Compact High Accuracy Temperature Sensor ICs Thermostat Output Temperature ICs with Variable Detection Temperature BDE□□□0G Series No.11047JCT03 ●Description Low quiescent current (16µA), high accuracy thermostat (temperature switch) ICs. Built in temperature sensor, reference voltage regulator, D/A converter, and comparator. Detecting temperature by itself, OS terminal state is changed at logically. Open Drain Output (Active L ) is available in BDE□□□0G series. ●Features 1) Detection Temperature Range +55~+115℃ by 6 products. 2) ±5℃ Step Selectable Detection Temperature with CTRL. 3) Hysteresis Temperature (typically 10℃) 4) High Accuracy Analog Output (typically ±3.5℃@Ta=30℃) 5) Analog Output Temperature Sensitivity (typically -10.8mV/℃) 6) Low Supply Current (typically 16µA) 7) Small Package (typically 2.90mm×2.80mm×1.25mm) 8) ESD Rating 8kV (HBM) 9) Excellent Ripple Rejection Characteristic ●Applications Thermal Protection for Electrical Equipment (Notebook PC, Cell phone, FPD-TV, etc.) FAN Control for Thermal Management ●Products Line up BDE 0 □□□ Detection Temperature (Center Temperature) 110:110℃ 100:100℃ 090: 90℃ 080: 80℃ 070: 70℃ 060: 60℃ Output Format (Open Drain, Active Low) Package (SSOP5) H : High ) OS Output Format Marking Temperature / Output Format Table CTRL status description ( L : Low, O : Open, Detection Temperature (℃) Product CTRL Name L H O G BDE1100G 105 110 115 Open Drain Active L eB BDE1000G 95 100 105 Open Drain Active L eC BDE0900G 85 90 95 Open Drain Active L eD BDE0800G 75 80 85 Open Drain Active L eE BDE0700G 65 70 75 Open Drain Active L eF BDE0600G 55 60 65 Open Drain Active L eG www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/8 2011.07 - Rev.C Technical Note BDE□□□0G Series ●Absolute Maximum Ratings ( Ta = 25℃ ) Parameters Symbol Limit Unit Power Supply Voltage VDD -0.3 to 7.0*1 V Input Voltage ( CTRL ) VIN -0.3 to VDD+0.3 V Input Current ( CTRL ) IIN -1.0, +0.1 mA OS terminal Voltage VOS -0.3 to 7.0 V OS terminal Current IOS 5.0 mA Power dissipation Pd 540*2 mW Storage Temperature Range Tstg -55 to 150 ℃ *1. Not to exceed Pd *2. Reduced by 5.40mW for each increase in Ta of 1℃ over 25℃( mounted on 70mm×70mm×1.6mm Glass-epoxy PCB ) ●Recommended Operating Condition Parameters Symbol Min. Typ. Max. Unit Power Supply Voltage VDD 2.9 3.0 5.5 V Operating Temperature Range Topr -30 - 130 ℃ ●Temperature Accuracy ( Unless otherwise specified, VDD = 3.0V ) Parameters Symbol Limit Min. Typ. Max. Unit Conditions Thermostat ( Temperature Switch ) Detection TemperatureAccuracy Tacc - 0 ±4.0 ℃ Detection Temperature Hysteresis Thys 7.5 10.0 12.5 ℃ TTemp - - ±3.5 ℃ Ta = -20℃~115℃ Analog Output VTemp Temperature Accuracy Ta = 30℃ ●Electrical Characteristics ( Unless otherwise specified, VDD = 3.0V, Ta = 25℃ ) Parameter Symbol Limits Unit Conditions Min. Typ. Max. IDD - 16.0 20.0 µA CTRL = 3.0V VTemp 1.716 1.753 1.790 V Ta = 30℃ VSE -10.28 -10.68 -11.08 mV/℃ ⊿VTempRL - - 1 mV difference of IOUT : 0µA / 2µA IL - - 1.0 µA OS : 5.0V VOL - - 0.4 V IinOS = 1.2mA Input L Voltage VIL GND - 0.6 V Input H Voltage VIH 2.4 - VDD V Supply Current Analog Output VTemp Output Voltage VTemp Temperature Sensitivity VTemp Load Regulation Ta = -30 to 100℃ OS Output Open Drain OS Leakage Current OS Output Voltage CTRL *Radiation hardiness is not designed. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/8 2011.07 - Rev.C Technical Note BDE□□□0G Series ●Package Outline Product Type Lot No. SSOP5 (Unit: mm) ●Pin Description Pin No. Pin Name Function 1 CTRL Detection temperature setting 2 GND GROUND 3 Vtemp 4 VDD 5 OS Comment Refer to 2/7 page for the temperature set. ( Temperature / Output Format Table ) - Output voltage in inverse proportion to the temperature( TYP. -10.68mV/℃) POWER SUPPLY Open Drain type Use the pull-up resistor over 10kΩ. Digital thermostat output www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Set the OPEN state or Connect high impedance input node. 3/8 2011.07 - Rev.C Technical Note BDE□□□0G Series ●Equivalence Circuit CTRL OS VDD OS CTRL GND GND Please connect the pull-up resistor over 10kΩ. VTemp VDD VTemp GND Please don’t connect the pull-down resistor ●Block Diagram CTRL 1 GND 2 V Temp www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3 OUT 5 OS 4 VDD + - Vref TEMP SENSOR 4/8 Iref 2011.07 - Rev.C Technical Note BDE□□□0G Series Analog Output Voltage ( VTemp ) [V] ●Functional Diagram ( ex. Detection Temperature 110℃ ) 3.0 2.5 Temperature Sensitivity (-10.68mV/℃ Typical) 2.0 1.5 VTemp@30℃ (1.753V Typical) 1.0 0.5 -50 -30 -10 30 10 50 70 90 110 130 OS Output Voltage ( VOS ) [V] Temperature [℃] Temperature Hysteresis (10℃ Typical) Vos 0 -50 -30 -10 10 30 50 70 90 110 130 Temperature [℃] www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/8 2011.07 - Rev.C Technical Note BDE□□□0G Series ●Reference Data 25 3.0 VDD=3V 20 2.0 IDD [uA] VTemp [V] 2.5 1.5 1.0 15 10 5 0.5 Ta=25℃ 0.0 -80 -40 0 0 40 80 120 160 0 1 2 Temperature [℃] 4 5 6 7 8 VDD [V] Fig1. VTemp Voltage vs. Temperature (Temperature Sensitivity) Fig2. Supply Current vs. Supply Voltage 25 3.0 Ta=25℃ 0 2.5 -25 2.0 -50 ΔVTemp [mV] VTemp [V] 3 1.5 1.0 0.5 -75 -100 -125 -150 VDD=3V, Ta=25℃ -175 0.0 0 1 2 3 4 5 6 7 -200 8 0 2 3 4 5 ITemp [uA] VDD [V] Fig4. VTemp Voltage vs. Output Current Fig3. VTemp Voltage vs. Supply Voltage 3.0 1 VDD=3V, Ta=25℃ 2.5 VOS[V] 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 IOS [mA] Fig5. OS Output Voltage vs. Load Current www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/8 2011.07 - Rev.C Technical Note BDE□□□0G Series ●Notes for use 1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. 3) Pin short and mistake fitting When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is a placement mistake, the IC may be burned up. 4) Operation in strong electric field Be noted that using ICs in the strong electric field can malfunction them. 5) Mutual impedance Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible. Use a capacitor to keep ripple to a minimum. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/8 2011.07 - Rev.C Technical Note BDE□□□0G Series ●Ordering part number B D E 0 Part No. 6 Part No. 0600 0700 0900 1000 0 0 G - Package G: SSOP5 0800 1100 T R Packaging and forming specification TR: Embossed tape and reel (SSOP5) SSOP5 5 4 1 2 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6° 4° −4° 2.9±0.2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 −0.03 0.05±0.05 1.1±0.05 1.25Max. ) +0.05 0.42 −0.04 0.95 0.1 Direction of feed Reel (Unit : mm) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/8 ∗ Order quantity needs to be multiple of the minimum quantity. 2011.07 - Rev.C Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. 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The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. 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Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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