CHR3364-QEG RoHS COMPLIANT 17-24GHz Down Converter GaAs Monolithic Microwave IC in SMD leadless package Description The CHR3364-QEG is a multifunction monolithic receiver, which integrates a balanced cold FET mixer, a LO chain with buffers associated to a time two multiplier, and a RF low noise amplifier including gain control. It is designed for a wide range of applications, from military to commercial communication systems. The circuit is manufactured with a pHEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in RoHS compliant SMD package. UMS R3364 YYWW Noise figure Main Features 10 ■ Broadband performances: 17-24GHz ■ 11dB Conversion gain ■ 17dBc Image Rejection ■ 1dBm Input IP3 ■ 2.7dB Noise Figure for IF>0.1GHz ■ 0dBm LO input Power ■ DC bias: Vd=4V @ Id=320mA ■ 24L-QFN4x5 ■ MSL1 9 8 Noise Figure (dB) 7 USB LSB 6 5 4 3 2 1 0 17 18 19 20 21 22 23 24 RF Frequency (GHz) Main Electrical Characteristics Tamb.= +25°C Symbol Parameter FRF RF frequency range FLO LO frequency range FIF IF frequency range CG Conversion gain Ref. : DSCHR3364-QEG1192 - 11 Jul 11 Min 17.0 6.5 DC Typ 11.0 1/14 Max 24.0 14.0 3.5 Unit GHz GHz GHz dB Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHR3364-QEG 17-24GHz Down Converter Electrical Characteristics Tamb.= +25°C, VD = VDL = 4.0V Symbol Parameter Min Typ Max Unit FRF RF frequency range 17 24 GHz FLO LO frequency range 6.5 14 GHz FIF IF frequency range DC 3.5 GHz CG Conversion Gain 11 dB NF Noise Figure for IF>0.1GHz 2.7 dB (1) Im_rej Image rejection 17 dBc PLO LO Input power 0 dBm IIP3 Input IP3 1 dBm 2LO/RF 2LO leakage at RF port -40 dBc VD, VDL DC drain voltage 4.0 V ID Drain current on VD pin for LO buffer 245 mA IDL Drain current on VDL pin for LNA 75 mA (2) VGL LNA DC gate voltage -0.5 V VGM Mixer DC gate voltage -0.7 V These values are representative of onboard measurements as defined on the drawing in paragraph "Evaluation mother board". (1) An external combiner 90° is required on I / Q. Typical VGL value for IDL = 75mA See in paragraph “ biasing option” other possibility to optimise differently the performances (2) Absolute Maximum Ratings (1) Tamb.= +25°C Symbol Parameter Values Unit VD, VDL Drain bias voltage 5 V ID+IDL Drain bias current 430 mA VGL LNA Gate bias voltage -2 to +0.4 V VGM Mixer Gate bias voltage -2 to +0.4 V (2) PRF Maximum peak RF input power overdrive +10 dBm PLO Maximum peak LO input power overdrive (2) +10 dBm Tj Junction temperature 175 °C Ta Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to +150 °C (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s. Ref. : DSCHR3364-QEG1192 - 11 Jul 11 2/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature can not be maintained below than the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). DEVICE THERMAL SPECIFICATION : CHR3364-QEG Recommended max. junction temperature (Tj max) : 124 Junction temperature absolute maximum rating : 175 Max. continuous dissipated power (Pdiss. Max.) : 1.3 => Pdiss. Max. derating above Tcase(1)= 85 °C : 33 Junction-Case thermal resistance (Rth J-C)(2) : <30 Minimum Tcase operating temperature(3) : -40 Maximum Tcase operating temperature(3) : 85 Minimum storage temperature : -55 Maximum storage temperature : 150 °C °C W mW/°C °C/W °C °C °C °C (1) Derating at junctio n temperature