERN EXAMPLE SCALE:20X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS 4222124/A 06/2015 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LM27761 LM27761 www.ti.com SNVSA85 – OCTOBER 2015 EXAMPLE STENCIL DESIGN DSG0008B WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 8X (0.5) SYMM METAL 1 8 8X (0.25) PRODUCT PREVIEW (0.45) SYMM (0.7) 6X (0.5) 5 4 (R0.05) TYP (0.9) (1.9) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 87% PRINTED SOLDER COVERAGE BY AREA SCALE:25X 4222124/A 06/2015 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LM27761 5 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM27761DSGR PREVIEW WSON DSG 8 3000 TBD Call TI Call TI -40 to 85 LM27761DSGT PREVIEW WSON DSG 8 250 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. 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