OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 Dual, Wideband, Voltage-Feedback OPERATIONAL AMPLIFIER with Disable Check for Samples: OPA2690 FEATURES DESCRIPTION • The OPA2690 represents a major step forward in unity-gain stable, voltage-feedback op amps. A new internal architecture provides slew rate and full-power bandwidth previously found only in wideband, current-feedback op amps. A new output stage architecture delivers high currents with a minimal headroom requirement. These give exceptional single-supply operation. Using a single +5V supply, the OPA2690 can deliver a 1V to 4V output swing with over 120mA drive current and 150MHz bandwidth. This combination of features makes the OPA2690 an ideal RGB line driver or single-supply Analog-to-Digital Converter (ADC) input driver. 1 2 • • • • • • FLEXIBLE SUPPLY RANGE: +5V to +12V Single Supply ±2.5V to ±6V Dual Supply WIDEBAND +5V OPERATION: 220MHz (G = 2) HIGH OUTPUT CURRENT: 190mA OUTPUT VOLTAGE SWING: ±4.0V HIGH SLEW RATE: 1800V/ms LOW SUPPLY CURRENT: 5.5mA/ch LOW DISABLE CURRENT: 100mA/ch APPLICATIONS • • • • • • • VIDEO LINE DRIVING xDSL LINE DRIVER/RECEIVER HIGH-SPEED IMAGING CHANNELS ADC BUFFERS PORTABLE INSTRUMENTS TRANSIMPEDANCE AMPLIFIERS ACTIVE FILTERS Single-Supply Differential ADC Driver +5V 100W The low 5.5mA/ch supply current of the OPA2690 is precisely trimmed at +25°C. This trim, along with low temperature drift, provides lower maximum supply current than competing products. System power may be reduced further using the optional disable control pin. Leaving this disable pin open, or holding it HIGH, will operate the OPA2690I-14D normally. If pulled LOW, the OPA2690I-14D supply current drops to less than 200mA/ch while the output goes to a high-impedance state. 2kW OPA2690 RELATED PRODUCTS +2.5V +2.5V 0.1mF +5V 100pF 1/2 OPA2690 2kW REFB 499W REFT 0.1mF 499W 1kW 35W SINGLES DUALS TRIPLES Voltage-Feedback OPA690 OPA2690 OPA3690 Current-Feedback OPA691 OPA2691 OPA3691 Fixed Gain OPA692 — OPA3692 IN 10pF 10-Bit 40MSPS 35W 499W HARMONIC DISTORTION vs FREQUENCY FOR THE SINGLE-SUPPLY ADC DRIVER ADS825 2.5VCM 2VPP VIN -50 10pF 1/2 OPA2690 +2.5V 499W Clock Harmonic Distortion (dBc) 1kW 2VPP Differential Output -55 IN -60 -65 -70 -75 -80 3rd-Harmonic -85 -90 2nd-Harmonic -95 -100 1 10 20 Frequency (MHz) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2010, Texas Instruments Incorporated OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR OPA2690 SO-8 D –40°C to +85°C OPA2690 OPA2690 SO-14 D –40°C to +85°C OPA2690 (1) ORDERING NUMBER TRANSPORT MEDIA, QUANTITY OPA2690ID Rails, 100 OPA2690IDR Tape and Reel, 2500 OPA2690I-14D Rails, 58 OPA2690I-14DR Tape and Reel, 2500 For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. OPA2690 UNIT ±6.5 VDC Power Supply Internal Power Dissipation See Thermal Analysis section Differential Input Voltage ±1.2 Input Voltage Range ±VS V –65 to +125 °C Storage Temperature Range: D Junction Temperature (TJ) ESD Ratings (1) V +150 °C Human Body Model (HBM) 2000 V Charge Device Model (CDM) 1500 V Machine Model (MM) 200 V Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. D PACKAGE SO-8 (TOP VIEW) Out A -In A 1 2 +In A 3 -VS 4 A B D PACKAGE SO-14 (TOP VIEW) 8 +VS 7 Out B 6 -In B 5 +In B 2 -In A 1 14 Out A +In A 2 13 NC DIS A 3 12 NC -VS 4 11 +VS DIS B 5 10 NC +In B 6 9 NC -In B 7 8 Out B Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 ELECTRICAL CHARACTERISTICS: VS = ±5V Boldface limits are tested at +25°C. At RF = 402Ω, RL = 100Ω, and G = +2 (see Figure 36 for ac performance only), unless otherwise noted. OPA2690ID, I-14D MIN/MAX OVER TEMPERATURE TYP PARAMETER +25°C (2) 0°C to +70°C (3) -40°C to +85°C (3) 220 165 160 150 G = +10, VO = 0.5VPP 30 20 19 G ≥ 10 300 200 190 G = +2, VO < 0.5VPP 30 TEST CONDITIONS +25°C G = +1, VO = 0.5VPP, RF = 25Ω 500 G = +2, VO = 0.5VPP MIN/ MAX TEST LEVELS (1) MHz typ C MHz min B 18 MHz min B 180 MHz min B MHz typ C UNIT AC PERFORMANCE (see Figure 36) Small-Signal Bandwidth Gain Bandwidth Product Bandwidth for 0.1dB Gain Flatness Peaking at a Gain of +1 VO < 0.5VPP 4 dB typ C Large-Signal Bandwidth G = +2, VO < 5VPP 200 MHz typ C G = +2, 4V Step 1800 V/ms min B G = +2, VO = 0.5V Step 1.4 ns typ C Slew Rate Rise-and-Fall Time 1400 1200 900 G = +2, VO = 5V Step 2.8 ns typ C Settling Time to 0.02% G = +2, VO = 5V Step 12 ns typ C Settling Time to 0.1% G = +2, VO = 5V Step 8 ns typ C Harmonic Distortion G = +2, f = 5MHz, VO = 2VPP xx x 2nd-Harmonic RL = 100Ω –68 –64 –62 –60 dBc max B RL ≥ 500Ω –77 –70 –68 –66 dBc max B RL = 100Ω –70 –68 –66 –64 dBc max B RL ≥ 500Ω –81 –78 –76 –75 dBc max B f > 1MHz 5.5 nV/√Hz typ C xx x 3rd-Harmonic Input Voltage Noise Input Current Noise f > 1MHz 3.1 pA/√Hz typ C Differential Gain G = +2, NTSC, VO = 1.4VP, RL = 150Ω 0.06 % typ C Differential Phase G = +2, NTSC, VO = 1.4VP, RL = 150Ω 0.03 deg typ C f = 5MHz, Input-Referred –85 dBc typ C Channel-to-Channel Crosstalk DC PERFORMANCE (4) Open-Loop Voltage Gain (AOL) VO = 0V, RL = 100Ω 69 58 56 54 dB min A Input Offset Voltage VCM = 0V ±1.0 ±4.5 ±5.0 ±5.2 mV max A xxx Average Offset Voltage Drift VCM = 0V ±12 ±12 mV/°C max B Input Bias Current VCM = 0V ±12 ±13 mA max A xxx Average Bias Current Drift (magnitude) VCM = 0V ±20 ±40 nA/°C max B Input Offset Current VCM = 0V ±1.4 ±1.6 mA max A xxx Average Offset Current Drift VCM = 0V ±1.0 ±1.5 nA/°C max B +5 ±0.1 ±11 ±1.0 INPUT Common-Mode Input Range (CMIR) (5) ±3.5 ±3.4 ±3.3 ±3.2 V min A VCM = ±1V 65 60 57 56 dB min A xxx Differential Mode VCM = 0V 190 || 0.6 kΩ || pF typ C xxx Common-Mode VCM = 0V 3.2 || 0.9 MΩ || pF typ C Common-Mode Rejection Ratio (CMRR) Input Impedance (1) (2) (3) (4) (5) Test levels: (A) 100% tested at +25°C. Over temperature limits by characterization and simulation. (B) Limits set by characterization and simulation. (C) Typical value only for information. Junction temperature = ambient for +25°C specifications. Junction temperature = ambient at low temperature limits; junction temperature = ambient +15°C at high temperature limit for over temperature specifications. Current is considered positive out of node. VCM is the input common-mode voltage. Tested < 3dB below minimum specified CMRR at ±CMIR limits. 3 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com ELECTRICAL CHARACTERISTICS: VS = ±5V (continued) Boldface limits are tested at +25°C. At RF = 402Ω, RL = 100Ω, and G = +2 (see Figure 36 for ac performance only), unless otherwise noted. OPA2690ID, I-14D MIN/MAX OVER TEMPERATURE TYP PARAMETER TEST CONDITIONS +25°C +25°C (2) 0°C to +70°C (3) -40°C to +85°C (3) UNIT MIN/ MAX TEST LEVELS (1) OUTPUT Voltage Output Swing No Load ±4.0 ±3.8 ±3.7 ±3.6 V min A 100Ω Load ±3.9 ±3.7 ±3.6 ±3.3 V min A Current Output, Sourcing VO = 0V +190 +160 +140 +100 mA min A Current Output, Sinking VO = 0V –190 –160 –140 –100 mA min A Short-Circuit Current VO = 0V ±250 mA typ C G = +2, f = 100kHz 0.04 Ω typ C mA max A ns typ C Closed-Loop Output Impedance DISABLE (SO-14 Only) Power-Down Supply Current (+VS) Disabled LOW VDIS = 0V, Both Channels –200 VIN = 1VDC 200 Enable Time VIN = 1VDC 25 ns typ C Off Isolation G = +2, RL = 150Ω, VIN = 0V 70 dB typ C Output Capacitance in Disable G = +2, RL = 150Ω, VIN = 0V 4 pF typ C Turn-On Glitch ±50 mV typ C Turn-Off Glitch ±20 mV typ C Enable Voltage 3.3 3.5 3.6 3.7 V min A Disable Voltage 1.8 1.7 1.6 1.5 V max A 75 130 150 160 mA max A V typ C ±6.0 ±6.0 ±6.0 V max A Disable Time Control Pin Input BIas Current (VDIS) VDIS = 0V, Each Channel –400 –480 –520 POWER SUPPLY Specified Operating Voltage ±5 Maximum Operating Voltage Range Maximum Quiescent Current (2 Channels) VS = ±5V 11 11.6 12.4 13.2 mA max A Minimum Quiescent Current (2 Channels) VS = ±5V 11 10.6 9.2 8.6 mA min A Input-Referred 75 68 66 64 dB min A –40 to +85 °C typ C xx x D xxx SO-8 125 °C/W typ C xx x D xxx SO-14 100 °C/W typ C Power-Supply Rejection Ratio (+PSRR) THERMAL CHARACTERISTICS Specified Operating Range: D Thermal Resistance, qJA Junction-to-Ambient 4 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 ELECTRICAL CHARACTERISTICS: VS = +5V Boldface limits are tested at +25°C. At RF = 402Ω, RL = 100Ω to VS/2, and G = +2 (see Figure 37 for ac performance only), unless otherwise noted. OPA2690ID, I-14D MIN/MAX OVER TEMPERATURE TYP PARAMETER +25°C (2) 0°C to +70°C (3) -40°C to +85°C (3) 190 150 145 140 G = +10, VO < 0.5VPP 25 18 17 G ≥ 10 250 180 170 G = +2, VO < 0.5VPP 20 TEST CONDITIONS +25°C G = +1, VO = 0.5VPP, RF = ±25Ω 400 G = +2, VO < 0.5VPP MIN/ MAX TEST LEVELS (1) MHz typ C MHz min B 16 MHz min B 160 MHz min B MHz typ C UNIT AC PERFORMANCE (see Figure 37) Small-Signal Bandwidth Gain Bandwidth Product Bandwidth for 0.1dB Gain Flatness Peaking at a Gain of +1 VO < 0.5VPP 5 dB typ C Large-Signal Bandwidth G = +2, VO = 2VPP 220 MHz typ C G = +2, 2V Step 1000 V/ms min B G = +2, VO = 0.5V Step 1.6 ns typ C Slew Rate Rise-and-Fall Time 700 670 550 G = +2, VO = 2V Step 2.0 ns typ C Settling Time to 0.02% G = +2, VO = 2V Step 12 ns typ C Settling Time to 0.1% G = +2, VO = 2V Step 8 ns typ C Harmonic Distortion G = +2, f = 5MHz, VO = 2VPP xx x 2nd-Harmonic RL = 100Ω to VS/2 –65 –60 –59 –56 dBc max B RL ≥ 500Ω to VS/2 –75 –70 –68 –66 dBc max B RL = 100Ω to VS/2 –68 –64 –62 –60 dBc max B RL ≥ 500Ω to VS/2 –77 –73 –71 –70 dBc max B f > 1MHz 5.6 nV/√Hz typ C xx x 3rd-Harmonic Input Voltage Noise Input Current Noise f > 1MHz 3.2 pA/√Hz typ C Differential Gain G = +2, NTSC, VO = 1.4VP, RL = 150Ω to VS/2 0.06 % typ C Differential Phase G = +2, NTSC, VO = 1.4VP, RL = 150Ω to VS/2 0.02 deg typ C DC PERFORMANCE (4) Open-Loop Voltage Gain (AOL) VO = 2.5V, RL = 100Ω to VS/2 63 56 54 52 dB min A Input Offset Voltage VCM = 2.5V ±1.0 ±4.5 ±4.8 ±5.2 mV max A xxx Average Offset Voltage Drift VCM = 2.5V ±10 ±10 mV/°C max B Input Bias Current VCM = 2.5V ±12 ±13 mA max A xxx Average Bias Current Drift (magnitude) VCM = 2.5V ±20 ±40 nA/°C max B Input Offset Current VCM = 2.5V ±1.4 ±1.6 mA max A xxx Average Offset Current Drift VCM = 2.5V ±7 ±9 nA/°C max B +5 ±0.3 ±11 ±1.0 INPUT Least Positive Input Voltage (5) 1.5 1.6 1.7 1.8 V max A Most Positive Input Voltage (5) 3.5 3.4 3.3 3.2 V min A 63 58 56 54 dB min A Common-Mode Rejection Ratio (CMRR) VCM = 2.5V ± 0.5V Input Impedance xxx Differential Mode VCM = 2.5V 92 || 1.4 kΩ || pF typ C xxx Common-Mode VCM = 2.5V 2.2 || 1.5 MΩ || pF typ C (1) (2) (3) (4) (5) Test levels: (A) 100% tested at +25°C. Over temperature limits by characterization and simulation. (B) Limits set by characterization and simulation. (C) Typical value only for information. Junction temperature = ambient for +25°C specifications. Junction temperature = ambient at low temperature limits; junction temperature = ambient +15°C at high temperature limit for over temperature specifications. Current is considered positive out of node. VCM is the input common-mode voltage. Tested < 3dB below minimum specified CMRR at ±CMIR limits. 5 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com ELECTRICAL CHARACTERISTICS: VS = +5V (continued) Boldface limits are tested at +25°C. At RF = 402Ω, RL = 100Ω to VS/2, and G = +2 (see Figure 37 for ac performance only), unless otherwise noted. OPA2690ID, I-14D MIN/MAX OVER TEMPERATURE TYP PARAMETER TEST CONDITIONS +25°C +25°C (2) 0°C to +70°C (3) -40°C to +85°C (3) UNIT MIN/ MAX TEST LEVELS (1) OUTPUT Most Positive Output Voltage No Load 4 3.8 3.6 3.5 V min A RL = 100Ω to 2.5V 3.9 3.7 3.5 3.4 V min A No Load 1 1.2 1.4 1.5 V max A RL = 100Ω to 2.5V 1.1 1.3 1.5 1.7 V max A Current Output, Sourcing +160 +120 +100 +80 mA min A Current Output, Sinking –160 –120 –100 –80 mA min A Short-Circuit Current ±250 mA typ C 0.04 Ω typ C mA max A dB typ C Least Positive Output Voltage Closed-Loop Output Impedance DISABLE (SO-14 only) Power-Down Supply Current (+VS) G = +2, f = 100kHz Disabled LOW VDIS = 0V, Both Channels –200 G = +2, 5MHz 65 4 pF typ C Turn-On Glitch G = +2, RL = 150Ω, VIN = VS/2 ±50 mV typ C Turn-Off Glitch G = +2, RL = 150Ω, VIN = VS/2 ±20 mV typ C Off Isolation Output Capacitance in Disable –400 –480 –520 Enable Voltage 3.3 3.5 3.6 3.7 V min A Disable Voltage 1.8 1.7 1.6 1.5 V max A 75 130 150 160 mA typ B V typ C 12 12 12 V max B A Control Pin Input BIas Current (VDIS) VDIS = 0V, Each Channel POWER SUPPLY Specified Single-Supply Operating Voltage 5 Maximum Single-Supply Operating Voltage Maximum Quiescent Current (2 Channels) VS = +5V 9.8 10.88 11.44 12.1 mA max Minimum Quiescent Current (2 Channels) VS = +5V 9.8 8.96 8.0 7.72 mA min A Input-Referred 72 dB typ C –40 to +85 °C typ C xx x D xxx SO-8 125 °C/W typ C xx x D xxx SO-14 150 °C/W typ C Power-Supply Rejection Ratio (+PSRR) THERMAL CHARACTERISTICS Specification: D Thermal Resistance, qJA Junction-to-Ambient 6 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 TYPICAL CHARACTERISTICS: VS = ±5V At TA = +25°C, G = +2, RF = 402Ω, and RL = 100Ω (see Figure 36 for ac performance only), unless otherwise noted. SMALL−SIGNAL FREQUENCY RESPONSE 9 6 VO = 0.5VPP G = +1 RF = 25W 3 6 0 G=5 -3 -6 VO = 2VPP Gain (3dB/div) Normalized Gain (dB) LARGE−SIGNAL FREQUENCY RESPONSE G=2 G = 10 3 VO = 1VPP 0 VO = 4VPP -9 -3 -12 VO = 7VPP -6 0.5 -15 0.7 1 10 700 100 1 Frequency (MHz) Figure 1. Figure 2. SMALL-SIGNAL PULSE RESPONSE LARGE-SIGNAL PULSE RESPONSE G = +2 VO = 0.5VPP 300 500 G = +2 VO = 5VPP 3 200 Output Voltage (V) Output Voltage (mV) 100 4 400 100 0 -100 -200 2 1 0 -1 -2 -3 -300 -4 -400 Time (5ns/div) Time (5ns/div) Figure 3. Figure 4. COMPOSITE VIDEO dG/dP CHANNEL-TO-CHANNEL CROSSTALK +5V 0.175 75W 1/2 OPA2690 0.150 402W -55 No Pull- Down With 1.3kW Pull-Down Video In -60 -65 Optional 1.3kW Pull- Down Crosstalk (5dB/div) 0.200 dG/dP (%/degree) 10 Frequency (MHz) dG 402W 0.125 dG 0.100 -5V dP 0.075 0.050 -70 -75 -80 -85 -90 dP 0.025 -95 0 -100 1 2 3 4 Input Referred 1 Number of 150W Loads 10 100 Frequency (MHz) Figure 5. Figure 6. 7 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com TYPICAL CHARACTERISTICS: VS = ±5V (continued) At TA = +25°C, G = +2, RF = 402Ω, and RL = 100Ω (see Figure 36 for ac performance only), unless otherwise noted. HARMONIC DISTORTION vs LOAD RESISTANCE 5MHz HARMONIC DISTORTION vs SUPPLY VOLTAGE -60 VO = 2VPP RL = 100W f = 5MHz VO = 2VPP f = 5MHz -65 Harmonic Distortion (dBc) Harmonic Distortion (dBc) -60 -70 2nd-Harmonic -75 3rd-Harmonic -80 -85 -65 2nd-Harmonic -70 3rd-Harmonic -75 -80 -90 2.0 1000 100 2.5 3.0 5.0 HARMONIC DISTORTION vs FREQUENCY HARMONIC DISTORTION vs OUTPUT VOLTAGE 5.5 6.0 -60 RL = 100W f = 5MHz -60 2nd-Harmonic -70 -80 3rd-Harmonic -90 2nd-Harmonic -65 -70 3rd-Harmonic -75 -80 -100 0.1 1 10 0.1 20 5 1 Output Voltage Swing (VPP) Frequency (MHz) Figure 9. Figure 10. HARMONIC DISTORTION vs NONINVERTING GAIN HARMONIC DISTORTION vs INVERTING GAIN -40 -40 VO = 2VPP RL = 100W f = 5MHz -50 Harmonic Distortion (dBc) Harmonic Distortion (dBc) 4.5 Figure 8. VO = 2VPP RL = 100W -50 4.0 Figure 7. Harmonic Distortion (dBc) Harmonic Distortion (dBc) -40 3.5 Supply Voltage (±VS) Load Resistance (W) -60 2nd-Harmonic 3rd-Harmonic -70 -80 VO = 2VPP RL = 100W f = 5MHz RF = 1kW -50 -60 2nd-Harmonic 3rd-Harmonic -70 -80 -90 1 10 20 1 10 20 Inverting Gain (V/V) Noninverting Gain (V/V) Figure 11. Figure 12. 8 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 TYPICAL CHARACTERISTICS: VS = ±5V (continued) At TA = +25°C, G = +2, RF = 402Ω, and RL = 100Ω (see Figure 36 for ac performance only), unless otherwise noted. INPUT VOLTAGE AND CURRENT NOISE DENSITY TWO−TONE, 3RD−ORDER INTERMODULATION SPURIOUS -30 3rd-Order Spurious Level (dBc) Voltage Noise (nV/ÖHz) Current Noise (pA/ÖHz) 100 10 Voltage Noise 5.5nV/ÖHz Current Noise 3.1pA/ÖHz 1 -35 50MHz -40 -45 -50 20MHz -55 -60 -65 10MHz Load Power at Matched 50W Load, see Figure 36 -70 -75 100 1k 10k 100k 1M 10M -8 -6 -4 Frequency (Hz) 0 -2 2 4 Figure 13. Figure 14. RECOMMENDED RS vs CAPACITIVE LOAD FREQUENCY RESPONSE vs CAPACITIVE LOAD 8 10 9 80 G = +2 Gain-to-Capacitive Load (dB) 70 60 RS ( W ) 6 Single-Tone Load Power (dBm) 50 40 30 20 10 CL = 10pF 6 CL = 100pF 3 CL = 22pF 0 CL = 47pF -3 VIN RS 1/2 OPA2690 VOUT 1kW CL 402W -6 402W 1kW is optional. 0 -9 10 1000 100 0 20 40 DISABLE FEEDTHROUGH vs FREQUENCY 2 2.0 Output Voltage 1.6 Each Channel SO-14 Package Only 1.2 0.8 G = +2 VIN = +1V -45 -50 VDIS = 0 -55 Feedthrough (5dB/div) 4 VDIS (2V/div) LARGE-SIGNAL ENABLE/DISABLE RESPONSE 0 Output Voltage (0.4V/div) 100 120 140 160 180 200 Figure 16. VDIS 0 80 Figure 15. 6 0.4 60 Frequency (20MHz/div) Capacitive Load (pF) -60 -65 -70 -75 -80 -85 Reverse -90 -95 Time (50ns/div) -100 100k Forward 1M 10M 100M Frequency (Hz) Figure 17. Figure 18. 9 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com TYPICAL CHARACTERISTICS: VS = ±5V (continued) At TA = +25°C, G = +2, RF = 402Ω, and RL = 100Ω (see Figure 36 for ac performance only), unless otherwise noted. OUTPUT VOLTAGE AND CURRENT LIMITATIONS 1 0 25W Load Line 50W Load Line -1 -2 100W Load Line -3 -4 -5 -300 -200 0 -100 100 200 0.5 Input Offset Current (IOS) 0 0 -0.5 -1.0 -10 Input Offset Voltage (VOS) -20 -2.0 -50 300 -25 0 25 50 75 100 Figure 19. Figure 20. COMMON−MODE REJECTION RATIO AND POWER−SUPPLY REJECTION RATIO vs FREQUENCY SUPPLY AND OUTPUT CURRENTS vs TEMPERATURE 100 14 250 -PSRR 90 Sourcing Output Current 80 Supply Current (2mA/div) Power-Supply Rejection Ratio (dB) Common-Mode Rejection Ratio (dB) 125 Ambient Temperature (°C) IO (mA) CMRR 70 60 +PSRR 50 40 30 20 12 200 Sinking Output Current 10 150 Quiescent Supply Current 8 100 6 50 10 0 4 10k 100k 1M 10M 100M -50 -25 Frequency (MHz) 10 0 25 50 75 Figure 21. Figure 22. CLOSED-LOOP OUTPUT IMPEDANCE vs FREQUENCY OPEN−LOOP GAIN AND PHASE Open-Loop Gain (dB) 1/2 200W OPA2690 ZO -5V 402W 402W 0.1 0.01 0 100k 1M 10M 100M -30 Open-Loop Gain 50 Open-Loop Phase -60 40 -90 30 -120 20 -150 10 -180 0 -210 -10 -240 -20 10k 0 125 70 +5V 1 100 Ambient Temperature (°C) 60 Output Impedance (W) 10 -1.5 1W Internal Power Limit Output Current Limit Input Bias Current (IB) 1.0 1k 10k 100k 1M 10M 100M Open-Loop Phase (°) VO (V) 1.5 One Channel Only 2 20 Output Current (50mA/div) 3 Input Offset Voltage (mV) 4 2.0 Output Current Limited 1W Internal Power Limit Input Bias and Offset Currents (mA) 5 TYPICAL DC DRIFT OVER TEMPERATURE -270 1G Frequency (Hz) Frequency (Hz) Figure 23. Figure 24. 10 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 TYPICAL CHARACTERISTICS: VS = ±5V (continued) At TA = +25°C, G = +2, RF = 402Ω, and RL = 100Ω (see Figure 36 for ac performance only), unless otherwise noted. 5 10 4 8 3 6 2 4 1 Output Voltage 2 0 0 -1 -2 -2 -4 -3 -4 Input Voltage -5 Output Voltage (V) Input Voltage (V) NONINVERTING OVERDRIVE RECOVERY -6 -8 -10 Time (10ns/div) Figure 25. 11 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com TYPICAL CHARACTERISTICS: +5V At TA = +25°C, G = +2, RF = 402Ω, and RL = 100Ω (see Figure 37 for ac performance only), unless otherwise noted. SMALL−SIGNAL FREQUENCY RESPONSE 6 LARGE−SIGNAL FREQUENCY RESPONSE 9 VO = 0.5VPP 3 6 VO = 3VPP G = +2 0 3 G = +5 Gain (dB) Normalized Gain (dB) VO = 2VPP G = +1 RF = 25W -3 VO = 1VPP 0 G = +10 -6 -3 -9 -6 0.7 1 100 10 700 0.5 1 Figure 26. Figure 27. SMALL-SIGNAL PULSE RESPONSE LARGE-SIGNAL PULSE RESPONSE 4.1 G = +2 VO = 0.5VPP 2.8 Output Voltage (mV) 2.7 2.6 2.5 2.4 2.3 G = +2 VO = 2VPP 3.7 2.2 3.3 2.9 2.5 2.1 1.7 1.3 2.1 0.9 Time (5ns/div) Time (5ns/div) Figure 28. Figure 29. RECOMMENDED RS vs CAPACITIVE LOAD FREQUENCY RESPONSE vs CAPACITIVE LOAD 9 50 CL = 10pF Gain-to-Capacitive Load (dB) 45 40 35 RS ( W ) 500 Frequency (MHz) 2.9 Output Voltage (mV) 100 10 Frequency (Hz) 30 25 20 15 10 6 CL = 100pF 3 0 +5V -3 VIN 0.1mF CL = 22pF 714W 1/2 58W 714W 714W OPA2690 RS V OUT CL = 47pF CL -6 402W +5V 5 402W -9 0 1 10 100 1000 0 20 40 60 80 100 120 140 160 180 200 Frequency (20MHz/div) Capacitive Load (pF) Figure 30. Figure 31. 12 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 TYPICAL CHARACTERISTICS: +5V (continued) At TA = +25°C, G = +2, RF = 402Ω, and RL = 100Ω (see Figure 37 for ac performance only), unless otherwise noted. HARMONIC DISTORTION vs LOAD RESISTANCE HARMONIC DISTORTION vs FREQUENCY -40 -60 Harmonic Distortion (dBc) Harmonic Distortion (dBc) VO = 2VPP f = 5MHz -65 -70 2nd-Harmonic 3rd-Harmonic -75 -50 VO = 2VPP RL = 100W to 2.5V -60 2nd-Harmonic -70 -80 3rd-Harmonic -90 -100 -80 1000 100 0.1 1 Figure 32. Figure 33. HARMONIC DISTORTION vs OUTPUT VOLTAGE TWO-TONE, 3RD-ORDER INTERMODULATION SPURIOUS -60 20 -30 -65 3rd-Order Spurious Level (dBc) RL = 100W to 2.5V f = 5MHz Harmonic Distortion (dBc) 10 Frequency (MHz) Resistance ( W ) 3rd-Harmonic -70 2nd-Harmonic -75 -35 50MHz -40 -45 -50 20MHz -55 -60 -65 10MHz -70 Load Power at Matched 50W Load, see Figure 37 -80 -75 0.1 1 3 -14 Output Voltage Swing (VPP) -12 -10 -8 -6 -4 -2 0 2 Single-Tone Load Power (dBm) Figure 34. Figure 35. 13 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com APPLICATION INFORMATION WIDEBAND VOLTAGE-FEEDBACK OPERATION The OPA2690 provides an exceptional combination of high output power capability in a wideband, unity-gain stable voltage-feedback op amp using a new high slew rate input stage. Typical differential input stages used for voltage feedback op amps are designed to steer a fixed-bias current to the compensation capacitor, setting a limit to the achievable slew rate. The OPA2690 uses a new input stage that places the transconductance element between two input buffers, using their output currents as the forward signal. As the error voltage increases across the two inputs, an increasing current is delivered to the compensation capacitor. This provides very high slew rate (1800V/ms) while consuming relatively low quiescent current (5.5mA/ch). This exceptional, full-power performance comes at the price of a slightly higher input noise voltage than alternative architectures. The 5.5nV/√Hz input voltage noise for the OPA2690 is exceptionally low for this type of input stage. Figure 36 shows the dc-coupled, gain of +2, dual power supply circuit configuration used as the basis of the ±5V Electrical Characteristics and Typical Characteristics. This is for one channel; the other channel is connected similarly. For test purposes, the input impedance is set to 50Ω with a resistor to ground and the output impedance is set to 50Ω with a series output resistor. Voltage swings reported in the Electrical Characteristics are taken directly at the input and output pins, while output powers (dBm) are at the matched 50Ω load. For the circuit of Figure 36, the total effective load will be 100Ω || 804Ω. The disable control line (SO-14 package only) is typically left open for normal amplifier operation. Two optional components are included in Figure 36. An additional resistor (175Ω) is included in series with the noninverting input. Combined with the 25Ω dc source resistance looking back towards the signal generator, this gives an input bias current cancelling resistance that matches the 200Ω source resistance seen at the inverting input (see the DC Accuracy and Offset Control section). In addition to the usual power-supply decoupling capacitors to ground, a 0.1mF capacitor is included between the two power-supply pins. In practical printed circuit board (PCB) layouts, this optional-added capacitor will typically improve the 2nd-harmonic distortion performance by 3dB to 6dB. Figure 37 shows the ac-coupled, gain of +2, single-supply circuit configuration used as the basis of the +5V Electrical Characteristics and Typical Characteristics. Though not a rail-to-rail design, the OPA2690 requires minimal input and output voltage headroom compared to other very wideband voltage-feedback op amps. It will deliver a 3VPP output swing on a single +5V supply with > 150MHz bandwidth. The key requirement of broadband single-supply operation is to maintain input and output signal swings within the usable voltage ranges at both the input and the output. The circuit of Figure 37 establishes an input midpoint bias using a simple resistive divider from the +5V supply (two 698Ω resistors). Separate bias networks would be required at each input. The input signal is then ac-coupled into the midpoint voltage bias. The input voltage can swing to within 1.5V of either supply pin, giving a 2VPP input signal range centered between the supply pins. The input impedance matching resistor (59Ω) used for testing is adjusted to give a 50Ω input load when the parallel combination of the biasing divider network is included. +5V +VS 0.1mF 50W Source VI 6.8mF + 175W DIS VD 0.1mF 50W VO 1/2 OPA2690 50W 50W Load RF 402W RG 402W 6.8mF + -VS 0.1mF -5V Figure 36. DC-Coupled, G = +2, Bipolar-Supply Specification and Test Circuit +5V +VS + 0.1mF 6.8mF 698W 0.1mF VI 50W DIS VD 59W 698W 1/2 OPA2690 VO 100W VS/2 RF 402W RG 402W 0.1mF Figure 37. AC-Coupled, G = +2, Single-Supply Specification and Test Circuit 14 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 Again, an additional resistor (50Ω in this case) is included directly in series with the noninverting input. This minimum recommended value provides part of the dc source resistance matching for the noninverting input bias current. It is also used to form a simple parasitic pole to roll off the frequency response at very high frequencies ( > 500MHz) using the input parasitic capacitance. The gain resistor (RG) is ac-coupled, giving the circuit a dc gain of +1, which puts the input dc bias voltage (2.5V) on the output as well. The output voltage can swing to within 1V of either supply pin while delivering > 100mA output current. A demanding 100Ω load to a midpoint bias is used in this characterization circuit. The new output stage circuit used in the OPA2690 can deliver large bipolar output currents into this midpoint load with minimal crossover distortion, as shown in the +5V supply harmonic distortion plots. The OPA2690 in the circuit of Figure 39 provides > 200MHz bandwidth for a 2VPP output swing. Minimal 3rd-harmonic distortion or two-tone, 3rd-order intermodulation distortion will be observed due to the very low crossover distortion in the OPA2690 output stage. The limit of output Spurious-Free Dynamic Range (SFDR) will be set by the 2nd-harmonic distortion. Without RB, the circuit of Figure 39 measured at 10MHz shows an SFDR of 57dBc. This can be improved by pulling additional dc bias current (IB) out of the output stage through the optional RB resistor to ground (the output midpoint is at 2.5V for Figure 39). Adjusting IB gives the improvement in SFDR shown in Figure 38. SFDR improvement is achieved for IB values up to 5mA, with worse performance for higher values. Using the dual OPA2690 in an I/Q receiver channel will give matched ac performance through high frequencies. SINGLE-SUPPLY ADC INTERFACE 70 Most modern, high-performance ADCs (such as the TI ADS8xx and ADS9xx series) operate on a single +5V (or lower) power supply. It has been a considerable challenge for single-supply op amps to deliver a low distortion input signal at the ADC input for signal frequencies exceeding 5MHz. The high slew rate, exceptional output swing, and high linearity of the OPA2690 make it an ideal single-supply ADC driver. The circuit on the front page shows one possible interface particularly suited to differential I/O, ac-coupled requirements. Figure 39 shows the test circuit of Figure 37 modified for a capacitive (ADC) load and with an optional output pull-down resistor (RB). This circuit would be suitable to dual-channel ADC driving with a single-ended I/O. 68 VO = 2VPP, 10MHz 66 SFDR (dBc) 64 62 60 58 56 54 52 50 0 1 2 3 4 5 6 7 8 9 10 Output Pull-Down Current (mA) Figure 38. SFDR vs IB +5V Power- supply decoupling not shown. 