MBRP20030CTL POWERTAP II Switch-mode Power Rectifier The switch−mode Power Rectifier uses the Schottky Barrier principle with a platinum barrier metal. This state−of−the−art device has the following features: Features • • • • • • • • Dual Diode Construction − May Be Paralleled for Higher Current Output Guardring for Stress Protection Low Forward Voltage Drop 150°C Operating Junction Temperature Recyclable Epoxy Guaranteed Reverse Avalanche Energy Capability Improved Mechanical Ratings Pb−Free Packages are Available* www.onsemi.com LOW VF SCHOTTKY BARRIER RECTIFIER 200 AMPERES, 30 VOLTS 1 3 2 Mechanical Characteristics: • • • • • Case: Epoxy, Molded with metal heatsink base Weight: 80 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant Top Terminal Torque: 25−40 lb−in Max Base Plate Torques: See procedure given in the Package Outline Section 2 1 POWERTAP II CASE 357C PLASTIC 3 MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 30 V Average Rectified Forward Current Per Leg (At Rated VR, TC = 125°C) Per Device IF(AV) Peak Repetitive Forward Current, (At Rated VR, Square Wave, 20 kHz, TC = 100°C) IFRM 200 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 1500 A Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM 2.0 A Storage Temperature Range Tstg −55 to +150 °C TJ −55 to +150 °C dv/dt 10,000 V/ms Operating Junction Temperature Voltage Rate of Change (Rated VR) A 100 200 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2015 January, 2015 − Rev. 7 1 MARKING DIAGRAM MCC AYYWWG B20030L MCC A YY WW G B20030L = Specific Device Code = Mold Compound Code = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device MBRP20030CTL Package Shipping POWERTAP II 25 Units/Tray MBRP20030CTLG POWERTAP II (Pb−Free) 25 Units/Tray Publication Order Number: MBRP20030CTL/D MBRP20030CTL THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction−to−Case Symbol Value Unit RqJC 0.45 °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 1) (IF = 200 A, TC = + 125°C) (IF = 200 A, TC = + 25°C) VF Maximum Instantaneous Reverse Current (Note 1), (Rated dc Voltage, TC = + 25°C) IR V 0.52 0.60 5.0 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2%. MAXIMUM MECHANICAL RATINGS Terminal Penetration: 0.235 max POWERTAP MECHANICAL DATA APPLIES OVER OPERATING TEMPERATURE Terminal Torque: 25−40 in-lb max Mounting Torque — Outside Holes: 30−40 in-lb max Mounting Torque — Center Hole: 8−10 in-lb max Seating Plane Flatness 1 mil per in. (between mounting holes) 2″ Vertical Pull 250 lbs. max 2 in. Lever Pull 50 lbs. max Note: While the POWERTAP is capable of sustaining these vertical and levered tensions, the intimate contact Note: between POWERTAP and heat sink may be lost. This could lead to thermal runaway. The use of very Note: flexible leads is recommended for the anode connections. Use of thermal grease is highly recommended. www.onsemi.com 2 MBRP20030CTL MOUNTING PROCEDURE The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper heatsink. It is important to follow the proper tightening sequence to avoid warping the heatsink, which can reduce thermal contact between the POWERTAP and heat sink. STEP 1: Locate the POWERTAP on the heatsink and start mounting bolts into the threads by hand (2 or 3 turns). STEP 2: Finger tighten the center bolt. The bolt may catch on the threads of the heatsink so it is important to make sure the face of the bolt or washer is in contact with the surface of the POWERTAP. STEP 3: Tighten each of the end bolts between 5 to 10 in-lb. STEP 4: Tighten the center bolt between 8 to 10 in-lb. STEP 5: Finally, tighten the end bolts between 30 to 40 in-lb. 2 −3 TURNS 2 −3 TURNS POWER TAP HEAT SINK 2 −3 TURNS FINGER-TIGHT 2 −3 TURNS POWER TAP HEAT SINK FINGER-TIGHT 5 −10 IN-LB 5 −10 IN-LB POWER TAP HEAT SINK 8 −10 IN-LB 5 −10 IN-LB 5 −10 IN-LB POWER TAP HEAT SINK 8 −10 IN-LB 30 −40 IN-LB 30 −40 IN-LB POWER TAP HEAT SINK www.onsemi.com 3 2 −3 TURNS MBRP20030CTL PACKAGE DIMENSIONS CASE 357C−03 POWERTAP PLASTIC PACKAGE ISSUE E −A− W 0.25 (0.010) R G T A M M B M N NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TERMINAL PENETRATION: 5.97 (0.235) MAXIMUM. −B− Q H 0.25 (0.010) F C U 2 PL E −T− T A M M B M SEATING PLANE V DIM A B C E F G H N Q R U V W INCHES MIN MAX 3.450 3.635 0.700 0.810 0.615 0.640 0.120 0.130 0.435 0.445 1.370 1.380 0.007 0.030 1/4-20UNC-2B 0.270 0.285 31.50 BSC 0.600 0.630 0.330 0.375 0.170 0.190 MILLIMETERS MIN MAX 87.63 92.33 17.78 20.57 15.63 16.26 3.05 3.30 11.05 11.30 34.80 35.05 0.18 0.76 1/4-20UNC-2B 6.86 7.23 80.01 BSC 15.24 16.00 8.39 9.52 4.32 4.82 ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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