Freescale MC34912G5R2 Lin system basis chip with dc motor pre-driver and current sense Datasheet

MC33912G5AC / MC34912G5AC
Freescale Semiconductor
Advance Information
Document Number: MC33912
Rev. 8.0, 3/2010
LIN System Basis Chip with DC
Motor Pre-driver and Current
Sense
33912
The 33912G5/BAC is a Serial Peripheral Interface (SPI) controlled
System Basis Chip (SBC), combining many frequently used functions
in an MCU based system, plus a Local Interconnect Network (LIN)
transceiver. The 33912 has a 5.0 V, 50 mA/60 mA low dropout
regulator with full protection and reporting features. The device
provides full SPI readable diagnostics and a selectable timing
watchdog for detecting errant operation. The LIN Protocol Specification
2.0 and 2.1 compliant LIN transceiver has waveshaping circuitry that
can be disabled for higher data rates.
Two 50 mA/60 mA high side switches and two 150 mA/160 mA low
side switches with output protection are available. All outputs can be
pulse-width modulated (PWM). Four high voltage inputs are available
for use in contact monitoring, or as external wake-up inputs. These
inputs can be used as high voltage Analog Inputs. The voltage on these
pins is divided by a selectable ratio and available via an analog
multiplexer.
The 33912 has three main operating modes: Normal (all functions
available), Sleep (VDD off, wake-up via LIN, wake-up inputs (L1-L4),
cyclic sense and forced wake-up), and Stop (VDD on with limited current
capability, wake-up via CS, LIN bus, wake-up inputs, cyclic sense,
forced wake-up and external reset).
The 33912 is compatible with LIN Protocol Specification 2.0, 2.1, and
SAEJ2602-2.
SYSTEM BASIS CHIP WITH LIN
2ND GENERATION
AC SUFFIX (Pb-FREE)
98ASH70029A
32-PIN LQFP
ORDERING INFORMATION
Features
•
•
•
•
•
•
•
•
•
Device
Temperature
Range (TA)
MC33912G5AC/R2
- 40°C to 125°C
MC34912G5AC/R2
-40°C to 85°C
Full-duplex SPI interface at frequencies up to 4.0 MHz
LIN transceiver capable of up to 100 kbps with wave shaping
MC33912BAC/R2
- 40°C to 125°C
Current sense module
MC34912BAC/R2
-40°C to 85°C
Four high voltage analog/logic Inputs
Configurable window watchdog
* See Page 2 for Device Variations
Switched/protected 5.0 V output (used for Hall sensors)
Two 50 mA high side and two 150 mA/160 mA low side protected switches
5.0 V low drop regulator with fault detection and low voltage reset (LVR) circuitry
Pb-free packaging designated by suffix code AC
33912
VBAT
VSENSE
HS1
VS1
VS2
LIN INTERFACE
L1
L2
L3
L4
LIN
VDD
LGND
PGND
AGND
MCU
PWMIN
ADOUT0
ADOUT1
MOSI
MISO
SCLK
CS
RXD
TXD
IRQ
RST
LS1
LS2
ISENSEH
ISENSEL
HVDD
HS2
WDCONF
Figure 1. 33912 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2009 - 2010. All rights reserved.
M
Package
32-LQFP
MC33912G5AC / MC34912G5AC
DEVICE VARIATIONS
DEVICE VARIATIONS
The 33912G5 data sheet is within MC33912G5 Product
Specifications Pages 3 to 47
The 33912BAC data sheet is within MC33912BAC
Product Specifications Pages 48 to 90
Table 1. Device Variations for the MC33912
Device
MC33912G5AC/R2
Temperature
Generation
- 40°C to 125°C
2. Immunity against ISO7637 pulse 3b
2.5
MC34912G5AC/R2
Changes
1. Increase ESD Gun IEC61000-4-2 (gun test contact with 150 pF, 330 ohm test
conditions) performance to achieve ±6.0 kV min on the LIN pin.
3. Reduce EMC emission level on LIN
4. Improve EMC immunity against RF - target new specification including
3x68pF
- 40°C to 85°C
5. Comply with J2602 conformance test
MC33912BAC/R2
- 40°C to 125°C
MC34912BAC/R2
- 40°C to 85°C
2.0
Initial release
33912
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
MC33912G5 PRODUCT SPECIFICATIONS PAGES 3 TO 47
MC33912G5 PRODUCT SPECIFICATIONS
PAGES 3 TO 47
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
MC33912G5AC / MC34912G5AC
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
RST IRQ
INTERRUPT CONTROL
MODULE
LVI, HVI,
ALL OT (VDD,HS,LS,LIN,SD)
RESET CONTROL
MODULE
LVR, WD, EXT µC
VS1
INTERNAL BUS
VS2
VDD
AGND
VOLTAGE REGULATOR
5V OUTPUT
MODULE
HVDD
LS1
LOW SIDE
CONTROL
MODULE
WINDOW
WATCHDOG
MODULE
LS2
PWMIN
PGND
VS2
MISO
SCLK
VS2
SPI
&
CONTROL
HS1
HS2
ANALOG MULTIPLEXER
MOSI
HIGH SIDE
CONTROL
MODULE
CS
ADOUT0
WAKE-UP MODULE
VBAT
SENSE MODULE
VSENSE
CHIP TEMPERATURE
SENSE MODULE
ANALOG INPUT
MODULE
L1
L2
L3
RXD
TXD
DIGITAL INPUT MODULE
LIN PHYSICAL
LAYER
L4
LIN
ISENSEH
CURRENT SENSE MODULE
ISENSEL
LGND
WDCONF
ADOUT1
Figure 2. 33912 Simplified Internal Block Diagram
33912
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
PIN CONNECTIONS
AGND
VDD
HVDD
VSENSE
NC
VS1
VS2
HS1
32
31
30
29
28
27
26
25
PIN CONNECTIONS
MISO
3
22
L2
MOSI
4
21
L3
SCLK
5
20
L4
CS
6
19
LS1
ADOUT0
7
18
PGND
PWMIN
8
17
LS2
9
10
11
12
13
14
15
16
ISENSEH
L1
ISENSEL
23
LGND
2
LIN
TXD
WDCONF
HS2
ADOUT1
24
IRQ
1
RST
RXD
Figure 3. 33912 Pin Connections
Table 2. 33912 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 24.
Pin
Pin Name
Formal Name
Definition
1
RXD
Receiver Output
This pin is the receiver output of the LIN interface which reports the state of
the bus voltage to the MCU interface.
2
TXD
Transmitter Input
This pin is the transmitter input of the LIN interface which controls the state of
the bus output.
3
MISO
SPI Output
SPI (Serial Peripheral Interface) data output. When CS is high, pin is in the
high-impedance state.
4
MOSI
SPI Input
SPI (Serial Peripheral Interface) data input.
5
SCLK
SPI Clock
SPI (Serial Peripheral Interface) clock Input.
6
CS
SPI Chip Select
7
ADOUT0
Analog Output Pin 0
8
PWMIN
PWM Input
9
RST
Internal Reset I/O
Bidirectional Reset I/O pin - driven low when any internal reset source is
asserted. RST is active low.
10
IRQ
Internal Interrupt
Output
Interrupt output pin, indicating wake-up events from Stop mode or events from
Normal and Normal request modes. IRQ is active low.
11
ADOUT1
Analog Output Pin 1
SPI (Serial Peripheral Interface) chip select input pin. CS is active low.
Analog Multiplexer Output.
High Side and Low Side Pulse Width Modulation Input.
Current sense analog output.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
MC33912G5AC / MC34912G5AC
PIN CONNECTIONS
Table 2. 33912 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 24.
Pin
Pin Name
Formal Name
12
WDCONF
Watchdog
Configuration Pin
13
LIN
LIN Bus
14
LGND
LIN Ground Pin
Definition
This input pin is for configuration of the watchdog period and allows the
disabling of the watchdog.
This pin represents the single-wire bus transmitter and receiver.
This pin is the device LIN ground connection. It is internally connected to the
PGND pin.
15
ISENSEL
16
ISENSEH
17
LS2
19
LS1
18
PGND
20
L4
21
L3
22
L2
23
L1
24
HS2
25
HS1
26
VS2
27
VS1
28
NC
Not Connected
29
VSENSE
Voltage Sense Pin
Battery voltage sense input.(3)
30
HVDD
Hall Sensor Supply
Output
+5.0 V switchable supply output pin.(4)
31
VDD
Voltage Regulator
Output
+5.0 V main voltage regulator output pin.(5)
32
AGND
Analog Ground Pin
This pin is the device analog ground connection.
Current Sense Pins
Current Sense differential inputs.
Low Side Outputs
Relay drivers low side outputs.
Power Ground Pin
This pin is the device low side ground connection. It is internally connected to
the LGND pin.
Wake-up Inputs
These pins are the wake-up capable digital inputs(1). In addition, all Lx inputs
can be sensed analog via the analog multiplexer.
High Side Outputs
High side switch outputs.
Power Supply Pin
These pins are device battery level power supply pins. VS2 is supplying the
HSx drivers while VS1 supplies the remaining blocks.(2)
This pin can be left open or connected to any potential ground or power
supply.
Notes
1. When used as digital input, a series 33 kΩ resistor must be used to protect against automotive transients.
2. Reverse battery protection series diodes must be used externally to protect the internal circuitry.
3. This pin can be connected directly to the battery line for voltage measurements. The pin is self protected against reverse battery
connections. It is strongly recommended to connect a 10 kΩ resistor in series with this pin for protection purposes.
4. External capacitor (1.0 µF < C < 10 µF; 0.1 Ω < ESR < 5.0 Ω) required.
5. External capacitor (2.0 µF < C < 100 µF; 0.1 Ω < ESR < 10 Ω) required.
33912
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
Normal Operation (DC)
VSUP(SS)
-0.3 to 27
Transient Conditions (load dump)
VSUP(PK)
-0.3 to 40
VDD
-0.3 to 5.5
VIN
-0.3 to VDD +0.3
VIN(IRQ)
-0.3 to 11
HS1 and HS2 Pin Voltage (DC)
VHS
- 0.3 to VSUP +0.3
V
LS1 and LS2 Pin Voltage (DC)
VLS
-0.3 to 45
V
Normal Operation with a series 33 k resistor (DC)
VLxDC
-18 to 40
Transient input voltage with external component (according to ISO7637-2)
(See Figure 5, page 20)
VLxTR
±100
ISENSEH and ISENSEL Pin Voltage (DC)
VISENSE
-0.3 to 40
V
VSENSE Pin Voltage (DC)
VVSENSE
-27 to 40
V
Normal Operation (DC)
VBUSDC
-18 to 40
Transient input voltage with external component (according to ISO7637-2)
(See Figure 4, page 20)
VBUSTR
-150 to 100
IVDD
Internally Limited
ELECTRICAL RATINGS
Supply Voltage at VS1 and VS2
Supply Voltage at VDD
Input / Output Pins Voltage
V
(6)
CS, RST, SCLK, PWMIN, ADOUT0, ADOUT1, MOSI, MISO, TXD, RXD,
HVDD
Interrupt Pin (IRQ)(7)
V
L1, L2, L3 and L4 Pin Voltage
V
LIN Pin Voltage
VDD output current
V
V
A
Notes
6. Exceeding voltage limits on specified pins may cause a malfunction or permanent damage to the device.
7. Extended voltage range for programming purpose only.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
ESD Capability
Unit
V
AECQ100
Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 Ω)
LIN Pin
VESD1-1
L1, L2, L3, and L4
VESD1-2
± 8.0k
± 6.0k
all other Pins
VESD1-3
±2000
Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
VESD2-1
± 750
All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
VESD2-2
± 500
LIN pin with 220 pF
VESD3-1
± 20k
LIN pin without capacitor
VESD3-2
± 11k
VS1/VS2 (100 nF to ground)
VESD3-3
>± 12k
Lx inputs (33 kΩ serial resistor)
VESD3-4
±6000
LIN pin with 220 pF and without capacitor
VESD4-1
± 8000
VS1/VS2 (100 nF to ground)
VESD4-2
± 8000
VESD4-3
± 8000
Charge Device Model - JESD22/C101 (CZAP = 4.0 pF)
According to LIN Conformance Test Specification / LIN EMC Test
Specification, August 2004 (CZAP = 150 pF, RZAP = 330 Ω)
Contact Discharge, Unpowered
According to IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 Ω)
Unpowered
Lx inputs (33 kΩ serial resistor)
THERMAL RATINGS
Operating Ambient Temperature (8)
Operating Junction Temperature
°C
TA
33912
-40 to 125
34912
-40 to 85
TJ
-40 to 150
°C
Storage Temperature
TSTG
-55 to 150
°C
Thermal Resistance, Junction to Ambient
RθJA
Natural Convection, Single Layer board (1s)(8), (9)
Natural Convection, Four Layer board (2s2p)(8), (10)
Thermal Resistance, Junction to Case(11)
Peak Package Reflow Temperature During Reflow(12), (13)
°C/W
85
56
RθJC
23
°C/W
TPPRT
Note 13
°C
Notes
8.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
9.
10.
11.
12.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
13.
33912
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VSUP
5.5
–
18
V
Functional Operating Voltage(14)
VSUPOP
–
–
27
V
Load Dump
VSUPLD
–
–
40
V
IRUN
–
4.5
10
mA
SUPPLY VOLTAGE RANGE (VS1, VS2)
Nominal Operating Voltage
SUPPLY CURRENT RANGE (VSUP = 13.5 V)
Normal Mode (IOUT at VDD = 10 mA), LIN Recessive State(15)
Stop Mode, VDD ON with IOUT = 100 µA, LIN Recessive State
(17) (18)
,
(15), (16),
ISTOP
µA
5.5 V < VSUP < 12 V
–
47
VSUP = 13.5 V
–
62
90
13.5 V < VSUP < 18 V
–
180
400
5.5 V < VSUP < 12 V
–
27
35
VSUP = 13.5 V
–
33
48
13.5 V ≤ VSUP < 18 V
–
160
300
ICYCLIC
–
10
–
Threshold (measured on VS1)(19)
VBATFAIL
1.5
3.0
3.9
Hysteresis (measured on VS1)(19)
VBATFAIL_HYS
–
0.9
–
VSUV
5.55
6.0
6.6
VSUV_HYS
–
0.2
–
VSOV
18
19.25
20.5
–
1.0
–
Sleep Mode, VDD OFF, LIN Recessive State(15), (17)
Cyclic Sense Supply Current Adder(19)
80
ISLEEP
µA
µA
SUPPLY UNDER/OVER-VOLTAGE DETECTIONS
Power-On Reset (BATFAIL)(20)
V
VSUP under-voltage detection (VSUV Flag) (Normal and Normal Request
Modes, Interrupt Generated)
Threshold (measured on VS1)
Hysteresis (measured on VS1)
V
VSUP over-voltage detection (VSOV Flag) (Normal and Normal Request
Modes, Interrupt Generated)
Threshold (measured on VS1)
Hysteresis (measured on VS1)
VSOV_HYS
V
Notes
14. Device is fully functional. All features are operating.
15. Total current (IVS1 + IVS2) measured at GND pins excluding all loads, cyclic sense disabled.
16.
Total IDD current (including loads) below 100 µA.
17.
Stop and Sleep Modes current will increase if VSUP exceeds13.5 V.
18.
19.
20.
This parameter is guaranteed after 90 ms.
This parameter is guaranteed by process monitoring but not production tested.
The Flag is set during power up sequence. To clear the flag, a SPI read must be performed.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
(21)
VOLTAGE REGULATOR
Symbol
Min
Typ
Max
4.75
5.00
5.25
60
110
200
–
0.1
0.25
Unit
(VDD)
Normal Mode Output Voltage
VDDRUN
1.0 mA < IVDD < 50 mA; 5.5 V < VSUP < 27 V
Normal Mode Output Current Limitation
IVDDRUN
Dropout Voltage(22)
VDDDROP
IVDD = 50 mA
Stop Mode Output Voltage
V
V
VDDSTOP
IVDD < 5.0 mA
mA
V
4.75
5.0
5.25
IVDDSTOP
6.0
13
36
Normal Mode, 5.5 V < VSUP < 18 V; IVDD = 10 mA
LRRUN
–
–
25
Stop Mode, 5.5 V < VSUP < 18 V; IVDD = 1.0 mA
LRSTOP
–
–
25
Normal Mode, 1.0 mA < IVDD < 50 mA
LDRUN
–
–
80
Stop Mode, 0.1 mA < IVDD < 5.0 mA
LDSTOP
–
–
50
90
115
140
TPRE_HYS
–
13
–
°C
TSD
150
170
190
°C
TSD_HYS
–
13
–
°C
-2.0
–
2.0
20
35
50
Stop Mode Output Current Limitation
Line Regulation
mV
Load Regulation
Over-temperature Prewarning
mA
mV
(Junction)(23)
TPRE
Interrupt generated, VDDOT Bit Set
Over-temperature Prewarning Hysteresis(23)
Over-temperature Shutdown Temperature
(Junction)(23)
(23)
Over-temperature Shutdown Hysteresis
°C
HALL SENSOR SUPPLY OUTPUT(24) (HVDD)
VDD Voltage matching HVDDACC = (HVDD-VDD) / VDD * 100%
HVDDACC
IHVDD = 15 mA
Current Limitation
Dropout Voltage
IHVDD
HVDDDROP
IHVDD = 15 mA; IVDD = 5.0 mA
Line Regulation
–
160
300
–
–
40
mV
LDHVDD
1.0 mA > IHVDD > 15 mA; IVDD = 5.0 mA
mA
mV
LRHVDD
IHVDD = 5.0 mA; IVDD = 5.0 mA
Load Regulation
%
mV
–
–
20
Notes
21. Specification with external capacitor 2.0 µF < C < 100 µF and 100 mΩ ≤ ESR ≤ 10 Ω.
22. Measured when voltage has dropped 250 mV below its nominal Value (5.0 V).
23. This parameter is guaranteed by process monitoring but not production tested.
24. Specification with external capacitor 1.0 µF < C < 10 µF and 100 mΩ ≤ ESR ≤ 10 Ω.
33912
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VRSTTH
4.3
4.5
4.7
V
0.0
–
0.9
-150
-250
-350
1.5
–
8.0
RST INPUT/OUTPUT PIN (RST)
VDD Low Voltage Reset Threshold
Low-state Output Voltage
VOL
IOUT = 1.5 mA; 3.5 V ≤ VSUP ≤ 27 V
High-state Output Current (0 V < VOUT < 3.5 V)
IOH
Pull-down Current Limitation (internally limited)
IPD_MAX
VOUT = VDD
V
µA
mA
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
MISO SPI OUTPUT PIN (MISO)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
0.0
–
1.0
VDD -0.9
–
VDD
-10
–
10
VOH
IOUT = -250 µA
Tri-state Leakage Current
V
V
ITRIMISO
0 V ≤ VMISO ≤ VDD
µA
SPI INPUT PINS (MOSI, SCLK, CS)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
MOSI, SCLK Input Current
IIN
-10
–
10
10
20
30
0 V ≤ VIN ≤ VDD
CS Pull-up Current
µA
IPUCS
0 V < VIN < 3.5 V
µA
INTERRUPT OUTPUT PIN (IRQ)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
0.0
–
0.8
VDD -0.8
–
VDD
–
–
2.0
VOH
IOUT = -250 µA
Leakage Current
V
V
IOUT
VDD ≤ VOUT ≤ 10 V
mA
PULSE WIDTH MODULATION INPUT PIN (PWMIN)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
Pull-up current
0 V < VIN < 3.5 V
IPUPWMIN
µA
10
20
30
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
TJ = 25°C, ILOAD = 50 mA; VSUP > 9.0 V
–
–
7.0
TJ = 150°C, ILOAD = 50 mA; VSUP > 9.0 V(25)
–
–
10
TJ = 150°C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V(25)
–
–
14
Unit
HIGH SIDE OUTPUTS HS1 AND HS2 PINS (HS1, HS2)
Output Drain-to-Source On Resistance
Ω
RDS(ON)
Output Current Limitation(26)
ILIMHSX
0 V < VOUT < VSUP - 2.0 V
mA
60
90
250
–
5.0
7.5
–
–
10
VSUP -2.0
–
–
THSSD
140
160
180
°C
THSSD_HYS
–
10
–
°C
TJ = 25°C, ILOAD = 150 mA, VSUP > 9.0 V
–
–
2.5
TJ = 125°C, ILOAD = 150 mA, VSUP > 9.0 V
–
–
4.5
–
–
10
160
275
350
–
7.5
12
Open Load Current Detection
(27)
IOLHSX
Leakage Current
ILEAK
-0.2 V < VHSX < VS2 + 0.2 V
Short-circuit Detection Threshold(28)
Over-temperature Shutdown(29), (33)
Over-temperature Shutdown
µA
VTHSC
5.5 V < VSUP < 27 V
Hysteresis(33)
mA
V
LOW SIDE OUTPUTS LS1 AND LS2 PINS (LS1, LS2)
Output Drain-to-Source On Resistance
RDS(ON)
TJ = 125°C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V
Output Current Limitation(30)
Ω
ILIMLSX
2.0 V < VOUT < VSUP
Open Load Current Detection(31)
IOLLSX
Leakage Current
ILEAK
-0.2 V < VOUT < VS1
Active Output Energy Clamp
mA
µA
–
–
10
VSUP +2.0
–
VSUP +5.0
2.0
–
–
TLSSD
140
160
180
°C
TLSSD_HYS
–
10
–
°C
VCLAMP
IOUT = 150 mA
Short-circuit Detection Threshold(28)
V
VTHSC
5.5 V < VSUP < 27 V
Over-temperature Shutdown(32), (33)
(33)
Over-temperature Shutdown Hysteresis
mA
V
Notes
25. This parameter is production tested up to TA = 125°C, and guaranteed by process monitoring up to TJ = 150°C.
26.
27.
28.
29.
30.
31.
32.
33.
When over-current occurs, the corresponding high side stays ON with limited current capability and the HSxCL flag is set in the HSSR.
When open load occurs, the flag (HSxOP) is set in the HSSR.
HS and LS automatically shutdown if HSOT or LSOT occurs or if the HVSE flag is enabled and an over-voltage occurs.
When over-temperature shutdown occurs, both high sides are turned off. All flags in HSSR are set.
When over-current occurs, the corresponding low side stays ON with limited current capability and the LSxCL flag is set in the LSSR.
When open load occurs, the flag (LSxOP) is set in the LSSR.
When over-temperature shutdown occurs, both low sides are turned off. All flags in LSSR are set.
Guaranteed by characterization but not production tested
33912
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
2.0
2.5
3.0
Unit
L1, L2, L3 AND L4 INPUT PINS (L1, L2, L3, L4)
Low Detection Threshold(34)
VTHL
5.5 V < VSUP < 27 V
High Detection Threshold(34)
VTHH
5.5 V < VSUP < 27 V
Hysteresis
V
(34)
V
3.0
3.5
4.0
0.4
0.8
1.4
VHYS
5.5 V < VSUP < 27 V
Input Current(35)
V
IIN
-0.2 V < VIN < VS1
µA
-10
–
10
800
1300
2000
LXDS (Lx Divider Select) = 0
0.95
1.0
1.05
LXDS (Lx Divider Select) = 1
3.42
3.6
3.78
-80
6.0
80
-22
2.0
22
96
100
104
96
100
104
REXT
20
–
200
kΩ
WDACC
-15
–
15
%
TA = -40°C
2.0
-
2.8
TA = 25°C
2.8
3.0
3.6
TA = 125°C
3.6
-
4.6
VADOUT0_25
3.1
3.15
3.2
V
STTOV
9.0
10.5
12
mV/K
STTOV_3T
9.9
10.2
10.5
mV/K
5.0
5.25
5.5
Analog Input
Impedance(36)
RLXIN
Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0)
RATIOLX
Analog Output offset Ratio
VRATIOLx-
LXDS (Lx Divider Select) = 0
OFFSET
LXDS (Lx Divider Select) = 1
Analog Inputs Matching
mV
LXMATCHING
LXDS (Lx Divider Select) = 0
LXDS (Lx Divider Select) = 1
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
kΩ
%
(37)
External Resistor Range
Watchdog Period Accuracy with External Resistor (Excluding Resistor
Accuracy)(38)
ANALOG MULTIPLEXER
Temperature Sense Analog Output Voltage
Temperature Sense Analog Output Voltage per characterization(39)
VADOUT0_TEMP
V
TA = 25°C
Internal Chip Temperature Sense Gain
Internal Chip Temperature Sense Gain per characterization at 3
temperatures(39) See Figure 16, Temperature Sense Gain
VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / VADOUT0)
5.5 V < VSUP < 27 V
Notes
34.
35.
36.
37.
RATIOVSENSE
The unused Lx pins must be connected to ground.
Analog multiplexer input disconnected from Lx input pin.
Analog multiplexer input connected to Lx input pin.
For VSUP 4.7 V to 18 V
38.
Watchdog timing period calculation formula: tPWD [ms] = [0.466 * (REXT - 20)] + 10 with (REXT in kΩ)
39.
These limits have been defined after laboratory characterization on 3 lots and 30 samples. These tighten limits could not be guaranteed
by production test.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Min
Typ
Max
5.15
5.25
5.35
-30
-10
30
-30
-12.6
0
VDD -0.35
–
VDD
0.0
–
0.35
CSGS (Current Sense Gain Select) = 0
29
30
31
CSGS (Current Sense Gain Select) = 1
14
14.5
15
CSGS (Current Sense Gain Select) = 0
2.0
10
30
CSGS (Current Sense Gain Select) = 1
5.0
20
50
CSGS (Current Sense Gain Select) = 0
100
–
200
CSGS (Current Sense Gain Select) = 1
100
–
200
-0.2
–
3.0
CSAZ (Current Sense Auto Zero) = 0
-15
–
15
CSAZ (Current Sense Auto Zero) = 1
-2.0
–
2.0
0.0
–
0.8
VDD -0.8
–
VDD
VSENSE Input Divider Ratio (RATIOVSENSE=VSENSE/VADOUT0) per
characterization(40)
Symbol
Z
5.5 <VSUP< 27 V
VSENSE Output Related Offset
VSENSE Output Related Offset per characterization(40)
Unit
RATIOVSENSEC
OFFSETVSENSE
mV
OFFSETVSENSE
_CZ
mV
ANALOG OUTPUTS (ADOUT0 AND ADOUT1)
Maximum Output Voltage
VOUT_MAX
-5.0 mA < IO < 5.0 mA
Minimum Output Voltage
V
VOUT_MIN
-5.0 mA < IO < 5.0 mA
V
CURRENT SENSE AMPLIFIER (ISENSEH, ISENSEL)
Gain
Differential Input Impedance
Common Mode Input Impedance
ISENSEH, ISENSEL Input Voltage Range
Input Offset Voltage
G
DIFF
kΩ
CM
VIN
kΩ
VIN_OFFSET
V
mV
RXD OUTPUT PIN (LIN PHYSICAL LAYER) (RXD)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
V
V
TXD INPUT PIN (LIN PHYSICAL LAYER) (TXD)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
IPUIN
10
20
30
µA
TAGE
5.0
-
6.0
VJ2602_DEG
-
400
-
Pin Pull-up Current, 0 V < VIN < 3.5 V
LIN PHYSICAL LAYER WITH J2602 FEATURE ENABLED (BIT DIS_J2602 = 0)
LIN Under-voltage threshold
Positive and Negative threshold (VTHP, VTHN)
Hysteresis (VTHP - VTHN)
VTH_UNDER_VOL
V
mV
Notes
40. These limits have been defined after laboratory characterization on 3 lots and 30 samples. These tighten limits could not be guaranteed
by production test.
33912
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
Operating Voltage Range
VBAT
8.0
-
18
V
Supply Voltage Range
VSUP
7.0
-
18
V
VSUP_NON_OP
-0.3
-
40
V
40
90
200
-1.0
–
–
–
–
20
-1.0
–
1.0
–
–
100
–
–
0.4
0.6
–
–
(41)
LIN PHYSICAL LAYER, TRANSCEIVER (LIN)
Voltage Range within which the device is not destroyed
Current Limitation for Driver Dominant State
IBUS_LIM
Driver ON, VBUS = 18 V
Input Leakage Current at the receiver
mA
IBUS_PAS_DOM
Driver off; VBUS = 0 V; VBAT = 12 V
Leakage Output Current to GND
mA
IBUS_PAS_REC
Driver Off; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS ≥ VBAT
Control unit disconnected from ground(42)
µA
IBUS_NO_GND
GNDDEVICE = VSUP; VBAT = 12 V; 0 < VBUS < 18 V
VBAT Disconnected; VSUP_DEVICE = GND; 0 V < VBUS < 18 V(43)
Receiver Dominant State
mA
IBUSNO_BAT
µA
VBUSDOM
Receiver Recessive State
VSUP
VBUSREC
Receiver Threshold Center
VSUP
VBUS_CNT
(VTH_DOM + VTH_REC)/2
Receiver Threshold Hysteresis
VSUP
0.475
0.5
0.525
–
–
0.175
VHYS
(VTH_REC - VTH_DOM)
VSUP
Voltage Drop at the serial Diode in pull-up path
VSERDIODE
0.4
1.0
V
VBAT_SHIFT
VSHIFT_BAT
0
11.5%
VBAT
VSHIFT_GND
0
11.5%
VBAT
5.3
5.8
V
GND_SHIFT
LIN Wake-up threshold from Stop or Sleep mode
(44)
LIN Pull-up Resistor to VSUP
Over-temperature
Shutdown(45)
Over-temperature Shutdown Hysteresis
VBUSWU
RSLAVE
20
30
60
kΩ
TLINSD
140
160
180
°C
TLINSD_HYS
–
10
–
°C
Notes
41. Parameters guaranteed for 7.0 V ≤ VSUP ≤ 18 V.
42.
43.
44.
45.
Loss of local ground must not affect communication in the residual network.
Node has to sustain the current that can flow under this condition. Bus must remain operational under this condition.
This parameter is 100% tested on an Automatic Tester. However, since it has not been monitored during reliability stresses, Freescale
does not guarantee this parameter during the product's life time.
When over-temperature shutdown occurs, the LIN bus goes in recessive state and the flag LINOT in LINSR is set.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SPI Operating Frequency
f SPIOP
–
–
4.0
MHz
SCLK Clock Period
SPI INTERFACE TIMING (SEE Figure 13, PAGE 23)
tPSCLK
250
–
N/A
ns
SCLK Clock High Time(46)
tWSCLKH
110
–
N/A
ns
SCLK Clock Low Time(46)
tWSCLKL
110
–
N/A
ns
Falling Edge of CS to Rising Edge of SCLK(46)
tLEAD
100
–
N/A
ns
Falling Edge of SCLK to CS Rising Edge(46)
tLAG
100
–
N/A
ns
MOSI to Falling Edge of SCLK(46)
tSISU
40
–
N/A
ns
Falling Edge of SCLK to MOSI(46)
tSIH
40
–
N/A
ns
MISO Rise Time(46)
tRSO
–
40
–
CL = 220 pF
MISO Fall Time(46)
ns
tFSO
CL = 220 pF
Time from Falling or Rising Edges of
ns
–
40
–
CS to:(46)
ns
- MISO Low-impedance
tSOEN
0.0
–
50
- MISO High-impedance
tSODIS
0.0
–
50
Time from Rising Edge of SCLK to MISO Data Valid(46)
tVALID
0.0
–
75
t RST
0.65
1.0
1.35
ms
t RSTDF
350
480
900
ns
8.5
10
11.5
0.2 x VDD ≤ MISO ≥ 0.8 x VDD, CL = 100 pF
ns
RST OUTPUT PIN
Reset Low-level Duration After VDD High (see Figure 12, page 23)
Reset Deglitch Filter Time
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
Watchdog Time Period(47)
t PWD
External Resistor REXT = 20 kΩ (1%)
ms
External Resistor REXT = 200 kΩ (1%)
79
94
108
Without External Resistor REXT (WDCONF Pin Open)
110
150
205
CMR
70
–
–
dB
SVR
60
–
–
dB
GBP
0.75
3.0
–
MHz
SR
0.5
–
–
V/µs
CURRENT SENSE AMPLIFIER(46)
Common Mode Rejection Ratio
Supply Voltage Rejection Ratio
(48)
Gain Bandwidth Product
Output Slew-Rate
Notes
46. This parameter is guaranteed by process monitoring but not production tested.
47. Watchdog timing period calculation formula: tPWD [ms] = [0.466 * (REXT - 20)] + 10 with (REXT in kΩ)
48.
Analog Outputs are supplied by VDD and from 100 Hz to 4.0 kHz
33912
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
t WUF
8.0
20
38
μs
–
–
5.0
t NR TOUT
110
150
205
ms
TON
130
200
270
µs
+35
%
L1, L2, L3 AND L4 INPUTS
Lx Filter Time Deglitcher(49)
STATE MACHINE TIMING
Delay Between CS LOW-to-HIGH Transition (at End of SPI Stop Command)
and Stop Mode Activation(49)
Normal Request Mode Timeout (see Figure 12, page 23)
Cyclic Sense ON Time from Stop and Sleep mode(50)
t STOP
Cyclic Sense Accuracy(49)
Delay Between SPI Command and HS /LS Turn On(51)
-35
–
–
10
μs
t S-OFF
9.0 V < VSUP < 27 V
Delay Between Normal Request and Normal mode After a Watchdog Trigger
Command (Normal Request Mode)(49)
μs
t S-ON
9.0 V < VSUP < 27 V
Delay Between SPI Command and HS /LS Turn Off(51)
μs
–
–
10
–
–
10
μs
t SNR2N
Delay Between CS Wake-up (CS LOW to HIGH) in Stop mode and:
μs
Normal Request mode, VDD ON and RST HIGH
t WUCS
9.0
15
80
First Accepted SPI Command
t WUSPI
90
—
N/A
t 2CS
4.0
—
—
35
50
70
Minimum Time Between Rising and Falling Edge on the CS
μs
J2602 DEGLITCHER
VSUP Deglitcher(52)
(DIS_J2602 = 0)
tJ2602_DEG
μs
Notes
49. This parameter is guaranteed by process monitoring but not production tested.
50. This parameter is 100% tested on an Automatic Tester. However, since it has not been monitored during reliability stresses, Freescale
does not guarantee this parameter during the product's life time.
51. Delay between turn on or off command (rising edge on CS) and HS or LS ON or OFF, excluding rise or fall time due to external load.
52. This parameter has not been monitoring during operating life test.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0KBIT/SEC ACCORDING TO LIN PHYSICAL
LAYER SPECIFICATION(53), (54)
Duty Cycle 1:
D1
THREC(MAX) = 0.744 * VSUP
THDOM(MAX) = 0.581 * VSUP
D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 µs, 7.0 V ≤ VSUP ≤ 18 V
Duty Cycle 2:
0.396
—
—
—
—
0.581
D2
THREC(MIN) = 0.422 * VSUP
THDOM(MIN) = 0.284 * VSUP
D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 µs, 7.6 V ≤ VSUP ≤ 18 V
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4KBIT/SEC ACCORDING TO LIN PHYSICAL LAYER
SPECIFICATION(53), (55)
Duty Cycle 3:
D3
THREC(MAX) = 0.778 * VSUP
THDOM(MAX) = 0.616 * VSUP
D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 µs, 7.0 V ≤ VSUP ≤ 18 V
Duty Cycle 4:
0.417
—
—
—
—
0.590
D4
THREC(MIN) = 0.389 * VSUP
THDOM(MIN) = 0.251 * VSUP
D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96 µs, 7.6 V ≤ VSUP ≤ 18 V
Notes
53. Bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD signal to LIN signal
threshold defined at each parameter. See Figure 6, page 21.
54. See Figure 7, page 21.
55. See Figure 8, page 21.
33912
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SRFAST
—
20
—
V / μs
t REC_PD
—
4.2
6.0
t REC_SYM
- 2.0
—
2.0
t PROPWL
42
70
95
t WAKE_SLEEP
—
—
1500
t WAKE_STOP
9.0
27
35
t TXDDOM
0.65
1.0
1.35
-
10
-
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR FAST SLEW RATE
LIN Fast Slew Rate (Programming mode)
LIN PHYSICAL LAYER: CHARACTERISTICS AND WAKE-UP TIMINGS
(56)
Propagation Delay and Symmetry(57)
μs
Propagation Delay of Receiver, tREC_PD = MAX (tREC_PDR, tREC_PDF)
Symmetry of Receiver Propagation Delay, tREC_PDF - tREC_PDR
Bus Wake-Up Deglitcher (Sleep and Stop
modes)(58)(62) (59)
Bus Wake-Up Event Reported
From Sleep Mode
(60)
From Stop Mode(61)
TXD Permanent Dominant State Delay
μs
μs
s
PULSE WIDTH MODULATION INPUT PIN (PWMIN)
PWMIN pin(62)
Max. frequency to drive HS and LS output pins
fPWMIN
kHz
Notes
56. VSUP from 7.0 to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD
signal to LIN signal threshold defined at each parameter. See Figure 6, page 21.
57. See Figure 9, page 22
58. See Figure 10, page 22 for Sleep and Figure 11, page 22 for Stop Mode.
59. This parameter is tested on automatic tester but has not been monitoring during operating life test.
60. The measurement is done with 1µF capacitor and 0mA current load on VDD. The value takes into account the delay to charge the
capacitor. The delay is measured between the bus wake-up threshold (VBUSWU) rising edge of the LIN bus and when VDD reaches 3.0V.
See Figure 10, page 22. The delay depends of the load and capacitor on VDD.
61.
62.
In Stop Mode, the delay is measured between the bus wake-up threshold (VBUSWU) and the falling edge of the IRQ pin. See Figure 11,
page 22.
This parameter is guaranteed by process monitoring but not production tested.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
33912
1.0 nF
LIN
TRANSIENT PULSE
GENERATOR
(NOTE)
GND
PGND LGND
AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b.
Figure 4. Test Circuit for Transient Test Pulses (LIN)
33912
Transient Pulse
Generator
(Note)
1.0 nF
L1, L2, L3, L4
10 kΩ
GND
PGND LGND AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b,.
Figure 5. Test Circuit for Transient Test Pulses (Lx)
VSUP
TXD
LIN
R0
RXD
C0
R0 AND C0 COMBINATIONS:
• 1.0 KΩ and 1.0 nF
• 660 Ω and 6.8 nF
• 500 Ω and 10 nF
Figure 6. Test Circuit for LIN Timing Measurements
33912
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TXD
tBIT
tBIT
tBUS_DOM(MAX)
VLIN_REC
THREC(MAX)
74.4% VSUP
THDOM(MAX)
58.1% VSUP
tBUS_REC(MIN)
Thresholds of
receiving node 1
LIN
THREC(MIN)
THDOM(MIN)
Thresholds of
receiving node 2
42.2% VSUP
28.4% VSUP
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD
Output of receiving Node 1
tREC_PDF(1)
tREC_PDR(1)
RXD
Output of receiving Node 2
tREC_PDF(2)
tREC_PDR(2)
Figure 7. LIN Timing Measurements for Normal Slew Rate
TXD
tBIT
tBIT
tBUS_DOM(MAX)
VLIN_REC
THREC(MAX)
77.8% VSUP
THDOM(MAX)
61.6% VSUP
tBUS_REC(MIN)
Thresholds of
receiving node 1
LIN
THREC(MIN)
THDOM(MIN)
Thresholds of
receiving node 2
38.9% VSUP
25.1% VSUP
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD
Output of receiving Node 1
tREC_PDF(1)
tREC_PDR(1)
RXD
Output of receiving Node 2
tREC_PDR(2)
tREC_PDF(2)
Figure 8. LIN Timing Measurements for Slow Slew Rate
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VLIN_REC
VBUSREC
0.6% VSUP
VBUSDOM
0.4% VSUP
VSUP
LIN BUS SIGNAL
RXD
tREC_PDF
tREC_PDR
Figure 9. LIN Receiver Timing
VLIN_REC
LIN
5.0 V
VBUSWU
DOMINANT LEVEL
3.0 V
VDD
tPROPWL
tWAKE_SLEEP
Figure 10. LIN Wake-Up Sleep Mode Timing
VLIN_REC
LIN
5.0 V
VBUSWU
DOMINANT LEVEL
IRQ
tPROPWL
tWAKE_STOP
Figure 11. LIN Wake-up Stop Mode Timing
33912
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VSUP
VDD
RST
tNRTOUT
tRST
Figure 12. Power On Reset and Normal Request Timeout Timing
tPSCLK
CS
tWSCLKH
tLEAD
tLAG
SCLK
tWSCLKL
tSISU
MOSI
UNDEFINED
D0
tSIH
DON’T CARE
D7
DON’T CARE
tVALID
tSODIS
tSOEN
MISO
D0
DON’T CARE
D7
Figure 13. SPI Timing Characteristics
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
MC33912G5AC / MC34912G5AC
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33912 was designed and developed as a highly
integrated and cost-effective solution for automotive and
industrial applications. For automotive body electronics, the
33912 is well suited to perform relay control in applications
such as a window lift, sunroof, etc. via the LIN bus.
Power switches are provided on the device configured as
high side and low side outputs. Other ports are also provided,
which include a current and voltage sense port, a Hall Sensor
port supply, and four wake-up capable pins. An internal
voltage regulator provides power to a MCU device.
Also included in this device is a LIN physical layer, which
communicates using a single wire. This enables this device
to be compatible with 3-wire bus systems, where one wire is
used for communication, one for battery, and one for ground.
FUNCTIONAL PIN DESCRIPTION
See Figure 1, 33912 Simplified Application Diagram,
page 1, for a graphic representation of the various pins
referred to in the following paragraphs. Also, see the pin
diagram on page 5 for a description of the pin locations in the
package.
RECEIVER OUTPUT PIN (RXD)
The RXD pin is a digital output. It is the receiver output of
the LIN interface and reports the state of the bus voltage:
RXD Low when LIN bus is dominant, RXD High when LIN bus
is recessive.
TRANSMITTER INPUT PIN (TXD)
The TXD pin is a digital input. It is the transmitter input of
the LIN interface and controls the state of the bus output
(dominant when TXD is Low, recessive when TXD is High).
This pin has an internal pull-up to force recessive state in
case the input is left floating.
LIN BUS PIN (LIN)
The LIN pin represents the single-wire bus transmitter and
receiver. It is suited for automotive bus systems and is
compliant to the LIN bus specification 2.0, 2.1, and SAE
J2602-2.
The LIN interface is only active during Normal Mode. See
Table 6, Operating Modes Overview.
MASTER IN SLAVE OUT PIN (MISO)
The MISO pin sends data to an SPI-enabled MCU. It is a
digital tri-state output used to shift serial data to the
microcontroller. Data on this output pin changes on the
positive edge of the SCLK. When CS is High, this pin will
remain in the high-impedance state.
CHIP SELECT PIN (CS)
CS is an active low digital input. It must remain low during
a valid SPI communication and allow for several devices to
be connected in the same SPI bus without contention. A
rising edge on CS signals the end of the transmission and the
moment the data shifted in is latched. A valid transmission
must consist of 8 bits only.
While in STOP Mode, a low-to-high level transition on this
pin will generate a wake-up condition for the 33912.
ANALOG MULTIPLEXER PIN (ADOUT0)
The ADOUT0 pin can be configured via the SPI to allow
the MCU A/D converter to read the several inputs of the
Analog Multiplexer, including the VSENSE, L1, L2, L3, L4
input voltages, and the internal junction temperature.
CURRENT SENSE AMPLIFIER PIN (ADOUT1)
The ADOUT1 pin is an analog interface to the MCU A/D
converter. It allows the MCU to read the output of the current
sense amplifier.
SERIAL DATA CLOCK PIN (SCLK)
The SCLK pin is the SPI clock input. MISO data changes
on the positive transition of the SCLK. MOSI is sampled on
the negative edge of the SCLK.
MASTER OUT SLAVE IN PIN (MOSI)
The MOSI digital pin receives SPI data from the MCU. This
data input is sampled on the negative edge of SCLK.
PWM INPUT CONTROL PIN (PWMIN)
This digital input can control the high sides and low sides
drivers in Normal Request and Normal Mode.
To enable PWM control, the MCU must perform a write
operation to the High Side Control Register (HSCR) or the
Low Side Control Register (LSCR).
This pin has an internal 20 μA current pull-up.
33912
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
RESET PIN (RST)
This bidirectional pin is used to reset the MCU in case the
33912 detects a reset condition, or to inform the 33912 that
the MCU has just been reset. After release of the RST pin,
Normal Request Mode is entered.
The RST pin is an active low filtered input and output
formed by a weak pull-up and a switchable pull-down
structure which allows this pin to be shorted either to VDD or
to GND during software development, without the risk of
destroying the driver.
INTERRUPT PIN (IRQ)
The IRQ pin is a digital output used to signal events or
faults to the MCU while in Normal and Normal Request mode
or to signal a wake-up from Stop mode. This active low output
will transition to high only after the interrupt is acknowledged
by a SPI read of the respective status bits.
WATCHDOG CONFIGURATION PIN (WDCONF)
The WDCONF pin is the configuration pin for the internal
watchdog. A resistor can be connected to this pin to configure
the window watchdog period. When connected directly to
ground, the watchdog will be disabled. When this pin is left
open, the watchdog period is fixed to its lower precision
internal default value (150 ms typical).
GROUND CONNECTION PINS (AGND, PGND,
LGND)
The AGND, PGND and LGND pins are the Analog and
Power ground pins.
The AGND pin is the ground reference of the voltage
regulator and the current sense module.
The PGND and LGND pins are used for high current load
return as in the relay-drivers and LIN interface pin.
Note: PGND, AGND and LGND pins must be connected
together.
CURRENT SENSE AMPLIFIER INPUT PINS
(ISENSEH AND ISENSEL)
The ISENSEH and ISENSEL pins are the input pins of a
ground compatible differential amplifier designed to be used
to sense the voltage drop over a shunt resistor. The main
purpose of this amplifier is to implement accurate current
sensors. The gain of the differential amplifier can be set by
SPI.
LOW SIDE PINS (LS1 AND LS2)
LS1 and LS2 are the low side driver outputs. Those
outputs are short-circuit protected and include active clamp
circuitry to drive inductive loads. Due to the energy clamp
voltage on this pin, it can raise above the battery level when
switched off. The switches are controlled through the SPI and
can be configured to respond to a signal applied to the
PWMIN input pin.
Both low side switches are protected against overheating.
In case of VS1 disconnection and the low sides are still
supplied by VBAT through a load, both low sides will have a
VDS voltage equal to the clamping value, as stated in the
specification.
DIGITAL/ANALOG PINS (L1, L2, L3 AND L4)
The Lx pins are multi purpose inputs. They can be used as
digital inputs, which can be sampled by reading the SPI and
used for wake-up when 33912 is in low power mode or used
as analog inputs for the analog multiplexer. When used to
sense voltage outside the module, a 33 kohm series resistor
must be used on each input.
When used as wake-up inputs L1-L4 can be configured to
operate in cyclic-sense mode. In this mode one or both of the
high side switches are configured to be periodically turned on
and sample the wake-up inputs. If a state change is detected
between two cycles a wake-up is initiated. The 33912 can
also wake-up from Stop or Sleep by a simple state change on
L1-L4.
When used as analog inputs, the voltage present on the Lx
pins is scaled down by an selectable internal voltage divider
and can be routed to the ADOUT0 output through the analog
multiplexer.
Note: If an Lx input is selected in the analog multiplexer, it
will be disabled as a digital input and remains disabled in low
power mode. No wake-up feature is available in that
condition.
When an Lx input is not selected in the analog multiplexer,
the voltage divider is disconnected from that input.
HIGH SIDE OUTPUT PINS (HS1 AND HS2)
These two high side switches are able to drive loads such
as relays or lamps. Their structures are connected to the VS2
supply pin. The pins are short-circuit protected and both
outputs are also protected against overheating.
HS1 and HS2 are controlled by SPI and can respond to a
signal applied to the PWMIN input pin.
HS1 and HS2 outputs can also be used during low-power
mode for the cyclic-sense of the wake inputs.
POWER SUPPLY PINS (VS1 AND VS2)
Those are the battery level voltage supply pins. In an
application, VS1 and VS2 pins must be protected against
reverse battery connection and negative transient voltages
with external components. These pins sustain standard
automotive voltage conditions such as a load dump at 40 V.
The high side switches (HS1 and HS2) are supplied by the
VS2 pin. All other internal blocks are supplied by the VS1 pin.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
MC33912G5AC / MC34912G5AC
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
VOLTAGE SENSE PIN (VSENSE)
This input can be connected directly to the battery line. It
is protected against battery reverse connection. The voltage
present in this input is scaled down by an internal voltage
divider, and can be routed to the ADOUT0 output pin and
used by the MCU to read the battery voltage.
The ESD structure on this pin allows for excursion up to
+40 V and down to -27 V, allowing this pin to be connected
directly to the battery line. It is strongly recommended to
connect a 10 kohm resistor in series with this pin for
protection purposes.
HALL SENSOR SWITCHABLE SUPPLY PIN (HVDD)
The HVDD pin needs to be connected to an external
capacitor to stabilize the regulated output voltage.
+5V MAIN REGULATOR OUTPUT PIN (VDD)
An external capacitor has to be placed on the VDD pin to
stabilize the regulated output voltage. The VDD pin is
intended to supply a microcontroller. The pin is current limited
against shorts to GND and over-temperature protected.
During Stop mode, the voltage regulator does not operate
with its full drive capabilities and the output current is limited.
During Sleep mode, the regulator output is completely shut
down.
This pin provides a switchable supply for external hall
sensors. While in Normal Mode, this current limited output
can be controlled through the SPI.
33912
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
INTRODUCTION
The 33912 offers three main operating modes: Normal
(Run), Stop, and Sleep (Low Power). In Normal mode, the
device is active and is operating under normal application
conditions. The Stop and Sleep modes are low power modes
with wake-up capabilities.
In Stop mode, the voltage regulator still supplies the MCU
with VDD (limited current capability), while in Sleep mode the
voltage regulator is turned off (VDD = 0 V).
Wake-up from Stop mode is initiated by a wake-up
interrupt. Wake-up from Sleep mode is done by a reset and
the voltage regulator is turned back on.
The selection of the different modes is controlled by the
MOD1:2 bits in the Mode Control Register (MCR).
Figure 14 describes how transitions are done between the
different operating modes. Table 6, 29, gives an overview of
the operating modes.
RESET MODE
The 33912 enters the Reset mode after a power up. In this
mode, the RST pin is low for 1.0 ms (typical value). After this
delay, it enters the Normal Request mode and the RST pin is
driven high.
The Reset mode is entered if a reset condition occurs (VDD
low, watchdog trigger fail, after wake-up from Sleep mode,
Normal Request mode timeout occurs).
NORMAL REQUEST MODE
This is a temporary mode automatically accessed by the
device after the Reset mode, or after a wake-up from Stop
mode.
In Normal Request mode, the VDD regulator is ON, the
RESET pin is High, and the LIN is operating in RX Only
mode.
As soon as the device enters in the Normal Request mode
an internal timer is started for 150 ms (typical value). During
these 150 ms, the MCU must configure the Timing Control
Register (TIMCR) and the Mode Control Register (MCR) with
MOD2 and MOD1 bits set = 0, to enter the Normal mode. If
within the 150 ms timeout, the MCU does not command the
33912 to Normal mode, it will enter in Reset mode. If the
WDCONF pin is grounded in order to disable the watchdog
function, it goes directly in Normal mode after the Reset
mode.
NORMAL MODE
In Normal mode, all 33912 functions are active and can be
controlled by the SPI interface and the PWMIN pin.
The VDD regulator is ON and delivers its full current
capability.
If an external resistor is connected between the WDCONF
pin and the Ground, the window watchdog function will be
enabled.
The wake-up inputs (L1-L4) can be read as digital inputs
or have its voltage routed through the analog-multiplexer.
The LIN interface has slew rate and timing compatible with
the LIN protocol specification 2.0, 2.1 and SAEJ2602. The
LIN bus can transmit and receive information.
The high side and low side switches are active and have
PWM capability according to the SPI configuration.
The interrupts are generated to report failures for VSUP
over/under-voltage, thermal shutdown, or thermal shutdown
prewarning on the main regulator.
SLEEP MODE
The Sleep mode is a low power mode. From Normal
mode, the device enters into Sleep mode by sending one SPI
command through the Mode Control Register (MCR), or (VDD
low > 150 ms) with VSUV = 0. When in Reset mode, a VDD
under-voltage condition with no VSUP undervoltage (VSUV =
0) will send the device to Sleep mode. All blocks are in their
lowest power consumption condition. Only some wake-up
sources (wake-up inputs with or without cyclic sense, forced
wake-up and LIN receiver) are active. The 5.0 V regulator is
OFF. The internal low-power oscillator may be active if the IC
is configured for cyclic-sense. In this condition, one of the
high side switches is turned on periodically and the wake-up
inputs are sampled.
Wake-up from Sleep mode is similar to a power-up. The
device goes in Reset mode except that the SPI will report the
wake-up source and the BATFAIL flag is not set.
STOP MODE
The Stop mode is the second low power mode, but in this
case the 5.0 V regulator is ON with limited current drive
capability. The application MCU is always supplied while the
33912 is operating in Stop mode.
The device can enter into Stop mode only by sending the
SPI command. When the application is in this mode, it can
wake-up from the 33912 side (for example: cyclic sense,
force wake-up, LIN bus, wake inputs) or the MCU side (CS,
RST pins). Wake-up from Stop mode will transition the 33912
to Normal Request mode and generates an interrupt except
if the wake-up event is a low to high transition on the CS pin
or comes from the RST pin.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Normal Request
Timeout
Expired
(t NRTOUT
)
Normal Request
timeout
expired (NR
TOUT)
VVDD
Low
DD Low
VDD High and
Normal
Request
VVDDLow
Low
DD
VVDD
LOW (>t NRTOUT
) expired) Expired
DD Low (>NRTOUT
andand
VSUV
=0
VSUV
=0
Wake-up
Wake-Up (Reset)
(Reset)
Sleep
Command
SLEEP
Command
Sleep
Stop
STOPCommand
Command
Normal
WD
Failed
WD
failed
Wake-up
(Interrupt)
Wake-Up Interrupt
Reset
Reset
Delay
(t Delay
VDD
High and
Reset
RST) expired
RST) (tExpired
WD
Disabled
WD disabled
Power Up
WDtrigger
Trigger
WD
Power
Down
Stop
VDD
VDD Low
Low
Legend
WD: Watchdog
Notes:
WD Disabled:
Watchdog disabled (WDCONF pin connected to GND)
WD
- meansisWatchdog
WD Trigger:
Watchdog
triggered by SPI command
WD
means or
Watchdog
disabled
(WDCONF
terminal connected to GND)
WD Failed: No disabled
watchdog- trigger
trigger occurs
in closed
window
WD trigger – means Watchdog is triggered by SPI command
Stop Command: Stop command sent via SPI
WD failed – means no Watchdog trigger or trigger occurs in closed window
Sleep Command: Sleep command sent via SPI
STOP Command - means STOP command sent via SPI
Wake-up from Stop Mode: L1, L2, L3 or L4 state change, LIN bus wake-up, Periodic wake-up, CS rising edge wake-up or RST wake-up.
SLEEP
Command
means
command
via wake-up,
SPI
Wake-up from
Sleep
Mode: L1,- L2,
L3 orSLEEP
L4 state
change, send
LIN bus
Periodic wake-up.
Wake-Up - means L1 or L2 state change or LIN bus wake up or SS rising edge
Figure 14. Operating Modes and Transitions
33912
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Table 6. Operating Modes Overview
Function
VDD
Reset Mode Normal Request Mode
Normal
Mode
Stop Mode
Sleep Mode
Full
Full
Full
Stop
-
-
SPI(63)
SPI
-
-
-
SPI/PWM(64)
SPI/PWM
-
HSx
-
(64)
Analog Mux
-
SPI
SPI
-
-
Lx
-
Inputs
Inputs
Wake-up
Wake-up
Current Sense
On
On
On
-
-
LIN
-
Rx-Only
HVDD
LSx
SPI/PWM
SPI/PWM
Full/Rx-Only Rx-Only/Wake-up
Watchdog
-
150 ms (typ.) timeout
On(67)/Off
Voltage
Monitoring
VSUP/VDD
VSUP/VDD
VSUP/VDD
Notes
63.
64.
65.
66.
67.
Note
(65)
Note(66)
Wake-up
-
-
VDD
-
Operation can be enabled/controlled by the SPI.
Operation can be controlled by the PWMIN input.
HSx switches can be configured for cyclic sense operation in Stop mode.
HSx switches can be configured for cyclic sense operation in Sleep mode.
Windowing operation when enabled by an external resistor.
INTERRUPTS
Low-voltage Interrupt:
Interrupts are used to signal a microcontroller that a
peripheral needs to be serviced. The interrupts which can be
generated, change according to the operating mode. While in
Normal and Normal Request modes, the 33912 signals
through interrupts special conditions which may require a
MCU software action. Interrupts are not generated until all
pending wake-up sources are read in the Interrupt Source
Register (ISR).
While in Stop mode, interrupts are used to signal wake-up
events. Sleep mode does not use interrupts. Wake-up is
performed by powering-up the MCU. In Normal and Normal
Request mode the wake-up source can be read by SPI.
The interrupts are signaled to the MCU by a low logic level
of the IRQ pin, which will remain low until the interrupt is
acknowledged by a SPI read command of the ISR register.
The IRQ pin will then be driven high.
Interrupts are only asserted while in Normal, Normal
Request and Stop mode. Interrupts are not generated while
the RST pin is low.
The following is a list of the interrupt sources in Normal and
Normal Request modes. Some of these can be masked by
writing to the SPI - Interrupt Mask Register (IMR).
Signals when the supply line (VS1) voltage drops below
the VSUV threshold (VSUV).
High-voltage Interrupt:
Signals when the supply line (VS1) voltage increases
above the VSOV threshold (VSOV).
Over-temperature Prewarning:
Signals when the 33912 temperature has reached the preshutdown warning threshold. It is used to warn the MCU that
an over-temperature shutdown in the main 5.0 V regulator is
imminent.
LIN Over-temperature Shutdown / TXD Stuck At
Dominant / RXD Short-circuit:
These signal fault conditions within the LIN interface will
cause the LIN driver to be disabled. In order to restart the
operation, the fault must be removed and TXD must go
recessive.
High Side Over-temperature Shutdown:
Signals a shutdown in the high side outputs.
Low Side Over-temperature Shutdown:
Signals a shutdown in the low side outputs.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
RESET
To reset a MCU the 33912 drives the RST pin low for the
time the reset condition lasts.
After the reset source is removed, the state machine will
drive the RST output low for at least 1.0ms (typical value)
before driving it high.
In the 33912, four main reset sources exist:
5.0 V Regulator Low-voltage-Reset (VRSTTH)
The 5.0 V regulator output VDD is continuously monitored
against brown outs. If the supply monitor detects that the
voltage at the VDD pin has dropped below the reset threshold
VRSTTH the 33912 will issue a reset. In case of overtemperature, the voltage regulator will be disabled and the
voltage monitoring will issue a VDDOT Flag independently of
the VDD voltage.
In order to select and activate direct wake-up from Lx
inputs, the Wake-up Control Register (WUCR) must be
configured with appropriate LxWE inputs enabled or
disabled. The wake-up input’s state is read through the
Wake-up Status Register (WUSR).
Lx inputs are also used to perform cyclic-sense wake-up.
Note: Selecting an Lx input in the analog multiplexer
before entering low power mode will disable the wake-up
capability of the Lx input
Wake-up from Wake-up inputs (L1-L4) with cyclic sense
timer enabled
During Sleep mode, the 5V regulator is not active, hence
all wake-up requests from Sleep mode require a power-up/
reset sequence.
The SBCLIN can wake-up at the end of a cyclic sense
period if on one of the four wake-up input lines (L1-L4) a state
change occurs. One or both HSx switch can be activated in
Sleep or Stop modes from an internal timer. Cyclic sense and
force wake-up are exclusive. If cyclic sense is enabled, the
force wake-up can not be enabled.
In order to select and activate the cyclic sense wake-up
from Lx inputs, before entering in low power modes (Stop or
Sleep modes), the following SPI set-up has to be performed:
In WUCR: select the Lx input to WU-enable.
In HSCR: enable the desired HSx.
• In TIMCR: select the CS/WD bit and determine the
cyclic sense period with CYSTx bits.
• Perform Goto Sleep/Stop command.
External Reset
Forced Wake-up
The 33912 has a bidirectional reset pin which drives the
device to a safe state (same as Reset mode) for as long as
this pin is held low. The RST pin must be held low long
enough to pass the internal glitch filter and get recognized by
the internal reset circuit. This functionality is also active in
Stop mode.
After the RST pin is released, there is no extra t RST to be
considered.
The 33912 can wake-up automatically after a
predetermined time spent in Sleep or Stop mode. Cyclic
sense and Forced wake-up are exclusive. If Forced wake-up
is enabled, the Cyclic Sense can not be enabled.
To determine the wake-up period, the following SPI set-up
has to be sent before entering in low power modes:
• In TIMCR: select the CS/WD bit and determine the low
power mode period with CYSTx bits.
• In HSCR: all HSx bits must be disabled.
Window Watchdog Overflow
If the watchdog counter is not properly serviced while its
window is open, the 33912 will detect an MCU software runaway and will reset the microcontroller.
Wake-up From Sleep Mode
WAKE-UP CAPABILITIES
Once entered into one of the low-power modes (Sleep or
Stop) only wake-up sources can bring the device into Normal
mode operation.
In Stop mode, a wake-up is signaled to the MCU as an
interrupt, while in Sleep mode the wake-up is performed by
activating the 5.0 V regulator and resetting the MCU. In both
cases the MCU can detect the wake-up source by accessing
the SPI registers and reading the Interrupt Source Register.
There is no specific SPI register bit to signal a CS wake-up or
external reset. If necessary this condition is detected by
excluding all other possible wake-up sources.
Wake-up from Wake-up inputs (L1-L4) with cyclic sense
disabled
CS Wake-up
While in Stop mode, a rising edge on the CS will cause a
wake-up. The CS wake-up does not generate an interrupt,
and is not reported on SPI.
LIN Wake-up
While in the low-power mode, the 33912 monitors the
activity on the LIN bus. A dominant pulse larger than t PROPWL
followed by a dominant to recessive transition will cause a
LIN wake-up. This behavior protects the system from a short
to ground bus condition. The bit RXONLY = 1 from LINCR
Register disables the LIN wake-up from Stop mode.
The wake-up lines are dedicated to sense state changes
of external switches and wake-up the MCU (in Sleep or Stop
mode).
33912
30
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
RST Wake-up
While in Stop mode, the 33912 can wake-up when the
RST pin is held low long enough to pass the internal glitch
filter. Then, the 33912 will change to Normal Request or
Normal modes depending on the WDCONF pin
configuration. The RST wake-up does not generate an
interrupt and is not reported via SPI.
From Stop mode, the following wake-up events can be
configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• CS wake-up
• LIN wake-up
• RST wake-up
From Sleep mode, the following wake-up events can be
configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• LIN wake-up
WINDOW WATCHDOG
The 33912 includes a configurable window watchdog
which is active in Normal mode. The watchdog can be
configured by an external resistor connected to the WDCONF
pin. The resistor is used to achieve higher precision in the
timebase used for the watchdog.
SPI clears are performed by writing through the SPI in the
MOD bits of the Mode Control Register (MCR).
During the first half of the SPI timeout, watchdog clears are
not allowed, but after the first half of the SPI timeout window,
the clear operation opens. If a clear operation is performed
outside the window, the 33912 will reset the MCU, in the
same way as when the watchdog overflows.
WINDOW CLOSED
NO WATCHDOG CLEAR
ALLOWED
WD TIMING X 50%
WINDOW OPEN
FOR WATCHDOG
CLEAR
WD TIMING X 50%
WD PERIOD (tPWD)
WD TIMING SELECTED BY RESISTOR
ON WDCONF PIN
Figure 15. Window Watchdog Operation
To disable the watchdog function in Normal mode the user
must connect the WDCONF pin to ground. This measure
effectively disables Normal Request mode. The WDOFF bit
in the Watchdog Status Register (WDSR) will be set. This
condition is only detected during Reset mode.
If neither a resistor nor a connection to ground is detected,
the watchdog falls back to the internal lower precision
timebase of 150 ms (typ.) and signals the faulty condition
through the Watchdog Status Register (WDSR).
The watchdog timebase can be further divided by a
prescaler which can be configured by the Timing Control
Register (TIMCR). During Normal Request mode, the
window watchdog is not active but there is a 150 ms (typ.)
timeout for leaving the Normal Request mode. In case of a
timeout, the 33912 will enter into Reset mode, resetting the
microcontroller before entering again into Normal Request
mode.
FAULTS DETECTION MANAGEMENT
The 33912 has the capability to detect faults like an over
or under-voltage on VS1, TxD in permanent Dominant State,
Over-temperature on HS, LIN. It is able to take corrective
actions accordingly. Most of faults are monitoring through
SPI and the Interrupt pin. The microcontroller can also take
actions.
The following table summarizes all fault sources the
device is able to detect with associated conditions. The status
for a device recovery and the SPI or pins monitoring are also
described.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Table 7. Fault Detection Management Conditions
MONITORING(69)
BLOCK
FAULT
BATTERY FAIL
VSUP OVERVOLTAGE
Power Supply
MODE
All modes
Normal, Normal
Request
VSUP UNDERVOLTAGE
VDD UNDERVOLTAGE
CONDITION
FALLOUT
VSUP<3.0 V (typ)
then power-up
VSUP > 19.25 V (typ)
In Normal mode, HS
and LS shutdown if
bit HVSE=1 (reg
MCR)
VSUP < 6.0 V (typ)
All except Sleep
VDD < 4.5 V (typ)
RECOVERY
REG (FLAG,
BIT)
INTERRUPT
Condition gone
VSR (BATFAIL, 0)
-
Condition gone, to
re-enable HS or LS
write to HSCR or
LSCR registers
VSR (VSOV,3)
-
(70)
VSR (VSUV,2)
Reset (68)
IRQ low +
ISR (0101)
IRQ low + ISR
(0101)
-
-
Condition gone
VDD OVER-TEMP
PREWARNING
VDD OVERTEMPERATURE
All except Low
Power modes
RXD PIN SHORT
CIRCUIT
LIN
TXD PIN
PERMANENT
DOMINANT
Normal, Normal
Request
VDD shutdown,
Reset then Sleep
RXD pin shorted to
GND or 5 V
LIN trans shutdown
TXD pin low for more
than 1s (typ)
Temperature >
160°C (typ)
HIGH SIDE DRIVERS
OVERTEMPERATURE
Temperature >
160°C (typ)
HS2 OPEN-LOAD
DETECTION
-
Temperature >
170°C (typ)
LIN DRIVER OVERTEMPERATURE
HS1 OPEN-LOAD
DETECTION
High Side
Temperature >
115°C (typ)
LIN transmitter
shutdown
VSR (VDDOT,1)
IRQ low + ISR
(0101)
-
-
LINSR,
(RXSHORT,3)
LIN transmitter reenabled once the
condition is gone and
TXD is high
LINSR (TXDOM,2)
IRQ low + ISR
(0100)(70)
LINSR (LINOT,1)
Both HS thermal
shutdown
Condition gone, to
re-enable HS write to
HSCR reg
All flags in HSSR
are set
IRQ low + ISR
(0010) (70)
HSSR (HS1OP,1)
Normal, Normal
Request
Current through HSx
< 5.0 mA (typ)
HSSR (HS2OP,3)
Condition gone
HS1 OVERCURRENT
HS2 OVERCURRENT
LOW SIDE DRIVERS
OVERTEMPERATURE
LS1 OPEN-LOAD
Low Side
LS2 OPEN-LOAD
Normal, Normal
Request
Temperature >
160°C (typ)
Both LS thermal
shutdown
HSSR (HS2CL,2)
Condition gone, to
re-enable LS write to
LSCR reg
All flags in LSSR are
set
IRQ low + ISR
(0011) (70)
LSSR (LS2OP,3)
-
Normal Request
The MCU did not
command the device
to Normal mode
within the 150 ms
timeout after reset
Reset
WATCHDOG
TIMEOUT
Normal
WD timeout or WD
clear within the
window closed
Reset
WATCHDOG ERROR
Normal
WDCONF pin is
floating
WD internal lower
precision timebase
150 ms (typ)
NORMAL REQUEST
TIME-OUT EXPIRED
HSSR (HS1CL,0)
LSSR (LS1OP,1)
Current through LSx
< 7.5mA (typ)
LSx on with limited
current capability
160 mA (min)
LS2 OVER-CURRENT
Notes
68.
69.
70.
HSx on with limited
current capability
60 mA (min)
Current through LSx
tends to rise above
the current limit
160 mA (min)
LS1 OVER-CURRENT
Watchdog
Current through HSx
tends to rise above
the current limit
60 mA (min)
LSSR (LS1CL,0)
-
LSSR (LS2CL,2)
WDSR (WDTO, 3)
Connect WDCONF
to a resistor or to
GND
WDSR (WDERR, 2)
When in Reset mode a VDD under-voltage condition combined with no VSUP under-voltage (VSUV=0) will send the device to Sleep mode.
Registers to be read when back in Normal Request or Normal mode depending on the fault. Interrupts only generated in Normal, Normal Request and Stop modes
Unless masked, If masked IRQ remains high and the ISR flags are not set.
33912
32
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
TEMPERATURE SENSE GAIN
The analog multiplexer can be configured via SPI to allow
the ADOUT0 pin to deliver the internal junction temperature
of the device.
The graph below illustrates the internal chip temp sense
obtained per characterization at 3 temperatures with 3
different lots and 30 samples.
Temperature Sense Analog Output Voltage
5
4.5
Vadout0 (V)
4
3.5
3
2.5
2
-50
0
50
100
150
Temperature (°C)
Figure 16. Temperature Sense Gain
HIGH SIDE OUTPUT PINS HS1 AND HS2
These outputs are two high side drivers intended to drive
small resistive loads or LEDs incorporating the following
features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• High-voltage shutdown (software maskable)
• Cyclic sense
The high side switches are controlled by the bits HS1:2 in
the High Side Control Register (HSCR).
PWM Capability (direct access)
Each high side driver offers additional (to the SPI control)
direct control via the PWMIN pin.
If both the bits HS1 and PWMHS1 are set in the High Side
Control Register (HSCR), then the HS1 driver is turned on if
the PWMIN pin is high and turned of if the PWMIN pin is low.
This applies to HS2 configuring HS2 and PWMHS2 bits.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
33
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Interrupt
Control
Module
MOD1:2
HSx
HSxOP
VDD
VDD
PWMIN
High-Side Interrupt
High Voltage Shutdown
HVSE
PWMHSx
VS2
on/off
Control
Status
HSxCL
High Side Driver
charge pump
open load detection
current limitation
over-temperture shutdown (interrupt maskable)
high voltage shutdown (maskable)
Cyclic Sense
HSx
Wakeup
Module
Figure 17. High Side Drivers HS1 and HS2
Open Load Detection
Each high side driver signals an open load condition if the
current through the high side is below the open load current
threshold.
The open load condition is indicated with the bits HS1OP
and HS2OP in the High Side Status Register (HSSR).
Current Limitation
Each high side driver has an output current limitation. In
combination with the over-temperature shutdown the highside drivers are protected against over-current and shortcircuit failures.
When the driver operates in the current limitation area, it is
indicated with the bits HS1CL and HS2CL in the HSSR.
Note: If the driver is operating in current limitation mode,
excessive power might be dissipated.
A write to the High Side Control Register (HSCR), when
the over-temperature condition is gone, will re-enable the
high side drivers.
High-voltage Shutdown
In case of a high voltage condition and if the high voltage
shutdown is enabled (bit HVSE in the Mode Control Register
(MCR) is set both high side drivers are shut down.
A write to the High Side Control Register (HSCR), when
the high voltage condition is gone, will re-enable the high side
drivers.
Sleep And Stop Mode
The high side drivers can be enabled to operate in Sleep
and Stop mode for cyclic sensing. Also see Table 6,
Operating Modes Overview.
Over-temperature Protection (HS Interrupt)
LOW SIDE OUTPUT PINS LS1 AND LS2
Both high side drivers are protected against overtemperature. In case of an over-temperature condition both
high side drivers are shut down and the event is latched in the
Interrupt Control Module. The shutdown is indicated as HS
Interrupt in the Interrupt Source Register (ISR).
A thermal shutdown of the high side drivers is indicated by
setting all HSxOP and HSxCL bits simultaneously.
These outputs are two low side drivers intended to drive
relays incorporating the following features:
If the bit HSM is set in the Interrupt Mask Register (IMR),
then an interrupt (IRQ) is generated.
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• Active clamp (for driving relays)
• High-voltage shutdown (software maskable)
The low side switches are controlled by the bit LS1:2 in the
Low Side Control Register (LSCR).
33912
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
To protect the device against over-voltage when an
inductive load (relay) is turned off. An active clamp will reenable the low side FET if the voltage on the LS1 or LS2 pin
exceeds a certain level.
If both the bits LS1 and PWMLS1 are set in the Low Side
Control Register (LSCR), then the LS1 driver is turned on if
the PWMIN pin is high and turned off if the PWMIN pin is low.
The same applies to the LS2 and PWMLS2 bits for the LS2
driver.
PWM Capability (direct access)
Each low side driver offers additional (to the SPI control)
direct control via the PWMIN pin.
HVSE
VDD
Interrupt
Control
Module
VDD
MOD1:2
LSx
LSxOP
PWMLSx
Low Side Interrupt
High-voltage Shutdown
PWMIN
active
clamp
LSx
on/off
Control
LSxCL
Status
Low Side Driver
(active clamp)
Open-load Detection
Current Limitation
Over-temperture Shutdown (interrupt maskable)
High-voltage shutdown (maskable)
PGND
Figure 18. Low Side Drivers LS1 and LS2
Open Load Detection
High-voltage Shutdown
Each low side driver signals an open load condition if the
current through the low side is below the open load current
threshold.
The open load condition is indicated with the bit LS1OP
and LS2OP in the Low Side Status Register (LSSR).
In case of a high-voltage condition and if the high-voltage
shutdown is enabed (bit HVSE in the Mode Control Register
(MCR) is set) both low sides drivers are shut down.
A write to the Low Side Control Register (LSCR), when the
high-voltage condition is gone, will re-enable the low side
drivers.
Current Limitation
Each low side driver has a current limitation. In
combination with the over-temperature shutdown the low
side drivers are protected against over-current and shortcircuit failures.
When the drivers operate in current limitation, this is
indicated with the bits LS1CL and LS2CL in the LSSR.
Note: If the drivers are operating in current limitation mode
excessive power might be dissipated.
Over-temperature Protection (LS Interrupt)
Both low side drivers are protected against overtemperature. In case of an over-temperature condition both
low side drivers are shut down and the event is latched in the
Interrupt Control Module. The shutdown is indicated as an LS
Interrupt in the Interrupt Source Register (ISR).
If the bit LSM is set in the Interrupt Mask Register (IMR)
then an Interrupt (IRQ) is generated.
A write to the Low Side Control Register (LSCR), when the
over-temperature condition is gone, will re-enable the low
side drivers.
Sleep And Stop Mode
The low side drivers are disabled in Sleep and Stop mode.
Also see Table 6, Operating Modes Overview.
LIN PHYSICAL LAYER
The LIN bus pin provides a physical layer for single-wire
communication in automotive applications. The LIN physical
layer is designed to meet the LIN physical layer specification
and has the following features:
• LIN physical layer 2.0, 2.1 and SAEJ2602 compliant
• Slew rate selection
• Over-temperature shutdown
• Advanced diagnostics
The LIN driver is a low side MOSFET with thermal
shutdown. An internal pull-up resistor with a serial diode
structure is integrated, so no external pull-up components are
required for the application in a slave node. The fall time from
dominant to recessive and the rise time from recessive to
dominant is controlled. The symmetry between both slopes is
guaranteed.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
LIN Pin
The LIN pin offers a high susceptibility immunity level from
external disturbance, guaranteeing communication during
external disturbance.
WAKE-UP
MODULE
LIN
Wake-up
MOD1:2
LSR0:1
J2602
VS1
LIN DRIVER
RXONLY
Slope and Slew Rate Control
RXSHORT
Over-temperature Shutdown (interrupt maskable)
TXDOM
LINOT
30 K
LIN
TXD
SLOPE
CONTROL
WAKE-UP
FILTER
LGND
RXD
RECEIVER
Figure 19. LIN Interface
Slew Rate Selection
The slew rate can be selected for optimized operation at
10.4 and 20 kBit/s as well as a fast baud rate for test and
programming. The slew rate can be adapted with the bits
LSR1:0 in the LIN Control Register (LINCR). The initial slew
rate is optimized for 20 kBit/s.
J2602 Conformance
To be compliant with the SAE J2602-2 specification, the
J2602 feature has to be enabled in the LINCR Register (bit
DIS_J2602 sets to 0). The LIN transmitter is disabled in case
of a VSUP under-voltage condition occurs and TXD is in
Recessive State: the LIN bus goes in Recessive State and
RXD goes high. The LIN transmitter is not disabled if TXD is
in Dominant State. A deglitcher on Vsup (tJ2602_DEG) is
implemented to avoid false switching.
If the (DIS_J2602) bit is set to 1, the J2602 feature is
disabled and the communication TXD-LIN-RXD works for
VSUP down to 4.6 V (typical value) and then the
communication is interrupted.
The (DIS_J2602) bit is set per default to 0.
Over-temperature Shutdown (LIN Interrupt)
The output low side FET is protected against overtemperature conditions. In case of an over-temperature
condition, the transmitter will be shut down and the LINOT bit
in the LIN Status Register (LINSR) is set.
If the LINM bit is set in the Interrupt Mask Register (IMR),
an Interrupt IRQ will be generated.
The transmitter is automatically re-enabled once the
condition is gone and TXD is high.
RXD Short-circuit Detection (LIN Interrupt)
The LIN transceiver has a short-circuit detection for the
RXD output pin. If the device transmits and in case of a short-
33912
36
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
circuit condition, either 5.0 V or Ground, the RXSHORT bit in
the LIN Status Register (LINSR) is set and the transmitter is
shut down.
If the LINM bit is set in the Interrupt Mask Register (IMR),
an Interrupt IRQ will be generated.
The transmitter is automatically re-enabled once the
condition is gone (transition on RXD) and TXD is high.
A read of the LIN Status Register (LINSR) without the RXD
pin short-circuit condition will clear the bit RXSHORT.
TXD Dominant Detection (LIN Interrupt)
The LIN transceiver monitors the TXD input pin to detect a
stuck in dominant (0 V) condition. In case of a stuck condition
(TXD pin 0 V for more than 1 second (typ.)), the transmitter is
shut down and the TXDOM bit in the LIN Status Register
(LINSR) is set.
If the LINM bit is set in the IMR, an Interrupt IRQ will be
generated.
The transmitter is automatically re-enabled once TXD is
high.
A read of the LIN Status Register (LINSR) with the TXD pin
at 5.0 V will clear the bit TXDOM.
LIN Receiver Operation Only
While in Normal mode, the activation of the RXONLY bit
disables the LIN TXD driver. In case of a LIN error condition,
this bit is automatically set. If Stop mode is selected with this
bit set, the LIN wake-up functionality is disabled and the RXD
pin will reflect the state of the LIN bus.
STOP Mode And Wake-up Feature
During Stop mode operation, the transmitter of the
physical layer is disabled. The receiver is still active and able
to detect wake-up events on the LIN bus line.
A dominant level longer than TPROPWL followed by a rising
edge will generate a wake-up interrupt, and will be reported
in the Interrupt Source Register (ISR). Also see Figure 11,
page 22.
SLEEP Mode And Wake-up Feature
During Sleep mode operation, the transmitter of the
physical layer is disabled. The receiver must be active to
detect wake-up events on the LIN bus line.
A dominant level longer than TPROPWL followed by a rising
edge will generate a system wake-up (Reset), and will be
reported in the Interrupt Source Register (ISR). Also see
Figure 10, page 22.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
37
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
LOGIC COMMANDS AND REGISTERS
33912 SPI INTERFACE AND CONFIGURATION
• MISO — Master-in Slave-out
• SCLK— Serial Clock
A complete data transfer via the SPI consists of 1 byte.
The master sends 4 bits of address (A3:A0) + 4 bits of control
information (C3:C0) and the slave replies with 4 system
status bits (VMS,LINS,HSS,LSS) + 4 bits of status
information (S3:S0).
The serial peripheral interface creates the communication
link between a microcontroller (master) and the 33912.
The interface consists of four pins (see Figure 20):
• CS — Chip Select
• MOSI — Master-out Slave-in
CS
Register Write Data
MOSI
A3
A2
A1
A0
C3
C2
C1
C0
S1
S0
Register Read Data
MISO
VMS LINS HSS
LSS
S3
S2
SCLK
Read Data Latch
Rising: 33912 changes MISO/
MCU changes MOSI
Write Data Latch
Falling: 33912 samples MOSI/
MCU samples MISO
Figure 20. SPI Protocol
During the inactive phase of the CS (HIGH), the new data
The rising edge of the Chip Select CS indicates the end of
transfer is prepared.
the transfer and latches the write data (MOSI) into the
register. The CS high forces MISO to the high-impedance
The falling edge of the CS indicates the start of a new data
state.
transfer and puts the MISO in the low-impedance state and
Register reset values are described along with the reset
latches the analog status data (Register read data).
condition.
Reset condition is the condition causing the bit to
With the rising edge of the SPI clock (SCLK), the data is
be set to its reset value. The main reset conditions are:
moved to MISO/MOSI pins. With the falling edge of the SPI
- Power-On Reset (POR): the level at which the logic is
clock (SCLK), the data is sampled by the receiver.
reset
and BATFAIL flag sets.
The data transfer is only valid if exactly 8 sample clock
- Reset mode
edges are present during the active (low) phase of CS.
- Reset done by the RST pin (ext_reset)
33912
38
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
SPI REGISTER OVERVIEW
Table 8. System Status Register
Adress(A3:A0)
$0 - $F
BIT
Register Name / Read / Write Information
SYSSR - System Status Register
R
7
6
5
4
VMS
LINS
HSS
LSS
Table 9 summarizes the SPI Register content for Control Information (C3:C0)=W and status information (S3:S0) = R.
Table 9. SPI Register Overview
Adress(A3:A0)
BIT
Register Name / Read / Write Information
3
2
1
0
MCR - Mode Control Register
W
HVSE
0
MOD2
MOD1
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
WUCR - Wake-up Control Register
W
L4WE
L3WE
L2WE
L1WE
WUSR - Wake-up Status Register
R
L4
L3
L2
L1
WUSR - Wake-up Status Register
R
L4
L3
L2
L1
LINCR - LIN Control Register
W
DIS_J2602
RXONLY
LSR1
LSR0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
0
HSCR - High Side Control Register
W
PWMHS2
PWMHS1
HS2
HS1
HSSR - High Side Status Register
R
HS2OP
HS2CL
HS1OP
HS1CL
HSSR - High Side Status Register
R
HS2OP
HS2CL
HS1OP
HS1CL
LSCR - Low Side Control Register
W
PWMLS2
PWMLS1
LS2
LS1
LSSR - Low Side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
LSSR - Low Side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
TIMCR - Timing Control Register
W
CS/WD
WD2
WD1
WD0
CYST2
CYST1
CYST0
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$B
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$C
AMUXCR - Analog Multiplexer Control Register
W
LXDS
MX2
MX1
MX0
$D
CFR - Configuration Register
W
HVDD
CYSX8
CSAZ
CSGS
IMR - Interrupt Mask Register
W
HSM
LSM
LINM
VMM
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
$0
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$E
$F
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
REGISTER DEFINITIONS
1 = High Side Status bit set
0 = None
System Status Register - SYSSR
The System Status Register (SYSSR) is always
transferred with every SPI transmission and gives a quick
system status overview. It summarizes the status of the
Voltage Monitor Status (VMS), LIN Status (LINS), High Side
Status (HSS), and the Low Side Status (LSS).
HS1CL
HS1OP
HSS
HS2CL
HS2OP
Table 10. System Status Register
Figure 23. High Side Status
S7
S6
S5
S4
VMS
LINS
HSS
LSS
LSS - Low Side Switch Status
Read
VMS - Voltage Monitor Status
This read-only bit indicates that one or more bits in the
VSR are set.
This read-only bit indicates that one or more bits in the
LSSR are set.
1 = Low Side Status bit set
0 = None
1 = Voltage Monitor bit set
0 = None
LS1CL
LS1OP
BATFAIL
VDDOT
VSUV
LSS
LS2CL
LS2OP
VMS
Figure 24. Low Side Status
VSOV
Mode Control Register - MCR
Figure 21. Voltage Monitor Status
LINS - LIN Status
This read-only bit indicates that one or more bits in the
LINSR are set.
1 = LIN Status bit set
0 = None
LINOT
TXDOM
LINS
The Mode Control Register (MCR) allows switching
between the operation modes and to configure the 33912.
Writing the MCR will return the VSR.
Table 11. Mode Control Register - $0
C3
C2
C1
C0
Write
HVSE
0
MOD2
MOD1
Reset
Value
1
0
-
-
Reset
Condition
POR
POR
-
-
RXSHORT
Figure 22. LIN Status
HSS - High Side Switch Status
This read-only bit indicates that one or more bits in the
HSSR are set.
HVSE - High-voltage Shutdown Enable
This write-only bit enables/disables automatic shutdown of
the high side and the low side drivers during a high-voltage
VSOV condition.
1 = automatic shutdown enabled
0 = automatic shutdown disabled
33912
40
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
MOD2, MOD1 - Mode Control Bits
These write-only bits select the operating mode and allow
clearing the watchdog in accordance with Table 8 Mode
Control Bits.
1 = POR Reset has occurred
0 = POR Reset has not occurred
Wake-up Control Register - WUCR
MOD2
MOD1
Description
This register is used to control the digital wake-up inputs.
Writing the WUCR will return the Wake-Up Status Register
(WUSR).
0
0
Normal Mode
Table 14. Wake-Up Control Register - $2
0
1
Stop Mode
1
0
Sleep Mode
1
1
Normal Mode + Watchdog Clear
Table 12. Mode Control Bits
Voltage Status Register - VSR
Returns the status of the several voltage monitors. This
register is also returned when writing to the Mode Control
Register (MCR).
C2
C1
C0
Write
L4WE
L3WE
L2WE
L1WE
Reset
Value
1
1
1
1
Reset
Condition
POR, Reset mode or ext_reset
LxWE - Wake-up Input x Enable
Table 13. Voltage Status Register - $0/$1
Read
C3
S3
S2
S1
S0
VSOV
VSUV
VDDOT
BATFAIL
VSOV - VSUP Over-voltage
This read-only bit indicates an over-voltage condition on
the VS1 pin.
1 = Over-voltage condition.
0 = Normal condition.
VSUV - VSUP Under-voltage
This read-only bit indicates an under-voltage condition on
the VS1 pin.
1 = Under-voltage condition.
0 = Normal condition.
VDDOT - Main Voltage Regulator Over-temperature
Warning
This read-only bit indicates that the main voltage regulator
temperature reached the Over-temperature Prewarning
Threshold.
1 = Over-temperature Prewarning
0 = Normal
BATFAIL - Battery Fail Flag.
This read-only bit is set during power-up and indicates that
the 33912 had a Power-On-Reset (POR).
Any access to the MCR or VSR will clear the BATFAIL flag.
This write-only bit enables/disables which Lx inputs are
enabled. In Stop and Sleep mode the LxWE bit determines
which wake inputs are active for wake-up. If one of the Lx
inputs is selected on the analog multiplexer, the
corresponding LxWE is masked to 0.
1 = Wake-up Input x enabled.
0 = Wake-up Input x disabled.
Wake-up Status Register - WUSR
This register is used to monitor the digital wake-up inputs
and is also returned when writing to the WUCR.
Table 15. Wake-up Status Register - $2/$3
Read
S3
S2
S1
S0
L4
L3
L2
L1
Lx - Wake-up input x
This read-only bit indicates the status of the corresponding
Lx input. If the Lx input is not enabled, then the according
Wake-up status will return 0.
After a wake-up from Stop or Sleep mode these bits also
allow to determine which input has caused the wake-up, by
first reading the Interrupt Status Register (ISR) and then
reading the WUSR. The source of the wake-up is only
reported on the first WUCR or WUSR access.
1 = Lx pin high, or Lx is the source of the wake-up.
0 = Lx pin low, disabled or selected as an analog input.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
41
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
LIN Control Register - LINCR
LIN Status Register - LINSR
This register controls the LIN physical interface block.
Writing the LIN Control Register (LINCR) returns the LIN
Status Register (LINSR).
Table 16. LIN Control Register - $4
This register returns the status of the LIN physical
interface block and is also returned when writing to the
LINCR.
C3
C2
C1
C0
Write
DIS_J2602
RXONLY
LSR1
LSR0
Reset
Value
0
0
0
0
POR
POR, Reset
mode, ext_reset
or LIN failure
gone*
Table 18. LIN Status Register - $4/$5
Read
Reset
Condition
S3
S2
S1
S0
RXSHORT
TXDOM
LINOT
0
RXSHORT - RXD Pin Short-circuit
POR
* LIN failure gone: if LIN failure (over-temp, TXD/RXD short) was set,
the flag resets automatically when the failure is gone.
J2602 - LIN Dominant Voltage Select
This write-only bit controls the J2602 circuitry. If the
circuitry is enabled (bit sets to 0), the TXD-LIN-RXD
communication works down to the battery under-voltage
condition is detected. Below, the bus is in recessive state. If
the circuitry is disabled (bit sets to 1), the communication
TXD-LIN-RXD works down to 4.6 V (typical value).
0 = Enabled J2602 feature.
1 = Disabled J2602 feature.
RXONLY - LIN Receiver Operation Only
This write-only bit controls the behavior of the LIN
transmitter.
In Normal mode, the activation of the RXONLY bit disables
the LIN transmitter. In case of a LIN error condition, this bit is
automatically set.
In Stop mode this bit disables the LIN wake-up
functionality, and the RXD pin will reflect the state of the LIN
bus.
1 = only LIN receiver active (Normal mode) or LIN wakeup disabled (Stop mode).
0 = LIN fully enabled.
LSRx - LIN Slew-Rate
This read-only bit indicates a short-circuit condition on the
RXD pin (shorted either to 5.0 V or to Ground). The shortcircuit delay must be a worst case of 8µs to be detected and
to shut down the driver. To clear this bit, it must be read after
the condition is gone (transition detected on RXD pin). The
LIN driver is automatically re-enabled once the condition is
gone and TXD is high.
1 = RXD short-circuit condition.
0 = None.
TXDOM - TXD Permanent Dominant
This read-only bit signals the detection of a TXD pin stuck
at dominant (Ground) condition and the resultant shutdown in
the LIN transmitter. This condition is detected after the TXD
pin remains in dominant state for more than 1 second (typical
value).
To clear this bit, it must be read after TXD has gone high.
The LIN driver is automatically re-enabled once TXD goes
High.
1 = TXD stuck at dominant fault detected.
0 = None.
LINOT - LIN Driver Over-temperature
This read-only bit signals that the LIN transceiver was
shutdown due to over-temperature. The transmitter is
automatically re-enabled after the over-temperature
condition is gone and TXD is high. The LINOT bit is cleared
after SPI read once the condition is gone.
1 = LIN over-temperature shutdown
0 = None
This write-only bit controls the LIN driver slew-rate in
accordance with Table .
Table 17. LIN Slew Rate Control
LSR1
LSR0
Description
0
0
Normal Slew Rate (up to 20 kb/s)
0
1
Slow Slew Rate (up to 10 kb/s)
1
0
Fast Slew Rate (up to 100 kb/s)
1
1
Reserved
33912
42
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
High Side Control Register - HSCR
Low Side Control Register - LSCR
This register controls the operation of the high side drivers.
Writing to this register returns the High Side Status Register
(HSSR).
This register controls the operation of the low side drivers.
Writing the Low Side Control Register (LSCR) will also return
the Low Side Status Register (LSSR).
Table 19. High Side Control Register - $6
Table 21. Low Side Control Register - $8
C3
C2
C1
C0
Write
PWMHS2
PWMHS1
HS2
HS1
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset mode, ext_reset, HSx
over-temp or (VSOV & HVSE)
POR
C3
C2
C1
C0
Write
PWMLS2
PWMLS1
LS2
LS1
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset mode, ext_reset, LSx
over-temp or (VSOV & HVSE)
POR
PWMHSx - PWM Input Control Enable.
PWMLx - PWM Input Control Enable.
This write-only bit enables/disables the PWMIN input pin
to control the respective high side switch. The corresponding
high side switch must be enabled (HSx bit).
1 = PWMIN input controls HSx output.
0 = HSx is controlled only by SPI.
This write-only bit enables/disables the PWMIN input pin
to control the respective low side switch. The corresponding
low side switch must be enabled (LSx bit).
1 = PWMIN input controls LSx.
0 = LSx is controlled only by SPI.
HSx - HSx Switch Control.
LSx - LSx Switch Control.
This write-only bit enables/disables the corresponding
high side switch.
1 = HSx switch on.
0 = HSx switch off.
This write-only bit enables/disables the corresponding low
side switch.
1 = LSx switch on.
0 = LSx switch off.
High Side Status Register - HSSR
Low Side Status Register - LSSR
This register returns the status of the high side switches
and is also returned when writing to the HSCR.
This register returns the status of the low side switches
and is also returned when writing to the LSCR.
Table 20. High Side Status Register - $6/$7
Read
S3
S2
S1
S0
HS2OP
HS2CL
HS1OP
HS1CL
Table 22. Low Side Status Register - $8/$9
Read
C3
C2
C1
C0
LS2OP
LS2CL
LS1OP
LS1CL
High Side Thermal Shutdown
Low Side Thermal Shutdown
A thermal shutdown of the high side drivers is indicated by
setting all HSxOP and HSxCL bits simultaneously.
A thermal shutdown of the low side drivers is indicated by
setting all LSxOP and LSxCL bits simultaneously.
HSxOP - High Side Switch Open-Load Detection
LSxOP - Low Side Switch Open-Load Detection
This read-only bit signals that the high side switches are
conducting current below a certain threshold indicating
possible load disconnection.
This read-only bit signals that the low side switches are
conducting current below a certain threshold indicating
possible load disconnection.
1 = HSx Open Load detected (or thermal shutdown)
0 = Normal
1 = LSx Open Load detected (or thermal shutdown)
0 = Normal
HSxCL - High Side Current Limitation
LSxCL - Low Side Current Limitation
This read-only bit indicates that the respective high side
switch is operating in current limitation mode.
1 = HSx in current limitation (or thermal shutdown)
0 = Normal
This read-only bit indicates that the respective low side
switch is operating in current limitation mode.
1 = LSx in current limitation (or thermal shutdown)
0 = Normal
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
43
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
Timing Control Register - TIMCR
This register allows to configure the watchdog, the cyclic
sense and Forced Wake-up periods. Writing to the Timing
Control Register (TIMCR) will also return the Watchdog
Status Register (WDSR).
Table 23. Timing Control Register - $A
C3
Write
C2
C1
C0
WD2
WD1
WD0
CYST2
CYST1
CYST0
0
0
0
CS/WD
Reset
Value
-
Reset
Condition
-
POR
CS/WD - Cyclic Sense or Watchdog Prescaler Select
This write-only bit selects which prescaler is being written
to, the Cyclic Sense/Forced Wake-up prescaler or the
Watchdog prescaler.
1 = Cyclic Sense/Forced Wake-up Prescaler selected
0 = Watchdog Prescaler select
WDx - Watchdog Prescaler
This write-only bits selects the divider for the watchdog
prescaler and therefore selects the watchdog period in
accordance with Table 24. This configuration is valid only if
windowing watchdog is active.
Table 24. watchdog Prescaler
WD2
WD1
WD0
Prescaler Divider
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
6
1
0
0
8
1
0
1
10
1
1
0
12
1
1
1
14
CYSTx - Cyclic Sense Period Prescaler Select
This write-only bits selects the interval for the wake-up
cyclic sensing together with the bit CYSX8 in the
Configuration Register (CFR) (see page 45).
This option is only active if one of the high side switches is
enabled when entering in Stop or Sleep mode. Otherwise, a
timed wake-up is performed after the period shown in
Table 25.
Table 25. Cyclic Sense and Force Wake up Interval
CYSX8(71)
CYST2
CYST1
CYST0
Interval
X
0
0
0
No cyclic sense(72)
0
0
0
1
20 ms
0
0
1
0
40 ms
0
0
1
1
60 ms
0
1
0
0
80 ms
0
1
0
1
100 ms
0
1
1
0
120 ms
0
1
1
1
140 ms
1
0
0
1
160 ms
1
0
1
0
320 ms
1
0
1
1
480 ms
1
1
0
0
640 ms
1
1
0
1
800 ms
1
1
1
0
960 ms
1
1
1
1
1120 ms
Notes
71. bit CYSX8 is located in Configuration Register (CFR)
72. No Cyclic Sense and no Force Wake-up available.
Watchdog Status Register - WDSR
This register returns the Watchdog status information and
is also returned when writing to the TIMCR.
Table 26. Watchdog Status Register - $A/$B
Read
S3
S2
S1
S0
WDTO
WDERR
WDOFF
WDWO
WDTO - Watchdog Timeout
This read-only bit signals the last reset was caused by
either a watchdog timeout or by an attempt to clear the
Watchdog within the window closed.
Any access to this register or the Timing Control Register
(TIMCR) will clear the WDTO bit.
1 = Last reset caused by watchdog timeout
0 = None
33912
44
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
WDERR - Watchdog Error
Table 28. Analog Multiplexer Channel Select
This read-only bit signals the detection of a missing
watchdog resistor. In this condition the watchdog is using the
internal, lower precision timebase. The Windowing function is
disabled.
1 = WDCONF pin resistor missing
0 = WDCONF pin resistor not floating
MX2
MX1
MX0
Meaning
0
0
0
Disabled
0
0
1
Reserved
0
1
0
Die Temperature Sensor
0
1
1
VSENSE input
1
0
0
L1 input
WDOFF - Watchdog Off
1
0
1
L2 input
This read-only bit signals that the watchdog pin connected
to Ground and therefore disabled. In this case watchdog
timeouts are disabled and the device automatically enters
Normal mode out of Reset. This might be necessary for
software debugging and for programming the Flash memory.
1 = Watchdog is disabled
0 = Watchdog is enabled
1
1
0
L3 input
1
1
1
L4 input
WDWO - Watchdog Window Open
This read-only bit signals when the watchdog window is
open for clears. The purpose of this bit is for testing. Should
be ignored in case WDERR is High.
1 = Watchdog window open
0 = Watchdog window closed
Analog Multiplexer Control Register - MUXCR
This register controls the analog multiplexer and selects
the divider ration for the Lx input divider.
Table 27. Analog Multiplexer Control Register -$C
C3
C2
C1
C0
Write
LXDS
MX2
MX1
MX0
Reset
Value
1
0
0
0
Reset
Condition
POR
POR, Reset mode or ext_reset
LXDS - Lx Analog Input Divider Select
This write-only bit selects the resistor divider for the Lx
analog inputs. Voltage is internally clamped to VDD.
0 = Lx Analog divider: 1
1 = Lx Analog divider: 3.6 (typ.)
MXx - Analog Multiplexer Input Select
These write-only bits selects which analog input is
multiplexed to the ADOUT0 pin according to Table 28.
When disabled or when in Stop or Sleep mode, the output
buffer is not powered and the ADOUT0 output is left floating
to achieve lower current consumption.
Configuration Register - CFR
This register controls the Hall Sensor Supply enable/
disable, the cyclic sense timing multiplier, enables/disables
the Current Sense Auto-zero function and selects the gain for
the current sense amplifier.
Table 29. Configuration Register - $D
C3
C2
C1
C0
Write
HVDD
CYSX8
CSAZ
CSGS
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset
mode or
ext_reset
POR
POR
POR
HVDD - Hall Sensor Supply Enable
This write-only bit enables/disables the state of the hall
sensor supply.
1 = HVDD on
0 = HVDD off
CYSX8 - Cyclic Sense Timing x 8.
This write-only bit influences the cyclic sense and Forced
Wake-up period as shown in Table 25.
1 = Multiplier enabled
0 = None
CSAZ - Current Sense Auto-Zero Function Enable
This write-only bit enables/disables the circuitry to lower
the offset voltage of the current sense amplifier.
1 = Auto-zero function enabled
0 = Auto-zero function disabled
CSGS - Current Sense Amplifier Gain Select
This write-only bit selects the gain of the current sense
amplifier.
1 = 14.5 (typ.)
0 = 30 (typ.)
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
45
MC33912G5AC / MC34912G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
Interrupt Mask Register - IMR
LINM - LIN Interrupts Mask
This register allows masking of some of the interrupt
sources. No interrupt will be generated to the MCU and no
flag will be set in the ISR register. The 5.0 V Regulator overtemperature prewarning interrupt and under-voltage (VSUV)
interrupts can not be masked and will always cause an
interrupt.
This write-only bit enables/disables interrupts generated in
the LIN block.
1 = LIN Interrupts Enabled
0 = LIN Interrupts Disabled
VMM - Voltage Monitor Interrupt Mask
Writing to the IMR will return the ISR.
This write-only bit enables/disables interrupts generated in
the Voltage Monitor block. The only maskable interrupt in the
Voltage Monitor Block is the VSUP over-voltage interrupt.
1 = Interrupts Enabled
0 = Interrupts Disabled
Table 30. Interrupt Mask Register - $E
C3
C2
C1
C0
Write
HSM
LSM
LINM
VMM
Reset
Value
1
1
1
1
Reset
Condition
Interrupt Source Register - ISR
This register allows the MCU to determine the source of
the last interrupt or wake-up respectively. A read of the
register acknowledges the interrupt and leads IRQ pin to
high, in case there are no other pending interrupts. If there
are pending interrupts, IRQ will be driven high for 10 µs and
then be driven low again.
This register is also returned when writing to the Interrupt
Mask Register (IMR).
POR
HSM - High Side Interrupt Mask
This write-only bit enables/disables interrupts generated in
the high side block.
1 = HS Interrupts Enabled
0 = HS Interrupts Disabled
Table 31. Interrupt Source Register - $E/$F
LSM - Low Side Interrupt Mask
This write-only bit enables/disables interrupts generated in
the low side block.
1 = LS Interrupts Enabled
0 = LS Interrupts Disabled
Read
S3
S2
S1
S0
ISR3
ISR2
ISR1
ISR0
ISRx - Interrupt Source Register
These read-only bits indicate the interrupt source following
Table 32. If no interrupt is pending then all bits are 0.
In case more than one interrupt is pending, the interrupt
sources are handled sequentially multiplex.
Table 32. Interrupt Sources
Interrupt Source
ISR3 ISR2 ISR1 ISR0
Priority
none maskable
maskable
0
0
0
0
no interrupt
no interrupt
none
0
0
0
1
Lx Wake-up from Stop and Sleep mode
-
highest
0
0
1
0
-
HS Interrupt (Over-temperature)
0
0
1
1
-
LS Interrupt (Over-temperature)
0
1
0
0
LIN Wake-up
LIN Interrupt (RXSHORT, TXDOM, LIN OT)
0
1
0
1
Voltage Monitor Interrupt
Voltage Monitor Interrupt
(Low Voltage and VDD over-temperature)
(High Voltage)
Forced Wake-up
-
0
1
1
0
lowest
33912
46
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912G5AC / MC34912G5AC
TYPICAL APPLICATION
TYPICAL APPLICATION
The 33912 can be configured in several applications. The figure below shows the 33912 in the typical Slave Node Application.
V
BAT
VS2
VS1
D1
C2
C1
C4
Interrupt
Control Module
LVI, HVI, HTI, OCI
IRQ
C3
Internal
Bus
VDD
Voltage Regulator
C5
AGND
HVDD
5V Output Module
VDD
IRQ
Reset
Control Module
LVR, HVR, HTR, WD,
RST
LS1
Low Side Control
Module
RST
TIMER
LS2
HB Type Relay
PGND
Window
Watchdog Module
PWMIN
HS1
HS2
MISO
MOSI
Chip Temp Sense Module
SCLK
Analog Multiplexer
SPI
&
CONTROL
SPI
CS
VSENSE
VBAT Sense Module
R2
L1
Analog Input Module
A/D
R1
Motor Output
High Side Control
Module
MCU
Hall Sensor Supply
ADOUT0
R3
L2
Wake Up Module
L3
Digital Input Module
L4
R4
Analog Input
R5
Analog Input
RXD
LIN Physical Layer
SCI
LIN
LIN
TXD
C6
ISENSEH
Current Sense Module
ADOUT1
WDCONF
LGND
AGND
ISENSEL
PGND
A/D
R6
R7
Typical Component Values:
C1 = 47 µF; C2 = C4 = 100 nF; C3 = 10 µF; C5 = 4.7 µF; C6 = 22 0pF or 68 pF
R1 = 10 kΩ; R2 = R3 = 10 kΩ; R4 = R5 = 33 kΩ; R6 = 20 Ω; R7 = 20 kΩ200 kΩ
Recommended Configuration of the not Connected Pins (NC):
Pin 28 = this pin is not internally connected and may be used for PCB routing
optimization.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
47
MC33912BAC / MC34912BAC
MC33912BAC PRODUCT SPECIFICATIONS PAGES 48 TO 90
MC33912BAC PRODUCT SPECIFICATIONS
PAGES 48 TO 90
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
48
MC33912BAC / MC34912BAC
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
RST IRQ
INTERRUPT
CONTROL
MODULE
LVI, HVI, HTI, OCI
RESET CONTROL
MODULE
LVR, HVR, HTR, WD
VS1
INTERNAL BUS
VS2
VDD
AGND
VOLTAGE REGULATOR
5V OUTPUT
MODULE
HVDD
LS1
LOW SIDE
CONTROL
MODULE
WINDOW
WATCHDOG
MODULE
LS2
PWMIN
PGND
VS2
MISO
SCLK
SPI
&
CONTROL
VS2
HS1
HS2
ANALOG MULTIPLEXER
MOSI
HIGH SIDE
CONTROL
MODULE
CS
ADOUT0
WAKE-UP MODULE
VBAT
SENSE MODULE
VSENSE
CHIP TEMPERATURE
SENSE MODULE
ANALOG INPUT
MODULE
L1
L2
L3
RXD
TXD
DIGITAL INPUT MODULE
LIN PHYSICAL
LAYER
L4
LIN
ISENSEH
CURRENT SENSE MODULE
ISENSEL
LGND
WDCONF
ADOUT1
Figure 25. 33912 Simplified Internal Block Diagram
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
49
MC33912BAC / MC34912BAC
PIN CONNECTIONS
AGND
VDD
HVDD
VSENSE
NC
VS1
VS2
HS1
32
31
30
29
28
27
26
25
PIN CONNECTIONS
MISO
3
22
L2
MOSI
4
21
L3
SCLK
5
20
L4
CS
6
19
LS1
ADOUT0
7
18
PGND
PWMIN
8
17
LS2
9
10
11
12
13
14
15
16
ISENSEH
L1
ISENSEL
23
LGND
2
LIN
TXD
WDCONF
HS2
ADOUT1
24
IRQ
1
RST
RXD
Figure 26. 33912 Pin Connections
Table 33. 33912 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description on page 68.
Pin
Pin Name
Formal Name
Definition
1
RXD
Receiver Output
This pin is the receiver output of the LIN interface which reports the state of
the bus voltage to the MCU interface.
2
TXD
Transmitter Input
This pin is the transmitter input of the LIN interface which controls the state of
the bus output.
3
MISO
SPI Output
SPI (Serial Peripheral Interface) data output. When CS is high, pin is in the
high-impedance state.
4
MOSI
SPI Input
SPI (Serial Peripheral Interface) data input.
5
SCLK
SPI Clock
SPI (Serial Peripheral Interface) clock Input.
6
CS
SPI Chip Select
7
ADOUT0
Analog Output Pin 0
8
PWMIN
PWM Input
9
RST
Internal Reset I/O
Bidirectional Reset I/O pin - driven low when any internal reset source is
asserted. RST is active low.
10
IRQ
Internal Interrupt
Output
Interrupt output pin, indicating wake-up events from Stop mode or events from
Normal and Normal request modes. IRQ is active low.
11
ADOUT1
Analog Output Pin 1
SPI (Serial Peripheral Interface) chip select input pin. CS is active low.
Analog Multiplexer Output.
High Side and Low Side Pulse Width Modulation Input.
Current sense analog output.
33912
50
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
PIN CONNECTIONS
Table 33. 33912 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description on page 68.
Pin
Pin Name
Formal Name
12
WDCONF
Watchdog
Configuration Pin
13
LIN
LIN Bus
14
LGND
LIN Ground Pin
15
ISENSEL
16
ISENSEH
17
LS2
19
LS1
18
PGND
20
L4
21
L3
22
L2
23
L1
24
HS2
25
HS1
26
VS2
27
VS1
29
Current Sense Pins
Definition
This input pin is for configuration of the watchdog period and allows the
disabling of the watchdog.
This pin represents the single-wire bus transmitter and receiver.
This pin is the device LIN ground connection. It is internally connected to the
PGND pin.
Current Sense differential inputs.
Low Side Outputs
Relay drivers low side outputs.
Power Ground Pin
This pin is the device low side ground connection. It is internally connected to
the LGND pin.
Wake-up Inputs
These pins are the wake-up capable digital inputs(73). In addition, all Lx inputs
can be sensed analog via the analog multiplexer.
High Side Outputs
High side switch outputs.
Power Supply Pin
These pins are device battery level power supply pins.VS2 is supplying the
HSx drivers while VS1 supplies the remaining blocks.(74)
VSENSE
Voltage Sense Pin
Battery voltage sense input.(75)
30
HVDD
Hall Sensor Supply
Output
+5.0 V switchable supply output pin.(76)
31
VDD
Voltage Regulator
Output
+5.0 V main voltage regulator output pin.(77)
32
AGND
Analog Ground Pin
This pin is the device analog ground connection.
Notes
73. When used as digital input, a series 33 kΩ resistor must be used to protect against automotive transients.
74. Reverse battery protection series diodes must be used externally to protect the internal circuitry.
75. This pin can be connected directly to the battery line for voltage measurements. The pin is self protected against reverse battery
connections. It is strongly recommended to connect a 10kΩ resistor in series with this pin for protection purposes.
76. External capacitor (1.0 µF < C < 10 µF; 0.1 Ω < ESR < 5.0 Ω) required.
77. External capacitor (2.0 µF < C < 100 µF; 0.1 Ω < ESR < 10.0 Ω) required.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
51
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 34. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
Normal Operation (DC)
VSUP(SS)
-0.3 to 27
Transient Conditions (load dump)
VSUP(PK)
-0.3 to 40
VDD
-0.3 to 5.5
VIN
-0.3 to VDD +0.3
VIN(IRQ)
-0.3 to 11
HS1 and HS2 Pin Voltage (DC)
VHS
- 0.3 to VSUP +0.3
V
LS1 and LS2 Pin Voltage (DC)
VLS
-0.3 to 45
V
Normal Operation with a series 33 k resistor (DC)
VLxDC
-18 to 40
Transient input voltage with external component (according to ISO7637-2)
(See Figure 28)
VLxTR
±100
ISENSEH and ISENSEL Pin Voltage (DC)
VISENSE
-0.3 to 40
V
VSENSE Pin Voltage (DC)
VVSENSE
-27 to 40
V
Normal Operation (DC)
VBUSDC
-18 to 40
Transient input voltage with external component (according to ISO7637-2)
(See Figure 27)
VBUSTR
-150 to 100
IVDD
Internally Limited
Human Body Model - LIN Pin
VESD1-1
± 8000
Human Body Model - all other Pins
VESD1-2
±2000
VESD2
± 150
Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
VESD3-1
± 750
All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
VESD3-2
± 500
ELECTRICAL RATINGS
Supply Voltage at VS1 and VS2
Supply Voltage at VDD
Input / Output Pins Voltage
V
(78)
CS, RST, SCLK, PWMIN, ADOUT0, ADOUT1, MOSI, MISO, TXD, RXD,
HVDD
Interrupt Pin (IRQ)(79)
V
L1, L2, L3 and L4 Pin Voltage
V
LIN Pin Voltage
VDD output current
V
ESD Voltage(80)
Machine Model
V
A
V
Charge Device Model
Notes
78. Exceeding voltage limits on specified pins may cause a malfunction or permanent damage to the device.
79. Extended voltage range for programming purpose only.
80. Testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), Machine Model (CZAP = 200 pF,
RZAP = 0 Ω) and the Charge Device Model, Robotic (CZAP = 4.0 pF).
33912
52
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 34. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
THERMAL RATINGS
Operating Ambient Temperature (81)
°C
TA
Operating Junction Temperature
33912
-40 to 125
34912
-40 to 85
TJ
-40 to 150
°C
Storage Temperature
TSTG
-55 to 150
°C
Thermal Resistance, Junction to Ambient
RθJA
Natural Convection, Single Layer board (1s)(82), (83)
Natural Convection, Four Layer board (2s2p)(82), (84)
(85)
Thermal Resistance, Junction to Case
Peak Package Reflow Temperature During
Reflow(86), (87)
°C/W
85
56
RθJC
23
°C/W
TPPRT
Note 87
°C
Notes
81. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
82.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
83.
84.
85.
86.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
87.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
53
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VSUP
5.5
–
18
V
Functional Operating Voltage(88)
VSUPOP
–
–
27
V
Load Dump
VSUPLD
–
–
40
V
IRUN
–
4.5
10
mA
–
48
80
–
58
90
–
27
35
–
37
48
ICYCLIC
–
10
–
VBATFAIL
1.5
3.0
3.9
VBATFAIL_HYS
–
0.9
–
VSUV
5.55
6.0
6.6
VSUV_HYS
–
1.0
–
VSOV
18
19.25
20.5
–
1.0
–
SUPPLY VOLTAGE RANGE (VS1, VS2)
Nominal Operating Voltage
SUPPLY CURRENT RANGE (VSUP = 13.5 V)
Normal Mode (IOUT at VDD = 10 mA), LIN Recessive State(89)
Stop mode, VDD ON with IOUT = 100 µA, LIN Recessive State
(89), (90), (91)
ISTOP
µA
5.5 V < VSUP < 12 V
VSUP = 13.5 V
Sleep mode, VDD OFF, LIN Recessive
State(89), (91)
ISLEEP
µA
5.5 V < VSUP < 12 V
12 V ≤ VSUP < 13.5 V
Cyclic Sense Supply Current
Adder(92)
µA
SUPPLY UNDER/OVER-VOLTAGE DETECTIONS
Power-On Reset (BATFAIL)(93)
Threshold (measured on VS1)
V
(92)
Hysteresis (measured on VS1)(92)
VSUP Under-voltage Detection (VSUV Flag) (Normal and Normal Request
modes, Interrupt Generated)
Threshold (measured on VS1)
Hysteresis (measured on VS1)
V
VSUP Over-voltage Detection (VSOV Flag) (Normal and Normal Request
modes, Interrupt Generated)
Threshold (measured on VS1)
Hysteresis (measured on VS1)
VSOV_HYS
V
Notes
88. Device is fully functional. All features are operating.
89. Total current (IVS1 + IVS2) measured at GND pins excluding all loads, cyclic sense disabled.
90.
Total IDD current (including loads) below 100 µA.
91.
Stop and Sleep modes current will increase if VSUP exceeds13.5 V.
92.
93.
This parameter is guaranteed by process monitoring but not production tested.
The Flag is set during power up sequence. To clear the flag, a SPI read must be performed.
33912
54
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
(94)
VOLTAGE REGULATOR
Symbol
Min
Typ
Max
4.75
5.00
5.25
60
110
200
–
0.1
0.25
Unit
(VDD)
Normal Mode Output Voltage
VDDRUN
1.0 mA < IVDD < 50 mA; 5.5 V < VSUP < 27 V
Normal Mode Output Current Limitation
IVDDRUN
Dropout Voltage(95)
VDDDROP
IVDD = 50 mA
Stop Mode Output Voltage
V
V
VDDSTOP
IVDD < 5.0 mA
mA
V
4.75
5.0
5.25
IVDDSTOP
6.0
12
36
Normal mode, 5.5 V < VSUP < 18 V; IVDD = 10 mA
LRRUN
–
20
25
Stop mode, 5.5 V < VSUP < 18 V; IVDD = 1.0 mA
LRSTOP
–
5.0
25
Normal mode, 1.0 mA < IVDD < 50 mA
LDRUN
–
15
80
Stop mode, 0.1 mA < IVDD < 5.0 mA
LDSTOP
–
10
50
110
125
140
TPRE_HYS
–
10
–
°C
TSD
155
170
185
°C
TSD_HYS
–
10
–
°C
-2.0
–
2.0
20
30
50
Stop Mode Output Current Limitation
Line Regulation
mV
Load Regulation
Over-temperature Prewarning
mA
mV
(Junction)(96)
TPRE
Interrupt generated, VDDOT Bit Set
Over-temperature Prewarning Hysteresis(96)
Over-temperature Shutdown Temperature
(Junction)(96)
(96)
Over-temperature Shutdown Hysteresis
°C
HALL SENSOR SUPPLY OUTPUT(97) (HVDD)
VDD Voltage matching HVDDACC = (HVDD-VDD) / VDD * 100%
HVDDACC
IHVDD = 15 mA
Current Limitation
Dropout Voltage
IHVDD
HVDDDROP
IHVDD = 15 mA; IVDD = 5.0 mA
Line Regulation
–
160
300
–
25
40
mV
LDHVDD
1.0 mA > IHVDD > 15 mA; IVDD = 5.0 mA
mA
mV
LRHVDD
IHVDD = 5.0 mA; IVDD = 5.0 mA
Load Regulation
%
mV
–
10
20
Notes
94. Specification with external capacitor 2.0 µF < C < 100 µF and 100 mΩ ≤ ESR ≤ 10 Ω.
95. Measured when voltage has dropped 250 mV below its nominal Value (5.0 V).
96. This parameter is guaranteed by process monitoring but not production tested.
97. Specification with external capacitor 1.0 µF < C < 10 µF and 100 mΩ ≤ ESR ≤ 10 Ω.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
55
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VRSTTH
4.3
4.5
4.7
V
0.0
–
0.9
-150
-250
-350
1.5
–
8.0
RST INPUT/OUTPUT PIN (RST)
VDD Low Voltage Reset Threshold
Low-state Output Voltage
VOL
IOUT = 1.5 mA; 3.5 V ≤ VSUP ≤ 27 V
High-state Output Current (0 < VOUT < 3.5 V)
Pull-down Current Limitation (internally limited)
IOH
V
IPD_MAX
VOUT = VDD
µA
mA
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
0.0
–
1.0
VDD -0.9
–
VDD
MISO SPI OUTPUT PIN (MISO)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
Tri-state Leakage Current
V
V
ITRIMISO
0 V ≤ VMISO ≤ VDD
µA
-10
–
10
SPI INPUT PINS (MOSI, SCLK, CS)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
MOSI, SCLK Input Current
IIN
0 V ≤ VIN ≤ VDD
CS Pull-up Current
µA
-10
–
10
10
20
30
0.0
–
0.8
VDD -0.8
–
VDD
IPUCS
0 V < VIN < 3.5 V
µA
INTERRUPT OUTPUT PIN (IRQ)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
Leakage Current
V
V
VOH
VDD ≤ VOUT ≤ 10 V
mA
–
–
2.0
PULSE WIDTH MODULATION INPUT PIN (PWMIN)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
10
20
30
Pull-up current
0 V < VIN < 3.5 V
IPUPWMIN
µA
33912
56
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
TJ = 25°C, ILOAD = 50 mA; VSUP > 9.0 V
–
–
7.0
TJ = 150°C, ILOAD = 50 mA; VSUP > 9.0 V(98)
–
–
10
TJ = 150°C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V(98)
–
–
14
Unit
HIGH SIDE OUTPUTS HS1 AND HS2 PINS (HS1, HS2)
Output Drain-to-Source On Resistance
Ω
RDS(ON)
Output Current Limitation(99)
ILIMHSX
0 V < VOUT < VSUP - 2.0 V
mA
60
120
250
–
5.0
7.5
–
–
10
VSUP -2.0
–
–
THSSD
150
165
180
°C
THSSD_HYS
–
10
–
°C
TJ = 25°C, ILOAD = 150 mA, VSUP > 9.0 V
–
–
2.5
TJ = 125°C, ILOAD = 150 mA, VSUP > 9.0 V
–
–
4.5
–
–
10
160
275
350
–
8.0
12
Open Load Current Detection
(100)
IOLHSX
Leakage Current
ILEAK
-0.2 V < VHSX < VS2 + 0.2 V
Short-circuit Detection Threshold(101)
Over-temperature Shutdown(102), (107)
Over-temperature Shutdown
µA
VTHSC
5.5 V < VSUP < 27 V
Hysteresis(107)
mA
V
LOW SIDE OUTPUTS LS1 AND LS2 PINS (LS1, LS2)
Output Drain-to-Source On Resistance
RDS(ON)
TJ = 125°C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V
Output Current Limitation(103)
Ω
ILIMLSX
2.0 V < VOUT < VSUP
Open Load Current Detection(104)
IOLLSX
Leakage Current
ILEAK
-0.2 V < VOUT < VS1
Active Output Energy Clamp
mA
µA
–
–
10
VSUP +2.0
–
VSUP +5.0
2.0
–
–
TLSSD
150
165
180
°C
TLSSD_HYS
–
10
–
°C
VCLAMP
IOUT = 150 mA
Short-circuit Detection Threshold(105)
V
VTHSC
5.5 V < VSUP < 27 V
Over-temperature Shutdown(106), (107)
(107)
Over-temperature Shutdown Hysteresis
mA
V
Notes
98. This parameter is production tested up to TA = 125°C and guaranteed by process monitoring up to TJ = 150°C.
99.
100.
101.
102.
103.
104.
105.
106.
107.
When over-current occurs, the corresponding high side stays ON with limited current capability and the HSxCL flag is set in the HSSR.
When open load occurs, the flag (HSxOP) is set in the HSSR.
When short-circuit occurs and if HVSE flag is enabled, both HS automatic shutdown.
When over-temperature shutdown occurs, both high sides are turned off. All flags in HSSR are set.
When over-current occurs, the corresponding low side stays ON with limited current capability and the LSxCL flag is set in the LSSR.
When open load occurs, the flag (LSxOP) is set in the LSSR.
When short-circuit occurs and if HVSE Flag is enabled, both LS automatic shutdown
When over-temperature shutdown occurs, both low sides are turned off. All flags in LSSR are set.
Guaranteed by characterization but not production tested
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
57
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
2.0
2.5
3.0
3.0
3.5
4.0
0.5
1.0
1.5
-10
–
10
800
1550
–
LXDS (Lx Divider Select) = 0
0.95
1.0
1.05
LXDS (Lx Divider Select) = 1
3.42
3.6
3.78
-80
0.0
80
-22
0.0
22
Unit
L1, L2, L3 AND L4 INPUT PINS (L1, L2, L3, L4)
Low Detection Threshold
VTHL
5.5 V < VSUP < 27 V
High Detection Threshold
VTHH
5.5 V < VSUP < 27 V
Hysteresis
Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0)
Analog Output offset Ratio
LXDS (Lx Divider Select) = 0
RLXIN
µA
kΩ
RATIOLX
VRATIOLxOFFSET
LXDS (Lx Divider Select) = 1
Analog Inputs Matching
V
IIN
-0.2 V < VIN < VS1
Analog Input Impedance(109)
V
VHYS
5.5 V < VSUP < 27 V
Input Current(108)
V
mV
LXMATCHING
%
LXDS (Lx Divider Select) = 0
96
100
104
LXDS (Lx Divider Select) = 1
96
100
104
REXT
20
–
200
kΩ
WDACC
-15
–
15
%
STTOV
–
10.5
–
mV/K
5.0
5.25
5.5
-30
–
30
-45
–
45
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
External Resistor Range
Watchdog Period Accuracy with External Resistor (Excluding Resistor
Accuracy)(110)
ANALOG MULTIPLEXER
Internal Chip Temperature Sense Gain
VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / VADOUT0)
RATIOVSENSE
5.5 V < VSUP < 27 V
VSENSE Output Related Offset
OFFSETVSENSE
-40°C < TA < -20°C
mV
ANALOG OUTPUTS (ADOUT0 AND ADOUT1)
Maximum Output Voltage
VOUT_MAX
-5.0 mA < IO < 5.0 mA
Minimum Output Voltage
-5.0 mA < IO < 5.0 mA
V
VDD -0.35
–
VDD
0.0
–
0.35
VOUT_MIN
V
Notes
108. Analog multiplexer input disconnected from Lx input pin.
109. Analog multiplexer input connected to Lx input pin.
110. Watchdog timing period calculation formula: tPWD [ms] = 0.466 * (REXT - 20) + 10 (REXT in kΩ)
33912
58
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
CURRENT SENSE AMPLIFIER (ISENSEH, ISENSEL)
Gain
G
CSGS (Current Sense Gain Select) = 0
29
30
31
CSGS (Current Sense Gain Select) = 1
14
14.5
15
CSGS (Current Sense Gain Select) = 0
2.0
10
30
CSGS (Current Sense Gain Select) = 1
5.0
20
50
CSGS (Current Sense Gain Select) = 0
75
–
300
CSGS (Current Sense Gain Select) = 1
75
–
300
-0.2
–
3.0
CSAZ (Current Sense Auto Zero) = 0
-15
–
15
CSAZ (Current Sense Auto Zero) = 1
-2.0
–
2.0
0.0
–
0.8
VDD -0.8
–
VDD
Differential Input Impedance
Common Mode Input Impedance
ISENSEH, ISENSEL Input Voltage Range
Input Offset Voltage
DIFF
kΩ
CM
VIN
kΩ
VIN_OFFSET
V
mV
RXD OUTPUT PIN (LIN PHYSICAL LAYER) (RXD)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
V
V
TXD INPUT PIN (LIN PHYSICAL LAYER) (TXD)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
IPUIN
10
20
30
µA
Pin Pull-up Current, 0V < VIN < 3.5V
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
59
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
40
120
200
Unit
(111)
LIN PHYSICAL LAYER, TRANSCEIVER (LIN)
Output Current Limitation
IBUSLIM
Dominant State, VBUS = 18 V
mA
Leakage Output Current to GND
Dominant State; VBUS = 0 V; VBAT = 12 V
IBUS_PAS_dom
-1.0
–
–
mA
Recessive State; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS ≥ VBAT
IBUS_PAS_REC
GND Disconnected; GNDDEVICE = VSUP; VBAT = 12 V; 0 < VBUS < 18 V
IBUS_NO_GND
–
-1.0
–
–
20
1.0
µA
mA
IBUS
–
–
100
µA
Receiver Dominant State
VBUSDOM
–
–
0.4
Receiver Recessive State
VBUSREC
0.6
–
–
Receiver Threshold Center (VTH_DOM + VTH_REC)/2
VBUS_CNT
0.475
0.5
0.525
Receiver Threshold Hysteresis (VTH_REC - VTH_DOM)
VHYS
–
–
0.175
VLIN_REC
VSUP -1.0
–
–
Dominant State, TXD LOW, 500 Ω External Pull-up Resistor, LDVS = 0
VLIN_DOM_0
–
1.1
1.4
Dominant State, TXD LOW, 500 Ω External Pull-up Resistor, LDVS = 1
VLIN_DOM_1
–
1.7
2
LIN Pull-up Resistor to VSUP
RSLAVE
20
30
60
kΩ
Over-temperature Shutdown(112)
TLINSD
150
165
180
°C
TLINSD_HYS
–
10
–
°C
VBAT Disconnected; VSUP_DEVICE = GND; 0 < VBUS < 18 V
Receiver Input Voltages
VSUP
LIN Transceiver Output Voltage
Recessive State, TXD HIGH, IOUT = 1.0 µA
Over-temperature Shutdown Hysteresis
V
Notes
111. Parameters guaranteed for 7.0 V ≤ VSUP ≤ 18 V.
112.
