SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com FLATLINK™ TRANSMITTER Check for Samples: SN75LVDS83C FEATURES 1 • 2 • • • • • • LVDS Display Serdes Interfaces Directly to LCD Display Panels with Integrated LVDS Package: 4.5mm x 7mm BGA 1.8V up to 3.3V Tolerant Data Inputs to Connect Directly to Low-Power, Low-Voltage Application and Graphic Processors Transfer Rate up to 85Mpps (Mega Pixel Per Second); Pixel Clock Frequency Range 10MHz to 85MHz Suited for Display Resolutions Ranging From HVGA up to HD With Low EMI Operates From a Single 3.3V Supply and 148mW (typical) at 75MHz • • • • 28 Data Channels Plus Clock In Low-Voltage TTL to 4 Data Channels Plus Clock Out Low-Voltage Differential Consumes Less Than 1mW When Disabled Selectable Rising or Falling Clock Edge Triggered Inputs ESD: 5kV HBM Support Spread Spectrum Clocking (SSC) APPLICATIONS • • • LCD Display Panel Driver UMPC and Netbook PC Digital Picture Frame DESCRIPTION The SN75LVDS83C FlatLink™ transmitter contains four 7-bit parallel-load serial-out shift registers, a 7X clock synthesizer, and five Low-Voltage Differential Signaling (LVDS) line drivers in a single integrated circuit. These functions allow 28 bits of single-ended LVTTL data to be synchronously transmitted over five balanced-pair conductors for receipt by a compatible receiver, such as the SN75LVDS82 and LCD panels with integrated LVDS receiver. When transmitting, data bits D0 through D27 are each loaded into registers upon the edge of the input clock signal (CLKIN). The rising or falling edge of the clock can be selected via the clock select (CLKSEL) pin. The frequency of CLKIN is multiplied seven times, and then used to unload the data registers in 7-bit slices and serially. The four serial streams and a phase-locked clock (CLKOUT) are then output to LVDS output drivers. The frequency of CLKOUT is the same as the input clock, CLKIN. swiv Application processor (e.g. OMAPTM) el SN75LVDS83C TM FlatLink Transmitter BGA Package: 4.5 x 7mm 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. FlatLink is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2011, Texas Instruments Incorporated SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) The SN75LVDS83C requires no external components and little or no control. The data bus appears the same at the input to the transmitter and output of the receiver with the data transmission transparent to the user(s). The only user intervention is selecting a clock rising edge by inputting a high level to CLKSEL or a falling edge with a low-level input, and the possible use of the Shutdown/Clear (SHTDN). SHTDN is an active-low input to inhibit the clock, and shut off the LVDS output drivers for lower power consumption. A low-level on this signal clears all internal registers to a low-level. The SN75LVDS83C is characterized for operation over ambient air temperatures of -10°C to 70°C. ORDERING INFORMATION (1) (1) PART NUMBER PART MARKING PACKAGE SN75LVDS83CZQLR LVDS83C in BGA package 56-pin ZQL LARGE Tape and Reel For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT MIN MAX Supply voltage range, VCC, IOVCC, LVDSVCC, PLLVCC (2) -0.5 4 V Voltage range at any output terminal -0.5 VCC + 0.5 V Voltage range at any input terminal -0.5 IOVCC + 0.5 V Continuous power dissipation See the Thermal Information Table –65 Storage temperature, Ts Human Body Model (HBM) ESD rating (1) (2) (3) (4) (5) 2 (3) all pins 150 °C 5 kV Charged Device Model (CDM) (4) all pins 500 V Machine Model (MM) (5) all pins 150 V Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. All voltages are with respect to the GND terminals. In accordance with JEDEC Standard 22, Test Method A114-A. In accordance with JEDEC Standard 22, Test Method C101. In accordance with JEDEC Standard 22, Test Method A115-A. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) PARAMETER MIN NOM MAX Supply voltage, VCC 2.8 3.3 3.6 LVDS output Supply voltage, LVDSVCC 2.8 3.3 3.6 PLL analog supply voltage, PLLVCC 2.8 3.3 3.6 1.62 1.8 / 2.5 / 3.3 3.6 IO input reference supply voltage, IOVCC Power supply noise on any VCC terminal UNIT V 0.1 High-level input voltage, VIH Low-level input voltage, VIL IOVCC = 1.8V IOVCC/2 + 0.3V IOVCC = 2.5V IOVCC/2 + 0.4V IOVCC = 3.3V IOVCC/2 + 0.5V V IOVCC = 1.8V IOVCC/2 - 0.3V IOVCC = 2.5V IOVCC/2 - 0.4V IOVCC = 3.3V Differential load impedance, ZL Operating free-air temperature, TA V IOVCC/2 - 0.5V 90 132 Ω -10 70 C THERMAL INFORMATION THERMAL METRIC (1) SN75LVDS83C UNIT ZQL (56 PINS) θJA Junction-to-ambient thermal resistance 67.1 °C/W θJCtop Junction-to-case (top) thermal resistance 25.2 °C/W θJB Junction-to-board thermal resistance 31.0 °C/W ψJT Junction-to-top characterization parameter 0.8 °C/W ψJB Junction-to-board characterization parameter 30.3 °C/W θJCbot Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. TIMING REQUIREMENTS PARAMETER Input clock period, tc Input clock modulation MIN MAX UNIT 11.76 100 ns with modulation frequency 30kHz 8% with modulation frequency 50kHz 6% High-level input clock pulse width duration, tw 0.4 tc Input signal transition time, tt Data set up time, D0 through D27 before CLKIN (See Figure 3) Data hold time, D0 through D27 after CLKIN 0.6 tc ns 3 ns 2 ns 0.8 ns Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 3 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com ZQL PACKAGE (TOP VIEW) 6 5 4 3 2 1 D8 D7 D5 D4 D2 D1 D9 GND D6 D3 D0 D27 D11 VCC D10 GND Y0P Y0M D13 D12 IOVCC GND Y1P Y1M D14 GND GND D16 D15 Y2P Y2M D17 D18 CLKSEL GND CLKP CLKM D19 GND IOVCC GND Y3P Y3M D20 D21 D25 SHTDN PLLVCC GND D22 D23 D24 D26 CLKIN GND K J H G F LVDSVCC E D C B A ZQL PIN LIST 4 Ball # Signal Ball # Signal Ball # Signal A1 GND A2 CLKIN A3 D26 A4 D24 A5 D23 A6 D22 B1 GND B2 PLLVCC B3 SHTDN B4 D25 B5 D21 B6 D20 C1 Y3M C2 Y3P C3 GND C4 IOVCC C5 GND C6 D19 D1 CLKM D2 CLKP D3 GND D4 CLKSEL D5 D18 D6 D17 E1 Y2M E2 Y2P E3 ball not populated E4 ball not populated E5 D15 E6 D16 F1 LVDSVCC F2 GND F3 ball not populated F4 ball not populated F5 GND F6 D14 G1 Y1M G2 Y1P G3 GND G4 IOVCC G5 D12 G6 D13 H1 Y0M H2 Y0P H3 GND H4 D10 H5 VCC H6 D11 J1 D27 J2 D0 J3 D3 J4 D6 J5 GND J6 D9 K1 D1 K2 D2 K3 D4 K4 D5 K5 D7 K6 D8 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com PIN FUNCTIONS PIN I/O Y0P, Y0M, Y1P, Y1M, Y2P, Y2M Y3P, Y3M DESCRIPTION Differential LVDS data outputs. Outputs are high-impedance when SHTDN is pulled low (de-asserted) LVDS Out Differential LVDS Data outputs. Output is high-impedance when SHTDN is pulled low (de-asserted). Note: if the application only requires 18-bit color, this output can be left open. CLKP, CLKM Differential LVDS pixel clock output. Output is high-impedance when SHTDN is pulled low (de-asserted). D0 – D27 Data inputs; supports 1.8V to 3.3V input voltage selectable by VDD supply. To connect a graphic source successfully to a display, the bit assignment of D[27:0] is critical (and not necessarily intuitive). For input bit assignment see Figure 11 to Figure 14 for details. Note: if application only requires 18-bit color, connect unused inputs D5, D10, D11, D16, D17, D23, and D27 to GND. CLKIN CMOS IN with pulldn Input pixel clock; rising or falling clock polarity is selectable by Control input CLKSEL. SHTDN Device shut down; pull low (de-assert) to shut down the device (low power, resets all registers) and high (assert) for normal operation. CLKSEL Selects between rising edge input clock trigger (CLKSEL = VIH and falling edge input clock trigger (CLKSEL = VIL). VCC 3.3V digital supply voltage IOVCC PLLVCC I/O supply reference voltage (1.8V up to 3.3V matching the GPU data output signal swing) Power Supply (1) 3.3V PLL analog supply LVDSVCC 3.3V LVDS output analog supply GND Supply ground for VCC, IOVCC, LVDSVCC, and PLLVCC. (1) For a multilayer pcb, it is recommended to keep one common GND layer underneath the device and connect all ground terminals directly to this plane. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 5 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAM Parallel-Load 7-bit Shift Register D0, D1, D2, D3, D4, D6, D7 7 Y0P A,B,...G SHIFT/LOAD >CLK Y0M Parallel-Load 7-bit Shift Register D8, D9, D12, D13, D14, D15, D18 7 Y1P A,B,...G SHIFT/LOAD >CLK Y1M Parallel-Load 7-bit Shift Register D19, D20, D21, D22, D24, D25, D26 7 Y2P A,B,...G SHIFT/LOAD >CLK Y2M Parallel-Load 7-bit Shift Register D27, D5, D10, D11, D16, D17, D23 7 Y3P Y3M A,B,...G SHIFT/LOAD >CLK Control Logic SHTDN 7X Clock/PLL 7XCLK CLKIN CLKOUTP CLKOUTM >CLK CLKINH CLKSEL 6 RISING/FALLING EDGE Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com Dn CLKIN or CLKIN CLKOUT Previous cycle Next Current cycle Y0 D0-1 D7 D6 D4 D3 D2 D1 D0 D7+1 Y1 D8-1 D18 D15 D14 D13 D12 D9 D8 D18+1 Y2 D19-1 D26 D25 D24 D22 D21 D20 D19 D26+1 Y3 D27-1 D23 D17 D16 D11 D10 D5 D27 D23+1 Figure 1. Typical SN75LVDS83C Load and Shift Sequences LVDSVCC IOVCC 5W D or SHTDN 50W 7V YnP or YnM 10kW 300kW 7V Figure 2. Equivalent Input and Output Schematic Diagrams Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 7 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER VT Input voltage threshold |VOD| Differential steady-state output voltage magnitude TEST CONDITIONS MIN TYP (1) MAX IOVCC/2 250 UNIT V 450 mV RL = 100Ω, See Figure 4 Δ|VOD| Change in the steady-state differential output voltage magnitude between opposite binary states VOC(SS) Steady-state common-mode output voltage VOC(PP) Peak-to-peak common-mode output voltage IIH High-level input current VIH = IOVCC IIL Low-level input current VIL = 0 V ±10 μA VOY = 0 V ±24 mA 1 See Figure 4 tR/F (Dx, CLKin) = 1ns 1.125 35 1.375 mV V 35 mV 25 μA IOS Short-circuit output current VOD = 0 V ±12 mA IOZ High-impedance state output current VO = 0 V to VCC ±20 μA Rpdn Input pull-down integrated resistor on all inputs (Dx, CLKSEL, SHTDN, CLKIN) IOVCC = 1.8V 200 IOVCC = 3.3V 100 IQ Quiescent current (average) disabled, all inputs at GND; SHTDN = VIL 2 kΩ 100 μA SHTDN = VIH, RL = 100Ω (5 places), grayscale pattern (Figure 5) VCC = 3.3V, fCLK = 75MHz ICC CI (1) 8 Supply current (average) I(VCC) + I(PLLVCC) + I(LVDSVCC) 44.9 I(IOVCC) with IOVCC = 1.8V 0.1 mA SHTDN = VIH, RL = 100Ω (5 places), worst-case pattern (Figure 6), VCC = 3.3V, fCLK = 75MHz I(VCC) + I(PLLVCC) + I(LVDSVCC) 55.1 I(IOVCC) with IOVCC = 1.8V 0.5 Input capacitance 2 mA pF All typical values are at VCC = 3.3V, TA = 25°C. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com SWITCHING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT -0.15 0 0.15 ns t0 Delay time, CLKOUT↑ after Yn valid (serial bit position 0, equal D1, D9, D20, D5) t1 Delay time, CLKOUT↑ after Yn valid (serial bit position 1, equal D0, D8, D19, D27) 1 /7 tc - 0.15 1 /7 tc + 0.15 ns t2 Delay time, CLKOUT↑ after Yn valid (serial bit position 2, equal D7, D18, D26. D23) 2 /7 tc - 0.15 2 /7 tc + 0.15 ns t3 Delay time, CLKOUT↑ after Yn valid (serial bit position 3; equal D6, D15, D25, D17) 3 /7 tc - 0.15 3 /7 tc + 0.15 ns t4 Delay time, CLKOUT↑ after Yn valid (serial bit position 4, equal D4, D14, D24, D16) 4 /7 tc - 0.15 4 /7 tc + 0.15 ns t5 Delay time, CLKOUT↑ after Yn valid (serial bit position 5, equal D3, D13, D22, D11) 5 /7 tc - 0.15 5 /7 tc + 0.15 ns t6 Delay time, CLKOUT↑ after Yn valid (serial bit position 6, equal D2, D12, D21, D10) 6 /7 tc - 0.15 6 /7 tc + 0.15 ns tc(o) Output clock period Δtc(o) See Figure 7, tC = 13.3ns, |Input clock jitter| < 25ps (2) tc Output clock cycle-to-cycle jitter (3) tC = 13.3ns; clean reference clock, see Figure 8 ±26 tC = 13.3ns with 0.05UI added noise modulated at 3MHz, see Figure 8 ±44 High-level output clock pulse duration tr/f Differential output voltage transition time (tr or tf) See Figure 4 ten Enable time, SHTDN↑ to phase lock (Yn valid) tdis Disable time, SHTDN↓ to off-state (CLKOUT high-impedance) (1) (2) (3) ps 4 tw ns 200 /7 tc 250 ns 800 ps f(clk) = 85MHz, See Figure 9 15 µs f(clk) = 85MHz, See Figure 10 13 ns All typical values are at VCC = 3.3 V, TA = 25°C. |Input clock jitter| is the magnitude of the change in the input clock period. The output clock cycle-to-cycle jitter is the largest recorded change in the output clock period from one cycle to the next cycle observed over 15,000 cycles.Tektronix TDSJIT3 Jitter Analysis software was used to derive the maximum and minimum jitter value. PARAMETER MEASUREMENT INFORMATION tsu thold Dn CLKIN All input timing is defined at IOVDD / 2 on an input signal with a 10% to 90% rise or fall time of less than 3 ns. CLKSEL = 0V. Figure 3. Set Up and Hold Time Definition Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 9 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 49.9W ± 1% (2 PLCS) YP VOD VOC YM 100% 80% VOD(H) 0V VOD(L) 20% 0% tf tr VOC(PP) VOC(SS) VOC(SS) 0V Figure 4. Test Load and Voltage Definitions for LVDS Outputs. CLKIN D0,8,16 D1,9,17 D2,10,18 D3,11,19 D4-7,12-15,20-23 D24-27 The 16 grayscale test pattern test device power consumption for a typical display pattern. Figure 5. 16 Grayscale Test Pattern 10 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) T CLKIN EVEN Dn ODD Dn The worst-case test pattern produces nearly the maximum switching frequency for all of the LVDS outputs. Figure 6. Worst-Case Power Test Pattern t7 CLKIN CLKOUT t6 t5 t4 t3 t2 t0 Yn t1 VOD(H) ~2.5V CLKOUT or Yn 1.40V CLKIN 0.00V ~0.5V VOD(L) t7 t0-6 CLKOUT is shown with CLKSEL at high-level. CLKIN polarity depends on CLKSEL input level. Figure 7. SN75LVDS83C Timing Definitions Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 11 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Reference + Device Under Test VCO + Modulation v(t) = A sin(2 pfmodt) HP8656B Signal Generator, 0.1 MHz-990 MHz RF Output HP8665A Synthesized Signal Generator, 0.1 MHz-4200 MHz Device Under Test RF Output Modulation Input CLKIN CLKOUT DTS2070C Digital TimeScope Input Figure 8. Output Clock Jitter Test Set Up CLKIN Dn ten SHTDN Invalid Yn Valid Figure 9. Enable Time Waveforms CLKIN tdis SHTDN CLKOUT Figure 10. Disable Time Waveforms 12 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com APPLICATION INFORMATION This section describes the power up sequence, provides information on device connectivity to various GPU and LCD display panels, and offers a pcb routing example. Power Up Sequence The SN75LVDS83C does not require a specific power up sequence. It is permitted to power up IOVCC while VCC, VCCPLL, and VCCLVDS remain powered down and connected to GND. The input level of the SHTDN during this time does not matter as only the input stage is powered up while all other device blocks are still powered down. It is also permitted to power up all 3.3V power domains while IOVCC is still powered down to GND. The device will not suffer damage. However, in this case, all the I/Os are detected as logic HIGH, regardless of their true input voltage level. Hence, connecting SHTDN to GND will still be interpreted as a logic HIGH; the LVDS output stage will turn on. The power consumption in this condition is significantly higher than standby mode, but still lower than normal mode. The user experience can be impacted by the way a system powers up and powers down an LCD screen. The following sequence is recommended: Power up sequence (SN75LVDS83C SHTDN input initially low): 1. Ramp up LCD power (maybe 0.5ms to 10ms) but keep backlight turned off. 2. Wait for additional 0-200ms to ensure display noise won’t occur. 3. Enable video source output; start sending black video data. 4. Toggle LVDS83C shutdown to SHTDN = VIH. 5. Send >1ms of black video data; this allows the LVDS83C to be phase locked, and the display to show black data first. 6. Start sending true image data. 7. Enable backlight. Power Down sequence (SN75LVDS83C SHTDN input initially high): 1. Disable LCD backlight; wait for the minimum time specified in the LCD data sheet for the backlight to go low. 2. Video source output data switch from active video data to black image data (all visible pixel turn black); drive this for >2 frame times. 3. Set SN75LVDS83C input SHTDN = GND; wait for 250ns. 4. Disable the video output of the video source. 5. Remove power from the LCD panel for lowest system power. Signal Connectivity While there is no formal industry standardized specification for the input interface of LVDS LCD panels, the industry has aligned over the years on a certain data format (bit order). Figure 11 through Figure 14 show how each signal should be connected from the graphic source through the SN75LVDS83C input, output and LVDS LCD panel input. Detailed notes are provided with each figure. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 13 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 SN75LVDS83C 4.8k 1.8V or 2.5V or 3.3V C1 Rpullup Rpulldown Y0M Y0P Y2M Y2P Y3M Y3P 100 to column driver 100 FPC Cable Panel connector Y1M Y1P LVDS timing Controller (8bpc, 24bpp) 100 100 to row driver CLKOUTM CLKOUTP 100 VCC PLLVCC LVDSVCC 24-bpp LCD Display GND SHTDN D27 D5 D0 D1 D2 D3 D4 D6 D10 D11 D7 D8 D9 D12 D13 D14 D16 D17 D15 D18 D19 D20 D21 D22 D24 D25 D26 D23 CLKIN CLKSEL FORMAT2 (See Note A) D0 D1 D2 D3 D4 D6 D27 D5 D7 D8 D9 D12 D13 D14 D10 D11 D15 D18 D19 D20 D21 D22 D16 D17 D24 D25 D26 D23 CLKIN IOVCC VDDGPUIO GND R0(LSB) R1 R2 R3 R4 R5 R6 R7(MSB) G0(LSB) G1 G2 G3 G4 G5 G6 G7(LSB) B0(LSB) B1 B2 B3 B4 B5 B6 B7(MSB) HSYNC VSYNC ENABLE RSVD (Note C) CLK FORMAT1 Main board connector 24-bpc GPU www.ti.com 3.3V C2 3.3V C3 (See Note B) Main Board Note A. FORMAT: The majority of 24-bit LCD display panels require the two most significant bits (2 MSB ) of each color to be transferred over the 4th serial data output Y3. A few 24-bit