698W 0.1mF 50W VI RS 30W 1/2 OPA2690 1VPP 59W 698W 2.5V DC ±1V AC 50pF ADC Input 402W 402W RB 0.1mF IB Figure 39. SFDR versus IB Test Circuit 15 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com HIGH-PERFORMANCE DAC TRANSIMPEDANCE AMPLIFIER 50W 1/2 OPA2690 High-frequency, direct digital synthesis (DDS) digital-to-analog converters (DACs) require a low distortion output amplifier to retain their SFDR performance into real-world loads. Figure 40 shows a single-ended output drive implementation. The diagram shows the signal output current(s) connected into the virtual ground summing junction(s) of the OPA2690, which is set up as a transimpedance stage or I-V converter. If the DAC requires that its outputs terminate to a compliance voltage other than ground for operation, the appropriate voltage level may be applied to the noninverting input of the OPA2690. The dc gain for this circuit is equal to RF. At high frequencies, the DAC output capacitance (CD in Figure 40) will produce a zero in the noise gain for the OPA2690 that may cause peaking in the closed-loop frequency response. CF is added across RF to compensate for this noise gain peaking. To achieve a flat transimpedance frequency response, the pole in each feedback network should be set to: 1 = 2pRFCF which will give approximately: f-3dB = GBP 4pRFCD a cutoff High- Speed DAC f−3dB, GBP 2pRFCD RF1 CF1 IO CD1 RF2 CF2 -IO CD2 1/2 OPA2690 -VO = -IO RF 50W Figure 40. DAC Transimpedance Amplifier WIDEBAND VIDEO MULTIPLEXING (1) frequency, VO = IO RF One common application for video speed amplifiers that include a disable pin is to wire multiple amplifier outputs together, then select which one of several possible video inputs to source onto a single line. This simple wired-OR video multiplexer can be easily implemented using the OP2690I-14D (SO-14 package only), as shown in Figure 6. of (2) Where GBP = gain bandwidth product (Hz) for the OPA2690. +5V 2kW VDIS +5V 146W DISA 1/2 OPA2690 Video 1 75W 340W 402W -5V 75W Cable 340W 402W Video 2 RG-59 75W Load +5V 146W 82.5W 82.5W 1/2 OPA2690 DISB 75W 2kW -5V Figure 41. Two-Channel Video Multiplexer (SO-14 package only) 16 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 Typically, channel switching is performed either on sync or retrace time in the video signal. The two inputs are approximately equal at this time. The make-before-break disable characteristic of the OPA2690 ensures that there is always one amplifier controlling the line when using a wired-OR circuit like that shown in Figure 41. As both inputs may be on for a short period during the transition between channels, the outputs are combined through the output impedance matching resistors (82.5Ω in this case). When one channel is disabled, its feedback network forms part of the output impedance and slightly attenuates the signal in getting out onto the cable. The gain and output matching resistor have been slightly increased to get a signal gain of +1 at the matched load and provide a 75Ω output impedance to the cable. The video multiplexer connection (see Figure 41) also ensures that the maximum differential voltage across the inputs of the unselected channel does not exceed the rated ±1.2V maximum for standard video signal levels. See the Disable Operation section for the turn-on and turn-off switching glitches using a 0V input for a single channel is typically less than ±50mV. Where two outputs are switched (see Figure 41), the output line is always under the control of one amplifier or the other due to the make-before-break disable timing. In this case, the switching glitches for two 0V inputs drops to < 20mV. HIGH-SPEED DELAY CIRCUIT The OPA2690 makes an ideal amplifier for a variety of active filter designs. Shown in Figure 42 is a circuit that uses the two amplifiers within the dual OPA2690 to design a two-stage analog delay circuit. For simplicity, the circuit uses a dual-supply (±5V) operation, but it can also be modified to operate on a signal supply. The input to the first filter stage is driven by the OPA692 wideband buffer amplifier to isolate the signal input from the filter network. Each of the two filter stages is a 1st-order filter with a voltage gain of +1. The delay time through one filter is given by Equation 3: tGR0 = 2RC (3) For a more accurate analysis of the circuit, consider the group delay for the amplifiers. For example, in the case of the OPA2690, the group delay in the bandwidth from 1MHz to 100MHz is approximately 1.0ns. To account for this, modify the transfer function, which now comes out to be: tGR = 2(2RC + tD) (4) Where tD = (1/360) × (df/df) = delay of the op amp itself. The values of resistors RF and RG should be equal and low to avoid parasitic effects. If the all-pass filter is designed for very low delay times, include parasitic board capacitances to calculate the correct delay time. Simulating this application using the PSPICE model of the OPA2690 will allow this design to be tuned to the desired performance. DIFFERENTIAL RECEIVER/DRIVER A very versatile application for a dual operational amplifier is the differential amplifier configuration detailed in Figure 43. With both amplifiers of the OPA2690 connected for noninverting operation, the circuit provides a high input impedance whereas the gain can easily be set by just one resistor, RG. When operated in low gains, the output swing may be limited as a result of the common-mode input swing limits of the amplifier itself. An interesting modification of this circuit is to place a capacitor in series with the RG. Now the dc gain for each side is reduced to +1, whereas the ac gain still follows the standard transfer function of G = 1 + 2RF/RG. This might be advantageous for applications processing only a frequency band that excludes dc or very low frequencies. An input dc voltage resulting from input bias currents is not amplified by the ac gain and can be kept low. This circuit can be used as a differential line receiver, driver, or as an interface to a differential input ADC. C VIN OPA692 1/2 OPA2690 C 1/2 OPA2690 R VOUT R RG 402W RF 402W RG 402W RF 402W Figure 42. Two-Stage, All-Pass Network 17 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com SINGLE-SUPPLY MFB DIFFERENTIAL ACTIVE FILTER: 10MHz BUTTERWORTH CONFIGURATION 50W VI 1/2 OPA2690 RO The active filter circuit shown in Figure 44 can be easily implemented using the OPA2690. In this configuration, each amplifier of the OPA2690 operates as an integrator. For this reason, this type of application is also called infinite gain filter implementation. A Butterworth filter can be implemented using the following component ratios: 1 fO = (cutoff frequency) 2´p´R´C R1 = R2 = 0.65 ´ R R3 = 0.375 ´ R C1 = C C2 = 2 ´ C (5) RF 402W RG 50W VDIFF = 1 + RF 402W 1/2 OPA2690 2RF RG VI - (-VI) RO -VI Figure 43. High-Speed Differential Receiver +12V 6kW 50W VCM 1/2 OPA2690 1000pF 6kW C1A 100pF R3A 60W R1A 102W R2A 102W C2 200pF VIN R2B 102W R1B 102W R3B 60W 50W VOUT C1B 100pF 1/2 OPA2690 VCM Figure 44. Single-Supply, MFB Active Filter, 10MHz LP Butterworth 18 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 The frequency response for a 10MHz Butterworth filter is shown in Figure 45. One advantage for using this type of filter is the independent setting of wo and Q. Q can be easily adjusted by changing the R3A, B resistors without affecting wo. The circuit shown on the front page has a 195MHz, −3dB bandwidth that can be easily bandlimited by using a capacitor in parallel with the feedback resistors. Refer to Figure 46 for more details. The −3dB frequency is given by Equation 6. 1 f-3dB = 2pRFCF (6) 1 0 -1 -2 Gain (dB) Single-Supply Differential ADC Driver), the 2nd-harmonic reacts as expected and drops to a −95dBc at 1MHz and −87dBc at 5MHz—a significant improvement in going to differential from single-ended. -3 -4 -5 -6 9 -7 6 -9 0.1 1 10 20 Frequency (MHz) Figure 45. Multiple Feedback Filter Frequency Response Differential Gain (dB) -8 3 CF = 8.6pF 0 -3 -6 -9 SINGLE-SUPPLY DIFFERENTIAL ADC DRIVER The circuit shown on the front page is ideal for driving high-frequency ADCs. As shown in the plot on the front page (Harmonic Distortion vs Frequency for the -12 0.1 1 10 100 500 Frequency (MHz) Figure 46. Single-Supply Differential ADC Driver For example, CF = 8.6pF in parallel with RF = 402Ω will control the –3dB frequency to 18MHz. 19 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com DESIGN-IN TOOLS DEMONSTRATION FIXTURES MACROMODELS Two printed circuit boards (PCBs) are available to assist in the initial evaluation of circuit performance using the OPA2690 in its two package options. Both of these are offered free of charge as unpopulated PCBs, delivered with a user’s guide. The summary information for these fixtures is shown in Table 1. Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. This is particularly true for video and RF amplifier circuits where parasitic capacitance and inductance can have a major effect on circuit performance. A SPICE model for the OPA2690 (use two OPA690 SPICE models) is available through the OPA2690 product folder under Simulation Models. These models do a good job of predicting small-signal ac and transient performance under a wide variety of operating conditions. They do not do as well in predicting the harmonic distortion or dG/dP characteristics. These models do not attempt to distinguish between the package types in their small-signal ac performance. Table 1. Demonstration Fixtures by Package PRODUCT PACKAGE ORDERING NUMBER LITERATURE NUMBER OPA2690ID SO-8 DEM-OPA-SO-2A SBOU003 OPA2690I14D SO-14 DEM-OPA-SO-2D SBOU002 The demonstration fixtures can be requested at the Texas Instruments web site (www.ti.com) through the OPA2690 product folder. 20 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 OPERATING SUGGESTIONS OPTIMIZING RESISTOR VALUES As the the OPA2690 is a unity-gain stable, voltage-feedback op amp, a wide range of resistor values may be used for the feedback and gain setting resistors. The primary limits on these values are set by dynamic range (noise and distortion) and parasitic capacitance considerations. For a noninverting unity-gain follower application, the feedback connection should be made with a 25Ω resistor, not a direct short. This will isolate the inverting input capacitance from the output pin and improve the frequency response flatness. Usually, the feedback resistor value should be between 200Ω and 1.5kΩ. Below 200Ω, the feedback network will present additional output loading which can degrade the harmonic distortion performance of the OPA2690. Above 1.5kΩ, the typical parasitic capacitance (approximately 0.2pF) across the feedback resistor can cause unintentional band-limiting in the amplifier response. A good rule of thumb is to target the parallel combination of RF and RG (see Figure 36) to be less than approximately 300Ω. The combined impedance RF || RG interacts with the inverting input capacitance, placing an additional pole in the feedback network and thus, a zero in the forward response. Assuming a 2pF total parasitic on the inverting node, holding RF || RG < 300Ω will keep this pole above 250MHz. By itself, this constraint implies that feedback resistor RF can increase to several kΩ at high gains. This is acceptable as long as the pole formed by RF and any parasitic capacitance appearing in parallel is kept out of the frequency range of interest. BANDWIDTH vs GAIN: NONINVERTING OPERATION Voltage-feedback op amps exhibit decreasing closed-loop bandwidth as the signal gain is increased. In theory, this relationship is described by the Gain Bandwidth Product (GBP) shown in the Electrical Characteristics. Ideally, dividing GBP by the noninverting signal gain (also called the Noise Gain, or NG) will predict the closed-loop bandwidth. In practice, this only holds true when the phase margin approaches 90°, as it does in high gain configurations. At low gains (increased feedback factors), most amplifiers will exhibit a more complex response with lower phase margin. The OPA2690 is compensated to give a slightly peaked response in a noninverting gain of 2 (see Figure 36). This results in a typical gain of +2 bandwidth of 220MHz, far exceeding that predicted by dividing the 300MHz GBP by 2. Increasing the gain will cause the phase margin to approach 90° and the bandwidth to more closely approach the predicted value of (GBP/NG). At a gain of +10, the 30MHz bandwidth shown in the Electrical Characteristics agrees with that predicted using the simple formula and the typical GBP of 300MHz. The frequency response in a gain of +2 may be modified to achieve exceptional flatness simply by increasing the noise gain to 2.5. One way to do this, without affecting the +2 signal gain, is to add an 804Ω resistor across the two inputs in the circuit of Figure 36. A similar technique may be used to reduce peaking in unity-gain (voltage follower) applications. For example, by using a 402Ω feedback resistor along with a 402Ω resistor across the two op amp inputs, the voltage follower response will be similar to the gain of +2 response of Figure 37. Reducing the value of the resistor across the op amp inputs will further limit the frequency response due to increased noise gain. The OPA2690 exhibits minimal bandwidth reduction going to single-supply (+5V) operation as compared with ±5V. This is because the internal bias control circuitry retains nearly constant quiescent current as the total supply voltage between the supply pins is changed. 21 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com INVERTING AMPLIFIER OPERATION Since the OPA2690 is a general-purpose, wideband voltage-feedback op amp, all of the familiar op amp application circuits are available to the designer. Inverting operation is one of the more common requirements and offers several performance benefits. Figure 47 shows a typical inverting configuration where the I/O impedances and signal gain from Figure 36 are retained in an inverting circuit configuration. +5V + 0.1mF 6.8mF 0.1mF RB 146W 50W Source VO 1/2 OPA2690 RO 50W 50W Load RG 200W VO = -2 VI RF 402W VI RM 67W 0.1mF + 6.8mF -5V Figure 47. Gain of –2 Example Circuit In the inverting configuration, three key design considerations must be noted. The first is that the gain resistor (RG) becomes part of the signal channel input impedance. If input impedance matching is desired (which is beneficial whenever the signal is coupled through a cable, twisted-pair, long PCB trace, or other transmission line conductor), RG may be set equal to the required termination value and RF adjusted to give the desired gain. This is the simplest approach and results in optimum bandwidth and noise performance. However, at low inverting gains, the resultant feedback resistor value can present a significant load to the amplifier output. For an inverting gain of –2, setting RG to 50Ω for input matching eliminates the need for RM but requires a 100Ω feedback resistor. This has the interesting advantage that the noise gain becomes equal to 2 for a 50Ω source impedance—the same as the noninverting circuits considered in the previous section. The amplifier output, however, will now see the 100Ω feedback resistor in parallel with the external load. In general, the feedback resistor should be limited to the 200Ω to 1.5kΩ range. In this case, it is preferable to increase both the RF and RG values, as shown in Figure 47, and then achieve the input matching impedance with a third resistor (RM) to ground. The total input impedance becomes the parallel combination of RG and RM. The second major consideration, touched on in the previous paragraph, is that the signal source impedance becomes part of the noise gain equation and influences the bandwidth. For the example in Figure 47, the RM value combines in parallel with the external 50Ω source impedance, yielding an effective driving impedance of 50Ω || 67Ω = 28.6Ω. This impedance is added in series with RG for calculating the noise gain (NG). The resultant NG is 2.8 for Figure 47, as opposed to only 2 if RM could be eliminated as discussed above. The bandwidth will therefore be slightly lower for the gain of –2 circuit of Figure 47 than for the gain of +2 circuit of Figure 36. The third important consideration in inverting amplifier design is setting the bias current cancellation resistor on the noninverting input (RB). If this resistor is set equal to the total dc resistance looking out of the inverting node, the output dc error, due to the input bias currents, will be reduced to (Input Offset Current) × RF. If the 50Ω source impedance is dc-coupled in Figure 47, the total resistance to ground on the inverting input will be 228Ω. Combining this in parallel with the feedback resistor gives the RB = 146Ω used in this example. To reduce the additional high-frequency noise introduced by this resistor, it is sometimes bypassed with a capacitor. As long as RB < 350Ω, the capacitor is not required because the total noise contribution of all other terms will be less than that of the op amp input noise voltage. As a minimum, the OPA2690 requires an RB value of 50Ω to damp out parasitic-induced peaking—a direct short to ground on the noninverting input runs the risk of a very high-frequency instability in the input stage. 22 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 OUTPUT CURRENT AND VOLTAGE The OPA2690 provides output voltage and current capabilities in a low-cost monolithic op amp. Under no-load conditions at +25°C, the output voltage typically swings closer than 1V to either supply rail; the specified swing limit is within 1.2V of either rail. Into a 15Ω load (the minimum tested load), it will deliver more than ±160mA. The specifications described previously, though familiar in the industry, consider voltage and current limits separately. In many applications, it is the voltage × current, or V-I product, that is more relevant to circuit operation. Refer to Figure 19, the Output Voltage and Current Limitations plot in the Typical Characteristics. The X- and Y-axes of this graph show the zero-voltage output current limit and the zero-current output voltage limit, respectively. The four quadrants give a more detailed view of the OPA2690 output drive capabilities, noting that the graph is bounded by a Safe Operating Area of 1W maximum internal power dissipation for each channel separately. Superimposing resistor load lines onto the plot shows that the OPA2690 can drive ±2.5V into 25Ω or ±3.5V into 50Ω without exceeding the output capabilities or the 1W dissipation limit. A 100Ω load line (the standard test circuit load) shows the full ±3.9V output swing capability (see the Electrical Characteristics). The minimum specified output voltage and current specifications over temperature are set by worst-case simulations at the cold temperature extreme. Only at cold startup will the output current and voltage decrease to the numbers shown in the Electrical Characteristic tables. As the output transistors deliver power, their junction temperatures increase, decreasing their VBEs (increasing the available output voltage swing) and increasing their current gains (increasing the available output current). In steady-state operation, the available output voltage and current is always greater than that shown in the over-temperature specifications because the output stage junction temperatures will be higher than the minimum specified operating ambient. To protect the output stage from accidental shorts to ground and the power supplies, output short-circuit protection is included in the OPA2690. The circuit acts to limit the maximum source or sink current to approximately 250mA. OPA2690 can be very susceptible to decreased stability and closed-loop response peaking when a capacitive load is placed directly on the output pin. When the amplifier's open-loop output resistance is considered, this capacitive load introduces an additional pole in the signal path that can decrease the phase margin. Several external solutions to this problem have been suggested. When the primary considerations are frequency response flatness, pulse response fidelity, and/or distortion, the simplest and most effective solution is to isolate the capacitive load from the feedback loop by inserting a series-isolation resistor between the amplifier output and the capacitive load. This does not eliminate the pole from the loop response, but rather shifts it and adds a zero at a higher frequency. The additional zero acts to cancel the phase lag from the capacitive load pole, thus increasing the phase margin and improving stability. The Typical Characteristics show the recommended RS versus capacitive load (Figure 15 for ±5V and Figure 30 for +5V) and the resulting frequency response at the load. Parasitic capacitive loads greater than 2pF can begin to degrade the performance of the OPA2690. Long PCB traces, unmatched cables, and connections to multiple devices can easily exceed this value. Always consider this effect carefully, and add the recommended series resistor as close as possible to the OPA2690 output pin (see the Board Layout Guidelines section). The criterion for setting this RS resistor is a maximum bandwidth, flat frequency response at the load. For the OPA2690 operating in a gain of +2, the frequency response at the output pin is already slightly peaked without the capacitive load requiring relatively high values of RS to flatten the response at the load. Increasing the noise gain will reduce the peaking as described previously. The circuit of Figure 48 demonstrates this technique, allowing lower values of RS to be used for a given capacitive load. +5V 50W 175W 50W RNG Power-supply decoupling not shown. 1/2 OPA2690 402W R VO CLOAD DRIVING CAPACITIVE LOADS One of the most demanding and yet very common load conditions for an op amp is capacitive loading. Often, the capacitive load is the input of an ADC—including additional external capacitance which may be recommended to improve ADC linearity. A high-speed, high open-loop gain amplifier like the 402W -5V Figure 48. Capacitive Load Driving with Noise Gain Tuning 23 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com This gain of +2 circuit includes a noise gain tuning resistor across the two inputs to increase the noise gain, increasing the unloaded phase margin for the op amp. Although this technique will reduce the required RS resistor for a given capacitive load, it does increase the noise at the output. It also will decrease the loop gain, slightly decreasing the distortion performance. If, however, the dominant distortion mechanism arises from a high RS value, significant dynamic range improvement can be achieved using this technique. Figure 49 shows the required RS versus CLOAD parametric on noise gain using this technique. This is the circuit of Figure 48 with RNG adjusted to increase the noise gain (increasing the phase margin) then sweeping CLOAD and finding the required RS to get a flat frequency response. This plot also gives the required RS versus CLOAD for the OPA2690 operated at higher signal gains without RNG. 100 90 80 RS (W) 70 NG = 2 In most op amps, increasing the output voltage swing increases harmonic distortion directly. The new output stage used in the OPA2690 actually holds the difference between fundamental power and the 2ndand 3rd-harmonic powers relatively constant with increasing output power until very large output swings are required ( > 4VPP). This also shows up in the 2-tone, 3rd-order intermodulation spurious (IM3) response curves. The 3rd-order spurious levels are moderately low at low output power levels. The output stage continues to hold them low even as the fundamental power reaches very high levels. As the Typical Characteristics show, the spurious intermodulation powers do not increase as predicted by a traditional intercept model. As the fundamental power level increases, the dynamic range does not decrease significantly. For two tones centered at 20MHz, with 10dBm/tone into a matched 50Ω load (that is, 2VPP for each tone at the load, which requires 8VPP for the overall two-tone envelope at the output pin), the Typical Characteristics show 46dBc difference between the test tone powers and the 3rd-order intermodulation spurious powers. This exceptional performance improves further when operating at lower frequencies or powers. 60 50 NOISE PERFORMANCE 40 30 20 NG = 3 10 NG = 4 0 1 10 100 1000 Capacitive Load (pF) Figure 49. Required RS vs Noise Gain DISTORTION PERFORMANCE The OPA2690 provides good distortion performance into a 100Ω load on ±5V supplies. Relative to alternative solutions, it provides exceptional performance into lighter loads and/or operating on a single +5V supply. Generally, until the fundamental signal reaches very high frequency or power levels, the 2nd-harmonic dominates the distortion with a negligible 3rd-harmonic component. Focusing then on the 2nd-harmonic, increasing the load impedance improves distortion directly. Remember that the total load includes the feedback network; in the noninverting configuration (see Figure 36), this is sum of RF + RG, while in the inverting configuration it is just RF. Also, providing an additional supply-decoupling capacitor (0.1mF) between the supply pins (for bipolar operation) improves the 2nd-order distortion slightly (3dB to 6dB). Operating differentially also lowers 2nd-harmonic distortion terms (see the plot on the front page). High slew rate, unity-gain stable, voltage-feedback op amps usually achieve their slew rate at the expense of a higher input noise voltage. The 5.5nV/√Hz input voltage noise for the OPA2690 is, however, much lower than comparable amplifiers. The input-referred voltage noise, and the two input-referred current noise terms, combine to give low output noise under a wide variety of operating conditions. Figure 50 shows the op amp noise analysis model with all the noise terms included. In this model, all noise terms are taken to be noise voltage or current density terms in either nV/√Hz or pA/√Hz. ENI 1/2 OPA2690 RS EO IBN ERS RF Ö 4kTRS 4kT RG RG IBI Ö 4kTRF 4kT = 1.6E - 20J at 290°K Figure 50. Op Amp Noise Analysis Model 24 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 The total output spot noise voltage can be computed as the square root of the sum of all squared output noise voltage contributors. Equation 7 shows the general form for the output noise voltage using the terms shown in Figure 50. EO = ENI2 2 2 2 + (IBNRS) + 4kTRS NG + (IBIRF) + 4kTRFNG (7) Dividing this expression by the noise gain [NG = (1 + RF/RG)] will give the equivalent input-referred spot noise voltage at the noninverting input, as