Rohm BD83733HFP-M Aec-q100 qualified Datasheet

Datasheet
Constant Current LED Drivers
50V 500mA
1ch Source Driver for Automotive
BD83732HFP-M /BD83733HFP-M
General Description
Key Specifications
BD83732HFP-M and BD83733HFP-M are 50V tolerant
LED current drivers. Suitable for Automotive LED
applications, it can control light through constant current
output with control using PWM.
Having LED open/short detective circuit and LED current
de-rating functions integrated, it can deliver high reliability.
By utilizing Rohm’s patented PBUS function, it is possible
to turn OFF all LEDs when a row of LEDs are
short/open-circuited if multiple number of the ICs are used
In case the LED connected to the output IOUT terminal
has 2 LEDs in serise, BD83732HFP-M has to be used, in
case of 3 LEDs in series - BD83733HFP-M ( Refer to
Page.18 LED Open Detection / Disable LED Open
Detection ).
„
„
„
„
Input Voltage Range: 4.5V to 42V
Max Output Current: 500mA (Max)
Output Current Accuracy: ±5% (Max)
Operating Temperature Range: -40°C to +125°C
Packages
HRP7
W(Typ) x D(Typ) x H(Max)
9.395mm x 10.540mm x 2.005mm
Features
„
„
„
„
„
„
„
„
„
AEC-Q100 Qualified
Variable form Constant-Current Source Driver
PWM Dimming Function
LED constant current set by external resistor
LED Current De-rating Function
LED Open/Short detection
Disable LED Open Detection at low power supply
Temperature Protective
Abnormal Output Detection and Output Functions
(PBUS)
HRP7
Application
„ On-board Exterior Lamp
(Rear Lamp, Turn Lamp, DRL/Position Lamp,
Fog Lamp, etc.)
„ On-board Interior Lamp
(Air Conditioner Lamp, Interior Lamp,
Cluster Light, etc.)
Basic Application Circuit
Figure 1. Typical Application Circuit
○Product configuration: Silicon monolithic integrated circuit
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Datasheet
BD83732HFP-M / BD83733HFP-M
Pin Configurations
(TOP VIEW)
1
2
3
4
5
6
7
PBUS
DISC
CRT
GND
IOUT
VIN_F
VIN
FIN(GND)
Figure 2. HRP7 Package Pin Configuration
Pin Descriptions
HRP7 Package
Pin No.
Pin Name
Function
1
PBUS
Error detection I/O, LED current de-rating input terminal
2
DISC
Discharge setting pin
3
CRT
Capacitor Resistor Timer setting
4
GND
GND
5
IOUT
Current output
6
VIN_F
Output current detection
7
VIN
Power supply input
If not used DISC should be shorted to GND.
Block Diagram
Figure 3. Block Diagram
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Datasheet
BD83732HFP-M / BD83733HFP-M
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
VIN
-0.3～+50
V
VVIN_F,VCRT,VDISC,VIOUT,VPBUS
-0.3～VIN
V
Pd
2.29(Note1)
W
Operating Temperature Range
Topr
-40～125
°C
Storage Temperature Range
Tstg
-55～150
°C
Tjmax
150
°C
IOUT
500
mA
Supply Voltage
VIN_F,CRT,DISC,IOUT,PBUS
Terminal Voltage
Power Dissipation
Junction Temperature
IOUT Output Maximum Current
(Note1)
HRP7
De-rate by 18.4mW/°C when operating above Ta=25°C
Please refer to page 21 below.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Rating
Unit
Supply Voltage(Note1)
VIN
4.5～42.0
V
Operating Temperature Range
Topr
-40～125
°C
CRTIMER Frequency Range
F PWM
100～5000
Hz
PWM Minimum Pulse Width
T MIN
10
µs
(Note1)
Pd, ASO should not be exceeded
Operating Conditions
Parameter
Current Setting Resistor
Symbol
Min
Max
Unit
RVIN_F
0.36
3.6
Ω
Capacitor
connecting VIN terminal
Capacitor
connecting IOUT terminal
Capacitor
connecting CRT terminal
C vin
1.0
-
μF
C IOUT
0.1
0.66
μF
C CRT
0.01
1.0
μF
DC_IN pull-down resistor
R DCIN
-
50
kΩ
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Datasheet
BD83732HFP-M / BD83733HFP-M
Electrical Characteristics (Unless otherwise specified Ta=-40～125°C, VIN= 13V, RVIN_F=0.47Ω, RPBUS=10kΩ)
Parameter
Symbol
Min
Typ
Max
UNIT
Condition
Circuit Current
IVIN
-
2.1
6.0
mA
IOUT Terminal
Output Current Accuracy
373
383
393
mA
Ta=25°C
IOUT
364
383
402
mA
Ta=-40°C～125°C
VIN – IOUT Drop Voltage
VDR_IOUT
-
0.45
1.0
V
IOUT Terminal OFF Current
IIOUT_OFF
-
-
1
μA
V IOUT =2V, V CRT =0.7V
Ta=25°C
IOUT Current at GND Short
IIOUT_SHORT
-
7
40
μA
V IOUT =0V
VIN_F_REF
0.171
0.180
0.189
V
VIOUT_OPEN
V IN
-0.080
V IN
-0.050
V IN
-0.020
V
V IOUT_
0.2
0.6
1.0
V
I CRT_SO
29.75
35.00
40.25
μA
CRT Terminal Voltage
V CRT_CHA
0.990
1.10
1.21
V
CRT Terminal
Discharge Voltage 1
V CRT_DIS1
2.7
3.0
3.3
V
CRTIMER Discharge Constant
V CRT_CHA /
V CRT_DIS1
0.348
0.367
0.386
V/V
V CRT_DIS2
3.6
4.0
4.4
V
R CHA
51.6
54.3
57.0
kΩ
R CHA =(V CRT_DIS1 －
V CRT_CHA ) / I CRT_SO
R D1
-
50.0
100
Ω
V CRT =3.4V
R D2
2.5
5.0
10
kΩ
V CRT =5V
Current Sense Voltage
IOUT Voltage
at LED Open Detection
IOUT Voltage
at LED Short Detection
CRT Terminal Charge Current
CRT Terminal
Discharge Voltage 2
CRT Terminal
Charge Resistance
DISC Terminal
Discharge Resistance 1
DISC Terminal
Discharge Resistance 2
SHORT
I OUT =383mA
V IN_F_REF =V IN -V IN_F
V CRT =0.9V
R D1<-> R D2 (Note1)
PBUS Terminal De-rating Input
Voltage High
V DH_PBUS
2.3
2.5
2.7
V
⊿VIN_F_REF = 2.0mV
⊿VIN_F_REF =
VIN_F_REF(@PBUS = 13V) –
VIN_F_REF(@PBUS = VDH_PBUS)
PBUS Terminal De-rating Input
Voltage Low
V DL_PBUS
0.8
1.0
1.2
V
I OUT <5µA
GD
114
120
126
mV/V
V OL_PBUS
-
-
0.7
V
I PBUS =2mA
I IN_PBUS
-
38.0
100
μA
V PBUS =13V
BD83732HFP-M
V M_OPEN
7.30
7.65
8.00
V
VIN voltage
BD83733HFP-M
V M_OPEN
10.5
11.0
11.5
V
VIN voltage
De-rating Gain
PBUS Terminal
Low Voltage
PBUS Terminal
Input Current
Disable Open Detection
during low power supply voltage
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⊿I OUT =G D ×V PBUS
V PBUS =1.5V -> 2.0V
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Datasheet
BD83732HFP-M / BD83733HFP-M
●Typical Performance Curves (Reference Data)
(Unless otherwise specified Ta=25°C, VIN=13V, RCRT=3.9Ω, CCRT=0.033μF, CIOUT=0.1μF )
ΔIOUT=(IOUT/(0.18V/RVIN_F)-1)×100[%]
Figure 4. RVIN_F vs IOUT
Figure 5. RVIN_F vs ΔIOUT
Figure 6.Temperature vs VIN_F_REF
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Figure 7. PBUS vs VIN_F_REF
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Datasheet
BD83732HFP-M / BD83733HFP-M
CCRT=0.033μF, RCRT=3.9kΩ
(On-Duty 6.7% setting)
Ta=-40°C
Ta=25°C
Ta=125℃
Figure 9. Temperature vs PWM ON Duty
Figure 8. VCRT vs ICRT_SO
(VCRT:CRT Terminal Voltage)
Iout = OPEN
Iout = OPEN
Figure 11. BD83733HFP-M
LED Disable Open Detection voltage
Figure 10. BD83732HFP-M
LED Disable Open Detection voltage
Figure 12. Temperature vs De-rating Gain
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Datasheet
BD83732HFP-M / BD83733HFP-M
Functional Description
(Unless otherwise specified, Ta=25°C, VIN=13V, IOUT=6V and RVIN_F=0.47Ω. Numbers are "Typical" values.)
