Product Folder Sample & Buy Tools & Software Technical Documents Support & Community CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 CC2591 2.4-GHz RF Front End 1 Device Overview 1.1 Features 1 • Seamless Interface to 2.4-GHz Low-Power RF Devices from Texas Instruments • Output Power up to 22 dBm • Few External Components – Integrated Switches – Integrated Matching Network – Integrated Balun – Integrated Inductors – Integrated PA – Integrated LNA 1.2 • • • Applications All 2.4-GHz ISM Band Systems Wireless Sensor Networks Wireless Industrial Systems 1.3 • Digital Control of LNA Gain by HGM Pin • 100-nA in Power Down (EN = PAEN = 0) • Low Transmit Current Consumption (100 mA at 3 V for 20-dBm Out, PAE = 33%) • Low-Receive Current Consumption – 3.4 mA for High-Gain Mode – 1.7 mA for Low-Gain Mode • 4.8-dB LNA Noise Figure, Including T/R Switch and External Antenna Match • RoHS Compliant 4×4-mm QFN-16 Package • 2-V to 3.6-V Operation • • • IEEE 802.15.4 and ZigBee® Systems Wireless Consumer Systems Wireless Audio Systems Description CC2591 is a cost-effective and high-performance RF front end for low-power and low-voltage 2.4-GHz wireless applications. The device is a range extender for all existing and future 2.4-GHz low-power RF transceivers, transmitters, and System-on-Chip products from TI. CC2591 increases the link budget by providing a power amplifier for increased output power, and an LNA with low noise figure for improved receiver sensitivity. The device provides a small size, high output power RF design with its 4-mm × 4-mm QFN-16 package. The device contains PA, LNA, switches, RF-matching, and balun for simple design of high-performance wireless applications. Device Information (1) PART NUMBER CC2591RGV (1) PACKAGE BODY SIZE RGV (16) 4.00 mm × 4.00 mm For more information, see Section 7, Mechanical Packaging and Orderable Information. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 1.4 www.ti.com Functional Block Diagram Figure 1-1 shows the functional block diagram of the device. PA BALUN 4 RF_P 3 RXTX 2 RF_N 5 PAEN 6 EN 11 ANT LNA Logic Bias 15 7 BIAS HGM Figure 1-1. Functional Block Diagram 2 Device Overview Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 CC2591 www.ti.com SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 Table of Contents 1 2 3 Device Overview ......................................... 1 Typical Characteristics ............................... 8 Features .............................................. 1 1.2 Applications ........................................... 1 5.1 CC2591EM Evaluation Module ....................... 9 1.3 Description ............................................ 1 5.2 Controlling the Output Power from CC2591 1.4 Functional Block Diagram ............................ 2 5 6 Applications, Implementation, and Layout ......... 9 ........ 10 Device and Documentation Support ............... 14 Revision History ......................................... 3 Terminal Configuration and Functions .............. 4 6.1 Device Support ...................................... 14 6.2 Documentation Support ............................. 15 Pin Attributes ......................................... 5 6.3 Trademarks.......................................... 15 ............................................ Absolute Maximum Ratings .......................... Handling Ratings ..................................... Recommended Operating Conditions ................ Electrical Characteristics ............................. 3.1 4 4.6 1.1 Specifications 6 6.4 Electrostatic Discharge Caution ..................... 16 4.1 6 6.5 Export Control Notice 4.2 4.3 4.4 4.5 6 6 6 Thermal Resistance Characteristics for RGV Package .............................................. 7 6.6 7 ............................... Glossary ............................................. 16 16 Mechanical Packaging and Orderable Information .............................................. 17 7.1 Packaging Information .............................. 17 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (June 2008) to Revision B • Page Changed format of data sheet to the latest TI standards........................................................................ 