shown in Equation 8. EN = ENI2 + (IBNRS)2 + 4kTRS + IBIRF NG 2 + 4kTRF NG (8) Evaluating these two equations for the OPA2690 circuit and component values (see Figure 36) gives a total output spot noise voltage of 12.3nV/√Hz and a total equivalent input spot noise voltage of 6.1nV/√Hz. This is including the noise added by the bias current cancellation resistor (175Ω) on the noninverting input. This total input-referred spot noise voltage is only slightly higher than the 5.5nV/√Hz specification for the op amp voltage noise alone. This will be the case as long as the impedances appearing at each op amp input are limited to the previously recommend maximum value of 300Ω. Keeping both (RF || RG) and the noninverting input source impedance less than 300Ω will satisfy both noise and frequency response flatness considerations. As the resistor-induced noise is relatively negligible, additional capacitive decoupling across the bias current cancellation resistor (RB) for the inverting op amp configuration of Figure 47 is not required. ±(NG × VOS(MAX)) ± (RF × IOS(MAX)) = ±(2 × 4.5mV) ± (402Ω × 1mA) = ±9.4mV – (NG = noninverting signal gain) A fine-scale output offset null, or dc operating point adjustment, is often required. Numerous techniques are available for introducing dc offset control into an op amp circuit. Most of these techniques eventually reduce to adding a dc current through the feedback resistor. In selecting an offset trim method, one key consideration is the impact on the desired signal path frequency response. If the signal path is intended to be noninverting, the offset control is best applied as an inverting summing signal to avoid interaction with the signal source. If the signal path is intended to be inverting, applying the offset control to the noninverting input may be considered. However, the dc offset voltage on the summing junction will set up a dc current back into the source that must be considered. Applying an offset adjustment to the inverting op amp input can change the noise gain and frequency response flatness. For a dc-coupled inverting amplifier, Figure 51 shows one example of an offset adjustment technique that has minimal impact on the signal frequency response. In this case, the dc offsetting current is brought into the inverting input node through resistor values that are much larger than the signal path resistors. This ensures that the adjustment circuit has minimal effect on the loop gain and hence, the frequency response. +5V Power-supply decoupling not shown. 328W 0.1mF 1/2 OPA2690 VO DC ACCURACY AND OFFSET CONTROL The balanced input stage of a wideband voltage-feedback op amp allows good output dc accuracy in a wide variety of applications. The power-supply current trim for the OPA2690 gives even tighter control than comparable amplifiers. Although the high-speed input stage does require relatively high input bias current (typically 5mA out of each input terminal), the close matching between them may be used to reduce the output dc error caused by this current. The total output offset voltage may be considerably reduced by matching the dc source resistances appearing at the two inputs. This reduces the output dc error due to the input bias currents to the offset current times the feedback resistor. Evaluating the configuration of Figure 36, and using worst-case +25°C input offset voltage and current specifications, gives a worst-case output offset voltage equal to: BLANKSPACE BLANKSPACE -5V RG 500W +5V 5kW RF 1kW VI 20kW ±200mV Output Adjustment 10kW 0.1mF 5kW VO VI =- RF RG = -2 -5V Figure 51. DC-Coupled, Inverting Gain of -2, with Offset Adjustment 25 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com DISABLE OPERATION (SO-14 Package Only) The OPA2690-I-14D provides an optional disable feature that may be used either to reduce system power or to implement a simple channel multiplexing operation. If the DIS control pin is left unconnected, the OPA2690I-14D will operate normally. To disable, the control pin must be asserted LOW. Figure 52 shows a simplified internal circuit for the disable control feature. One key parameter in disable operation is the output glitch when switching in and out of the disabled mode. Figure 53 shows these glitches for the circuit of Figure 36 with the input signal at 0V. The glitch waveform at the output pin is plotted along with the DIS pin voltage. 15kW Q1 VDIS 110kW IS Control -VS Figure 52. Simplified Disable Control Circuit The transition edge rate (dV/dt) of the DIS control line will influence this glitch. For the plot of Figure 53, the edge rate was reduced until no further reduction in glitch amplitude was observed. This approximately 1V/ns maximum slew rate may be achieved by adding a simple RC filter into the DIS pin from a higher speed logic line. If extremely fast transition logic is used, a 2kΩ series resistor between the logic gate and the DIS input pin provides adequate bandlimiting using just the parasitic input capacitance on the DIS pin while still ensuring adequate logic level swing. 6 4 VDIS 2 0 Output Voltage (10mV/div) In normal operation, base current to Q1 is provided through the 110kΩ resistor, while the emitter current through the 15kΩ resistor sets up a voltage drop that is inadequate to turn on the two diodes in Q1's emitter. As VDIS is pulled LOW, additional current is pulled through the 15kΩ resistor, eventually turning on those two diodes (≈100mA). At this point, any further current pulled out of VDIS goes through those diodes holding the emitter-base voltage of Q1 at approximately 0V. This shuts off the collector current out of Q1, turning the amplifier off. The supply current in the disable mode are only those required to operate the circuit of Figure 52. Additional circuitry ensures that turn-on time occurs faster than turn-off time (make-before-break). VDIS (2V/div) +VS 25kW the output and exceptional signal isolation. If operating at a gain greater than +1, the total feedback network resistance (RF + RG) will appear as the impedance looking back into the output, but the circuit will still show very high forward and reverse isolation. If configured as an inverting amplifier, the input and output will be connected through the feedback network resistance (RF + RG) and the isolation will be very poor as a result. 30 20 10 Output Voltage 0 VI = 0V -10 -20 -30 Time (20ns/div) Figure 53. Disable/Enable Glitch When disabled, the output and input nodes go to a high-impedance state. If the OPA2690 is operating at a gain of +1, this will show a very high impedance at 26 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 THERMAL ANALYSIS Due to the high output power capability of the OPA2690, heatsinking or forced airflow may be required under extreme operating conditions. Maximum desired junction temperature will set the maximum allowed internal power dissipation as described below. In no case should the maximum junction temperature be allowed to exceed 150°C. Note that it is the power in the output stage and not into the load that determines internal power dissipation. As a worst-case example, compute the maximum TJ using an OPA2690ID (SO-8 package) in the circuit of Figure 36 operating at the maximum specified ambient temperature of +85°C and with both outputs driving a grounded 20Ω load to +2.5V. Operating junction temperature (TJ) is given by: TA + PD × qJA PD = 10V × 12.6mA + 2 [52/(4 × (20Ω || 804Ω)) The total internal power dissipation (PD) is the sum of quiescent power (PDQ) and additional power dissipated in the output stage (PDL) to deliver load power. Quiescent power is simply the specified no-load supply current times the total supply voltage across the part. PDL depends on the required output signal and load but, for a grounded resistive load, is at a maximum when the output is fixed at a voltage equal to 1/2 of either supply voltage (for equal bipolar supplies). Under this condition, PDL = VS2/(4 × RL) where RL includes feedback network loading. Maximum TJ = +85°C + (0.766W × 125°C/W) PD = 766mW PD = 180°C This absolute worst-case condition exceeds the specified maximum junction temperature. Actual PDL is normally less than that considered here. Carefully consider maximum TJ in your application. 