LCD display panels require the two LSBs of each color to be transmitted over the Y3 output. The system designer needs to verify which format is expected by checking the LCD display data sheet. • Format 1: use with displays expecting the 2 MSB to be transmitted over the 4th data channel Y3. This is the dominate data format for LCD panels. • Format 2: use with displays expecting the 2 LSB to be transmitted over the 4th data channel. Note B. Rpullup: install only to use rising edge triggered clocking. Rpulldown: install only to use falling edge triggered clocking. • C1: decoupling cap for the VDDIO supply; install at least 1x0.01µF. • C2: decoupling cap for the VDD supply; install at least 1x0.1µF and 1x0.01µF. • C3: decoupling cap for the VDDPLL and VDDLVDS supply; install at least 1x0.1µF and 1x0.01µF. Note C. If RSVD is not driven to a valid logic level, then an external connection to GND is recommended. Note D. RSVD must be driven to a valid logic level. All unused SN75LVDS83C inputs must be tied to a valid logic level. Figure 11. 24-Bit Color Host to 24-bit LCD Panel Application 14 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com SN75LVDS83C B0(LSB) B1 B2 B3 B4 B5(MSB) C1 100 FPC Cable Panel connector to column driver CLKOUTM CLKOUTP LVDS timing Controller (6-bpc, 18-bpp) 100 100 to row driver 18-bpp LCD Display Y3M Y3P 4.8k 1.8V or 2.5V or 3.3V Y1M Y1P Y2M Y2P IOVCC VDDGPUIO GND HSYNC VSYNC ENABLE RSVD CLK 100 Rpullup (See Note A) VCC PLLVCC LVDSVCC G0(LSB) G1 G2 G3 G4 G5(MSB) Y0M Y0P Main board connector D0 D1 D2 D3 D4 D6 D27 D5 D7 D8 D9 D12 D13 D14 D10 D11 D15 D18 D19 D20 D21 D22 D16 D17 D24 D25 D26 D23 CLKIN GND R0(LSB) R1 R2 R3 R4 R5(MSB) SHTDN CLKSEL 18-bpp GPU 3.3V C2 3.3V C3 Rpulldown (See Note B) Main Board Note A. Leave output Y3 NC. Note B.Rpullup: install only to use rising edge triggered clocking. Rpulldown: install only to use falling edge triggered clocking. • C1: decoupling cap for the VDDIO supply; install at least 1x0.01µF. • C2: decoupling cap for the VDD supply; install at least 1x0.1µF and 1x0.01µF. • C3: decoupling cap for the VDDPLL and VDDLVDS supply; install at least 1x0.1µF and 1x0.01µF. Figure 12. 18-Bit Color Host to 18-Bit Color LCD Panel Display Application Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 15 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 12-bpp GPU www.ti.com SN75LVDS83C (See Note B) D0 D1 D2 D3 D4 D6 D27 D5 D7 D8 D9 D12 D13 D14 D10 D11 D15 D18 D19 D20 D21 D22 D16 D17 D24 D25 D26 D23 CLKIN (See Note B) B2 or VCC B3 or GND B0 B1 B2 B3(MSB) C1 FPC Cable t Panell connector Main board connector CLKOUTM CLKOUTP LVDS timing Controller (6-bpc, 18-bpp) 100 100 to row driver 18-bpp LCD Display Y3M Y3P 4.8k 1.8V or 2.5V or 3.3V 100 Y2M Y2P IOVCC VDDGPUIO GND HSYNC VSYNC ENABLE RSVD CLK to column driver Rpullup (See Note A) VCC PLLVCC LVDSVCC G2 or VCC G3 or GND G0 G1 G2 G3(MSB) 100 Y1M Y1P SHTDN CLKSEL (See Note B) Y0M Y0P GND R2 or VCC R3 or GND R0 R1 R2 R3(MSB) 3.3V C2 3.3V C3 Rpulldown (See Note C) Main Board Note A. Leave output Y3 N.C. Note B. R3, G3, B3: this MSB of each color also connects to the 5th bit of each color for increased dynamic range of the entire color space at the expense of none-linear step sizes between each step. For linear steps with less dynamic range, connect D1, D8, and D18 to GND. R2, G2, B2: these outputs also connects to the LSB of each color for increased, dynamic range of the entire color space at the expense of none-linear step sizes between each step. For linear steps with less dynamic range, connect D0, D7, and D15 to VCC. Note C.Rpullup: install only to use rising edge triggered clocking. Rpulldown: install only to use falling edge triggered clocking. • C1: decoupling cap for the VDDIO supply; install at least 1x0.01µF. • C2: decoupling cap for the VDD supply; install at least 1x0.1µF and 1x0.01µF. • C3: decoupling cap for the VDDPLL and VDDLVDS supply; install at least 1x0.1µF and 1x0.01µF. Figure 13. 