co nstant = Tj max. (2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the M M IC and all the devices biased. (3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 1.4 1 0.8 0.6 0.4 0.2 Pdiss. Max. @Tj <Tj max (W) 0 -50 -25 0 25 50 75 100 125 150 Pdiss. Max. @Tj <Tj max (W) 1.2 Tcase Example: QFN 16L 3x3 Location of temeprature reference point (Tcase) on package's bottom side Tcase (°C) 6.0 Ref. : DSCHR3364-QEG1192 - 11 Jul 11 3/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4.0V, VGL = -0.5V, VGM = -0.7V, PLO = 0dBm The values shown on the following pages are representative of on-board measurements where results are given on package access planes. Noise Figure in Supradyne and Infradyne Mode versus RF Frequency FRF = 2xFLO±FIF, FIF = 2.0GHz 10 9 8 Noise Figure (dB) 7 USB LSB 6 5 4 3 2 1 0 17 18 19 20 21 22 23 24 RF Frequency (GHz) Ref. : DSCHR3364-QEG1192 - 11 Jul 11 4/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4.0V, VGL = -0.5V, VGM = -0.7V, PLO = 0dBm Conversion Gain in Supradyne and Infradyne Mode versus RF Frequency FRF = 2xFLO±FIF, FIF = 3.5GHz 18 16 Conversion Gain (dB) 14 12 10 8 6 4 2 USB Conv. Gain LSB Conv. Gain 0 15 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Image Rejection versus RF Frequency FRF = 2xFLO±FIF, FIF = 3.5GHz 35 30 Image Rejection (dB) 25 20 15 10 5 USB LSB 0 15 16 17 18 Ref. : DSCHR3364-QEG1192 - 11 Jul 11 19 20 21 22 23 RF Frequency (GHz) 5/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 24 25 26 27 28 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4.0V, VGL = -0.5V, VGM = -0.7V, PLO = 0dBm Input IP3 in Supradyne Mode versus RF Frequency FRF = 2xFLO+FIF, FIF = 3.5GHz 10 9 8 7 Input IP3 (dBm) 6 5 4 3 2 1 0 19.5GHz -1 21.5GHz -2 23.5GHz -3 24.5GHz -4 26.5GHz -5 -27 -25 -23 -21 -19 -17 -15 -13 -11 -9 -11 -9 Input Power DCL (dBm) Input IP3 in Infradyne Mode versus RF Frequency FRF = 2xFLO-FIF, FIF = 3.5GHz 10 9 8 7 Input IP3 (dBm) 6 5 4 3 2 1 0 19.5GHz -1 21.5GHz -2 23.5GHz -3 24.5GHz -4 26.5GHz -5 -27 -25 -23 -21 -19 -17 -15 -13 Input Power DCL (dBm) Ref. : DSCHR3364-QEG1192 - 11 Jul 11 6/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4.0V, VGL = -0.5V, VGM = -0.7V, PLO = 0dBm IMD3 in Supradyne Mode versus RF Frequency FRF = 2xFLO+FIF, FIF = 3.5GHz 70 19.5GHz 21.5GHz 23.5GHz 60 24.5GHz IMD3 (dBc) 26.5GHz 50 40 30 20 -27 -25 -23 -21 -19 -17 -15 -13 -11 -9 Input Power DCL (dBm) LO & RF return loss versus frequency 0 -2 -4 Return losses (dB) -6 -8 -10 -12 -14 RF LO -16 -18 -20 0 5 10 15 20 25 30 Frequency (GHz) Ref. : DSCHR3364-QEG1192 - 11 Jul 11 7/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Temperature Board Measurements T = [-40, +25, +85] °C, VD = VDL = 4.0V, VGL = -0.5V, VGM = -0.7V, PLO = 0dBm Conversion Gain in Supradyne Mode versus RF Frequency FRF = 2xFLO+FIF, FIF = 3.5GHz 18 16 Conversion Gain (dB) 14 12 10 8 6 -40°C 4 +25°C 2 +85°C 0 15 16 17 18 19 20 21 22 23 24 25 26 27 28 27 28 RF Frequency (GHz) Conversion Gain in Infradyne Mode versus RF Frequency FRF = 2xFLO-FIF, FIF = 3.5GHz 18 16 Conversion Gain (dB) 14 12 10 8 6 -40°C 4 +25°C 2 +85°C 0 15 16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Ref. : DSCHR3364-QEG1192 - 11 Jul 11 8/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Temperature Board Measurements T = [-40, +25, +85] °C, VD = VDL = 4.0V, VGL = -0.5V, VGM = -0.7V, PLO = 0dBm Input IP3 in Supradyne Mode versus RF Frequency FRF = 2xFLO+FIF, FIF = 3.5GHz 10 9 8 7 Input IP3 (dBm) 6 5 4 3 2 1 0 -1 -2 -3 -4 85°C @19.5GHz 25°C @19.5GHz -40°C @19.5GHz 85°C @23.5GHz 25°C @23.5GHz -40°C @23.5GHz -5 -27 -25 -23 -21 -19 -17 -15 -13 -11 -9 Input Power DCL (dBm) Ref. : DSCHR3364-QEG1192 - 11 Jul 11 9/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Package outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 1- Nc 2- Nc 3- Nc 9- VGL 10- VDL 11- VGM 4- Gnd(2) 12- VD 5- RF in 13- Nc 6- Gnd(2) 14- Gnd(2) 7- Nc 8- Nc 15- LO in 16- Gnd(2) 17- Nc 18- Nc 19- Nc IF_I 20out 21- Gnd(2) IF_Q 22out 23- Nc 24- Nc (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0017 (http://www.ums-gaas.com) for exact package dimensions. (2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package. Ref. : DSCHR3364-QEG1192 - 11 Jul 11 10/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Evaluation mother board ■ Compatible with the proposed footprint. ■ Based on typically Ro4003 / 8mils or equivalent. ■ Using a micro-strip to coplanar transition to access the package. ■ Recommended for the implementation of this product on a module board. ■ Decoupling capacitors of 10nF ±10% are recommended for all DC accesses. ■ See application note AN0017 for details. Hybrid coupler 90° 2-4GHz Ref. : DSCHR3364-QEG1192 - 11 Jul 11 11/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Notes 19 IF_I 20 GND 21 18 17 16 15 14 NC GND LO IN GND NC NC NC Due to ESD protection circuits on RF and LO input, an external capacitance might be requested to isolate the product from external voltage that could be present on these accesses. 13 x2 12 VD 11 VGM VGL NC 24 8 NC 1 2 3 4 5 6 7 NC 9 GND 23 RF IN NC GND VDL NC 10 NC 22 NC IF_Q ESD protections are also implemented on gate accesses. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling (10nF) on the PC board, as close as possible to the package. Biasing Options In order to improve the conversion gain or the input IP3, the biasing could be tuned. VGL voltage allows controlling IDL current. Table below gives the typical value for main characteristics VD=VDL= 4.0V IDL= 75mA VD=VDL= 4.5V IDL= 110mA 11 2.7 +1 -0.5 245 320 1280 12.5 2.6 +3 -0.4 250 360 1620 Conversion Gain (dB) Noise Figure (dB) Input IP3 (dBm) VGL (V) ID (mA) ID +IDL (mA) Total DC power consumption (mW) Ref. : DSCHR3364-QEG1192 - 11 Jul 11 12/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter DC Schematic LNA: 4V, 75mA Vd=4.0V 2k 45 22 17 15mA 310 25mA 64 35mA 2.8k 3.3k Vg~ -0.5V LO Buffer: 4V, 245mA Vd=4.0V 60mA 80mA 25mA 80mA 1k 25 960 5.5 8 1k 40 40 510 185 100 1.6k 15 16 960 510 725 25 5.5 220 100 40 15 190 100 Ref. : DSCHR3364-QEG1192 - 11 Jul 11 13/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3364-QEG 17-24GHz Down Converter Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management Refer to the application note AN0019 available at http://www.ums-gaas.com for environmental data on UMS package products. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products. Ordering Information QFN 4x5 RoHS compliant package: CHR3364-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR3364-QEG1192 - 11 Jul 11 14/14 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice