High Performance BGA Cooling Solutions with maxiGRIP™ Attachment ATS PART # ATS-53270P-C1-R0 Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB » Designed specifically for BGAs and other surface mount packages » Meets Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL-STD-810 Shock testing and Unpackaged Drop Testing standards » Comes preassembled with high performance, phase change, thermal interface material » “Keep-Out” Requirements: An “Un-Populated” boarder zone of 5 mm around the component is necessary to facilitate the Installation/ Removal of the maxiGRIP™. Please refer to the maxiGRIP™ KeepOut Guidelines and maxiGRIP™ Installation/Removal Instructions for further details Thermal Performance *Image above is for illustration purposes only. Air Velocity Thermal Resistance FT/MIN M/S °C/W (UNDUCTED FLOW) °C/W (DUCTED FLOW) 200 1.0 5.3 3.3 300 1.5 4.2 400 2.0 3.6 500 2.5 3.2 600 3.0 2.9 700 3.5 2.7 800 4.0 2.6 Product Details DIMENSION A DIMENSION B DIMENSION C DIMENSION D INTERFACE MATERIAL FINISH 27 mm 27 mm 17.5 mm 27 mm CHOMERICS T766 BLUE ANODIZED Notes: 1) 2) 3) 4) 5) Dimensions are measured in millimeters Dimensions A & B refer to component size Dimension C = the height of the heat sink shown above and does not include the height of the attachment method ATS reserves the right to update or change it products without notice Contact ATS to learn about custom options available For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV1_0908