1 Revision History Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 3 CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 www.ti.com 3 Terminal Configuration and Functions 15 14 AVDD_LNA BIAS 16 GND AVDD_BIAS The CC2591 pinout and description are shown in Figure 3-1 and Table 3-1, respectively. 13 AVDD_PA1 1 12 GND RF_N 2 11 ANT RXTX 3 10 AVDD_PA2 RF_P 4 9 EN 7 8 GND 6 HGM 5 PAEN QFN-16 4x4mm GND Figure 3-1. PIN AND I/O CONFIGURATION (TOP VIEW) NOTE The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference layout. Changes will alter the performance. For best performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when CC2591 is mounted onto layer 1. 4 Terminal Configuration and Functions Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 CC2591 www.ti.com 3.1 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 Pin Attributes Table 3-1. Pin Attributes TERMINAL TYPE DESCRIPTION NO. NAME — GND Ground The exposed die attach pad must be connected to a solid ground plane. See CC2591EM reference design for recommended layout. AVDD_PA1 Power 2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA . See CC2591EM reference design for recommended layout. 2 RF_N RF 3 RXTX Analog/Control 1 RF interface towards CC24xx or CC25xx device. RXTX switching voltage when connected to CC24xx devices. See Table 5-2 and Table 5-3 for details. 4 RF_P RF 5 PAEN Digital Input RF interface towards CC24xx or CC25xx device Digital control pin. See Table 5-2 and Table 5-3 for details. 6 EN Digital Input Digital control pin. See Table 5-2 and Table 5-3 for details. 7 HGM Digital Input Digital control pin. HGM=1 → Device in High Gain Mode HGM=0 → Device in Low Gain Mode (RX only) 8, 9, 12, 14 GND Ground Secondary ground connections. Should be shorted to the die attach pad on the top PCB layer. 10 AVDD_PA2 Power 2.0 V – 3.6 V Power. PCB trace to this pin serves as inductive load to PA. See CC2591EM reference design for recommended layout. 11 ANT RF 13 AVDD_LNA Power 2 V – 3.6 V Power. PCB trace to this pin serves as inductive load to LNA. See CC2591EM reference design for recommended layout. 15 BIAS Analog Biasing input. Resistor between this node and ground sets bias current to PAs. 16 AVDD_BIAS Power 2 V – 3.6 V Power. Antenna interface. Terminal Configuration and Functions Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 5 CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 www.ti.com 4 Specifications Absolute Maximum Ratings (1) (2) 4.1 Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values may cause permanent damage to the device. PARAMETER Supply voltage VALUE All supply pins must have the same voltage Voltage on any digital pin (2) dBm Handling Ratings Tstg MIN MAX UNIT –50 150 °C Human Body Model (HBM), per ANSI/ESDA/JEDEC JS001 (1) –600 600 V Charged Device Model (CDM), per JESD22-C101 (2) –500 500 V Storage temperature range Electrostatic discharge (ESD) performance: VESD 4.3 10 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to VSS, unless otherwise noted. 4.2 (1) (2) V –0.3 to VDD + 0.3, max 3.6 Input RF level (1) UNIT –0.3 to 3.6 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Recommended Operating Conditions The operating conditions for CC2591 are listed below. PARAMETER Ambient temperature range MIN MAX –40 85 °C 2 3.6 V 2400 2483.5 Operating supply voltage Operating frequency range 4.4 UNIT MHz Electrical Characteristics TC = 25°C, VDD = 3 V , fRF= 2440 MHz (unless otherwise noted). Measured on CC2591EM reference design including external matching components. PARAMETER TEST CONDITIONS MIN TYP MAX Receive current, High-Gain Mode HGM = 1 3.4 4 Receive current, Low-Gain Mode HGM = 0 1.7 2 Transmit current PIN = 0.5 dBm 112 Transmit current No input signal 40 50 Power-down current EN = PAEN = 0 0.1 0.3 High-input level (control pins) EN, PAEN, HGM, RXTX Low-input level (control pins) EN, PAEN, HGM, RXTX 1.3 VDD 0.3 UNIT mA μA V Power down - Receive mode switching time 12 μs Power down - Transmit mode switching time 1 μs RF Receive Gain, High-Gain Mode HGM = 1 11 dB Gain, Low-Gain Mode HGM = 0 1 dB Gain