When over-temperature shutdown occurs, the LIN bus goes in recessive state and the flag LINOT in LINSR is set.
33912
60
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 36. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SPI Operating Frequency
f SPIOP
–
–
4.0
MHz
SCLK Clock Period
SPI INTERFACE TIMING (SEE Figure 36)
tPSCLK
250
–
N/A
ns
SCLK Clock High Time(113)
tWSCLKH
110
–
N/A
ns
SCLK Clock Low Time(113)
tWSCLKL
110
–
N/A
ns
Falling Edge of CS to Rising Edge of SCLK(113)
tLEAD
100
–
N/A
ns
Falling Edge of SCLK to CS Rising Edge(113)
tLAG
100
–
N/A
ns
MOSI to Falling Edge of SCLK(113)
tSISU
40
–
N/A
ns
Falling Edge of SCLK to MOSI(113)
tSIH
40
–
N/A
ns
MISO Rise Time(113)
tRSO
–
40
–
CL = 220 pF
MISO Fall Time(113)
ns
tFSO
CL = 220 pF
Time from Falling or Rising Edges of
ns
–
40
–
CS to:(113)
ns
- MISO Low-impedance
tSOEN
0.0
–
50
- MISO High-impedance
tSODIS
0.0
–
50
Time from Rising Edge of SCLK to MISO Data Valid(113)
tVALID
0.0
–
75
t RST
0.65
1.0
1.35
ms
t RSTDF
350
600
900
ns
8.5
10
11.5
0.2 x VDD ≤ MISO ≥ 0.8 x VDD, CL = 100 pF
ns
RST OUTPUT PIN
Reset Low-level Duration After VDD High (see Figure 35)
Reset Deglitch Filter Time
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
Watchdog Time Period(114)
t PWD
External Resistor REXT = 20 kΩ (1%)
ms
External Resistor REXT = 200 kΩ (1%)
79
94
108
Without External Resistor REXT (WDCONF Pin Open)
110
150
205
CMR
70
–
–
dB
SVR
60
–
–
dB
GBP
0.75
3.0
–
MHz
SR
0.5
–
–
V/µs
CURRENT SENSE AMPLIFIER(113)
Common Mode Rejection Ratio
Supply Voltage Rejection Ratio
(115)
Gain Bandwidth Product
Output Slew-rate
Notes
113. This parameter is guaranteed by process monitoring but not production tested.
114. Watchdog timing period calculation formula: tPWD [ms] = 0.466 * (REXT - 20) + 10 (REXT in kΩ)
115.
Analog Outputs are supplied by VDD
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
61
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 36. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
t WUF
8.0
20
38
μs
–
–
5.0
110
150
205
–
–
10
L1, L2, L3 AND L4 INPUTS
Wake-up Filter Time
STATE MACHINE TIMING
Delay Between CS LOW-to-HIGH Transition (at End of SPI Stop Command)
and Stop mode Activation(116)
Normal Request Mode Timeout (see Figure 35)
Delay Between SPI Command and HS /LS Turn On(117)
t NR TOUT
Delay Between Normal Request and Normal Mode After a Watchdog Trigger
Command (Normal Request Mode)(116)
μs
t S-OFF
9.0 V < VSUP < 27 V
–
–
10
–
–
10
μs
t SNR2N
Delay Between CS Wake-up (CS LOW to HIGH) in Stop mode and:
μs
Normal Request mode, VDD ON and RST HIGH
t WUCS
9.0
15
80
First Accepted SPI Command
t WUSPI
90
—
N/A
t 2CS
4.0
—
—
Minimum Time Between Rising and Falling Edge on the CS
ms
μs
t S-ON
9.0 V < VSUP < 27 V
Delay Between SPI Command and HS /LS Turn Off(117)
μs
t STOP
μs
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0 KBIT/SEC(118), (119)
Duty Cycle 1: D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 µs
7.0 V ≤ VSUP ≤ 18 V
Duty Cycle 2: D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 µs
7.6 V ≤ VSUP ≤ 18 V
D1
7.0 V ≤ VSUP ≤ 18 V
Duty Cycle 4: D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96µs
7.6 V ≤ VSUP ≤ 18 V
—
—
—
—
0.581
D2
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4
Duty Cycle 3: D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 µs
0.396
KBIT/SEC(118), (120)
μs
D3
0.417
—
—
—
—
0.590
μs
D4
Notes
116. This parameter is guaranteed by process monitoring but not production tested.
117. Delay between turn on or off command (rising edge on CS) and HS or LS ON or OFF, excluding rise or fall time due to external load.
118. Bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD signal to LIN signal
threshold defined at each parameter. See Figure 29.
119. See Figure 30.
120. See Figure 31.
33912
62
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 36. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33912 and -40°C ≤ TA ≤ 85°C for the
34912, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SRFAST
—
20
—
V / μs
t REC_PD
—
3.0
6.0
t REC_SYM
- 2.0
—
2.0
t PROPWL
42
70
95
t WAKE
—
—
1500
t WAKE
9.0
13
17
t TXDDOM
0.65
1.0
1.35
-
10
-
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR FAST SLEW RATE
LIN Fast Slew Rate (Programming mode)
LIN PHYSICAL LAYER: CHARACTERISTICS AND WAKE-UP TIMINGS
(121)
Propagation Delay and Symmetry(122)
μs
Propagation Delay Receiver, tREC_PD = MAX (tREC_PDR, tREC_PDF)
Symmetry of Receiver Propagation Delay tREC_PDF - tREC_PDR
Bus Wake-up Deglitcher (Sleep and Stop
modes)(123)
Bus Wake-up Event Reported
From Sleep mode
(124)
From Stop mode(125)
TXD Permanent Dominant State Delay
μs
μs
s
PULSE WIDTH MODULATION INPUT PIN (PWMIN)
PWMIN pin(126)
fPWMIN
Max. frequency to drive HS and LS output pins
kHz
Notes
121. VSUP from 7.0 V to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD
signal to LIN signal threshold defined at each parameter. See Figure 29.
122. See Figure 32.
123. See Figure 33 for Sleep and Figure 34 for Stop mode.
124. The measurement is done with 1µF capacitor and 0 mA current load on VDD. The value takes into account the delay to charge the
capacitor. The delay is measured between the bus wake-up threshold (VBUSWU) rising edge of the LIN bus and when VDD reaches 3.0 V.
See Figure 33. The delay depends of the load and capacitor on VDD.
125.
In Stop mode, the delay is measured between the bus wake-up threshold (VBUSWU) and the falling edge of the IRQ pin. See Figure 34.
126.
This parameter is guaranteed by process monitoring but not production tested.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
63
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
33912
1.0 nF
LIN
TRANSIENT PULSE
GENERATOR
(NOTE)
GND
PGND LGND
AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b.
Figure 27. Test Circuit for Transient Test Pulses (LIN)
33912
Transient Pulse
Generator
(Note)
1.0 nF
L1, L2, L3, L4
10 kΩ
GND
PGND LGND AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b,.
Figure 28. Test Circuit for Transient Test Pulses (Lx)
VSUP
TXD
LIN
R0
RXD
C0
R0 AND C0 COMBINATIONS:
• 1.0 KΩ and 1.0 nF
• 660 Ω and 6.8 nF
• 500 Ω and 10 nF
Figure 29. Test Circuit for LIN Timing Measurements
33912
64
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TXD
tBIT
tBIT
tBUS_DOM (MAX)
VLIN_REC
tREC - MAX
tDOM - MIN
74.4% VSUP
tDOM - MIN
58.1% VSUP
40.0% VSUP
LIN
tBUS_REC (MIN)
60.0% VSUP
58.1% VSUP
40.0% VSUP
28.4% VSUP
28.4% VSUP
42.2% VSUP
tREC - MIN
tDOM - MAX
tBUS_DOM (MIN)
tBUS_REC (MAX)
RXD
tRDOM
tRREC
Figure 30. LIN Timing Measurements for Normal Slew Rate
TXD
tBIT
tBIT
tBUS_DOM (MAX)
VLIN_REC
tBUS_REC (MIN)
tREC - MAX
77.8% VSUP
tDOM - MIN
LIN
tDOM - MIN
61.6% VSUP
40.0% VSUP
60.0% VSUP
61.6% VSUP
40.0% VSUP
25.1% VSUP
25.1% VSUP
38.9% VSUP
tREC - MIN
tDOM - MAX
tBUS_DOM (MIN)
tBUS_REC (MAX)
RXD
tRDOM
tRREC
Figure 31. LIN Timing Measurements for Slow Slew Rate
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
65
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VLIN_REC
VBUSREC
VBUSDOM
VSUP
LIN BUS SIGNAL
RXD
tRX_PDF
tRX_PDR
Figure 32. LIN Receiver Timing
VLIN_REC
LIN
0.4 VSUP
DOMINANT LEVEL
VDD
tPROPWL
tWAKE
Figure 33. LIN Wake-up Sleep Mode Timing
Vrec
VLIN_REC
LIN
0.4VSUP
0.4 VSUP
Dominant
Level
Dominant level
IRQ
t PROPWL
TpropWL
t WAKE
Twake
Figure 34. LIN Wake-up Stop Mode Timing
33912
66
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VSUP
VDD
RST
tNRTOUT
tRST
Figure 35. Power On Reset and Normal Request Timeout Timing
tPSCLK
CS
tWSCLKH
tLEAD
tLAG
SCLK
tWSCLKL
tSISU
MOSI
UNDEFINED
D0
tSIH
DON’T CARE
D7
DON’T CARE
tVALID
tSODIS
tSOEN
MISO
D0
DON’T CARE
D7
Figure 36. SPI Timing Characteristics
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
67
MC33912BAC / MC34912BAC
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33912 was designed and developed as a highly
integrated and cost-effective solution for automotive and
industrial applications. For automotive body electronics, the
33912 is well suited to perform relay control in applications
like window lift, sunroof, etc. via LIN bus.
Power switches are provided on the device configured as
high side and low side outputs. Other ports are also provided,
which include a current and voltage sense port, a Hall Sensor
port supply, and four wake-up capable pins. An internal
voltage regulator provides power to a MCU device.
Also included in this device is a LIN physical layer, which
communicates using a single wire. This enables this device
to be compatible with 3-wire bus systems, where one wire is
used for communication, one for battery, and one for ground.
FUNCTIONAL PIN DESCRIPTION
See Figure 1, 33912 Simplified Application Diagram, for a
graphic representation of the various pins referred to in the
following paragraphs. Also, see the pin diagram on page 50
for a description of the pin locations in the package.
RECEIVER OUTPUT PIN (RXD)
The RXD pin is a digital output. It is the receiver output of
the LIN interface and reports the state of the bus voltage:
RXD Low when LIN bus is dominant, RXD High when LIN bus
is recessive.
TRANSMITTER INPUT PIN (TXD)
The TXD pin is a digital input. It is the transmitter input of
the LIN interface and controls the state of the bus output
(dominant when TXD is Low, recessive when TXD is High).
This pin has an internal pull-up to force recessive state in
case the input is left floating.
MASTER IN SLAVE OUT PIN (MISO)
The MISO pin sends data to an SPI-enabled MCU. It is a
digital tri-state output used to shift serial data to the
microcontroller. Data on this output pin changes on the
negative edge of the SCLK. When CS is High, this pin will
remain in high-impedance state.
CHIP SELECT PIN (CS)
CS is an active low digital input. It must remain low during
a valid SPI communication and allow for several devices to
be connected in the same SPI bus without contention. A
rising edge on CS signals the end of the transmission and the
moment the data shifted in is latched. A valid transmission
must consist of 8 bits only.
While in STOP mode, a low-to-high level transition on this
pin will generate a wake-up condition for the 33912.
ANALOG MULTIPLEXER PIN (ADOUT0)
LIN BUS PIN (LIN)
The LIN pin represents the single-wire bus transmitter and
receiver. It is suited for automotive bus systems and is
compliant to the LIN bus specification 2.0.
The LIN interface is only active during Normal and Normal
Request modes.
SERIAL DATA CLOCK PIN (SCLK)
The SCLK pin is the SPI clock input pin. MISO data
changes on the negative transition of the SCLK. MOSI is
sampled on the positive edge of the SCLK.
MASTER OUT SLAVE IN PIN (MOSI)
The MOSI digital pin receives SPI data from the MCU. This
data input is sampled on the positive edge of SCLK.
The ADOUT0 pin can be configured via the SPI to allow
the MCU A/D converter to read the several inputs of the
Analog Multiplexer, including the VSENSE, L1, L2, L3, L4
input voltages, and the internal junction temperature.
CURRENT SENSE AMPLIFIER PIN (ADOUT1)
The ADOUT1 pin is an analog interface to the MCU A/D
converter. It allows the MCU to read the output of the current
sense amplifier.
PWM INPUT CONTROL PIN (PWMIN)
This digital input can control the high sides and low sides
drivers in Normal Request- and Normal mode.
To enable PWM control, the MCU must perform a write
operation to the High Side Control Register (HSCR) or the
Low Side Control Register (LSCR).
This pin has an internal 20 μA current pull-up.
33912
68
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
RESET PIN (RST)
This bidirectional pin is used to reset the MCU in case the
33912 detects a reset condition, or to inform the 33912 that
the MCU has just been reset. After release of the RST pin,
Normal Request mode is entered.
The RST pin is an active low filtered input and output
formed by a weak pull-up and a switchable pull-down
structure which allows this pin to be shorted either to VDD or
to GND during software development, without the risk of
destroying the driver.
INTERRUPT PIN (IRQ)
The IRQ pin is a digital output used to signal events or
faults to the MCU while in Normal and Normal Request mode
or to signal a wake-up from Stop mode. This active low output
will transition to high only after the interrupt is acknowledged
by a SPI read of the respective status bits.
WATCHDOG CONFIGURATION PIN (WDCONF)
The WDCONF pin is the configuration pin for the internal
watchdog. A resistor can be connected to this pin to configure
the window watchdog period. When connected directly to
ground, the watchdog will be disabled. When this pin is left
open, the watchdog period is fixed to its lower precision
internal default value (150 ms typical).
GROUND CONNECTION PINS (AGND, PGND,
LGND)
The AGND, PGND and LGND pins are the Analog and
Power ground pins.
The AGND pin is the ground reference of the voltage
regulator and the current sense module.
The PGND and LGND pins are used for high current load
return as in the relay-drivers and LIN interface pin.
Note: PGND, AGND and LGND pins must be connected
together.
CURRENT SENSE AMPLIFIER INPUT PINS
(ISENSEH AND ISENSEL)
The ISENSEH and ISENSEL pins are the input pins of a
ground compatible differential amplifier designed to be used
to sense the voltage drop over a shunt resistor. The main
purpose of this amplifier is to implement accurate current
sensors. The gain of the differential amplifier can be set by
SPI.
LOW SIDE PINS (LS1 AND LS2)
LS1 and LS2 are the low side driver outputs. Those
outputs are short-circuit protected and include active clamp
circuitry to drive inductive loads. Due to the energy clamp
voltage on this pin, it can raise above the battery level when
switched off. The switches are controlled through the SPI and
can be configured to respond to a signal applied to the
PWMIN input pin.
Both low side switches are protected against overheating.
DIGITAL/ANALOG PINS (L1, L2, L3 AND L4)
The Lx pins are multi purpose inputs. They can be used as
digital inputs, which can be sampled by reading the SPI and
used for wake-up when 33912 is in low power mode or used
as analog inputs for the analog multiplexer. When used to
sense voltage outside the module, a 33 kohms series resistor
must be used on each input.
When used as wake-up inputs L1-L4 can be configured to
operate in cyclic-sense mode. In this mode one of the high
side switches is configured to be periodically turned on and
sample the wake-up inputs. If a state change is detected
between two cycles a wake-up is initiated. The 33912 can
also wake-up from Stop or Sleep by a simple state change on
L1-L4.
When used as analog inputs, the voltage present on the Lx
pins is scaled down by an selectable internal voltage divider
and can be routed to the ADOUT0 output through the analog
multiplexer.
Note: If an Lx input is selected in the analog multiplexer, it
will be disabled as a digital input and remains disabled in low
power mode. No wake-up feature is available in that
condition.
When an Lx input is not selected in the analog multiplexer,
the voltage divider is disconnected from that input.
HIGH SIDE OUTPUT PINS (HS1 AND HS2)
These two high side switches are able to drive loads such
as relays or lamps. Their structures are connected to the VS2
supply pin. The pins are short-circuit protected and both
outputs are also protected against overheating.
HS1 and HS2 are controlled by SPI and can respond to a
signal applied to the PWMIN input pin.
HS1 and HS2 outputs can also be used during low-power
mode for the cyclic-sense of the wake inputs.
POWER SUPPLY PINS (VS1 AND VS2)
Those are the battery level voltage supply pins. In an
application, VS1 and VS2 pins must be protected against
reverse battery connection and negative transient voltages
with external components. These pins sustain standard
automotive voltage conditions such as a load dump at 40 V.
The high side switches (HS1 and HS2) are supplied by the
VS2 pin. All other internal blocks are supplied by VS1 pin.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
69
MC33912BAC / MC34912BAC
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
VOLTAGE SENSE PIN (VSENSE)
This input can be connected directly to the battery line. It
is protected against battery reverse connection. The voltage
present in this input is scaled down by an internal voltage
divider, and can be routed to the ADOUT0 output pin and
used by the MCU to read the battery voltage.
The ESD structure on this pin allows for excursion up to
+40 V and down to -27 V, allowing this pin to be connected
directly to the battery line. It is strongly recommended to
connect a 10 kohm resistor in series with this pin for
protection purposes.
HALL SENSOR SWITCHABLE SUPPLY PIN (HVDD)
The HVDD pin needs to be connected to an external
capacitor to stabilize the regulated output voltage.
+5V MAIN REGULATOR OUTPUT PIN (VDD)
An external capacitor has to be placed on the VDD pin to
stabilize the regulated output voltage. The VDD pin is
intended to supply a microcontroller. The pin is current limited
against shorts to GND and over-temperature protected.
During Stop mode, the voltage regulator does not operate
with its full drive capabilities and the output current is limited.
During Sleep mode, the regulator output is completely shut
down.
This pin provides a switchable supply for external hall
sensors. While in Normal mode, this current limited output
can be controlled through the SPI.
33912
70
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC33912 - Functional Block Diagram
Integrated Supply
Hall Sensor Supply
Voltage Regulator
HVDD
VDD
Analog Circuitry
Wake-Up
Window Watchdog
Digital / Analog Input
Voltage, Current & Temperature Sense
MCU Interface and Output Control
SPI Interface
Reset & IRQ Logic
LIN Interface / Control
LS/HS - PWM Control
High Side Drivers
HS1 - HS2
Low Side Drivers
LS1 - LS2
LIN Physical Layer
Interface
Analog Output 0/1
Integrated Supply
Analog Circuitry
MCU Interface and Output Control
Drivers
Figure 37. Functional Internal Block Diagram
ANALOG CIRCUITRY
MCU INTERFACE
The 33912 is designed to operate under automotive
operating conditions. A fully configurable window watchdog
circuit will reset the connected MCU in case of an overflow.
Two low power modes are available with several different
wake-up sources to reactivate the device. Four analog /
digital inputs can be sensed or used as the wake-up source.
The device is capable of sensing the supply voltage
(VSENSE), the internal chip temperature (CTEMP) as well as
the motor current using an external sense resistor.
The 33912 is providing its control and status information
through a standard 8-Bit SPI interface. Critical system events
such as Low- or High-voltage/Temperature conditions as well
as over-current conditions in any of the driver stages can be
reported to the connected MCU via IRQ or RST. Both Low
Side and both High Side driver outputs can be controlled via
the SPI register as well as the PWMIN input. The integrated
LIN physical layer interface can be configured via SPI register
and its communication is driven through the RXD and TXD
device pins. All internal analog sources are multiplexed to the
ADOUT 0 pin. The current sense analog signal is directly
routed through ADOUT1.
HIGH SIDE DRIVERS
Two current and temperature protected High Side drivers
with PWM capability are provided to drive small loads such as
Status LED’s or small lamps. Both Drivers can be configured
for periodic sense during low power modes.
LOW SIDE DRIVERS
Two current and temperature protected Low Side drivers
with PWM capability are provided to drive H-Bridge type
relays for power motor applications
VOLTAGE REGULATOR OUTPUTS
Two independent voltage regulators are implemented on
the 33912. The VDD main regulator output is designed to
supply a MCU with a precise 5.0 V. The switchable HVDD
output is dedicated to supply small peripherals as hall
sensors.
LIN PHYSICAL LAYER INTERFACE
The 33912 provides a LIN 2.0 compatible LIN physical
layer interface with selectable slew rate and various
diagnostic features.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
71
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Introduction
The 33912 offers three main operating modes: Normal
(Run), Stop, and Sleep (Low Power). In Normal mode, the
device is active and is operating under normal application
conditions. The Stop and Sleep modes are low-power modes
with wake-up capabilities.
In Stop mode, the voltage regulator still supplies the MCU
with VDD (limited current capability), while in Sleep mode the
voltage regulator is turned off (VDD = 0 V).
Wake-up from Stop mode is initiated by a wake-up
interrupt. Wake-up from Sleep mode is done by a reset and
the voltage regulator is turned back on.
The selection of the different modes is controlled by the
MOD1:2 bits in the Mode Control Register (MCR).
Figure 38 describes how transitions are done between the
different operating modes. Table 37 gives an overview of the
operating modes.
RESET MODE
The 33912 enters the Reset mode after a power up. In this
mode, the RST pin is low for 1ms (typical value). After this
delay, it enters the Normal Request mode and the RST pin is
driven high.
The Reset mode is entered if a reset condition occurs (VDD
low, watchdog trigger fail, after wake-up from Sleep mode,
Normal Request mode timeout occurs).
NORMAL REQUEST MODE
This is a temporary mode automatically accessed by the
device after the Reset mode, or after a wake-up from Stop
mode.
In Normal Request mode, the VDD regulator is ON, the
RESET pin is High, and the LIN is operating in RX Only
mode.
As soon as the device enters in the Normal Request mode
an internal timer is started for 150 ms (typical value). During
these 150 ms, the MCU must configure the Timing Control
Register (TIMCR) and the Mode Control Register (MCR) with
MOD2 and MOD1 bits set = 0, to enter the Normal mode. If
within the 150ms timeout, the MCU does not command the
33912 to Normal mode, it will enter in Reset mode. If the
WDCONF pin is grounded in order to disable the watchdog
function, it goes directly in Normal mode after the Reset
mode. If the WDCONF pin is open, the 33912 stays typically
for 150 ms in Normal Request before entering in Normal
mode.
NORMAL MODE
In Normal mode, all 33912 functions are active and can be
controlled by the SPI interface and the PWMIN pin.
The VDD regulator is ON and delivers its full current
capability.
If an external resistor is connected between the WDCONF
pin and the Ground, the window watchdog function will be
enabled.
The wake-up inputs (L1-L4) can be read as digital inputs
or have its voltage routed through the analog-multiplexer.
The LIN interface has slew rate and timing compatible with
the LIN protocol specification 2.0. The LIN bus can transmit
and receive information.
The high side and low side switches are active and have
PWM capability according to the SPI configuration.
The interrupts are generated to report failures for VSUP
over/under-voltage, thermal shutdown, or thermal shutdown
prewarning on the main regulator.
SLEEP MODE
The Sleep mode is a low power mode. From Normal
mode, the device enters into Sleep mode by sending one SPI
command through the Mode Control Register (MCR). All
blocks are in their lowest power consumption condition. Only
some wake-up sources (wake-up inputs with or without cyclic
sense, forced wake-up and LIN receiver) are active. The
5.0 V regulator is OFF. The internal low-power oscillator may
be active if the IC is configured for cyclic-sense. In this
condition, one of the high side switches is turned on
periodically and the wake-up inputs are sampled.
Wake-up from Sleep mode is similar to a power-up. The
device goes in Reset mode except that the SPI will report the
wake-up source and the BATFAIL flag is not set.
STOP MODE
The Stop mode is the second low power mode, but in this
case the 5.0 V regulator is ON with limited current drive
capability. The application MCU is always supplied while the
33912 is operating in Stop mode.
The device can enter into Stop mode only by sending the
SPI command. When the application is in this mode, it can
wake-up from the 33912 side (for example: cyclic sense,
force wake-up, LIN bus, wake inputs) or the MCU side (CS,
RST pins). Wake-up from Stop mode will transition the 33912
to Normal Request mode and generates an interrupt except
if the wake-up event is a low to high transition on the CS pin
or comes from the RST pin.
33912
72
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Normal Request
Timeout
Expired
(t NRTOUT
)
Normal Request
timeout
expired (NR
TOUT)
VVDD
Low
DD Low
VDD High and
Normal
Request
VVDDLow
Low
DD
VVDD
LOW (>t NRTOUT
) expired) Expired
DD Low (>NRTOUT
andand
VSUV
=0
VSUV
=0
Wake-up
Wake-Up (Reset)
(Reset)
Sleep
Command
SLEEP
Command
Sleep
Stop
STOPCommand
Command
Normal
WD
Failed
WD
failed
Wake-Up
(Interrupt)
Wake-Up Interrupt
Reset
Reset
Delay
(t Delay
VDD
High and
Reset
RST) expired
RST) (tExpired
WD
Disabled
WD disabled
Power Up
WDtrigger
Trigger
WD
Power
Down
Stop
VDD
VDD Low
Low
Legend
WD: Watchdog
Notes:
WD Disabled:
Watchdog disabled (WDCONF pin connected to GND)
WD
- meansisWatchdog
WD Trigger:
Watchdog
triggered by SPI command
WD
means or
Watchdog
disabled
(WDCONF
terminal connected to GND)
WD Failed: No disabled
watchdog- trigger
trigger occurs
in closed
window
WD trigger – means Watchdog is triggered by SPI command
Stop Command: Stop command sent via SPI
WD failed – means no Watchdog trigger or trigger occurs in closed window
Sleep Command: Sleep command sent via SPI
STOP Command - means STOP command sent via SPI
Wake-Up from Stop Mode: L1, L2, L3 or L4 state change, LIN bus wake-up, Periodic wake-up, CS rising edge wake-up or RST wake-up.
SLEEP
Command
means
SLEEP
command
via wake-up,
SPI
Wake-Up from
Sleep
Mode: L1,- L2,
L3 or
L4 state
change,send
LIN bus
Periodic wake-up.
Wake-Up - means L1 or L2 state change or LIN bus wake up or SS rising edge
Figure 38. Operating Modes and Transitions
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
73
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Table 37. Operating Modes Overview
Function
VDD
HVDD
Reset Mode Normal Request Mode
Full
-
Full
(127)
SPI
Normal
Mode
Stop Mode
Sleep Mode
Full
Stop
-
SPI
-
-
-
SPI/PWM(128)
SPI/PWM
-
-
HSx
-
SPI/PWM(128)
SPI/PWM
Note(129)
Note(130)
Analog Mux
-
SPI
SPI
-
-
Lx
-
Inputs
Inputs
Wake-up
Wake-up
Current Sense
On
On
On
-
-
LIN
-
Rx-Only
LSx
Full/Rx-Only Rx-Only/Wake-up
Watchdog
-
150 ms (typ.) timeout
On(131)/Off
VSENSE
On
On
On
Notes
127.
128.
129.
130.
131.
Wake-up
-
-
VDD
-
Operation can be enabled/controlled by the SPI.
Operation can be controlled by the PWMIN input.
HSx switches can be configured for cyclic sense operation in Stop mode.
HSx switches can be configured for cyclic sense operation in Sleep mode.
Windowing operation when enabled by an external resistor.
INTERRUPTS
High-voltage Interrupt:
Interrupts are used to signal a microcontroller that a
peripheral needs to be serviced. The interrupts which can be
generated, change according to the operating mode. While in
Normal and Normal Request modes, the 33912 signals
through interrupts special conditions which may require a
MCU software action. Interrupts are not generated until all
pending wake-up sources are read in the Interrupt Source
Register (ISR).
While in Stop mode, interrupts are used to signal wake-up
events. Sleep mode does not use interrupts. Wake-up is
performed by powering-up the MCU. In Normal and Normal
Request mode the wake-up source can be read by SPI.
The interrupts are signaled to the MCU by a low logic level
of the IRQ pin, which will remain low until the interrupt is
acknowledged by a SPI read. The IRQ pin will then be driven
high.
Interrupts are only asserted while in Normal, Normal
Request and Stop mode. Interrupts are not generated while
the RST pin is low.
The following is a list of the interrupt sources in Normal and
Normal Request modes. Some of these can be masked by
writing to the SPI - Interrupt Mask Register (IMR).
Signals when the supply line (VS1) voltage increases
above the VSOV threshold (VSOV).
Low-voltage Interrupt:
Signals when the supply line (VS1) voltage drops below
the VSUV threshold (VSUV).
Over-temperature Prewarning:
Signals when the 33912 temperature has reached the preshutdown warning threshold. It is used to warn the MCU that
an over-temperature shutdown in the main 5.0 V regulator is
imminent.
LIN Over-current Shutdown / Over-temperature
Shutdown / TXD Stuck At Dominant / RXD Short-circuit:
These signal fault conditions within the LIN interface will
cause the LIN driver to be disabled, except for the LIN overcurrent condition. In order to restart operation, the fault must
be removed and must be acknowledged by reading the SPI.
The LINOC bit functionality in the LIN Status Register
(LINSR) is to indicate an LIN over-current has occurred and
the driver remains enabled.
High Side Over-temperature Shutdown:
Signals a shutdown in the high side outputs.
Low Side Over-temperature Shutdown:
Signals a shutdown in the low side outputs.
RESET
To reset a MCU the 33912 drives the RST pin low for the
time the reset condition lasts.
33912
74
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
After the reset source is removed, the state machine will
drive the RST output low for at least 1.0 ms (typical value)
before driving it high.
In the 33912, four main reset sources exist:
5.0 V Regulator Low-voltage-Reset (VRSTTH)
The 5.0 V regulator output VDD is continuously monitored
against brown outs. If the supply monitor detects that the
voltage at the VDD pin has dropped below the reset threshold
VRSTTH the 33912 will issue a reset. In case of overtemperature, the voltage regulator will be disabled and the
voltage monitoring will issue a VDDOT Flag independently of
the VDD voltage.
Window Watchdog Overflow
If the watchdog counter is not properly serviced while its
window is open, the 33912 will detect an MCU software runaway and will reset the microcontroller.
Wake-up From Sleep Mode
During Sleep mode, the 5V regulator is not active, hence
all wake-up requests from Sleep mode require a power-up/
reset sequence.
External Reset
The 33912 has a bidirectional reset pin which drives the
device to a safe state (same as Reset mode) for as long as
this pin is held low. The RST pin must be held low long
enough to pass the internal glitch filter and get recognized by
the internal reset circuit. This functionality is also active in
Stop mode.
After the RST pin is released, there is no extra t RST to be
considered.
WAKE-UP CAPABILITIES
Once entered into one of the low-power modes (Sleep or
Stop) only wake-up sources can bring the device into Normal
mode operation.
In Stop mode, a wake-up is signaled to the MCU as an
interrupt, while in Sleep mode the wake-up is performed by
activating the 5.0 V regulator and resetting the MCU. In both
cases the MCU can detect the wake-up source by accessing
the SPI registers. There is no specific SPI register bit to signal
a CS wake-up or external reset. If necessary this condition is
detected by excluding all other possible wake-up sources.
Wake-up from Wake-up inputs (L1-L4) with cyclic sense
disabled
The wake-up lines are dedicated to sense state changes
of external switches and wake-up the MCU (in Sleep or Stop
mode).
In order to select and activate direct wake-up from Lx
inputs, the Wake-up Control Register (WUCR) must be
configured with appropriate LxWE inputs enabled or
disabled. The wake-up input’s state is read through the
Wake-up Status Register (WUSR).
Lx inputs are also used to perform cyclic-sense wake-up.
Note: Selecting an Lx input in the analog multiplexer
before entering low power mode will disable the wake-up
capability of the Lx input
Wake-up from Wake-up inputs (L1-L4) with cyclic sense
timer enabled
The SBCLIN can wake-up at the end of a cyclic sense
period if on one of the four wake-up input lines (L1-L4) a state
change occurs. The HSx switch is activated in Sleep or Stop
modes from an internal timer. Cyclic sense and force wakeup are exclusive. If cyclic sense is enabled, the force wakeup can not be enabled.
In order to select and activate the cyclic sense wake-up
from Lx inputs, before entering in low power modes (Stop or
Sleep modes), the following SPI set-up has to be performed:
In WUCR: select the Lx input to WU-enable.
In HSCR: enable the desired HSx.
• In TIMCR: select the CS/WD bit and determine the
cyclic sense period with CYSTx bits.
• Perform Goto Sleep/Stop command.
Forced Wake-up
The 33912 can wake-up automatically after a
predetermined time spent in Sleep or Stop mode. Cyclic
sense and Forced wake-up are exclusive. If Forced wake-up
is enabled, the Cyclic Sense can not be enabled.
To determine the wake-up period, the following SPI set-up
has to be sent before entering in low power modes:
• In TIMCR: select the CS/WD bit and determine the low
power mode period with CYSTx bits.
• In HSCR: all HSx bits must be disabled.
CS Wake-up
While in Stop mode, a rising edge on the CS will cause a
wake-up. The CS wake-up does not generate an interrupt,
and is not reported on SPI.
LIN Wake-up
While in the low-power mode, the 33912 monitors the
activity on the LIN bus. A dominant pulse larger than t PROPWL
followed by a dominant to recessive transition will cause a
LIN wake-up. This behavior protects the system from a short
to ground bus condition.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
75
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
RST Wake-up
While in Stop mode, the 33912 can wake-up when the
RST pin is held low long enough to pass the internal glitch
filter. Then, the 33912 will change to Normal Request or
Normal modes depending on the WDCONF pin
configuration. The RST wake-up does not generate an
interrupt and is not reported via SPI.
From Stop mode, the following wake-up events can be
configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• CS wake-up
• LIN wake-up
• RST wake-up
From Sleep mode, the following wake-up events can be
configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• LIN wake-up
WINDOW WATCHDOG
The 33912 includes a configurable window watchdog
which is active in Normal mode. The watchdog can be
configured by an external resistor connected to the WDCONF
pin. The resistor is used to achieve higher precision in the
timebase used for the watchdog.
SPI clears are performed by writing through the SPI in the
MOD bits of the Mode Control Register (MCR).
During the first half of the SPI timeout, watchdog clears are
not allowed, but after the first half of the SPI timeout window,
the clear operation opens. If a clear operation is performed
outside the window, the 33912 will reset the MCU, in the
same way as when the watchdog overflows.
WINDOW CLOSED
NO WATCHDOG CLEAR
ALLOWED
WD TIMING X 50%
WINDOW OPEN
FOR WATCHDOG
CLEAR
To disable the watchdog function in Normal mode the user
must connect the WDCONF pin to ground. This measure
effectively disables Normal Request mode. The WDOFF bit
in the Watchdog Status Register (WDSR) will be set. This
condition is only detected during Reset mode.
If neither a resistor nor a connection to ground is detected,
the watchdog falls back to the internal lower precision
timebase of 150 ms (typ.) and signals the faulty condition
through the Watchdog Status Register (WDSR).
The watchdog timebase can be further divided by a
prescaler which can be configured by the Timing Control
Register (TIMCR). During Normal Request mode, the
window watchdog is not active but there is a 150 ms (typ.)
timeout for leaving the Normal Request mode. In case of a
timeout, the 33912 will enter into Reset mode, resetting the
microcontroller before entering again into Normal Request
mode.
HIGH SIDE OUTPUT PINS HS1 AND HS2
These outputs are two high side drivers intended to drive
small resistive loads or LEDs incorporating the following
features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• High-voltage shutdown (software maskable)
• Cyclic sense
The high side switches are controlled by the bits HS1:2 in
the High Side Control Register (HSCR).
PWM Capability (direct access)
Each high side driver offers additional (to the SPI control)
direct control via the PWMIN pin.
If both the bits HS1 and PWMHS1 are set in the High Side
Control Register (HSCR), then the HS1 driver is turned on if
the PWMIN pin is high and turned of if the PWMIN pin is low.
This applies to HS2 configuring HS2 and PWMHS2 bits.
WD TIMING X 50%
WD PERIOD (tPWD)
WD TIMING SELECTED BY REGISTER
ON WDCONF PIN
Figure 39. Window Watchdog Operation
33912
76
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Interrupt
Control
Module
MOD1:2
HSx
HSxOP
VDD
VDD
PWMIN
High-Side Interrupt
High Voltage Shutdown
HVSE
PWMHSx
VS2
on/off
Control
Status
HSxCL
High Side - Driver
charge pump
open load detection
current limitation
Over-temperture shutdown (interrupt maskable)
high voltage shutdown (maskable)
Cyclic Sense
HSx
Wakeup
Module
Figure 40. High Side Drivers HS1 and HS2
Open Load Detection
Each high side driver signals an open load condition if the
current through the high side is below the open load current
threshold.
The open load condition is indicated with the bits HS1OP
and HS2OP in the High Side Status Register (HSSR).
Current Limitation
Each high side driver has an output current limitation. In
combination with the over-temperature shutdown the highside drivers are protected against over-current and shortcircuit failures.
When the driver operates in the current limitation area, it is
indicated with the bits HS1CL and HS2CL in the HSSR.
Note: If the driver is operating in current limitation mode,
excessive power might be dissipated.
Over-temperature Protection (HS Interrupt)
Both high side drivers are protected against overtemperature. In case of an over-temperature condition both
high side drivers are shut down and the event is latched in the
Interrupt Control Module. The shutdown is indicated as HS
Interrupt in the Interrupt Source Register (ISR).
A thermal shutdown of the high side drivers is indicated by
setting all HSxOP and HSxCL bits simultaneously.
If the bit HSM is set in the Interrupt Mask Register (IMR),
then an interrupt (IRQ) is generated.
A write to the High Side Control Register (HSCR), when
the over-temperature condition is gone, will re-enable the
high side drivers.
High-voltage Shutdown
In case of a high voltage condition and if the high voltage
shutdown is enabled (bit HVSE in the Mode Control Register
(MCR) is set) both high side drivers are shut down.
A write to the High Side Control Register (HSCR), when
the high voltage condition is gone, will re-enable the high side
drivers.
Sleep And Stop Mode
The high side drivers can be enabled to operate in Sleep
and Stop mode for cyclic sensing. Also see Table 37.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
77
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
LOW SIDE OUTPUT PINS LS1 AND LS2
These outputs are two low side drivers intended to drive
relays incorporating the following features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• Active clamp (for driving relays)
• High-voltage shutdown (software maskable)
The low side switches are controlled by the bit LS1:2 in the
Low Side Control Register (LSCR).
HVSE
To protect the device against over-voltage when an
inductive load (relay) is turned off. An active clamp will reenable the low side FET if the voltage on the LS1 or LS2 pin
exceeds a certain level.
PWM Capability (direct access)
Each low side driver offers additional (to the SPI control)
direct control via the PWMIN pin.
If both the bits LS1 and PWMLS1 are set in the Low Side
Control Register (LSCR), then the LS1 driver is turned on if
the PWMIN pin is high and turned off if the PWMIN pin is low.
The same applies to the LS2 and PWMLS2 bits for the LS2
driver.
VDD
Interrupt
Control
Module
VDD
MOD1:2
LSx
LSxOP
LSxCL
PWMLSx
Low Side Interrupt
High-voltage Shutdown
PWMIN
active
clamp
LSx
on/off
Control
Status
Low Side Driver
(active clamp)
Open-load Detection
Current Limitation
Over-temperture Shutdown (interrupt maskable)
High-voltage shutdown (maskable)
PGND
Figure 41. Low Side Drivers LS1 and LS2
Open Load Detection
Each low side driver signals an open load condition if the
current through the low side is below the open load current
threshold.
The open load condition is indicated with the bit LS1OP
and LS2OP in the Low Side Status Register (LSSR).
Current Limitation
Each low side driver has a current limitation. In
combination with the over-temperature shutdown the low
side drivers are protected against over-current and shortcircuit failures.
When the drivers operate in current limitation, this is
indicated with the bits LS1CL and LS2CL in the LSSR.
Note: If the drivers are operating in current limitation mode
excessive power might be dissipated.
low side drivers are shut down and the event is latched in the
Interrupt Control Module. The shutdown is indicated as an LS
Interrupt in the Interrupt Source Register (ISR).
If the bit LSM is set in the Interrupt Mask Register (IMR)
than an Interrupt (IRQ) is generated.
A write to the Low Side Control Register (LSCR), when the
over-temperature condition is gone, will re-enable the low
side drivers.
High-voltage Shutdown
In case of a high-voltage condition and if the high-voltage
shutdown is enabed (bit HVSE in the Mode Control Register
(MCR) is set) both low sides drivers are shut down.
A write to the Low Side Control Register (LSCR), when the
high-voltage condition is gone, will re-enable the low side
drivers.
Over-temperature Protection (LS Interrupt)
Sleep And Stop Mode
Both low side drivers are protected against overtemperature. In case of an over-temperature condition both
The low side drivers are disabled in Sleep and Stop mode.
Also see Table 37.
33912
78
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
LIN PHYSICAL LAYER
The LIN bus pin provides a physical layer for single-wire
communication in automotive applications. The LIN physical
layer is designed to meet the LIN physical layer specification
and has the following features:
• LIN physical layer 2.0 compliant
• Slew rate selection
• Over-current shutdown
• Over-temperature shutdown
• LIN pull-up disable in Stop and Sleep modes
• Advanced diagnostics
• LIN dominant voltage level selection
The LIN driver is a low side MOSFET with over-current
and thermal shutdown. An internal pull-up resistor with a
serial diode structure is integrated, so no external pull-up
components are required for the application in a slave node.
The fall time from dominant to recessive and the rise time
from recessive to dominant is controlled. The symmetry
between both slopes is guaranteed.
LIN Pin
The LIN pin offers a high susceptibility immunity level from
external disturbance, guaranteeing communication during
external disturbance.
INTERRUPT
CONTROL
MODULE
High-voltage
Shutdown
High Side
Interrupt
WAKE-UP
MODULE
LIN
Wake-up
MOD1:2
LSR0:1
LINPE
LDVS
RXONLY
RXSHORT
VS1
LIN – DRIVER
Slope and Slew Rate Control
Over-current Shutdown (interrupt maskable)
Over-temperature Shutdown (interrupt maskable)
TXDOM
LINOT
LINOC
30K
LIN
TXD
SLOPE
CONTROL
WAKE-UP
FILTER
LGND
RXD
RECEIVER
Figure 42. LIN Interface
Slew Rate Selection
LIN Pull-up Disable In Stop And Sleep Modes
The slew rate can be selected for optimized operation at
10.4 and 20 kBit/s as well as a fast baud rate for test and
programming. The slew rate can be adapted with the bits
LSR 1:0 in the LIN Control Register (LINCR). The initial slew
rate is optimized for 20 kBit/s.
In cases of a LIN bus short to GND or LIN bus leakage
during low-power mode, the internal pull-up resistor on the
LIN pin can be disconnected by clearing the LINPE bit in the
Mode Control Register (MCR). The LINPE bit also changes
the Bus wake-up threshold (VBUSWU).
This feature will reduce the current consumption in STOP
and SLEEP modes. It also improves performance and safe
operation.
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
79
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Current Limit (LIN Interrupt)
The output low side FET is protected against over-current
conditions. In case of an over-current condition (e.g. LIN bus
short to VBAT), the transmitter will not be shut down. The bit
LINOC in the LIN Status Register (LINSR) is set.
If the LINM bit is set in the Interrupt Mask Register (IMR),
an Interrupt IRQ will be generated.
The transmitter is automatically re-enabled once TXD is
high.
A read of the LIN Status Register (LINSR) with the TXD pin
at 5.0 V will clear the bit TXDOM.
LIN Dominant Voltage Level Selection
The LIN dominant voltage level can be selected by the bit
LDVS in the LIN Control Register (LINCR).
Over-temperature Shutdown (LIN Interrupt)
The output low side FET is protected against overtemperature conditions. In case of an over-temperature
condition, the transmitter will be shut down and the LINOT bit
in the LIN Status Register (LINSR) is set.
If the LINM bit is set in the Interrupt Mask Register (IMR),
an Interrupt IRQ will be generated.
The transmitter is automatically re-enabled once the
condition is gone and TXD is high.
A read of the LIN Status Register (LINSR) with the TXD pin
high, will re-enable the transmitter.
RXD Short-circuit Detection (LIN Interrupt)
The LIN transceiver has a short-circuit detection for the
RXD output pin. In case of an short-circuit condition, either 5V
or Ground, the RXSHORT bit in the LIN Status Register
(LINSR) is set and the transmitter is shut down.
If the LINM bit is set in the Interrupt Mask Register (IMR),
an Interrupt IRQ will be generated.
The transmitter is automatically re-enabled once the
condition is gone (transition on RXD) and TXD is high.
A read of the LIN Status Register (LINSR) without the RXD
pin short-circuit condition will clear the bit RXSHORT.
TXD Dominant Detection (LIN Interrupt)
The LIN transceiver monitors the TXD input pin to detect a
stuck in dominant (0V) condition. In case of a stuck condition
(TXD pin 0 V for more than 1 second (typ.)), the transmitter is
shut down and the TXDOM bit in the LIN Status Register
(LINSR) is set.
If the LINM bit is set in the IMR, an Interrupt IRQ will be
generated.
LIN Receiver Operation Only
While in Normal mode, the activation of the RXONLY bit
disables the LIN TXD driver. If case of a LIN error condition,
this bit is automatically set. If a low-power mode is selected
with this bit set, the LIN wake-up functionality is disabled,
then in STOP mode, the RXD pin will reflect the state of the
LIN bus.
STOP Mode And Wake-up Feature
During Stop mode operation, the transmitter of the
physical layer is disabled. If the LIN-PU bit was set in the Stop
mode sequence, the internal pull-up resistor is disconnected
from VSUP and a small current source keeps the LIN pin in
the recessive state. The receiver is still active and able to
detect wake-up events on the LIN bus line.
A dominant level longer than TPROPWL followed by a rising
edge will generate a wake-up interrupt, and will be reported
in the Interrupt Source Register (ISR). Also see Figure 34.
SLEEP Mode And Wake-up Feature
During Sleep mode operation, the transmitter of the
physical layer is disabled. If the LIN-PU bit was set in the
Sleep mode sequence, the internal pull-up resistor is
disconnected from VSUP and a small current source keeps
the LIN pin in recessive state. The receiver must be active to
detect wake-up events on the LIN bus line.
A dominant level longer than TPROPWL followed by a rising
edge will generate a system wake-up (Reset), and will be
reported in the Interrupt Source Register (ISR). Also see
Figure 33.
33912
80
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
LOGIC COMMANDS AND REGISTERS
33912 SPI INTERFACE AND CONFIGURATION
• MISO — Master-In Slave-Out
• SCLK— Serial Clock
A complete data transfer via the SPI consists of 1 byte.
The master sends 4 bits of address (A3:A0) + 4 bits of control
information (C3:C0) and the slave replies with 4 system
status bits (VMS,LINS,HSS,LSS) + 4 bits of status
information (S3:S0).
The serial peripheral interface creates the communication
link between a microcontroller (master) and the 33912.
The interface consists of four pins (see Figure 43):
• CS — Chip Select
• MOSI — Master-Out Slave-In
CS
Register Write Data
MOSI
A3
A2
A1
A0
C3
C2
C1
C0
S1
S0
Register Read Data
MISO
VMS LINS HSS
LSS
S3
S2
SCLK
Read Data Latch
Rising Edge of SCLK
Change MISO/MISO Output
Write Data Latch
Falling Edge of SCLK
Sample MISO/MISO Input
Figure 43. SPI Protocol
During the inactive phase of the CS (HIGH), the new data
The rising edge of the Chip Select CS indicates the end of
transfer is prepared.
the transfer and latches the write data (MOSI) into the
register. The CS high forces MISO to the high impedance
The falling edge of the CS indicates the start of a new data
state.
transfer and puts the MISO in the low-impedance state and
Register reset values are described along with the reset
latches the analog status data (Register read data).
condition.
Reset condition is the condition causing the bit to
With the rising edge of the SPI clock (SCLK), the data is
be set to its reset value. The main reset conditions are:
moved to MISO/MOSI pins. With the falling edge of the SPI
- Power-On Reset (POR): the level at which the logic is
clock (SCLK), the data is sampled by the receiver.
reset
and BATFAIL flag sets.
The data transfer is only valid if exactly 8 sample clock
- Reset mode
edges are present during the active (low) phase of CS.
- Reset done by the RST pin (ext_reset)
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
81
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
SPI REGISTER OVERVIEW
Table 38. System Status Register
Adress(A3:A0)
$0 - $F
BIT
Register Name / Read / Write Information
SYSSR - System Status Register
R
7
6
5
4
VMS
LINS
HSS
LSS
Table 39 summarizes the SPI Register content for Control Information (C3:C0)=W and status information (S3:S0) = R.
Table 39. SPI Register Overview
Adress(A3:A0)
BIT
Register Name / Read / Write Information
3
2
1
0
MCR - Mode Control Register
W
HVSE
LINPE
MOD2
MOD1
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
WUCR - Wake-up Control Register
W
L4WE
L3WE
L2WE
L1WE
WUSR - Wake-up Status Register
R
L4
L3
L2
L1
WUSR - Wake-up Status Register
R
L4
L3
L2
L1
LINCR - LIN Control Register
W
LDVS
RXONLY
LSR1
LSR0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
LINOC
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
LINOC
HSCR - High Side Control Register
W
PWMHS2
PWMHS1
HS2
HS1
HSSR - High Side Status Register
R
HS2OP
HS2CL
HS1OP
HS1CL
HSSR - High Side Status Register
R
HS2OP
HS2CL
HS1OP
HS1CL
LSCR - Low Side Control Register
W
PWMLS2
PWMLS1
LS2
LS1
LSSR - Low Side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
LSSR - Low Side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
TIMCR - Timing Control Register
W
CS/WD
WD2
WD1
WD0
CYST2
CYST1
CYST0
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$B
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$C
AMUXCR - Analog Multiplexer Control Register
W
LXDS
MX2
MX1
MX0
$D
CFR - Configuration Register
W
HVDD
CYSX8
CSAZ
CSGS
IMR - Interrupt Mask Register
W
HSM
LSM
LINM
VMM
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
$0
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$E
$F
33912
82
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
REGISTER DEFINITIONS
HS1CL
System Status Register - SYSSR
HS1OP
The System Status Register (SYSSR) is always
transferred with every SPI transmission and gives a quick
system status overview. It summarizes the status of the
Voltage Status Register (VSR), LIN Status Register (LINSR),
High Side Status Register (HSSR), and the Low Side Status
Register (LSSR).