1.
Output Current Setting
LED Current IOUT can be set by value of resistor RVIN_F.
IOUT =
(VIN− VIN_F) VIN_F_REF
=
[A]
RVIN_F
RVIN_F
where:
VIN_F_REF is 0.18V (Typ)
Figure 13. Output Current Setting
2.
Table of Operations
The PWM dimming mode switches to linear control depending on CRT terminal voltage.
When VCRT > VCRT_DIS2 ( Typ ~ 4.0V ), Dimming mode turns to Linear Control, and discharge resistance of DISC
terminal changes from RD1( Typ ~ 50 Ω ) to RD2 ( Typ ~ 5k Ω ).
When an LED open/short-circuit fault is detected, which depends on IOUT terminal voltage, the output current is turned
OFF.
Output current is also turned OFF when PBUS terminal is pulled LOW.
Operation Mode
CRT Terminal
IOUT Terminal
Voltage
(VIOUT)
Output Current
(IOUT)
PBUS Terminal
Linear Control
4.0V(Typ)≤VCRT
-
50mA～500mA
Hi-Z
Hi-Z
PWM dimming
OPEN
-
See Features Functional
Description, 3. PWM
Dimming Operation using
external RC network
LED Current
De-rating
-
-
See Features Description,
9. LED Current De-rating
Function
PBUS<2.5V
LED Open
-
VIOUT ≥
VIN - 0.050V(Typ)
1μA(Max)
Low Output
LED Short
-
VIOUT ≤ 0.6V(Typ)
40μA(Max)
Low Output
PBUS Control OFF
-
-
1μA(Max)
Low Input
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Datasheet
BD83732HFP-M / BD83733HFP-M
3.
PWM Dimming Operation using external RC network
PWM Dimming is performed with the following circuit.
The CR timer function is activated if CRT terminal is OPEN. To perform PWM light control of LED current, a triangular
waveform is generated at CRT terminal. The LED current is turned OFF while CRT voltage is ramping up, and LED
current is turned ON while CRT voltage is ramping down.
The ramp up/down time of the CRT voltage, and therefore the dimming cycle and Duty, can be set by values of the external
components (CCRT, RCRT).
Please connect DISC to GND if it is not used.
+B
VIN_F
IOUT
IOUT
VIN
VREF
ICRT=35µA(Typ)
ON/OFF
CRT
CCRT
RCRT
VIN-0.180V
(Typ)
OSC
DISC
GND
50Ω(Typ)
CRT Voltage Ramp-up
CRT Voltage Ramp-down
CRT Terminal
Waveform
IOUT Waveform
Figure 14. PWM Dimming Operation
(1)
CRT Ramp up Time T1
CRT ramp up time can be obtained from the following equations:
T1 =
∆VCRT × CCRT
= RCHA × CCRT [s]
ICRT_SO
where:
ICRT_SO is the CRT Terminal Charge Current 35μA (Typ)
RCHA is the CRT Terminal Charge Resistance 54.3kΩ(Typ)
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BD83732HFP-M / BD83733HFP-M
(2)
CRT Ramp down Time T2
CRT ramp down time is defined by the discharge period due to the external capacitor CCRT and resistance (RCRT +
RD1). The CRT Terminal Charge Current is OFF at CRT ramp down.
Make sure that T2 is set > pulse width 20μs (Min).
⎛ VCRT_CHA ⎞
T2 = −CCRT × ( RCRT + RD1) × ln ⎜⎜
⎟⎟ [s]
⎝ VCRT_DIS1 ⎠
where:
50Ω (Typ)
RD1 is the CRT Terminal Discharge Resistance 1
VCRT_CHA is the CRT Terminal Discharge ON Voltage 1.1V (Typ)
VCRT_DIS1 is the CRT Terminal Discharge ON Voltage 3.0V (Typ)
(3)
Dimming Frequency fPWM
PWM frequency is defined by T1 and T2.
f PWM =
(4)
1
T1+ T 2
[Hz]
ON Duty (DON)
Like the above, PWM ON duty is defined by T1 and T2.