12-Bit Color Host to 18-Bit Color LCD Panel Display Application 16 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com SN75LVDS83C D0 D1 D2 D3 D4 D6 D27 D5 D7 D8 D9 D12 D13 D14 D10 D11 D15 D18 D19 D20 D21 D22 D16 D17 D24 D25 D26 D23 CLKIN G7(MSB) B0 and B1: NC (See Note B) B2 B3 B4 B5 B6 B7(MSB) B0 and B1: NC (See Note B) CLKOUTM CLKOUTP C1 FPC Cable LVDS timing Controller (6-bpc, 18-bpp) 100 100 to row driver 18-bpp LCD Display Y3M Y3P 4.8k 1.8V or 2.5V or 3.3V 100 Y2M Y2P IOVCC VDDGPUIO GND HSYNC VSYNC ENABLE RSVD CLK to column driver Y1M Y1P t Panell connector G2 G3 G4 G5 G6 100 Main board connector G0 and G1: NC (See Note B) Y0M Y0P SHTDN CLKSEL R7(MSB) Rpullup (See Note A) VCC PLLVCC LVDSVCC R2 R3 R4 R5 R6 GND 24-bpp GPU R0 and R1: NC (See Note B) 3.3V C2 3.3V C3 Rpulldown (See Note C) Main Board Note A. Leave output Y3 NC. Note B. R0, R1, G0, G1, B0, B1: For improved image quality, the GPU should dither the 24-bit output pixel down to18-bit per pixel. NoteC.Rpullup: install only to use rising edge triggered clocking. Rpulldown: install only to use falling edge triggered clocking. • C1: decoupling cap for the VDDIO supply; install at least 1x0.01µF. • C2: decoupling cap for the VDD supply; install at least 1x0.1µF and 1x0.01µF. • C3: decoupling cap for the VDDPLL and VDDLVDS supply; install at least 1x0.1µF and 1x0.01µF. Figure 14. 24-Bit Color Host to 18-Bit Color LCD Panel Display Application Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 17 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com Typical Application Schematic Figure 15 represents the schematic drawing of the SN75LVDS83C evaluation module. J1 U1H GND1 GND2 GND3 GND4 GND5 GND6 GND7 PLLGND LVDSGND1 LVDSGND2 J3 CLKM CLKP Y0P Y0M Y1P Y1M Y2P Y2M IOVCC R4 4.7k R5 4.7k R6 4.7k R7 4.7k R8 4.7k R9 4.7k Y3P Y3M R10 4.7k JMP1 U1B J2 K1 K2 J3 K3 J4 K5 D0 D1 D2 D3 D4 D6 D7 D1 D2 G2 G1 J5 E1 E2 sma_surface J6 sma_surface C2 C1 J7 sma_surface SN75LVDS83CZQL J8 sma_surface J9 sma_surface 14 Header 7x2 J10 sma_surface IOVCC R11 4.7k R12 4.7k R13 4.7k R14 4.7k R15 4.7k R16 4.7k R17 4.7k sma_surface JMP2 U1C K6 J6 G5 G6 F6 E5 D5 J4 sma_surface H2 H1 1 2 SN75LVDS83CZQL D8 D9 D12 D13 D14 D15 D18 sma_surface U1A SN75LVDS83CZQL D0 D1 D2 D3 D4 D6 D7 J2 sma_surface C3 C5 D3 F5 G3 H3 J5 A1 B1 F2 D8 D9 D12 D13 D14 D15 D18 1 2 IOVCC IOVCC 14 SN75LVDS83CZQL R2 R1 4.7k Header 7x2 IOVCC R18 4.7k R19 4.7k R20 4.7k R21 4.7k R22 4.7k R23 4.7k R24 4.7k JMP6 U1G JMP3 U1D C6 B6 B5 A6 A4 B4 A3 D19 D20 D21 D22 D24 D25 D 26 D19 D20 D21 D22 D24 D25 D26 SHTDN CLKSEL 1 2 B3 D4 SHTDN CLKSEL 1 2 3 4 Header 2x2 SN75LVDS83CZQL 14 U1J IOVCC R25 4.7k R26 4.7k R27 4.7k R28 4.7k R29 4.7k R30 4.7k E3 E4 F3 F4 NC1 NC2 NC3 NC4 Header 7x2 SN75LVDS83CZQL SN75LVDS83CZQL R31 4.7k JMP4 U1E K4 H4 H6 E6 D6 A5 J1 D5 D10 D11 D16 D17 D23 D27 D5 D10 D11 D16 D17 D23 D27 VCC 1 2 IOVCC U1I VCC PLLVCC LVDSVCC 14 IOVCC1 IOVCC2 Header 7x2 SN75LVDS83CZQL G4 B2 F1 H5 C4 SN75LVDS83CZQL VCC VCC C31 1uF C32 0.1uF C33 0.01uF VCC C34 1uF C35 0.1uF C36 0.01uF IOVCC C40 1uF C41 0.1uF C42 0.01uF C37 1uF C38 0.1uF