HSS
HS2CL
HS2OP
Figure 46. High Side Status
LSS - Low Side Switch Status
This read-only bit indicates that one or more bits in the
LSSR are set.
Table 40. System Status Register
Read
S7
S6
S5
S4
VMS
LINS
HSS
LSS
1 = Low Side Status bit set
0 = None
VMS - Voltage Monitor Status
LS1CL
This read-only bit indicates that one or more bits in the
VSR are set.
1 = Voltage Monitor bit set
0 = None
LS1OP
LSS
LS2CL
LS2OP
Figure 47. Low Side Status
BATFAIL
VDDOT
VSUV
Mode Control Register - MCR
VMS
VSOV
Figure 44. Voltage Monitor Status
The Mode Control Register (MCR) allows switching
between the operation modes and to configure the 33912.
Writing the MCR will return the VSR.
Table 41. Mode Control Register - $0
C3
C2
C1
C0
Write
HVSE
LINPE
MOD2
MOD1
Reset
Value
1
1
-
-
Reset
Condition
POR
POR
-
-
LINS - LIN Status
This read-only bit indicates that one or more bits in the
LINSR are set.
1 = LIN Status bit set
0 = None
HVSE - High-voltage Shutdown Enable
LINOC
LINOT
TXDOM
LINS
RXSHORT
Figure 45. LIN Status
This write-only bit enables/disables automatic shutdown of
the high side and the low side drivers during a high-voltage
VSOV condition.
1 = automatic shutdown enabled
0 = automatic shutdown disabled
HSS - High Side Switch Status
LINPE - LIN pull-up enable.
This read-only bit indicates that one or more bits in the
HSSR are set.
1 = High Side Status bit set
0 = None
This write-only bit enables/disables the 30 kΩ LIN pull-up
resistor in STOP and SLEEP modes. This bit also controls
the LIN bus wake-up threshold.
1 = LIN pull-up resistor enabled
0 = LIN pull-up resistor disabled
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
83
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
MOD2, MOD1 - Mode Control Bits
These write-only bits select the operating mode and allow
clearing the watchdog in accordance with Table 82 Mode
Control Bits.
1 = POR Reset has occurred
0 = POR Reset has not occurred
Wake-up Control Register - WUCR
This register is used to control the digital wake-up inputs.
Writing the WUCR will return the Wake-up Status Register
(WUSR).
Table 42. Mode Control Bits
MOD2
MOD1
Description
0
0
Normal Mode
0
1
Stop Mode
1
0
Sleep Mode
1
1
Normal Mode + Watchdog Clear
Table 44. Wake-up Control Register - $2
C3
C2
C1
C0
Write
L4WE
L3WE
L2WE
L1WE
Reset
Value
1
1
1
1
Voltage Status Register - VSR
Returns the status of the several voltage monitors. This
register is also returned when writing to the Mode Control
Register (MCR).
Reset
Condition
POR, Reset mode or ext_reset
Table 43. Voltage Status Register - $0/$1
Read
S3
S2
S1
S0
VSOV
VSUV
VDDOT
BATFAIL
VSOV - VSUP Over-voltage
This read-only bit indicates an over-voltage condition on
the VS1 pin.
1 = Over-voltage condition.
0 = Normal condition.
VSUV - VSUP Under-Voltage
This read-only bit indicates an under-voltage condition on
the VS1 pin.
1 = Under-voltage condition.
0 = Normal condition.
VDDOT - Main Voltage Regulator Over-temperature
Warning
This read-only bit indicates that the main voltage regulator
temperature reached the Over-temperature Prewarning
Threshold.
1 = Over-temperature Prewarning
0 = Normal
BATFAIL - Battery Fail Flag.
This read-only bit is set during power-up and indicates that
the 33912 had a Power-On-Reset (POR).
Any access to the MCR or VSR will clear the BATFAIL flag.
LxWE - Wake-up Input x Enable
This write-only bit enables/disables which Lx inputs are
enabled. In Stop and Sleep mode the LxWE bit determines
which wake inputs are active for wake-up. If one of the Lx
inputs is selected on the analog multiplexer, the
corresponding LxWE is masked to 0.
1 = Wake-Up Input x enabled.
0 = Wake-Up Input x disabled.
Wake-up Status Register - WUSR
This register is used to monitor the digital wake-up inputs
and is also returned when writing to the WUCR.
Table 45. Wake-up Status Register - $2/$3
Read
S3
S2
S1
S0
L4
L3
L2
L1
Lx - Wake-up input x
This read-only bit indicates the status of the corresponding
Lx input. If the Lx input is not enabled, then the according
Wake-Up status will return 0.
After a wake-up from Stop or Sleep mode these bits also
allow to determine which input has caused the wake-up, by
first reading the Interrupt Status Register (ISR) and then
reading the WUSR.
1 = Lx Wake-up.
0 = Lx Wake-up disabled or selected as analog input.
33912
84
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
LIN Control Register - LINCR
LIN Status Register - LINSR
This register controls the LIN physical interface block.
Writing the LIN Control Register (LINCR) returns the LIN
Status Register (LINSR).
This register returns the status of the LIN physical
interface block and is also returned when writing to the
LINCR.
Table 46. LIN Control Register - $4
Table 48. LIN Status Register - $4/$5
C3
C2
C1
C0
Write
LDVS
RXONLY
LSR1
LSR0
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset
mode or
ext_reset
POR, Reset
mode, ext_reset
or LIN failure
gone*
POR
* LIN failure gone: if LIN failure (over-temp, TXD/RXD short) was set, the flag
resets automatically when the failure is gone.
LDVS - LIN Dominant Voltage Select
This write-only bit controls the LIN Dominant voltage:
1 = LIN Dominant Voltage = VLIN_DOM_1 (1.7V typ)
0 = LIN Dominant Voltage = VLIN_DOM_0 (1.1V typ)
RXONLY - LIN Receiver Operation Only
This write-only bit controls the behavior of the LIN
transmitter.
In Normal mode, the activation of the RXONLY bit disables
the LIN transmitter. In case of a LIN error condition, this bit is
automatically set.
In Stop mode this bit disables the LIN wake-up
functionality, and the RXD pin will reflect the state of the LIN
bus.
1 = only LIN receiver active (Normal mode) or LIN wakeup disabled (Stop mode).
0 = LIN fully enabled.
LSRx - LIN Slew-Rate
This write-only bit controls the LIN driver slew-rate in
accordance with Table 47.
Table 47. LIN Slew-Rate Control
LSR1
LSR0
Description
0
0
Normal Slew Rate (up to 20kb/s)
0
1
Slow Slew Rate (up to 10kb/s)
1
0
Fast Slew Rate (up to 100kb/s)
1
1
Reserved
Read
S3
S2
S1
S0
RXSHORT
TXDOM
LINOT
LINOC
RXSHORT - RXD Pin Short-circuit
This read-only bit indicates a short-circuit condition on the
RXD pin (shorted either to 5.0 V or to Ground). The shortcircuit delay must be a worst case of 8µs to be detected and
to shut down the driver. To clear this bit, it must be read after
the condition is gone (transition detected on RXD pin). The
LIN driver is automatically re-enabled once the condition is
gone.
1 = RXD short-circuit condition.
0 = None.
TXDOM - TXD Permanent Dominant
This read-only bit signals the detection of a TXD pin stuck
at dominant (Ground) condition and the resultant shutdown in
the LIN transmitter. This condition is detected after the TXD
pin remains in dominant state for more than 1 second (typical
value).
To clear this bit, it must be read after TXD has gone high.
The LIN driver is automatically re-enabled once TXD goes
High.
1 = TXD stuck at dominant fault detected.
0 = None.
LINOT - LIN Driver Over-temperature Shutdown
This read-only bit signals that the LIN transceiver was
shutdown due to over-temperature. The transmitter is
automatically re-enabled after the over-temperature
condition is gone and TXD is high. The LINOT bit is cleared
after SPI read once the condition is gone.
1 = LIN over-temperature shutdown
0 = None
LINOC - LIN Driver Over-Current Shutdown
This read-only bit signals an over-current condition
occurred on the LIN pin. The LIN driver is not shut down but
an IRQ is generated. To clear this bit, it must be read after the
condition is gone.
1 = LIN over-current shutdown
0 = None
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
85
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
High Side Control Register - HSCR
Low Side Control Register - LSCR
This register controls the operation of the high side drivers.
Writing to this register returns the High Side Status Register
(HSSR).
This register controls the operation of the low side drivers.
Writing the Low Side Control Register (LSCR) will also return
the Low Side Status Register (LSSR).
Table 49. High Side Control Register - $6
Table 51. Low Side Control Register - $8
C3
C2
C1
C0
Write
PWMHS2
PWMHS1
HS2
HS1
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset mode, ext_reset, HSx
over-temp or (VSOV & HVSE)
POR
C3
C2
C1
C0
Write
PWMLS2
PWMLS1
LS2
LS1
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset mode, ext_reset, LSx
over-temp or (VSOV & HVSE)
POR
PWMHSx - PWM Input Control Enable.
PWMLx - PWM input control enable.
This write-only bit enables/disables the PWMIN input pin
to control the respective high side switch. The corresponding
high side switch must be enabled (HSx bit).
1 = PWMIN input controls HSx output.
0 = HSx is controlled only by SPI.
This write-only bit enables/disables the PWMIN input pin
to control the respective low side switch. The corresponding
low side switch must be enabled (LSx bit).
1 = PWMIN input controls LSx.
0 = LSx is controlled only by SPI.
HSx - HSx Switch Control.
LSx - LSx switch control.
This write-only bit enables/disables the corresponding
high side switch.
1 = HSx switch on.
0 = HSx switch off.
This write-only bit enables/disables the corresponding low
side switch.
1 = LSx switch on.
0 = LSx switch off.
High Side Status Register - HSSR
Low Side Status Register - LSSR
This register returns the status of the high side switches
and is also returned when writing to the HSCR.
This register returns the status of the low side switches
and is also returned when writing to the LSCR.
Table 50. High Side Status Register - $6/$7
Read
S3
S2
S1
S0
HS2OP
HS2CL
HS1OP
HS1CL
Table 52. Low Side Status Register - $8/$9
Read
C3
C2
C1
C0
LS2OP
LS2CL
LS1OP
LS1CL
High Side Thermal Shutdown
Low Side Thermal Shutdown
A thermal shutdown of the high side drivers is indicated by
setting all HSxOP and HSxCL bits simultaneously.
A thermal shutdown of the low side drivers is indicated by
setting all LSxOP and LSxCL bits simultaneously.
HSxOP - High Side Switch Open-Load Detection
LSxOP - Low Side Switch Open-Load Detection
This read-only bit signals that the high side switches are
conducting current below a certain threshold indicating
possible load disconnection.
1 = HSx Open Load detected (or thermal shutdown)
0 = Normal
This read-only bit signals that the low side switches are
conducting current below a certain threshold indicating
possible load disconnection.
1 = LSx Open Load detected (or thermal shutdown)
0 = Normal
HSxCL - High Side Current Limitation
LSxCL - Low Side Current Limitation
This read-only bit indicates that the respective high side
switch is operating in current limitation mode.
1 = HSx in current limitation (or thermal shutdown)
0 = Normal
This read-only bit indicates that the respective low side
switch is operating in current limitation mode.
1 = LSx in current limitation (or thermal shutdown)
0 = Normal
33912
86
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
Timing Control Register - TIMCR
This register is a double purpose register which allows to
configure the watchdog and the cyclic sense periods. Writing
to the Timing Control Register (TIMCR) will also return the
Watchdog Status Register (WDSR).
Table 53. Timing Control Register - $A
This option is only active if one of the high side switches is
enabled when entering in Stop or Sleep mode. Otherwise a
timed wake-up is performed after the period shown in
Table 55.
Table 55. Cyclic Sense Interval
CYSX8(132)
CYST2
CYST1
CYST0
Interval
X
0
0
0
No cyclic sense
0
0
0
1
20 ms
0
0
1
0
40 ms
0
0
1
1
60 ms
0
1
0
0
80 ms
0
1
0
1
100 ms
0
1
1
0
120 ms
0
1
1
1
140 ms
CS/WD - Cyclic Sense or Watchdog prescaler select
1
0
0
1
160 ms
This write-only bit selects which prescaler is being written
to, the Cyclic Sense prescaler or the Watchdog prescaler.
1 = Cyclic Sense Prescaler selected
0 = Watchdog Prescaler select
1
0
1
0
320 ms
1
0
1
1
480 ms
1
1
0
0
640 ms
1
1
0
1
800 ms
1
1
1
0
960 ms
1
1
1
1
1120 ms
C3
Write
C2
C1
C0
WD2
WD1
WD0
CYST2
CYST1
CYST0
CS/WD
Reset
Value
-
Reset
Condition
0
0
-
0
POR
WDx - Watchdog Prescaler
This write-only bits selects the divider for the watchdog
prescaler and therefore selects the watchdog period in
accordance with Table 54. This configuration is valid only if
windowing watchdog is active.
Table 54. Watchdog Prescaler
WD2
WD1
WD0
Prescaler Divider
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
6
1
0
0
8
1
0
1
10
1
1
0
12
1
1
1
14
CYSTx - Cyclic Sense Period Prescaler Select
This write-only bits selects the interval for the wake-up
cyclic sensing together with the bit CYSX8 in the
Configuration Register (CFR) (see Configuration Register CFR).
Notes
132. bit CYSX8 is located in Configuration Register (CFR)
Watchdog Status Register - WDSR
This register returns the Watchdog status information and
is also returned when writing to the TIMCR.
Table 56. Watchdog Status Register - $A/$B
Read
S3
S2
S1
S0
WDTO
WDERR
WDOFF
WDWO
WDTO - Watchdog Timeout
This read-only bit signals the last reset was caused by
either a watchdog timeout or by an attempt to clear the
Watchdog within the window closed.
Any access to this register or the Timing Control Register
(TIMCR) will clear the WDTO bit.
1 = Last reset caused by watchdog timeout
0 = None
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
87
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
WDERR - Watchdog Error
Table 58. Analog Multiplexer Channel Select
This read-only bit signals the detection of a missing
watchdog resistor. In this condition the watchdog is using the
internal, lower precision timebase. The Windowing function is
disabled.
1 = WDCONF pin resistor missing
0 = WDCONF pin resistor not floating
MX2
MX1
MX0
Meaning
0
0
0
Disabled
0
0
1
Reserved
0
1
0
Die Temperature Sensor
0
1
1
VSENSE input
1
0
0
L1 input
WDOFF - Watchdog Off
1
0
1
L2 input
This read-only bit signals that the watchdog pin connected
to Ground and therefore disabled. In this case watchdog
timeouts are disabled and the device automatically enters
Normal mode out of Reset. This might be necessary for
software debugging and for programming the Flash memory.
1 = Watchdog is disabled
0 = Watchdog is enabled
1
1
0
L3 input
1
1
1
L4 input
WDWO - Watchdog Window Open
This read-only bit signals when the watchdog window is
open for clears. The purpose of this bit is for testing. Should
be ignored in case WDERR is High.
1 = Watchdog window open
0 = Watchdog window closed
Analog Multiplexer Control Register - MUXCR
This register controls the analog multiplexer and selects
the divider ration for the Lx input divider.
Table 57. Analog Multiplexer Control Register -$C
C3
C2
C1
C0
Write
LXDS
MX2
MX1
MX0
Reset
Value
1
0
0
0
Reset
Condition
POR
POR, Reset mode or ext_reset
LXDS - Lx Analog Input Divider Select
This write-only bit selects the resistor divider for the Lx
analog inputs. Voltage is internally clamped to VDD.
0 = Lx Analog divider: 1
1 = Lx Analog divider: 3.6 (typ.)
MXx - Analog Multiplexer Input Select
These write-only bits selects which analog input is
multiplexed to the ADOUT0 pin according to Table 58.
When disabled or when in Stop or Sleep mode, the output
buffer is not powered and the ADOUT0 output is left floating
to achieve lower current consumption.
Configuration Register - CFR
This register controls the Hall Sensor Supply enable/
disable, the cyclic sense timing multiplier, enables/disables
the Current Sense Auto-zero function and selects the gain for
the current sense amplifier.
Table 59. Configuration Register - $D
C3
C2
C1
C0
Write
HVDD
CYSX8
CSAZ
CSGS
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset
mode or
ext_reset
POR
POR
POR
HVDD - Hall Sensor Supply Enable
This write-only bit enables/disables the state of the hall
sensor supply.
1 = HVDD on
0 = HVDD off
CYSX8 - Cyclic Sense Timing x 8.
This write-only bit influences the cyclic sense period as
shown in Table 55.
1 = Multiplier enabled
0 = None
CSAZ - Current Sense Auto-Zero Function Enable
This write-only bit enables/disables the circuitry to lower
the offset voltage of the current sense amplifier.
1 = Auto-zero function enabled
0 = Auto-zero function disabled
CSGS - Current Sense Amplifier Gain Select
This write-only bit selects the gain of the current sense
amplifier.
1 = 14.5 (typ.)
0 = 30 (typ.)
33912
88
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
FUNCTIONAL DEVICE OPERATIONS
Interrupt Mask Register - IMR
LINM - LIN Interrupts Mask
This register allows masking of some of the interrupt
sources. The respective flags within the Interrupt Source
Register (ISR) will continue to work but will not generate
interrupts to the MCU. The 5.0 V Regulator over-temperature
prewarning interrupt and Under-Voltage (VSUV) interrupts
can not be masked and will always cause an interrupt.
This write-only bit enables/disables interrupts generated in
the LIN block.
1 = LIN Interrupts Enabled
0 = LIN Interrupts Disabled
VMM - Voltage Monitor Interrupt Mask
Writing to the IMR will return the ISR.
This write-only bit enables/disables interrupts generated in
the Voltage Monitor block. The only maskable interrupt in the
Voltage Monitor Block is the VSUP over-voltage interrupt.
1 = Interrupts Enabled
0 = Interrupts Disabled
Table 60. Interrupt Mask Register - $E
C3
C2
C1
C0
Write
HSM
LSM
LINM
VMM
Reset
Value
1
1
1
1
Reset
Condition
Interrupt Source Register - ISR
This register allows the MCU to determine the source of
the last interrupt or wake-up respectively. A read of the
register acknowledges the interrupt and leads IRQ pin to
high, in case there are no other pending interrupts. If there
are pending interrupts, IRQ will be driven high for 10 µs and
then be driven low again.
This register is also returned when writing to the Interrupt
Mask Register (IMR).
POR
HSM - High Side Interrupt Mask
This write-only bit enables/disables interrupts generated in
the high side block.
1 = HS Interrupts Enabled
0 = HS Interrupts Disabled
Table 61. Interrupt Source Register - $E/$F
LSM - Low Side Interrupt Mask
This write-only bit enables/disables interrupts generated in
the low side block.
1 = LS Interrupts Enabled
0 = LS Interrupts Disabled
Read
S3
S2
S1
S0
ISR3
ISR2
ISR1
ISR0
ISRx - Interrupt Source Register
These read-only bits indicate the interrupt source following
Table 62. If no interrupt is pending then all bits are 0.
In case more than one interrupt is pending, the interrupt
sources are handled sequentially multiplex.
Table 62. Interrupt Sources
Interrupt Source
ISR3 ISR2 ISR1 ISR0
none maskable
maskable
0
0
0
0
0
0
0
1
0
0
1
0
-
HS Interrupt (Over-temperature)
0
0
1
1
-
LS Interrupt (Over-temperature)
0
1
0
0
0
1
0
1
0
1
1
no interrupt
Priority
no interrupt
none
Lx Wake-up from Stop mode-
highest
LIN Interrupt (RXSHORT, TXDOM, LIN OT, LIN
OC) or LIN Wake-up
Voltage Monitor Interrupt
Voltage Monitor Interrupt
(Low Voltage and VDD over-temperature)
(High Voltage)
-
Forced Wake-up
0
lowest
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
89
MC33912BAC / MC34912BAC
TYPICAL APPLICATION
TYPICAL APPLICATION
The 33912 can be configured in several applications. The figure below shows the 33912 in the typical Slave Node Application.
V
BAT
VS2
VS1
D1
C2
C1
C4
Interrupt
Control Module
LVI, HVI, HTI, OCI
IRQ
C3
Internal
Bus
VDD
Voltage Regulator
C5
AGND
HVDD
5V Output Module
VDD
IRQ
Reset
Control Module
LVR, HVR, HTR, WD,
RST
LS1
Low Side Control
Module
RST
TIMER
LS2
HB Type Relay
PGND
Window
Watchdog Module
PWMIN
HS1
HS2
MISO
MOSI
Chip Temp Sense Module
SCLK
Analog Multiplexer
SPI
&
CONTROL
SPI
CS
VSENSE
VBAT Sense Module
R2
L1
Analog Input Module
A/D
R1
Motor Output
High Side Control
Module
MCU
Hall Sensor Supply
ADOUT0
R3
L2
Wake Up Module
L3
Digital Input Module
L4
R4
Analog Input
R5
Analog Input
RXD
LIN Physical Layer
SCI
LIN
LIN
TXD
C6
ISENSEH
Current Sense Module
ADOUT1
WDCONF
LGND
AGND
ISENSEL
PGND
A/D
R6
R7
Typical Component Values:
C1 = 47µF; C2 = C4 = 100nF; C3 = 10µF; C5 = 4.7µF; C6 = 220pF
R1 = 10kΩ; R2 = R3 = 10kΩ; R4 = R5 = 33kΩ; R6 = 20Ω; R7 = 20kΩ-200kΩ
Recommended Configuration of the not Connected Pins (NC):
Pin 28 = this pin is not internally connected and may be used for PCB routing
optimization.
33912
90
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Important For the most current revision of the package, visit www.Freescale.com and select Documentation, then under
Available Documentation column select Packaging Information.
AC SUFFIX (PB-FREE)
32-PIN LQFP
98ASH70029A
REVISION D
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
91
MC33912BAC / MC34912BAC
IMPORTANT FOR THE MOST CURRENT REVISION OF THE PACKAGE, VISIT WWW.FREESCALE.COM AND SELECT DOCUMENTA-
PACKAGE DIMENSIONS (Continued)
AC SUFFIX (PB-FREE)
32-PIN LQFP
98ASH70029A
REVISION D
33912
92
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33912BAC / MC34912BAC
REVISION HISTORY
REVISION HISTORY
Revision
Date
Description of Changes
5/2007
•
Initial Release
2.0
9/2007
•
•
•
•
•
Several textual corrections
Page 11: “Analog Output offset Ratio” (LXDS=1) changed to “Analog Output offset” +/-22mV
Page 11: VSENSE Input Divider Ratio adjusted to 5,0/5,25/5,5
Page 12: Common mode input impedance corrected to 75kΩ
Page 13/15: LIN PHYSICAL LAYER parameters adjusted to final LIN specification release
3.0
9/2007
•
Revision number incremented at engineering request.
4.0
2/2008
•
•
Changed Functional Block Diagram on page 24.
This Data Sheet and previous versions cover Part Numbers MC33912BAC and MC34912BAC. Future
revisions do not cover these Part Numbers.
5.0
10/2008
•
•
•
Datasheet updated according to the Pass1.2 silicon version electrical parameters
Add Maximum Rating on IBUS_NO_GND parameter
Added L1, L2, L3, and L4, Temperature Sense Analog Output Voltage per characterization(39), Internal Chip
Temperature Sense Gain per characterization at 3 temperatures(39) See Figure 16, Temperature Sense Gain,
VSENSE Input Divider Ratio (RATIOVSENSE=VSENSE/VADOUT0) per characterization(40), and VSENSE
Output Related Offset per characterization(40) parameters
Added Temperature Sense Gain section
Minor corrections to ESD Capability, (18), Cyclic Sense ON Time from Stop and Sleep mode(50), Lin Bus Pin
(LIN), Serial Data Clock Pin (SCLK), Master Out Slave In Pin (MOSI), Master In Slave Out Pin (MISO), Low
Side Pins (LS1 and LS2), Digital/analog Pins (L1, L2, L3 and L4), Normal Request Mode, Sleep Mode, LIN
Over-temperature Shutdown / TXD Stuck At Dominant / RXD Short-circuit:, Fault Detection Management
Conditions, Lin Physical Layer, LIN Interface, Over-temperature Shutdown (LIN Interrupt), LIN Receiver
Operation Only, SPI Protocol, Lx - Wake-up input x, LIN Control Register - LINCR, and RXSHORT - RXD Pin
Short-circuit
This data sheet does not contain electrical parameters for MC33912BAC and MC34912BAC (see revision
4.0).
Updated Freescale form and style
1.0
•
•
•
•
6.0
2/2009
•
•
7.0
3/2009
•
•
Changed VBAT_SHIFT and GND_SHIFT maximum from 10% to 11.5% for both parameters on page 14.
This data sheet does not contain electrical parameters for MC33912BAC and MC34912BAC (see revision
4.0).
8.0
3/2010
•
Combined Complete Data sheet for Part Numbers MC33912BAC and MC34912BAC to the back of this data
sheet.
Changed ESD Voltage for Machine Model from ± 200 to ± 150
•
Added explanation for pins Not Connected (NC).
This data sheet does not contain electrical parameters for MC33912BAC and MC34912BAC (see revision
4.0).
33912
Analog Integrated Circuit Device Data
Freescale Semiconductor
93
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MC33912
Rev. 8.0
3/2010
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