Rohm BU52002GUL 1008 Unipolar detection hall ic Datasheet

Hall ICs
Unipolar Detection
Hall ICs
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
No.10045ECT03
●Description
The unipolar Detection Hall IC detects only either the N pole or S pole.
The output turns ON (active Low) upon detection.
●Features
1) Unipolar detection
2) Micropower operation (small current using intermittent operation method)
3) Ultra-compact CSP4 package (BU52002GUL, BU52003GUL)
4) Ultra- Small outline package (BU52012NVX)
5) Small outline package (BU52012HFV, BU52013HFV)
6) Line up of supply voltage
For 1.8V Power supply voltage (BU52012NVX, BU52012HFV, BU52013HFV)
For 3.0V Power supply voltage (BU52002GUL, BU52003GUL)
7) High ESD resistance 8kV(HBM)
●Applications
Mobile phones, notebook computers, digital video camera, digital still camera, etc.
●Lineup matrix
Function Product name
S pole
Supply
voltage
(V)
Operate
point
(mT)
Hysteresis
(mT)
Period
(ms)
Supply
current
(AVG.)
(µA)
Output type
Package
BU52002GUL
2.40～3.30
3.7
※
0.8
50
6.5
CMOS
VCSP50L1
BU52012NVX
1.65～3.60
3.0
※
0.9
50
3.5
COMS
SSON004X1216
BU52012HFV
1.65～3.30
3.0
※
0.9
50
3.5
CMOS
HVSOF5
BU52003GUL
2.40～3.30
-3.7
※
0.8
50
6.5
CMOS
VCSP50L1
BU52013HFV
1.65～3.30
-3.0
※
0.9
50
3.5
CMOS
HVSOF5
N pole
※Plus is expressed on the S-pole; minus on the N-pole
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© 2010 ROHM Co., Ltd. All rights reserved.
1/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Absolute maximum ratings
BU52002GUL,BU52003GUL (Ta=25℃)
Parameter
Symbol
Ratings
Power Supply Voltage
VDD
-0.1～+4.5※1
V
Output Current
IOUT
±1
Power Dissipation
Pd
Operating
Temperature Range
Storage
Temperature Range
BU52012NVX (Ta=25℃)
Parameter
Symbol
Unit
Unit
Power Supply Voltage
VDD
-0.1～+4.5※3
V
mA
Output Current
IOUT
±0.5
mA
420※2
mW
Power Dissipation
Pd
2049
Topr
-40～+85
℃
Topr
-40～+85
℃
Tstg
-40～+125
℃
Tstg
-40～+125
℃
Operating
Temperature Range
Storage
Temperature Range
※1. Not to exceed Pd
※2. Reduced by 4.20mW for each increase in Ta of 1℃ over 25℃
(mounted on 50mm×58mm Glass-epoxy PCB)
BU52012HFV,BU52013HFV (Ta=25℃)
Parameter
Symbol
Ratings
※4
mW
※3. Not to exceed Pd
※4. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)
Unit
Power Supply Voltage
VDD
-0.1～+4.5※5
V
Output Current
IOUT
±0.5
mA
Power Dissipation
Pd
536※6
mW
Topr
-40～+85
℃
Tstg
-40～+125
℃
Operating
Temperature Range
Storage
Temperature Range
Ratings
※5. Not to exceed Pd
※6. Reduced by 5.36mW for each increase in Ta of 1℃ over 25℃
(mounted on 70mm×70mm×1.6mm Glass-epoxy PCB)
●Magnetic, Electrical characteristics
BU52002GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Power Supply Voltage
VDD
2.4
3.0
3.3
V
Operate Point
BopS
-
3.7
5.5
mT
Release Point
BrpS
0.8
2.9
-
mT
Hysteresis
BhysS
-
0.8
-
mT
TP
-
50
100
ms
Output High Voltage
VOH
VDD-0.4
-
-
V
B<BrpS
IOUT=-1.0mA
※7
Output Low Voltage
VOL
-
-
0.4
V
BopS<B
IOUT =+1.0mA
※7
Supply Current
IDD(AVG)
-
6.5
9
µA
Average
Supply Current
During Startup Time
IDD(EN)
-
4.7
-
mA
During Startup Time Value
Supply Current
During Standby Time
IDD(DIS)
-
3.8
-
µA
During Standby Time Value
Period
※7. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
2/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52003GUL (Unless otherwise specified, VDD=3.0V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Power Supply Voltage
VDD
2.4
3.0
3.3
V
Operate Point
BopN
-5.5
-3.7
-
mT
Release Point
BrpN
-
-2.9
-0.8
mT
Hysteresis
BhysN
-
0.8
-
mT
TP
-
50
100
ms
Output High Voltage
VOH
VDD-0.4
-
-
V
BrpN<B
IOUT=-1.0mA
※8
Output Low Voltage
VOL
-
-
0.4
V
B<BopN
IOUT =+1.0mA
※8
Supply Current
IDD(AVG)
-
6.5
9
µA
Average
Supply Current
During Startup Time
IDD(EN)
-
4.7
-
mA
During Startup Time Value
Supply Current
During Standby Time
IDD(DIS)
-
3.8
-
µA
During Standby Time Value
Period
※8. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
3/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52012NVX (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Power Supply Voltage
VDD
1.65
1.80
3.60
V
Operate Point
BopS
-
3.0
5.0
mT
Release Point
BrpS
0.6
2.1
-
mT
Hysteresis
BhysS
-
0.9
-
mT
TP
-
50
100
ms
Output High Voltage
VOH
VDD-0.2
-
-
V
B<BrpS
IOUT =-0.5mA
※9
Output Low Voltage
VOL
-
-
0.2
V
BopS<B
IOUT =+0.5mA
※9
Supply Current 1
IDD1(AVG)
-
3.5
5.5
µA
VDD=1.8V, Average
Supply Current
During Startup Time 1
IDD1(EN)
-
2.8
-
mA
VDD=1.8V,
During Startup Time Value
Supply Current
During Standby Time 1
IDD1(DIS)
-
1.8
-
µA
VDD=1.8V,
During Standby Time Value
Supply Current 2
IDD2(AVG)
-
8.0
12.5
µA
VDD=3.0V, Average
Supply Current
During Startup Time 2
IDD2(EN)
-
5.3
-
mA
VDD=3.0V,
During Startup Time Value
Supply Current
During Standby Time 2
IDD2(DIS)
-
5.2
-
µA
VDD=3.0V,
During Standby Time Value
Period
※9. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
4/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52012HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Power Supply Voltage
VDD
1.65
1.80
3.30
V
Operate Point
BopS
-
3.0
5.0
mT
Release Point
BrpS
0.6
2.1
-
mT
Hysteresis
BhysS
-
0.9
-
mT
TP
-
50
100
ms
Output High Voltage
VOH
VDD-0.2
-
-
V
B<BrpS
IOUT =-0.5mA
※10
Output Low Voltage
VOL
-
-
0.2
V
BopS<B
IOUT =+0.5mA
※10
Supply Current 1
IDD1(AVG)
-
3.5
5.5
µA
VDD=1.8V, Average
Supply Current
During Startup Time 1
IDD1(EN)
-
2.8
-
mA
VDD=1.8V,
During Startup Time Value
Supply Current
During Standby Time 1
IDD1(DIS)
-
1.8
-
µA
VDD=1.8V,
During Standby Time Value
Supply Current 2
IDD2(AVG)
-
6.5
9
µA
VDD=2.7V, Average
Supply Current
During Startup Time 2
IDD2(EN)
-
4.5
-
mA
VDD=2.7V,
During Startup Time Value
Supply Current
During Standby Time 2
IDD2(DIS)
-
4.0
-
µA
VDD=2.7V,
During Standby Time Value
Period
※10. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
5/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52013HFV (Unless otherwise specified, VDD=1.80V, Ta=25℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Unit
Conditions
Power Supply Voltage
VDD
1.65
1.80
3.30
V
Operate Point
BopN
-5.0
-3.0
-
mT
Release Point
BrpN
-
-2.1
-0.6
mT
Hysteresis
BhysN
-
0.9
-
mT
TP
-
50
100
ms
Output High Voltage
VOH
VDD
-0.2
-
-
V
BrpN<B
IOUT =-0.5mA
※11
Output Low Voltage
VOL
-
-
0.2
V
B<BopN
IOUT =+0.5mA
※11
Supply Current 1
IDD1(AVG)
-
3.5
5.5
µA
VDD=1.8V, Average
Supply Current
During Startup Time 1
IDD1(EN)
-
2.8
-
mA
VDD=1.8V,
During Startup Time Value
Supply Current
During Standby Time 1
IDD1(DIS)
-
1.8
-
µA
VDD=1.8V,
During Standby Time Value
Supply Current 2
IDD2(AVG)
-
6.5
9
µA
VDD=2.7V, Average
Supply Current
During Startup Time 2
IDD2(EN)
-
4.5
-
mA
VDD=2.7V,
During Startup Time Value
Supply Current
During Standby Time 2
IDD2(DIS)
-
4.0
-
µA
VDD=2.7V,
During Standby Time Value
Period
※11. B = Magnetic flux density
1mT=10Gauss
Positive (“+”) polarity flux is defined as the magnetic flux from south pole which is direct toward to the branded face of the sensor.
After applying power supply, it takes one cycle of period (TP) to become definite output.
Radiation hardiness is not designed.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
6/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Figure of measurement circuit
Bop/Brp
Tp
200Ω
VDD
VDD
OUT
100µF
VDD
VDD
GND
Oscilloscope
V
OUT
GND
The period is monitored by Oscilloscope.
Bop and Brp are measured with applying the magnetic field
from the outside.
Fig.1 Bop,Brp measurement circuit
Fig.2 Tp measurement circuit
VOH
Product Name
VDD
VDD
OUT
100µF
GND
IOUT
V
IOUT
BU52002GUL, BU52003GUL
1.0mA
BU52012NVX, BU52012HFV,
BU52013HFV
0.5mA
Fig.3 VOH measurement circuit
VOL
Product Name
VDD
VDD
OUT
100µF
GND
IOUT
V
IOUT
BU52002GUL, BU52003GUL
1.0mA
BU52012NVX, BU52012HFV,
BU52013HFV
0.5mA
Fig.4 VOL measurement circuit
IDD
A
2200µF
VDD
VDD
OUT
GND
Fig.5
IDD measurement circuit
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© 2010 ROHM Co., Ltd. All rights reserved.
7/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Technical (Reference) Data
BU52002GUL (VDD=2.4～3.3V type)
8.0
4.0
2.0
Brp S
0.0
-2.0
-4.0
-6.0
-8.0
-60 -40 -20 0
Brp S
0.0
-2.0
-4.0
PERIOD [ms]
70
60
50
40
30
20
10
0
2.8
3.2
40
30
10
0
2.0
Fig.7
20.0
18.0
AVERAGE SUPPLY CURRENT [µA]
80
2.4
50
2.4
2.8
3.2
-60 -40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE [℃]
3.6
SUPPLY VOLTAGE ［V］
Ta = 25°C
2.0
60
-8.0
20 40 60 80 100
Bop,Brp – Ambient temperature
100
90
70
20
-6.0
AMBIENT TEMPERATURE [℃]
Fig.6
80
4.0
2.0
Bop,Brp – Supply voltage
VDD=3.0V
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
3.6
VDD=3.0V
90
Bop S
PERIOD [ms]
Bop S
100
Ta = 25°C
6.0
SUPPLY VOLTAGE [V]
20 40 60 80 100
Fig.8 TP –Ambient temperature
20.0
AVERAGE SUPPLY CURRENT [µA]
VDD=3.0V
6.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
18.0
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
2.0
AMBIENT TEMPERATURE [℃]
Fig.9 TP – Supply voltage
2.4
2.8
3.2
3.6
SUPPLY VOLTAGE [V]
Fig.11 IDD – Supply voltage
Fig.10 IDD – Ambient temperature
BU52003GUL (VDD=2.4～3.3V type)
8.0
4.0
2.0
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20 0
0.0
-4.0
-6.0
80
PERIOD [ms]
60
50
40
30
20
Bop N
10
-8.0
0
2.0
2.4
2.8
3.2
-60 -40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE [℃]
3.6
70
60
50
40
30
20
10
0
3.6
Fig.15 TP –Supply voltage
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© 2010 ROHM Co., Ltd. All rights reserved.
Fig.14 TP – Ambient temperature
Fig.13 Bop,Brp – Supply voltage
AVERAGE SUPPLY CURRENT [µA]
Ta = 25°C
2.4
2.8
3.2
SUPPLY VOLTAGE [V]
Brp N
-2.0
70
SUPPLY VOLTAGE ［V］
100
20.0
18.0
VDD=3.0V
80
2.0
20 40 60 80 100
Fig.12 Bop,Brp – Ambient temperature
2.0
90
4.0
AMBIENT TEMPERATURE [℃]
90
100
Ta = 25°C
6.0
PERIOD [ms]
VDD=3.0V
AVERAGE SUPPLY CURRENT [µA]
6.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
VDD=3.0V
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
Fig.16 IDD – Ambient temperature
8/19
20.0
18.0
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
2.0
2.4
2.8
3.2
SUPPLY VOLTAGE [V]
3.6
Fig.17 IDD – Supply voltage
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52012NVX (VDD=1.65～3.6V type)
8.0
6.0
Bop S
4.0
2.0
Brp S
0.0
-2.0
-4.0
-6.0
-8.0
-60 -40 -20 0
20 40 60 80 100
100
Ta = 25°C
6.0
Brp S
0.0
-2.0
90
Ta = 25°C
80
PERIOD [ms]
70
60
50
40
30
20
10
0
1.4
1.8
2.2
2.6
3.0
3.4
70
60
50
40
30
-4.0
20
-6.0
10
-8.0
0
1.4
1.8
2.2
2.6
3.0
3.4
-60 -40 -20 0
3.8
Fig.19 Bop,Brp – Supply voltage
Fig.20 TP – Ambient temperature
20.0
18.0
16.0
VDD=1.8V
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
3.8
SUPPLY VOLTAGE [V]
20.0
18.0
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
20 40 60 80 100
1.4
1.8
2.2
2.6
3.0
3.4
3.8
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Fig.21 TP – Supply voltage
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE ［V］
AVERAGE SUPPLY CURRENT [µA]
100
VDD=1.8V
80
2.0
AMBIENT TEMPERATURE [℃]
Fig.18 Bop,Brp – Ambient temperature
90
Bop S
4.0
AVERAGE SUPPLY CURRENT [µA]
VDD=1.8V
PERIOD [ms]
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
8.0
Fig.23 IDD – Supply voltage
Fig.22 IDD – Ambient temperature
BU52012HFV (VDD=1.65～3.3V type)
Bop S
4.0
2.0
Brp S
0.0
-2.0
-4.0
-6.0
-8.0
-60 -40 -20 0
20 40 60 80 100
Ta = 25°C
6.0
2.0
Brp S
0.0
-2.0
-4.0
90
Ta = 25°C
80
PERIOD [ms]
70
60
50
40
30
20
10
0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
SUPPLY VOLT AGE [V]
Fig.27 TP – Supply voltage
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© 2010 ROHM Co., Ltd. All rights reserved.
70
60
50
40
30
20
-6.0
10
-8.0
0
1.4
1.8
2.2
2.6
3.0
3.4
-60 -40 -20 0
3.8
Fig.25 Bop,Brp – Supply voltage
20.0
18.0
16.0
VDD=1.8V
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
Fig.28 IDD – Ambient temperature
9/19
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
SUPPLY VOLTAGE ［V］
AVERAGE SUPPLY CURRENT [µA]
100
VDD=1.8V
80
4.0
AMBIENT TEMPERATURE [℃]
Fig.24 Bop,Brp – Ambient temperature
90
Bop S
Fig.26 TP – Ambient temperature
AVERAGE SUPPLY CURRENT [µA]
VDD=1.8V
6.0
PERIOD [ms]
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
100
8.0
8.0
20.0
18.0
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
SUPPLY VOLTAGE [V]
Fig.29 IDD – Supply voltage
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
8.0
VDD=1.8V
4.0
2.0
0.0
Brp N
-2.0
-4.0
Bop N
-6.0
-8.0
-60 -40 -20 0
20 40 60 80 100
100
Ta = 25°C
6.0
2.0
0.0
Brp N
-2.0
-4.0
-6.0
Ta = 25°C
PERIOD [ms]
80
70
60
50
40
30
20
10
0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
SUPPLY VOLTAGE [V]
Fig.33 TP – Supply voltage
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© 2010 ROHM Co., Ltd. All rights reserved.
60
50
40
30
10
-8.0
0
1.4
1.8
2.2
2.6
3.0
3.4
-60 -40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE [℃]
3.8
Fig.31 Bop,Brp – Supply voltage
AVERAGE SUPPLY CURRENT [µA]
100
70
20
Bop N
SUPPLY VOLTAGE ［V］
Fig.30 Bop,Brp – Ambient temperature
VDD=1.8V
80
4.0
AMBIENT TEMPERATURE [℃]
90
90
20.0
18.0
VDD=1.8V
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60 -40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE [℃]
Fig.34 IDD – Ambient temperature
10/19
Fig.32 TP – Ambient temperature
AVERAGE SUPPLY CURRENT [µA]
6.0
PERIOD [ms]
8.0
MAGNETIC FLUX DENSITY [mT]
MAGNETIC FLUX DENSITY [mT]
BU52013HFV (VDD=1.65～3.3V type)
20.0
18.0
Ta = 25°C
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
1.4
1.8
2.2
2.6
3.0
3.4
3.8
SUPPLY VOLTAGE [V]
Fig.35 IDD – Supply voltage
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Block Diagram
BU52002GUL, BU52003GUL
0.1µF
VDD
A1
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
TIMING LOGIC
HALL
LATCH
SAMPLE
& HOLD
×
The CMOS output terminals enable direct connection to
the PC, with no external pull-up resistor required.
DYNAMIC
OFFSET
CANCELLATION
ELEMENT
B1
A2
OUT
GND
Fig.36
A1
PIN No.
PIN NAME
FUNCTION
A1
VDD
POWER SUPPLY
A2
GND
GROUND
B1
OUT
OUTPUT
B2
N.C.
A2
A2
A1
B2
B1
COMMENT
B1
OPEN or Short to GND.
B2
Surface
Reverse
BU52012NVX
0.1µF
VDD
Adjust the bypass capacitor value as
necessary, according to voltage
noise conditions, etc.
4
The CMOS output terminals enable direct
connection to the PC, with no external pull-up
resistor required.
LATCH
×
SAMPLE
& HOLD
HALL
ELEMENT
DYNAMIC
OFFSET
CANCELLATION
TIMING LOGIC
1
OUT
2
GND
Fig.37
4
PIN No.
PIN NAME
FUNCTION
1
OUT
OUTPUT
2
GND
GROUND
3
N.C.
4
VDD
3
3
4
COMMENT
OPEN or Short to GND.
1
2
Surface
POWER SUPPLY
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© 2010 ROHM Co., Ltd. All rights reserved.
11/19
2
1
Reverse
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52012HFV, BU52013HFV
0.1µF
VDD
Adjust the bypass capacitor value as
necessary, according to voltage noise
conditions, etc.
4
TIMING LOGIC
LATCH
SAMPLE
& HOLD
×
The CMOS output terminals enable direct connection to
the PC, with no external pull-up resistor required.
DYNAMIC
OFFSET
CANCELLATION
HALL
ELEMENT
5
2
OUT
GND
Fig.38
PIN No. PIN NAME
1
N.C.
2
GND
FUNCTION
COMMENT
5
4
4
5
1
2
3
Surface
3
2
1
Reverse
OPEN or Short to GND.
GROUND
3
N.C.
4
VDD
POWER SUPPLY
OPEN or Short to GND.
5
OUT
OUTPUT
●Description of Operations
(Micropower Operation)
The unipolar detection Hall IC adopts an intermittent operation
method to save energy. At startup, the Hall elements, amp,
comparator and other detection circuit power ON and magnetic
detection begins. During standby, the detection circuits power
OFF, thereby reducing current consumption. The detection results
are held while standby is active, and then output.
IDD
Period
Startup time
Standby
Reference period: 50ms (MAX100ms)
Reference startup time: 24µs
t
Fig.39
(Offset Cancelation)
VDD
I
B×
＋
Hall Voltage
－
The Hall elements form an equivalent Wheatstone (resistor)
bridge circuit. Offset voltage may be generated by a differential in
this bridge resistance, or can arise from changes in resistance
due to package or bonding stress. A dynamic offset cancellation
circuit is employed to cancel this offset voltage.
When Hall elements are connected as shown in Fig. 40 and a
magnetic field is applied perpendicular to the Hall elements,
voltage is generated at the mid-point terminal of the bridge. This
is known as Hall voltage.
Dynamic cancellation switches the wiring (shown in the figure) to
redirect the current flow to a 90˚ angle from its original path, and
thereby cancels the Hall voltage.
The magnetic signal (only) is maintained in the sample/hold
circuit during the offset cancellation process and then released.
GND
Fig.40
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© 2010 ROHM Co., Ltd. All rights reserved.
12/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
(Magnetic Field Detection Mechanism)
S
N
S
S
N
S
N
Flux
Flux
Fig.41
The Hall IC cannot detect magnetic fields that run horizontal to the package top layer.
Be certain to configure the Hall IC so that the magnetic field is perpendicular to the top layer.
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© 2010 ROHM Co., Ltd. All rights reserved.
13/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
BU52002GUL,BU52012HFV
S-Pole
N
S
N
S
S
N
OUT [V]
Flux
High
Flux
High
High
Low
B
Brp S
0
Magnetic flux density [mT]
N-Pole
Fig.42
Bop S
S-Pole
S-Pole Detection
BU52002GUL, BU52012HFV detects and outputs for the S-pole only. Since it is unipolar, it does not recognize the N-pole.
BU52003GUL, BU52013HFV
N-Pole
N
S
N
S
S
N
OUT [V]
Flux
Flux
High
High
High
Low
B
Bop N
Brp N
N-Pole
0
Magnetic flux density [mT]
Fig.43
S-Pole
N-Pole Detection
BU52003GUL, BU52013HFV detects and outputs for the N-pole only. Since it is unipolar, it does not recognize the S-pole.
The unipolar detection Hall IC detects magnetic fields running perpendicular to the top surface of the package. There is an
inverse relationship between magnetic flux density and the distance separating the magnet and the Hall IC: when distance
increases magnetic density falls. When it drops below the operate point (Bop), output goes HIGH. When the magnet gets
closer to the IC and magnetic density rises, to the operate point, the output switches LOW. In LOW output mode, the
distance from the magnet to the IC increases again until the magnetic density falls to a point just below Bop, and output
returns HIGH. (This point, where magnetic flux density restores HIGH output, is known as the release point, Brp.) This
detection and adjustment mechanism is designed to prevent noise, oscillation and other erratic system operation.
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© 2010 ROHM Co., Ltd. All rights reserved.
14/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Intermittent Operation at Power ON
Power ON
VDD
Startup time
Standby time
Standby time
Startup time
Supply current
(Intermittentaction)
Indefinite
interval
OUT
High
(No magnetic
field present)
Indefinite
interval
OUT
(Magnetic
field present)
Low
Fig.44
The unipolar detection Hall IC adopts an intermittent operation method in detecting the magnetic field during startup, as
shown in Fig.44. It outputs to the appropriate terminal based on the detection result and maintains the output condition
during the standby period. The time from power ON until the end of the initial startup period is an indefinite interval, but it
cannot exceed the maximum period, 100ms. To accommodate the system design, the Hall IC output read should be
programmed within 100ms of power ON, but after the time allowed for the period ambient temperature and supply voltage.
●Magnet Selection
Of the two representative varieties of permanent magnet, neodymium generally offers greater magnetic power per volume
than ferrite, thereby enabling the highest degree of miniaturization, thus, neodymium is best suited for small equipment
applications. Fig.45 shows the relation between the size (volume) of a neodymium magnet and magnetic flux density. The
graph plots the correlation between the distance (L) from three versions of a 4mm X 4mm cross-section neodymium magnet
(1mm, 2mm, and 3mm thick) and magnetic flux density. Fig.46 shows Hall IC detection distance – a good guide for
determining the proper size and detection distance of the magnet. Based on the BU52012HFV, BU52013HFV operating
point max 5.0 mT, the minimum detection distance for the 1mm, 2mm and 3mm magnets would be 7.6mm, 9.22mm, and
10.4mm, respectively. To increase the magnet’s detection distance, either increase its thickness or sectional area.
10
Magnetic flux density[mT]
9
t=3mm
8
7
t=1mm
t=2mm
6
5
4
3
2
1
7.6mm
9.2mm 10.4mm
0
0
2
4
6
8
10
12
14
16
18
20
Distance between magnet and Hall IC [mm]
Fig.45
Magnet material: NEOMAX-44H (material)
Maker: NEOMAX CO.,LTD.
X
t
Y
X=Y=4mm
t=1mm,2mm,3mm
Magnet size
Magnet
t
L: Variable
…Flux density measuring point
Fig.46 Magnet Dimensions and Flux Density Measuring Point
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© 2010 ROHM Co., Ltd. All rights reserved.
15/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Position of the Hall effect IC(Reference)
VCSP50L1
HVSOF5
SSON004X1216
0.6
0.6
0.55
0.55
0.35
0.8
0.8
0.2
0.2
(UNIT: mm)
●Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition)
VCSP50L1
SSON004X1216
Please avoid having potential overstress from
PCB material, strength, mounting positions.
If you had any further questions or concerns,
please contact your Rohm sales and affiliate.
HVSOF5
(UNIT: mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
16/19
2010.08 - Rev.C
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
Technical Note
●Operation Notes
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore
the magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in
the design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
6) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
7) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
8) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same
way, care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
9) Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
10) Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
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© 2010 ROHM Co., Ltd. All rights reserved.
17/19
2010.08 - Rev.C
Technical Note
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
●Ordering part number
B
U
5
Part No.
2
0
0
2
G
Part No.
52002,52003,
52012,52013
U
L
-
Package
GUL : VSCP50L1
HFV : HVSOF5
NVX: SSON004X1216
E
2
Packaging and forming specification
E2: Embossed tape and reel
(VSCP50L1)
TR: Embossed tape and reel
(HVSOF5, SSON004X1216)
VCSP50L1(BU52002GUL)
<Tape and Reel information>
0.55MAX
1.10±0.1
1.10±0.1
0.10±0.05
1PIN MARK
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
S
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.30±0.1
0.08 S
4-φ0.25±0.05
0.05 A B
A
B
A
1
0.30±0.1
2
0.50
0.50
B
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
VCSP50L1(BU52003GUL)
<Tape and Reel information>
1.10±0.1
0.55MAX
1.10±0.1
0.10±0.05
1PIN MARK
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
S
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.30±0.1
0.08 S
4-φ0.25±0.05
0.05 A B
A
B
A
1
0.30±0.1
2
0.50
0.50
B
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
HVSOF5
4
4
(0.91)
5
0.2MAX
(0.3)
(0.05)
1.0±0.05
5
(0.41)
1.6±0.05
(0.8)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
3 2 1
1 2 3
1pin
0.13±0.05
S
+0.03
0.02 −0.02
0.6MAX
1.2±0.05
(MAX 1.28 include BURR)
<Tape and Reel information>
1.6±0.05
0.1
S
0.5
0.22±0.05
0.08
Direction of feed
M
Reel
(Unit : mm)
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© 2010 ROHM Co., Ltd. All rights reserved.
18/19
∗ Order quantity needs to be multiple of the minimum quantity.
2010.08 - Rev.C
BU52002GUL,BU52003GUL,BU52012NVX,BU52012HFV,BU52013HFV
Technical Note
SSON004X1216
<Tape and Reel information>
1.6 ± 0.1
1.2±0.1
Embossed carrier tape
Quantity
5000pcs
Direction
of feed
0.6MAX
1PIN MARK
1
2
4
3
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
0.8 ± 0.1
(0.12)
0.65±0.1
+0.03
0.02 -0.02
S
0.2 ± 0.1
0.08 S
+0.05
0.2 -0.04
Tape
1pin
0.75±0.1
Reel
(Unit : mm)
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
19/19
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2010.08 - Rev.C
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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© 2010 ROHM Co., Ltd. All rights reserved.
R1010A