variation, 2400 – 2483.5 MHz, HighGain Mode HGM = 1 1.3 dB Gain variation, 2.0 V – 3.6 V, High-Gain Mode HGM = 1 1.5 dB 6 Specifications Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 CC2591 www.ti.com SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 Electrical Characteristics (continued) TC = 25°C, VDD = 3 V , fRF= 2440 MHz (unless otherwise noted). Measured on CC2591EM reference design including external matching components. PARAMETER TEST CONDITIONS Gain variation, -40°C – 85°C, High-Gain Mode HGM = 1 Noise figure, High-Gain Mode MIN TYP MAX UNIT 3 dB HGM = 1, including internal T/R switch and external antenna match 4.8 dB Input 1-dB compression, High-Gain Mode HGM = 1 –17 dBm Input IP3, High-Gain Mode HGM = 1 –2 dBm Input reflection coefficient, S11 HGM = 1, measured at antenna port –11 dB Output power, POUT PIN = 0.5 dBm 20.6 dBm Maximum output power PIN = 5 dBm 22 dBm Power Added Efficiency, PAE PIN = 0.5 dBm RF Transmit Gain 22 dB 34% Output 1-dB compression Output IP3 19 dBm 32 dBm Output power variation over frequency 2400 – 2483.5 MHz, PIN = 0.5 dBm 0.5 dB Output power variation over power supply 2 V – 3.6 V , PIN = 0.5 dBm 3.5 dB Output power variation over temperature -40°C – 85°C, PIN = 0.5 dBm 1.5 dB Second harmonic power PIN = 0.5 dBm. The second harmonic can be reduced to below regulatory limits by using an external LC filter and antenna. –15 dBm Third harmonic power PIN = 0.5 dBm. The third harmonic can be reduced to below regulatory limits by using an external LC filter and antenna. –30 dBm 4.5 Thermal Resistance Characteristics for RGV Package °C/W (1) (2) AIR FLOW (m/s) (3) NAME DESCRIPTION RΘJC-top Junction-to-case (top) 52.8 0.00 RΘJB Junction-to-board 20.4 0.00 RΘJA Junction-to-free air 41.9 0.00 PsiJT Junction-to-package top 1.4 0.00 PsiJB Junction-to-board 20.5 0.00 RΘJC-bottom Junction-to-case (bottom) 8.3 0.00 (1) (2) (3) °C/W = degrees Celsius per watt. These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements m/s = meters per second. Specifications Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 7 CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 4.6 Typical Characteristics 12 5.4 13 11 5.3 12 HGM 11 5.2 5.1 8 5 4.9 7 NF HGM 6 4.8 5 4.7 4 4.6 3 4.5 2 9 8 Gain − dB 9 7 6 5 4 3 1 0 1 4.3 -1 0 4.2 -2 -40 2400 2410 2420 2430 2440 2450 2460 2470 LGM 2 4.4 LGM HGM 10 Noise Figure − dB 10 Gain − dB www.ti.com 2480 -20 0 20 40 60 80 o T − Temperature − C Figure 4-2. LNA Gain vs Temperature f − Frequency − MHz Figure 4-1. LNA Gain and Noise Figure vs Frequency 12 11 10 HGM 9 Gain − dB 8 7 6 5 4 3 2 LGM 1 0 -1 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Power Supply − V Figure 4-3. LNA Gain vs Power Supply 8 Specifications Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 CC2591 www.ti.com SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 5 Applications, Implementation, and Layout NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 5.1 CC2591EM Evaluation Module VDD VDD C11/C12 C101/C102 = TLINE inductor VDD VDD C131/C132 TL131 AVDD_LNA TL101 AVDD_PA2 AVDD_BIAS AVDD_PA1 TL11 C161 LDB182G4520C-110 RF_P RXTX RXTX RXTX SMA L111 L112 CC2591 ANT C111 Balun C2 RF_N RF_N RF_N PAEN PAEN EN EN HGM HGM BIAS SMA RF_P RF_P RXTX R151 Figure 5-1. CC2591EM Evaluation Module Applications, Implementation, and Layout Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 9 CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 www.ti.com Table 5-1. List of Materials (See CC2591EM Reference Design) DEVICE FUNCTION VALUE L112 Part of antenna match. 1.5 nH: LQW15AN1N5B00 from Murata L111 DC block. 1 nF: GRM1555C1H102JA01 from Murata C111 Part of antenna match. 1 pF: GRM1555C1H1R0BZ01 from Murata C161 Decoupling capacitor. 1 nF: GRM1555C1H102JA01 from Murata C11/C12 Decoupling. Will affect PA resonance. 10 pF || 1 nF. The smallest cap closest. See CC2591EM reference design (SWRU190) for placement. 10 pF: GRM1555C1H100JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata C101/C102 Decoupling. Will affect PA resonance. 18 pF || 1 nF. The smallest cap closest. See CC2591EM reference design (SWRU190) for placement. 18 pF: GRM1555C1H180JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata C131/C132 Decoupling. Will affect PA resonance. 10 pF || 1 nF. The smallest cap closest. See CC2591EM reference design (SWRU190) for placement. 10 pF: GRM1555C1H100JZ01 from Murata 1 nF: GRM1555C1H102JA01 from Murata C2 Decoupling of external balun 1 nF: GRM1555C1H102JA01 from Murata TL11 Transmission line. Will affect PA resonance. See CC2591EM reference design. TL101 Transmission line. Will affect PA resonance. See CC2591EM reference design. TL131 Transmission line. Will affect LNA resonance. See CC2591EM reference design. R151 Bias resistor 4.3 kΩ: RK73H1ETTP4301F from Koa 5.2 Controlling the Output Power from CC2591 The output power of CC2591 is controlled by controlling the input power. The CC2591 PA is designed to work in compression (class AB), and the best efficiency is reached when a strong input signal is applied. 5.2.1 Input Levels on Control Pins The four digital control pins (PAEN, EN, HGM, RXTX) have built-in level-shifting functionality, meaning that if the CC2591 is operating from a 3.6-V supply voltage, the control pins will still sense 1.6-V - 1.8-V signals as logical ‘1’. An example of the above would be that RXTX is connected directly to the RXTX pin on CC24xx, but the global supply voltage is 3.6 V. The RXTX pin on CC24xx will switch between 0 V (RX) and 1.8 V(TX), which is still a high enough voltage to control the mode of CC2591. The input voltages should however not have logical ‘1’ level that is higher than the supply. 5.2.2 Connecting CC2591 to a CC24xx Device Table 5-2. Control Logic for Connecting CC2591 to a CC24xx Device 10 PAEN = EN RXTX HGM 0 X X Power Down 1 0 0 RX Low Gain Mode 1 0 1 RX High Gain Mode 1 1 X TX Applications, Implementation, and Layout MODE OF OPERATION Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 CC2591 www.ti.com SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 VDD VDD C11/C12 C101/C102 = TLINE inductor VDD VDD C131/C132 TL131 AVDD_LNA TL101 AVDD_PA2 AVDD_BIAS AVDD_PA1 TL11 C161 CC243x RF_P RF_P RF_P RF_P RXTX RXTX RXTX L111 ANT L112 C113 TXRX_SWITCH C112 CC2591 RF_N RF_N RF_N RF_N PAEN C111 RREG_OUT (CC243x) BIAS EN HGM R151 Connected to VDD/GND/MCU/RXTX Alternativiely from MCU Figure 5-2. CC2591 + CC24xx Application Circuit Applications, Implementation, and Layout Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 11 CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 5.2.3 www.ti.com Connecting CC2591 to the CC2500, CC2510, or CC2511 Device Table 5-3. Control Logic for Connecting CC2591 to a CC2500/10/11 Devices PAEN EN RXTX HGM MODE OF OPERATION 0 0 NC X Power Down 0 1 NC 0 RX LGM 0 1 NC 1 RX HGM 1 0 NC X TX 1 1 NC X Not allowed VDD VDD C11/C12 C101/C102 = TLINE inductor VDD VDD C131/C132 TL131 AVDD_LNA TL101 AVDD_PA2 AVDD_BIAS AVDD_PA1 TL11 C161 CC2500 CC2510 CC2511 RF_P RF_P RF_P RXTX RXTX RXTX L111 CC2591 C111 BIAS C113 NC C112 ANT L112 RF_P RF_N RF_N RF_N RF_N PAEN GDO0 EN GDO2 HGM R151 Connected to VDD/GND/MCU Alternatively from MCU Figure 5-3. CC2591 + CC2500/10/11 Device Application Circuit 12 Applications, Implementation, and Layout Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 CC2591 www.ti.com 5.2.4 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 Connecting CC2591 to a CC2520 Device Table 5-4. Control Logic for Connecting CC2591 to a CC2520 Device PAEN EN RXTX HGM MODE OF OPERATION 0 0 NC X Power Down 0 1 NC 0 RX LGM 0 1 NC 1 RX HGM 1 0 NC X TX 1 1 NC X Not allowed VDD VDD C11/C12 C101/C102 = TLINE inductor VDD VDD C131/C132 TL131 AVDD_LNA TL101 AVDD_PA2 AVDD_BIAS AVDD_PA1 TL11 C161 CC2520 C41 RF_P RF_P RXTX C112 CC2591 ANT L112 C113 C111 RF_P RF_P RXTX RXTX L111 L41 NC C1 L21 RF_N RF_N RF_N RF_N PAEN PA_EN LNA_EN BIAS EN HGM R151 Connected to VDD/GND/MCU C21 Alternatively from MCU Figure 5-4. CC2591 + CC2520 Application Circuit Applications, Implementation, and Layout Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 13 CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 www.ti.com 6 Device and Documentation Support 6.1 6.1.1 Device Support Development Support TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE). The following products support development of the CC2591 device applications: Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any CC2591 device application. Hardware Development Tools: Extended Development System (XDS™) Emulator For a complete listing of development-support tools for the CC2591 platform, visit the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. 