MC74VHC1G50 Buffer The MC74VHC1G50 is an advanced high speed CMOS buffer fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffered output which provides high noise immunity and stable output. The MC74VHC1G50 input structure provides protection when voltages up to 7.0 V are applied, regardless of the supply voltage. This allows the MC74VHC1G50 to be used to interface 5.0 V circuits to 3.0 V circuits. • • • • • • • http://onsemi.com MARKING DIAGRAMS SC--88A / SOT--353/SC--70 DF SUFFIX CASE 419A High Speed: tPD = 3.5 ns (Typ) at VCC = 5 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C Pin 1 d = Date Code Power Down Protection Provided on Inputs Balanced Propagation Delays Pin and Function Compatible with Other Standard Logic Families TSOP--5/SOT--23/SC--59 DT SUFFIX CASE 483 Chip Complexity: FET = 104; Equivalent Gate = 26 These devices are available in Pb--free package(s). Specifications herein apply to both standard and Pb--free devices. Please see our website at www.onsemi.com for specific Pb--free orderable part numbers, or contact your local ON Semiconductor sales office or representative. PIN ASSIGNMENT 1 IN A 2 3 GND 4 VRd Pin 1 d = Date Code VCC 5 1 NC VRd OUT Y NC 2 IN A 3 GND 4 OUT Y 5 VCC FUNCTION TABLE Figure 1. Pinout (Top View) IN A 1 OUT Y A Input Y Output L H L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2006 March, 2006 -- Rev. 12 1 Publication Order Number: MC74VHC1G50/D MC74VHC1G50 MAXIMUM RATINGS (Note 1) Symbol Value Unit VCC DC Supply Voltage Characteristics --0.5 to +7.0 V VIN DC Input Voltage --0.5 to +7.0 V VOUT DC Output Voltage --0.5 to 7.0 --0.5 to VCC + 0.5 V IIK Input Diode Current --20 mA IOK Output Diode Current +20 mA IOUT DC Output Current, per Pin +25 mA ICC DC Supply Current, VCC and GND +50 mA PD Power dissipation in still air SC--88A, TSOP--5 200 mW θJA Thermal resistance SC--88A, TSOP--5 333 °C/W TL Lead temperature, 1 mm from case for 10 s 260 °C TJ Junction temperature under bias +150 °C Tstg Storage temperature --65 to +150 °C VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V ILatch--Up Latch--Up Performance Above VCC and Below GND at 125°C (Note 5) ±500 mA VCC = 0 High or Low State VOUT < GND; VOUT > VCC 1. Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute--maximum--rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 2. Tested to EIA/JESD22--A114--A 3. Tested to EIA/JESD22--A115--A 4. Tested to JESD22--C101--A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Min Max Unit VCC Symbol DC Supply Voltage Characteristics 2.0 5.5 V VIN DC Input Voltage 0.0 5.5 V VOUT DC Output Voltage 0.0 VCC V TA Operating Temperature Range --55 +125 °C tr , tf Input Rise and Fall Time 0 0 100 20 ns/V VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Device Junction Temperature versus Time to 0.1% Bond Failures 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 TJ = 80 ° C 90 TJ = 90 ° C 117.8 TJ = 100 ° C 1,032,200 TJ = 110° C 80 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 120° C Time, Years TJ = 130 ° C Time, Hours NORMALIZED FAILURE RATE Junction Temperature °C 1 1 10 100 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 1000 MC74VHC1G50 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Test Conditions Min 1.5 2.1 3.15 3.85 VIH Minimum High--Level Input Voltage 2.0 3.0 4.5 5.5 VIL Maximum Low--Level Input Voltage 2.0 3.0 4.5 5.5 VOH Minimum High--Level Output Voltage VIN = VIH or VIL VOL Maximum Low--Level Output Voltage VIN = VIH or VIL TA = 25°C VCC (V) Typ TA ≤ 85°C Max Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 VIN = VIH or VIL IOH = --50 mA 2.0 3.0 4.5 1.9 2.9 4.4 VIN = VIH or VIL IOH = --4 mA IOH = --8 mA 3.0 4.5 2.58 3.94 VIN = VIH or VIL IOL = 50 mA 2.0 3.0 4.5 VIN = VIH or VIL IOL = 4 mA IOL = 8 mA Max Min Max 