CX2SM AT CRYSTAL 9.6 MHz to 250 MHz ™ Low Profile, Miniature Surface Mount AT Quartz Crystal Fundamental Mode: 9.6 MHz - 250 MHz Third Overtone: 48 MHz - 160 MHz actual size DESCRIPTION STATEK’s miniature CX2SM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These crystals are low profile and have a small footprint. The CX2SM crystal is manufactured using the STATEK-developed photolithographic process, and was designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. XX SXX glass lid side view ceramic lid PACKAGE DIMENSIONS B 1 FEATURES 2 A I Designed for surface mount applications using infrared, vapor phase, or epoxy mount techniques. H G Hermetically sealed ceramic package 3 F Excellent aging characteristics D Available with glass or ceramic lid High shock and vibration resistance E C Custom designs available Full military testing available Designed and manufactured in the USA APPLICATIONS Medical Infusion Pumps Industrial, Computer & Communications TYPICAL MAXIMUM DIM inches mm inches mm A 0.260 6.60 0.275 6.99 B 0.094 2.39 0.108 2.74 C - - D 0.035 0.89 0.045 1.14 E 0.059 1.50 0.069 1.75 see below F 0.050 1.27 0.060 1.52 Engine Control G 0.105 2.67 0.115 2.92 Down-hole Data Recorder H 0.155 3.94 0.165 4.19 I 0.210 5.33 0.220 5.59 Military & Aerospace Communications Smart Munitions Timing Devices (Fuzes) THICKNESS (DIM C) MAXIMUM GLASS LID Surveillance Devices CERAMIC LID inches mm inches mm SM1 0.065 1.65 0.075 1.91 SM2/SM4 0.067 1.70 0.077 1.96 SM3/SM5 0.070 1.78 0.080 2.03 Note: Terminal 1 is electrically connected internally to terminal 3 IS O RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de YS 90 01 ERT T E M C IFIC T A N IO S 10136 - Rev B Pb TERMINATIONS SPECIFICATIONS O Specifications are typical at 25 C unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency 10 MHz Motional Resistance (R1) 60 25 10 Motional Capacitance C1 (fF) 2.8 6.2 4.0 Quality Factor Q (k) 95 30 30 Shunt Capacitance C0 (pF) 1.4 2.3 2.3 Calibration Tolerance1 2 Load Capacitance Drive Level Frequency-Temperature Stability1,3 + _ Designation SM1 SM2 SM3 SM4 SM5 32 MHz 155.52 MHz Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) Max Process Temperature 260OC for 20 sec. 100 ppm, or tighter as required 20 pF for f ≤ 50 MHz PACKAGING OPTIONS 10 pF for f > 50 MHz • Tray Pack 500 µW MAX for f ≤ 50 MHz 200 µW MAX for f > 50 MHz • 16mm tape, 7” or 13” reels Per EIA 481 (see Tape and Reel data sheet 10109) + _ 50 ppm to + _ 10 ppm (Commercial) + _ 100 ppm to + _ 20 ppm (Industrial) SUGGESTED LAND PATTERN 0.070 (1.78) + _ 100 ppm to +_ 30 ppm (Military) 5 ppm MAX (better than 1 ppm available) Aging, first year4 3,000 g, 0.3 ms, 1/2 sine Shock, survival5 6 Vibration, survival 20 g, 10-2,000 Hz swept sine O Operating Temp. Range -10 C to +70 C (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55OC to +125OC Max Process Temperature 0.114 (2.90) O 0.105 (2.67) O 260 C for 20 sec. EQUIVALENT CIRCUIT 1. Other tolerances available. Contact factory. 2. Unless specified otherwise. 3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 4. 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 5. Higher shock version available. 6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. C0 1 L1 C1 R1 2 R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance HOW TO ORDER CX2SM AT CRYSTALS CX2 S “S” if special or custom design. Blank if Std. O.T. = 3RD O.T. Mode Blank = Fundamental Mode C C = Ceramic Lid Blank = Glass Lid SM1 – 32.0M Frequency M = MHz SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) , 100 / Calibration Tolerance @ 25OC (in ppm) 100 / — I / Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified Frequency Stability over Temp. Range (in ppm) OR — / — / 200 Total Frequency Tolerance (in ppm) / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified IS O RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de YS 90 01 ERT T E M C IFIC T A N IO S 10136 - Rev B Pb