C39 0.01uF PLACE UNDER LVDS83C (bottom pcb side) Figure 15. Schematic Example (SN75LVDS83C Evaluation Board) 18 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com PCB Routing Figure 16 and Figure 17 show a possible breakout of the data input and output signals from the BGA package. R1 R2 R3 R4 R5 R6 R7 R8 G0 G1 D8 D7 D5 D4 D2 D1 D9 GND D6 D3 D0 D27 D11 VCC D10 GND Y0P Y0M D13 D12 IOVCC GND Y1P Y1M D14 GND D16 D15 D17 D18 CLKSEL D19 GND IOVCC D20 D21 D25 D22 D23 D24 G2 G3 G4 G5 G6 G7 B0 B1 LVDS GND LVDS VCC Y2P Y2M GND CLKP CLKM GND Y3P Y3M B2 B3 B4 B5 B6 SHTDN PLLVCC LVDS GND +PLL GND D26 CLKIN PLL GND B7 HS VS EN CLK Figure 16. 24-Bit Color Routing (See Figure 11 for the Schematic) Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 19 SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 G1 G0 D8 D7 www.ti.com R5 R4 R3 R2 D5 D4 D2 R1 R0 D1 To GND G2 G3 D9 GND D6 D3 D0 D27 D11 VCC D10 GND Y0P Y0M D13 D12 IOVCC GND Y1P Y1M D14 GND D16 D15 D17 D18 CLKSEL D19 GND IOVCC G4 G5 B0 LVDS GND LVDS VCC To GND B1 Y2P Y2M GND CLKP CLKM GND Y3P Y3M B2 remains unconnected B3 B4 D20 D21 D22 D23 D25 SHTDN PLLVCC LVDS GND +PLL GND CLKIN B5 D24 PLL GND D26 HS VS EN CLK Figure 17. 18-Bit Color Routing (See Figure 12, Figure 13, and Figure 14 for the Schematic) 20 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C SN75LVDS83C SLLSE66A – OCTOBER 2010 – REVISED SEPTEMBER 2011 www.ti.com REVISION HISTORY Changes from Original (May 2009) to Revision A • Page Multiply changes throughout the data sheet ......................................................................................................................... 1 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): SN75LVDS83C 21 PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) HPA02273ZQLR ACTIVE BGA MICROSTAR JUNIOR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-2-260C-1 YEAR -10 to 70 LVDS83C SN75LVDS83CZQLR ACTIVE BGA MICROSTAR JUNIOR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-2-260C-1 YEAR -10 to 70 LVDS83C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN75LVDS83CZQLR Package Package Pins Type Drawing BGA MI CROSTA R JUNI OR ZQL 56 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 16.4 Pack Materials-Page 1 4.8 B0 (mm) K0 (mm) P1 (mm) 7.3 1.5 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN75LVDS83CZQLR BGA MICROSTAR JUNIOR ZQL 56 1000 336.6 336.6 28.6 Pack Materials-Page 2 PACKAGE OUTLINE ZQL0056A JRBGA - 1 mm max height SCALE 2.100 PLASTIC BALL GRID ARRAY 4.6 4.4 B A BALL A1 CORNER 7.1 6.9 1 MAX C SEATING PLANE 0.35 TYP 0.15 BALL TYP 0.1 C 3.25 TYP (0.625) TYP SYMM K (0.575) TYP J H G 5.85 TYP SYMM F E D C 56X NOTE 3 B A 0.65 TYP BALL A1 CORNER 1 2 3 4 5 0.45 0.35 0.15 0.08 C B A C 6 0.65 TYP 4219711/B 01/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. No metal in this area, indicates orientation. www.ti.com EXAMPLE BOARD LAYOUT ZQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY (0.65) TYP 56X ( 0.33) 2 1 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN EXPOSED METAL ( 0.33) METAL ( 0.33) SOLDER MASK OPENING EXPOSED METAL SOLDER MASK DEFINED NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4219711/B 01/2017 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com EXAMPLE STENCIL DESIGN ZQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY 56X ( 0.33) (0.65) TYP 1 2 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4219711/B 01/2017 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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