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 2.0 3.0 4.5 0.0 0.0 0.0 --55 ≤ TA ≤ 125°C V 0.5 0.9 1.35 1.65 1.9 2.9 4.4 1.9 2.9 4.4 2.48 3.80 2.34 3.66 Unit V V V 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 0.36 0.36 0.44 0.44 0.52 0.52 V V IIN Maximum Input Leakage Current VIN = 5.5 V or GND 0 to 5.5 ±0.1 ±1.0 ±1.0 mA ICC Maximum Quiescent Supply Current VIN = VCC or GND 5.5 1.0 20 40 mA AC ELECTRICAL CHARACTERISTICS Cload = 50 pF, Input tr = tf = 3.0 ns TA = 25°C Symbol tPLH, tPHL CIN Parameter Maximum Propagation Delay, Input A to Y Min Test Conditions TA ≤ 85°C Typ Max Min Max --55 ≤ TA ≤ 125°C Min Max Unit ns VCC = 3.3 ± 0.3 V CL = 15 pF CL = 50 pF 4.5 6.4 7.1 10.6 8.5 12.0 10.0 14.5 VCC = 5.0 ± 0.5 V CL = 15 pF CL = 50 pF 3.5 4.5 5.5 7.5 6.5 8.5 8.0 10.0 4 10 10 10 Maximum Input Capacitance pF Typical @ 25°C, VCC = 5.0 V CPD 8.0 Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD ¯ VCC ¯ fin + ICC. CPD is used to determine the no--load dynamic power consumption; PD = CPD ¯ VCC2 ¯ fin + ICC ¯ VCC. http://onsemi.com 3 MC74VHC1G50 TEST POINT A or B VCC 50% tPHL Y DEVICE UNDER TEST GND tPLH OUTPUT CL* 50% VCC *Includes all probe and jig capacitance Figure 4. Switching Waveforms Figure 5. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number Circuit Indicator Temp Range Identifier Technology Device Function Package Suffix Tape & Reel Suffix Package Type Tape and Reel Size† MC74VHC1G50DFT1 MC 74 VHC1G 50 DF T1 SC--88A / SOT--353 / SC--70 178 mm (7”) 3000 Unit MC74VHC1G50DFT2 MC 74 VHC1G 50 DF T2 SC--88A / SOT--353 / SC--70 178 mm (7”) 3000 Unit MC74VHC1G50DTT1 MC 74 VHC1G 50 DT T1 TSOP--5 / SOT--23 / SC--59 178 mm (7”) 3000 Unit †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC74VHC1G50 CAVITY TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN TOP TAPE COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 6. Tape Ends for Finished Goods TAPE DIMENSIONS mm 4.00 4.00 2.00 ∅1.50 TYP 1.75 3.50 ±0.50 8.00 ±0.30 1 ∅1.00 MIN DIRECTION OF FEED Figure 7. SC--70--5/SC--88A/SOT--353 DFT1 Reel Configuration/Orientation TAPE DIMENSIONS mm 4.00 2.00 4.00 ∅1.50 TYP 1.75 3.50 ±0.50 8.00 ±0.30 1 ∅1.00 MIN DIRECTION OF FEED Figure 8. SC--70/SC--88A/SOT--353 DFT2 and SOT23--5/TSOP--5/SC59--5 DTT1 Reel Configuration/Orientation http://onsemi.com 5 MC74VHC1G50 t MAX 1.5 mm MIN (0.06 in) A 13.0 mm ±0.2 mm (0.512 in ±0.008 in) 50 mm MIN (1.969 in) 20.2 mm MIN (0.795 in) FULL RADIUS G Figure 9. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm T1, T2 178 mm (7 in) 8.4 mm, + 1.5 mm, --0.0 (0.33 in + 0.059 in, --0.00) 14.4 mm (0.56 in) DIRECTION OF FEED BARCODE LABEL POCKET Figure 10. Reel Winding Direction http://onsemi.com 6 HOLE MC74VHC1G50 PACKAGE DIMENSIONS SC70--5/SC--88A/SOT--353 DF SUFFIX 5--LEAD PACKAGE CASE 419A--02 ISSUE G A G 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A--01 OBSOLETE. NEW STANDARD 419A--02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 4 DIM A B C D G H J K N S --B-- S 1 2 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC -----0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 J K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches Figure 11. SC--88A/SC70--5/SOT--353 *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC -----0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 MC74VHC1G50 PACKAGE DIMENSIONS SOT23--5/TSOP--5/SC59--5 DT SUFFIX 5--LEAD PACKAGE CASE 483--01 ISSUE C D S 5 4 1 2 L A 3 B MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0_ 10 _ 0_ 10 _ S 2.50 3.00 0.0985 0.1181 G J C 0.05 (0.002) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. H M K SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches Figure 12. THIN SOT23--5/TSOP--5/SC59--5 *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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