27 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com BOARD LAYOUT GUIDELINES Achieving optimum performance with a high-frequency amplifier like the OPA2690 requires careful attention to board layout parasitics and external component types. Recommendations that will optimize performance include: a. Minimize parasitic capacitance to any ac ground for all of the signal I/O pins. Parasitic capacitance on the output and inverting input pins can cause instability: on the noninverting input, it can react with the source impedance to cause unintentional bandlimiting. To reduce unwanted capacitance, a window around the signal I/O pins should be opened in all of the ground and power planes around those pins. Otherwise, ground and power planes should be unbroken elsewhere on the board. b. Minimize the distance (< 0.25") from the power-supply pins to high-frequency 0.1mF decoupling capacitors. At the device pins, the ground and power-plane layout should not be in close proximity to the signal I/O pins. Avoid narrow power and ground traces to minimize inductance between the pins and the decoupling capacitors. The power-supply connections should always be decoupled with these capacitors. An optional supply decoupling capacitor (0.1mF) across the two power supplies (for bipolar operation) will improve 2nd-harmonic distortion performance. Larger (2.2mF to 6.8mF) decoupling capacitors, effective at lower frequencies, should also be used on the main supply pins. These may be placed somewhat farther from the device and may be shared among several devices in the same area of the PCB. c. Careful selection and placement of external components will preserve the high-frequency performance of the OPA2690. Resistors should be a very low reactance type. Surface-mount resistors work best and allow a tighter overall layout. Metal film or carbon composition axially-leaded resistors can also provide good high-frequency performance. Again, keep their leads and PCB traces as short as possible. Never use wirewound type resistors in a high-frequency application. Since the output pin and inverting input pin are the most sensitive to parasitic capacitance, always position the feedback and series output resistor, if any, as close as possible to the output pin. Other network components, such as noninverting input termination resistors, should also be placed close to the package. Even with a low parasitic capacitance shunting the external resistors, excessively high resistor values can create significant time constants that can degrade performance. Good axial metal film or surface-mount resistors have approximately 0.2pF in shunt with the resistor. For resistor values > 1.5kΩ, this parasitic capacitance can add a pole and/or zero below 500MHz that can affect circuit operation. Keep resistor values as low as possible consistent with load driving considerations. The 402Ω feedback used in the Electrical Characteristics is a good starting point for design. Note that a 25Ω feedback resistor, rather than a direct short, is suggested for the unity-gain follower application. This effectively isolates the inverting input capacitance from the output pin that would otherwise cause an additional peaking in the gain of +1 frequency response. d. Connections to other wideband devices on the board may be made with short, direct traces or through onboard transmission lines. For short connections, consider the trace and the input to the next device as a lumped capacitive load. Relatively wide traces (50mils or 1,27mm to 100mils or 2,54mm) should be used, preferably with ground and power planes opened up around them. Estimate the total capacitive load and set RS from the plot of Recommended RS vs Capacitive Load (Figure 15 for ±5V and Figure 30 for +5V). Low parasitic capacitive loads (< 3pF) may not need an RS because the OPA2690 is nominally compensated to operate with a 2pF parasitic load. Higher parasitic capacitive loads without an RS are allowed as the signal gain increases (increasing the unloaded phase margin; see Figure 49). If a long trace is required, and the 6dB signal loss intrinsic to a doubly-terminated transmission line is acceptable, implement a matched impedance transmission line using microstrip or stripline techniques (consult an ECL design handbook for microstrip and stripline layout techniques). A 50Ω environment is normally not necessary on board, and in fact, a higher impedance environment will improve distortion as shown in the distortion versus load plots (Figure 7 for the ±5v and Figure 32 for the +5V). With a characteristic board trace impedance defined (based on board material and trace dimensions), a matching series resistor into the trace from the output of the OPA2690 is used as well as a terminating shunt resistor at the input of the destination device. Remember also that the terminating impedance will be the parallel combination of the shunt resistor and the input impedance of the destination device; this total effective impedance should be set to match the trace impedance. The high output voltage and current capability of the OPA2690 allows multiple destination devices to be handled as separate transmission lines, each with their own series and shunt terminations. If 28 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 www.ti.com SBOS238G – JUNE 2002 – REVISED MARCH 2010 the 6dB attenuation of a doubly-terminated transmission line is unacceptable, a long trace can be series-terminated at the source end only. Treat the trace as a capacitive load in this case and set the series resistor value as shown in the plots of Recommended RS vs Capacitive Load (Figure 15 for ±5V and Figure 30 for +5V). This will not preserve signal integrity as well as a doubly-terminated line. If the input impedance of the destination device is low, there will be some signal attenuation due to the voltage divider formed by the series output into the terminating impedance. e. Socketing a high-speed part like the OPA2690 is not recommended. The additional lead length and pin-to-pin capacitance introduced by the socket can create an extremely troublesome parasitic network which can make it almost impossible to achieve a smooth, stable frequency response. Best results are obtained by soldering the OPA2690 onto the board. INPUT AND ESD PROTECTION The OPA2690 is built using a very high-speed complementary bipolar process. The internal junction breakdown voltages are relatively low for these very small geometry devices. These breakdowns are reflected in the Absolute Maximum Ratings table. All device pins are protected with internal ESD protection diodes to the power supplies, as shown in Figure 54. +VCC External Pin Internal Circuitry -VCC Figure 54. Internal ESD Protection These diodes provide moderate protection to input overdrive voltages above the supplies as well. The protection diodes can typically support 30mA continuous current. Where higher currents are possible (for example, in systems with ±15V supply parts driving into the OPA2690), current-limiting series resistors should be added into the two inputs. Keep these resistor values as low as possible since high values degrade both noise performance and frequency response. 29 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 OPA2690 SBOS238G – JUNE 2002 – REVISED MARCH 2010 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (August 2008) to Revision G Page • Changed data sheet format to current standards ................................................................................................................. 1 • Changed Related Products table .......................................................................................................................................... 1 • Deleted Lead Temperature specification from Absolute Maximum Ratings table ................................................................ 2 • Changed test levels for Slew Rate, 2nd-Harmonic, and Channel-to-Channel Crosstalk parameters .................................. 3 • Changed test level for Control Pin Input Bias Current parameter ........................................................................................ 5 • Changed circuit within Figure 5 ............................................................................................................................................ 7 • Added Figure 25, Noninverting Overdrive Recovery graph ................................................................................................ 11 • Changed VO to VI in Figure 53 ............................................................................................................................................ 26 Changes from Revision E (May 2006) to Revision F • Page Changed Storage Temperature minimum value from −40°C to −65°C ................................................................................ 2 30 Copyright © 2002–2010, Texas Instruments Incorporated Product Folder Link(s): OPA2690 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPA2690I-14D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA2690 OPA2690I-14DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA2690 OPA2690I-14DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA2690 OPA2690ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2690 OPA2690IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2690 OPA2690IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2690 OPA2690IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 OPA 2690 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant OPA2690I-14DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 OPA2690IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2690I-14DR SOIC D 14 2500 367.0 367.0 38.0 OPA2690IDR SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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