1 of 3 Creation Date : May 08, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012JB1A335M125AA TDK item description C2012JB1A335MT**** Applications Commercial Grade Feature General General (Up to 50V) Series C2012 [EIA 0805] Status Production (Not Recommended for New Design) Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 1.25mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 3.3μF ±20% Rated Voltage 10VDC Temperature Characteristic JB(±10%) Dissipation Factor (Max.) 5% Insulation Resistance (Min.) 30MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 08, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012JB1A335M125AA Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C2012JB1A335M125AA ESR C2012JB1A335M125AA Capacitance C2012JB1A335M125AA C2012JB1A335M125AA Temperature Characteristic C2012JB1A335M125AA(No Bias) DC Bias Characteristic C2012JB1A335M125AA(DC Bias = 5V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C2012JB1A335M125AA(100kHz) C2012JB1A335M125AA(500kHz) C2012JB1A335M125AA(1MHz) Multilayer Ceramic Chip Capacitors C2012JB1A335M125AA Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 08, 2017 (GMT)