Sample & Buy Product Folder Support & Community Tools & Software Technical Documents DS250DF410 SNLS527 – FEBRUARY 2016 DS250DF410 25 Gbps Multi-Rate 4-Channel Retimer 1 Features 2 Applications • • • • • 1 • • • • • • • • • • • • Quad-Channel Multi-Rate Retimer with Integrated Signal Conditioning All Channels Lock Independently from 20.6 to 25.8 Gbps (Including Sub-Rates Like 10.3125 Gbps, 12.5 Gbps, and More) Ultra-Low Latency: <500 ps Typical for 25.78125Gbps Data Rate Single Power Supply, No Low-Jitter Reference Clock Required, and Minimal Supply Decoupling to Reduce Board Routing Complexity and BOM Cost Integrated 2×2 Cross Point Adaptive Continuous Time Linear Equalizer (CTLE) Adaptive Decision Feedback Equalizer (DFE) Low-Jitter Transmitter With 3-Tap FIR Filter Combined Equalization Supporting 35+ dB Channel Loss at 12.9 GHz Adjustable Transmit Amplitude: 205 mVppd to 1225 mVppd (Typical) On-Chip Eye Opening Monitor (EOM), PRBS Pattern Checker/Generator Supports JTAG/AC-JTAG Boundary Scan Small 6-mm × 6-mm BGA Package with Easy Flow-Through Routing • Jitter Cleaning for Front-Port Optical Active Cable Assemblies Backplane/Mid-Plane Reach Extension IEEE802.3bj 100GbE, Infiniband EDR, and OIFCEI-25G-LR/MR/SR/VSR Electrical Interfaces SFP28, QSFP28, CFP2/CFP4, CDFP 3 Description The DS250DF410 is a four-channel multi-rate retimer with integrated signal conditioning. It is used to extend the reach and robustness of long, lossy, crosstalk-impaired high-speed serial links while achieving a bit error rate (BER) of 10-15 or less. Each channel of the DS250DF410 independently locks to serial data rates in a continuous range from 20.6 Gbps to 25.8 Gbps or to any supported sub-rate (÷2 and ÷4), including key data rates such as 10.3125 Gbps and 12.5 Gbps, which allows the DS250DF410 to support individual lane Forward Error Correction (FEC) pass-through. Device Information(1) PART NUMBER PACKAGE DS250DF410 ABM (101) BODY SIZE (NOM) 6.0 mm × 6.0 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic RX0P RX0N RX RX3P RX3N RX TX . . . . . . . . . CDR CDR TX0P TX0N . . . TX . . . TX3P TX3N 2.5V or 3.3V VDD SMBus Slave mode 1 NŸ EN_SMB INT_N NC_TEST SDA(1) SDC(1) To other open-drain interrupt pins To system SMBus Address straps (pull-up, pulldown, or float) ADDR0 ADDR1 25 MHz SMBus Slave mode 2.5V 1 F (2x) 0.1 F (4x) CAL_CLK_IN CAL_CLK_OUT READ_EN_N ALL_DONE_N VDD GND 7R QH[W GHYLFH¶V CAL_CLK_IN Float for SMBus Slave mode, or connect to next GHYLFH¶V 5($'_EN_N for SMBus Master mode (1) SMBus signals need to be pulled up elsewhere in the system. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. DS250DF410 SNLS527 – FEBRUARY 2016 www.ti.com 4 Description (continued) The DS250DF410 has a single power supply and minimal need for external components. These features reduce PCB routing complexity and BOM cost. The advanced equalization features of the DS250DF410 include a low-jitter 3-tap transmit finite impulse response (FIR) filter, an adaptive continuous-time linear equalizer (CTLE), and an adaptive decision feedback equalizer (DFE). This enables reach extension for lossy interconnect and backplanes with multiple connectors and crosstalk. The integrated CDR function is ideal for front-port optical module applications to reset the jitter budget and retime the high-speed serial data. The DS250DF410 implements 2x2 cross-point on each channel pair, providing the host with lane crossing, fanout, and multiplexing options. The DS250DF410 can be configured either through the SMBus or through an external EEPROM. Up to 16 devices can share a single EEPROM using Common Channel format. A non-disruptive on-chip eye monitor and a PRBS generator/checker allow for in-system diagnostics. 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: DS250DF410 DS250DF410 www.ti.com SNLS527 – FEBRUARY 2016 Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Description (continued)......................................... Revision History..................................................... Device and Documentation Support.................... 6.1 6.2 6.3 6.4 6.5 1 1 1 2 3 4 7 Device Support.......................................................... Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 4 4 4 4 4 Mechanical, Packaging, and Orderable Information ............................................................. 4 5 Revision History DATE REVISION NOTES February 2016 * Initial release. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: DS250DF410 3 DS250DF410 SNLS527 – FEBRUARY 2016 www.ti.com 6 Device and Documentation Support 6.1 Device Support 6.1.1 Development Support For additional information, see TI’s Surface Mount Technology (SMT) References at: http://focus.ti.com/quality/docs under the Quality & Lead (Pb)-Free Data menu. 6.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 6.3 Trademarks E2E is a trademark of Texas Instruments. 6.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 6.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 4 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: DS250DF410 PACKAGE OPTION ADDENDUM www.ti.com 26-Feb-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS250DF410ABMR PREVIEW FC/CSP ABM 101 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DS250DF4 DS250DF410ABMT PREVIEW FC/CSP ABM 101 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR -40 to 85 DS250DF4 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 26-Feb-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OUTLINE ABM0101A FCBGA - 1.03 mm max height SCALE 2.300 PLASTIC BALL GRID ARRAY 6.1 5.9 A B BALL A1 CORNER 6.1 5.9 1.03 MAX C SEATING PLANE BALL TYP 0.26 TYP 0.15 0.08 C 5 TYP (0.5) TYP SYMM L (0.5) TYP K J H 5 TYP G SYMM F E D 101X C B 0.5 TYP BALL A1 CORNER 0.35 0.25 0.15 0.05 C A C B A 1 2 3 4 5 6 7 8 9 10 11 0.5 TYP 4222100/B 09/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT ABM0101A FCBGA - 1.03 mm max height PLASTIC BALL GRID ARRAY (0.5) TYP 101X ( 0.28) 1 2 3 4 5 6 7 8 9 10 11 A B (0.5) TYP C D E SYMM F G H J K L SYMM LAND PATTERN EXAMPLE SCALE:15X 0.05 MAX 0.05 MIN ( 0.28) METAL SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) METAL UNDER SOLDER MASK ( 0.28) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4222100/B 09/2015 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com EXAMPLE STENCIL DESIGN ABM0101A FCBGA - 1.03 mm max height PLASTIC BALL GRID ARRAY (0.5) TYP 1 (0.5) TYP 2 3 4 5 6 7 8 9 10 11 A B C D E SYMM F G H J K L SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:15X 101X ( 0.25) PCB PAD (R0.05) TYP STENCIL DETAIL SCALE 60.000 NTS 4222100/B 09/2015 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated