Seoul HYT722 Top led device Datasheet

Z-Power LED
X10490
Technical
Data
Sheet
Specification
HYT722
SSC
Drawn
Approval
CUSTOMER
Approval
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1. Feature & Application
2.
Absolute Maximum Ratings
3. Electro Characteristics
4. Optical characteristics
5. Rank of HYT722
6. Outline Dimension
7. Packing
8. Lot number
9. Soldering
10. Precaution for use
Z-Power LED
X10490
Technical
Data
Sheet
HYT722
Description
This surface-mount LED comes
in PLCC standard package
dimension. It has a substrate
made up of a molded plastic
reflector sitting on top of a bent
lead frame. The die is attached
within the reflector cavity and
the cavity is encapsulated by
epoxy or silicone.
The package design coupled
with careful selection of
component materials allow these
products to perform with high
reliability in a larger
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
HYT722
Features
•
White colored SMT
package.
• Material : AlInGaP
• Encapsulating Resin :
Epoxy Resin
• Suitable for all SMT
assembly methods ;
Suitable for all
soldering methods
• RoHS Compliant
Applications
• Interior automotive
• Office Automation,
Electrical Appliances,
Industrial Equipment
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
252
mW
Forward Current
IF
90
mA
100
mA
Peak Forward Current
IFM
*2
Reverse Voltage (per die)
VR
5
V
Operating Temperature
Topr
-40 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric & Optical characteristics
Sym
bol
Condition
Min
Typ
Max
Unit
Forward Voltage (per die)
VF
IF =20 mA
1.6
2.2
2.8
V
Reverse Current (per die)
IR
VR=5V
-
-
10
µA
IV
IF =60 mA
950
1400
1700
mcd
Luminance Flux
ΦV
IF =60 mA
-
4
-
lm
Dominant Wavelength
λd
IF =60 mA
582
590
598
nm
Peak Wavelength
λP
IF =60mA
-
593
-
nm
∆λ
IF =60 mA
-
18
-
nm
2θ½
IF =60 mA
-
120
-
deg
ηopt
IF =60 mA
-
30
-
lm/W
Parameter
Luminance Intensity
*1
Spectral Bandwidth
Viewing Angle
*2
Optical Efficiency
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned
with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
Forward Current IF[mA]
100
50
20
10
5
1
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
Forward Voltage VF[V]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
Relative Luminous Intensity IV/IV(25 C)[a.u.]
6
5
o
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
4
3
2
1
0
0
30
(10)
60
(20)
90
(30)
120
(40)
150
(50)
180
(60)
210
(70)
Forward Current IF[mA]
240
(80)
270 300 < total
(90) (100)< per die
Ambient Temperature vs. Allowable Forward Current (per die)
(Ta=25 OC )
40
3 Chip ON
30
Foward Current IF[mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
20
10
0
0
20
40
60
80
100
o
Ambient Temperature TA[ C]
Radiation Diagram
0
-30
-60
-90
30
60
90
Z-Power LED
X10490
Technical
Data
Sheet
5. Rank of HYT722
▣ Rank Name
X1
X2
X3
VF
IV
WD
▣ Forward Voltage [V]
Rank
Name
MIN
MAX
A
1.6
2.0
B
2.0
2.4
C
2.4
2.8
▣ Luminous Intensity [mcd]
Rank
Name
MIN
MAX
N
950
1150
O
1150
1400
P
1400
1700
▣ Dominant Wavelength [nm]
Rank
Name
MIN
MAX
1
582
586
2
586
590
3
590
594
4
594
598
Z-Power LED
X10490
Technical
Data
Sheet
6.outline dimension
Package Outlines
5
6
4
Package
Marking
(Anode)
1
2
3
Front View
Right View
Rear View
( Tolerance: ±0.2, Unit: mm )
Recommended
Solder Pad
Circuit Diagram
Yellow
Cathode
Yellow
Cathode
Yellow
Cathode
6
5
4
Y1
Y2
Y3
1
2
3
Yellow
Anode
Yellow
Anode
Yellow
Anode
* MATERIALS
PARTS
MATERIALS
Package
Heat-Resistant Polymer
Encapsulating Resin
Epoxy Resin
Electrodes
Ag Plating Copper Alloy
Z-Power LED
X10490
Technical
Data
Sheet
7. packing
Package
Marking
( Tolerance: ±0.2, Unit: mm )
1)Quantity : 700pcs/Reel
2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is
turned off from the carrier tape at the angle of 10 to the carrier tape
4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
XXX
RANK:
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
XXX
RANK:
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
XXX
RANK:
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
RoHS
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
a
b
Z-Power LED
X10490
Technical
Data
Sheet
8. lot number
The lot number is composed of the following characters;
HYT○□□◎◎ # ~ #
HYT –First Part Name
○ – Year (6 for 2006, 7 for 2007, 8 for 2008 )
□□ – Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.)
◎◎ – Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.)
# ~# – The number of the internal quality control
XXX
QUANTITY : 700
LOT NUMBER : HYT70426 01 512
PART NUMBER : HYT722
SEOUL SEMICONDUCTOR CO., LTD.
Z-Power LED
X10490
Technical
Data
Sheet
9. soldering
(1) Lead Solder
Lead Solder
Lead Solder
2.5~5 o C / sec.
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition
10 sec. Max.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 o C / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time Condition
10 sec. Max.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Z-Power LED
X10490
Technical
Data
Sheet
10. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or
a desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
(3) In the case of more than 1 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
(11) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
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