6.1.2 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC2591). These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS). Device development evolutionary flow: X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. null Production version of the silicon die that is fully qualified. Support tool development evolutionary flow: X and P devices are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGV) and the temperature range (for example, blank is the default commercial temperature range). provides a legend for reading the complete device name for any CC2591 device. For orderable part numbers of CC2591 devices in the RGV package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. 14 Device and Documentation Support Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 CC2591 www.ti.com 6.2 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 Documentation Support The following documents describe the CC2591 processor. Copies of these documents are available on the Internet at www.ti.com. 6.2.1 SWRA351 Antenna Quick Guide SWRA120 Design Note Overview SWRA350 YAGI 2.4 GHz PCB Antenna SWRA161 Antenna Selection Guide SWRA328 CC-Antenna-DK Documentation and Antenna Measurements Summary SWRA229 Using CC2591 RF Front End with CC2520 SWRA308 Using CC2591 Front End with CC2530 and CC2531 SWRA290 TIMAC and Z-Stack Modifications for using CC2591 RF Front End with CC2 SWRA236 Design Steps and Results for Changing PCB Layer Thickness SWRA230 TI-MAC modifications for using CC2591 PA/LNA with MSP430F2618+CC2520 SWRA208 TI-MAC and Z-Stack modifications for using CC2591 RF Front End w/CC2430 SWRA212 Using CC2591 RF Front End with CC2430 SWRC171 CC2530-CC2591EM Reference Design SPRU137 CC2520 Software Examples User's Guide SPRU178 CC2430 Software Examples User’s Guide Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 6.3 Trademarks E2E is a trademark of Texas Instruments. ZigBee is a registered trademark of ZigBee Alliance. Device and Documentation Support Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 15 CC2591 SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 6.4 www.ti.com Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 6.5 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 6.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 16 Device and Documentation Support Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2591 CC2591 www.ti.com SWRS070B – MARCH 2008 – REVISED SEPTEMBER 2014 7 Mechanical Packaging and Orderable Information 7.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2008–2014, Texas Instruments Incorporated Mechanical Packaging and Orderable Information Submit Documentation Feedback Product Folder Links: CC2591 17 PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) CC2591RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2591 CC2591RGVRG4 ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2591 CC2591RGVT ACTIVE VQFN RGV 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2591 CC2591RGVTG4 ACTIVE VQFN RGV 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2591 HPA00420RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2591 HPA01083RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2591 HPA02142RGVR ACTIVE VQFN RGV 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 CC2591 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 2-Nov-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CC2591RGVR VQFN RGV 16 2500 330.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 CC2591RGVT VQFN RGV 16 250 180.0 12.4 4.3 4.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Nov-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2591RGVR VQFN RGV 16 2500 336.6 336.6 28.6 CC2591RGVT VQFN RGV 16 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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