DON =
T2
T 1+ T 2
(Example) In case of fPWM = 518Hz and 6.7% Duty (Typ),
From fPWM=518Hz; T1 + T2 = 1 / fPWM = 1 / 518Hz = 1931μs
From ON Duty = 6.7%; CRT ramp up time T1 is T1 = (T1 + T2) × 0.933 = 1801.6μs
External capacity CCRT is;
CCRT = T1 × (ICRT / ∆VCRT) = 1800.7μs × 35μA / 1.9V ≒ 0.033μF
CRT ramp down time T2 is; T2 = (T1 + T2) × 0.067 = 129μs
External resistance RCRT is;
RCRT = －T2 / (CCRT × ln(VCRT_CHA / VCRT_DIS)) － RD1 = －129usec / (0.033μF × ln(1.1 / 3.0) – 50Ω) ≒ 3.9kΩ
PWM Dimming Operation using external signal
An external microcomputer can directly drive the PWM signal for Dimming CRT terminal. In that case, ’High’ level voltage
of PWM signal should be > VCRT_DIS2( 4.4V(Max)) and ’Low’ level voltage of PWM signal < VCRT_CHA(0.99V(Min)).
Figure 15. External Input of PWM Signal
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About a reverse connection protection diode
In case you apply voltage the CRT over the reverse protection diode (D3) as the figure below ( Figure 16), there is a
possibility that the CRT rise time and fall time will deviate from the settings due to reverse current of diode (D3) affecting
charge and discharge current to capacitance(C3). Reverse current Ir is getting high value with high temperatures, so the
diode recommended by ROHM or a diode with reverse current characteristics below max 1μA needs to be considered.
Besides, since reverse current causes also in the recommended diode, a resistor of about 1kΩ needs to be
connected between the A-point and GND, so that voltage in the A-point doesn’t rise.
CRT start-up / fall time Mechanism of deviation from settings
① During the PWM dimming operation mode, the A-point on Figure.16 becomes Hi-Z
↓
② Reverse current Ir of D2 and D3 goes to the A-point
(Power supply voltage is being input into the cathode of D2, so reverse current of D2 goes to mainly into C1)
⇒Reverse current Ir of D3 is added to the CRT terminal charge current ICRT_SO and discharge current IDIS, so
CRT start-up / fall time deviates from the settings.
↓
③ C1 gets charged, voltage in the A-point rises
↓
④ Voltage in the A-point exceeds voltage in CRT terminals of each IC
↓
⑤ Vf occurs in the diodes D3
↓
⑥ D3 circulate forward current If
⇒Forward current If of D3 is added to the CRT terminal charge current ICRT_SO and discharge current IDIS, so
CRT start-up / fall time deviates from the settings.↓
⑦ Repetition ②-⑥
Figure 16. About the mechanism of deviation of CRT start-up / fall time due to the reverse connection prevention diode
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BD83732HFP-M / BD83733HFP-M
Setting VIN Range
Number of LED connections N should meet the following conditions:
Vf_led × N ≤ +B – Vf_diode –VIN_F_REF –VDR_IOUT
where:
+B is the Battery Voltage
Vf_diode is the Reverse Connection Preventing Diode Vf
VIN_F_REF is the VIN_F Terminal Voltage (VIN – VIN_F)
VDR_IOUT is the IOUT Terminal Drop Voltage
Vf_led is the LED Vf ( maximum )
N is the Number of LED Levels
Example : If you want to supply constant current to LED at 9V or higher Battery Voltage (+B) (Supposing that Vf_diode is
0.5V),
Vf_led × N ≤ +B – Vf_diode － VIN_F_REF － VDR_IOUT = 9V –0.5V –0.189V(Max) – 1.0V(Max) = 7.311V
(Sum of Vf of LED connected to IOUT terminal is set to be 7.311V Max.)
VIN_F_REF
Vf_diode
IOUT
D1
RVIN_F
VIN_F
IOUT
PWM_in
CVIN
ZD1
VIN
CIOUT
D2
Vf_led × N
D3
CRT
DC_in
+B
RDCIN
RPBUS1
CCRT
RCRT
BD83732HFP-M
BD83733HFP-M
DISC
ZD2
FIN
RPBUS2
PBUS
GND
RTHM
Figure 17. LED Setting Range Schematic
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Datasheet
BD83732HFP-M / BD83733HFP-M
4.
Self-protection and PBUS Functionality
This IC includes self-protection from short/open-circuit of LED, and reports abnormal condition at the PBUS terminal.
(1) LED Open Detection Function
When any LED connected to IOUT terminal is open-circuited, it is detected by overvoltage at IOUT terminal (VOUT >
VIOUT_OPEN ). Then the output current is turned OFF and PBUS terminal is pulled Low.
Figure 18. LED Open Detection
(2) LED Short-circuit Detective Function
<
When the LEDs connected to the IOUT terminal are short-circuited, it is detected by a low voltage at IOUT terminal (VOUT
V IOUT_SHORT ).
Then the output current is turned OFF to prevent thermal destruction of IC, and PBUS terminal is
pulled to Low.
Figure 19. LED Short-circuit Detection
(3) IOUT Current at GND Short(IIOUT_SHORT)
In this case, IOUT Current at GND Short(IIOUT_SHORT) flows from IOUT terminal.
The value depends upon VOUT.
Figure 20.
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Datasheet
BD83732HFP-M / BD83733HFP-M
(4) Prevention of false LED Short Detection during PWM
When in Linear control mode, LED Open & Short Circuit Detection are active continuously.
In PWM Dimming mode, LED Open Detection is active only during the Fall time of VCRT, but LED Short Circuit Detection is
active at all time. (Refer to Figure20.)
(Note1)
can couple on
When IOUT is disabled during PWM, the output will be high impedance ( ‘Hi-Z’). During this time noise
to this pin and cause false detection of SHORT condition.
(Note2)
To prevent this it is necessary to connect a Capacitor(more than 0.1uF
terminal nearby terminal
(ROHM Recommended Value : CIOUT=0.1μF GCM188R11H104KA42 murata)
) between IOUT terminal and GND
(Note1) Conducted noise, Radiated noise, Interference of connecter and PCB pattern etc…
(Note2) If more than 0.1uF, please evaluate the time of VIN on to IIOUT on.
Linear Control Mode
VIN
VCRT
VIOUT
IIOUT
PWM Dimming Mode
VIN
0V
0V
VCRT
0V
VIOUT
0V
IIOUT
0mA
0V
0mA
IOUT Terminal
Hi-Z zone
None
IOUT Terminal
Hi-Z zone
LED Open
Detection
Active
LED Open
Detection
LED Short
Circuit
Detection
Hi-Z
Hi-Z
Active
LED Short
Circuit
Detection
Active
Hi-Z
Active
Active
Active
Figure 21. Timing of LED Open & Short Circuit Detection Function
and IOUT Terminal Hi-Z zone
D1
RVIN_F
VIN_F
IOUT
PWM_in
ZD1
CVIN
VIN
CIOUT
D2
D3
CRT
DC_in
+B
RDCIN
RPBUS1
CCRT
RCRT
DISC
ZD2
BD83732HFP-M
BD83733HFP-M
FIN
RPBUS2
PBUS
GND
RTHM
Figure 22. About the capacitor of connecting IOUT terminal
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Datasheet
BD83732HFP-M / BD83733HFP-M
Evaluation example (IIOUT pulse width at PWM Dimming operation)
Condition：+B=13V
Ta=25°C
LED 3Strings
RCRT=560Ω
CCRT=0.033μF
PWM Dimming Mode
(5) About the maximum value of the capacitor connected to the output
In case a capacitor exceeding the recommended range (above 0.66μF) is connected to the IOUT terminal, there is a
possibility that delay time of start-up will reach about several hundred ms, so special attention is needed. Below an
evaluation example is mentioned as reference data.
Measurement conditions：VIN=13V , Ta=25°C, RVIN_F=3.6Ω, LED 3 steps, linear control mode
VIN
10V/div
PBUS
10V/div
0.1~0.66uF
6.6uF
IIOUT
20mA/div
50msec/div
Figure 23. About the capacitor connected to the IOUT terminal
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BD83732HFP-M / BD83733HFP-M
PBUS Function
The PBUS terminal is an input/output terminal for outputting trouble and inputting trouble detection.
When an LED open/short-circuit occurs, the PBUS terminal output is pulled LOW (Note1).
It is possible to turn output current OFF by pulling the PBUS terminal Low.
(Note1) PBUS terminal is an open drain terminal. It should always be pulled up(10kΩ) to power supply voltage.
When multiple ICs are used to drive multiple LEDs, as shown in the drawing below, it is possible to turn off all rows of LEDs
if only some LEDs are short/open-circuited by connecting PBUS terminal of each IC.
VIN_F
CRT
VIN
VIN_F
CRT
LED
OPEN
IOUT
CH1
IOUT
CH2
PBUS
PBUS
+B
VIN
PBUS
Hi-Z ⇒Low
VIN_F
LED
OFF
CRT
VIN
IOUT
CH3
LED
OFF
PBUS
OPEN
Trouble
Occurs
PROTECT BUS
Possible to turn OFF all LEDs
Connect PBUS of each CH
Figure 24. PBUS Function
▼Example of Protective Operation due to LED Open Circuit
LED Open
Connect PBUS of each CH
1Output voltage is brought up
when LED Open occurs.
2 LED current turns OFF.
3 PBUS output become Low.
Clamp to 1.4V
during OFF
4 Turns OFF LED current of
other IC.
Clamp to 1.4V
during OFF
Figure 25. Example of Protective Operation
If LED OPEN occurs, PBUS of CH1 is switched from Hi-Z to Low output. As PBUS becomes Low, LED drivers of
other CH detect the condition and turns OFF their own LEDs. VIOUT clamps to 1.4V (Typ) during the OFF period, in
order to prohibit ground fault detection.
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5.
Caution when using multiple IC with different power supplies
Each Input terminal has a built- in ESD protection diodes. (Refer to I/O equivalence circuits)
If the VIN terminal is not supplied and other Input terminals are supplied voltage, the IC may malfunction(abnormal
operation mode, abnormal LED lighting ) due to arise VIN terminal voltage .
The Application Example of accidental operation is below.
H
TAIL
L
TAIL
STOP
VIN
L
VIN
VIN_F
STOP
A
B
CRT
PBUS
DISC
PBUS
GND
GND
VIN
(B)
VPBUS
(B)
VCRT
(B)
VIN
(A)
GND
H
L
H
L
H
L
H
L
⇒Due to Voltage arises VIN(A),
CRT(B) is not triangle wave output
Figure 26. Application Example
(Operational Explanation)
Only input Tail
: Arise VIN terminal voltage of IC A from ESD protection Diode between VIN terminal
and PBUS terminal of IC A.
Due to connect VIN terminal of IC A and CRT terminal of IC B across Diode,
DC voltage inputs CRT terminal of IC B, so it is possible to operate IC B DC mode.
6.
LED current de-rating function
BD83733/32 has an LED current de-rating functionality. When the PBUS terminal voltage falls below 2.5V(Typ), LED
current output decreases with VIN_F_REF voltage reduction. In order to eliminate oscillating of the output current, a capacitor is
required at the PBUS terminal.
Besides, in case of connecting the PBUS terminals between the series model BD8371XXX/BD8372XXX/BD8374XXX and
the BD83733/32HFP-M, the series model except BD83733/32 will be turned off during the de-rating operation.
Figure 27. LED Current De-rating Function Characteristics
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Datasheet
BD83732HFP-M / BD83733HFP-M
Timing Chart
IOUT
VIN_F
PWM_in
VIN
VREF
VREF
VIN-0.180V
(Typ)
ON/OFF
DC_in
B+
CRT
DISC
FIN
OSC
LED OPEN
DET
LED OPEN
DET MASK
7.65V/11.0V
(Typ)
(BD83732HFP-M
/BD83733HFP-M)
LED GND SHORT
DET
VIN0.05V
(Typ)
0.6V
(Typ)
LED
Current
Derate
PBUS
GND
Figure 28. Timing Chart
c If PWM_in is switched ON, VCRT will start oscillation, and LED current IOUT will follow this waveform.
(PWM light control mode)
d If DC_in is switched ON, VCRT will be pulled High (VIN-Vf). LED current IOUT will be continuous.
(Linear control mode)
e If LED becomes OPEN, LED current IOUT will stop. At the same time, VPBUS goes Low.
f If LED is short-circuited to GND, LED current IOUT will stop. At the same time, VPBUS goes Low.
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Operation Range of Constant Current Control
Operation range of constant current control can be obtained from the following equation:
Operation range of constant current control
VIN ≥ Vf_led × N + VIN_F_REF + VDR_IOUT [V]
Where:
VIN is the VIN Terminal Voltage
Vf_led is the LED Vf
N is the: Number of LED Levels
VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F)
VDR_IOUT is the IOUT Terminal Drop Voltage
LED Open Detection / Disable LED Open Detection range
This feature is implemented to detect a significant power supply voltage drop at start-up and shut-down, and to disable LED
open detection. In case of low power supply (VIN) close to LED forward voltage (VIOUT), the device disables the diagnostic
function of LED open to avoid any false open load detection.
At enough power supply higher than the V M_OPEN (threshold of disable LED open detection), when the IOUT terminal (VIOUT)
exceeds the VIOUT_OPEN ( LED open detection threshold ) by actual LED open load , the PBUS output will be Low.
The LED forward voltage has to be set lower than the V M_OPEN as following equation.
VM_OPEN ≥ Vf_led × N + 50mV(typ) + VDR_IOUT [V]
LED Open Detection Voltage at IOUT
VIOUT_OPEN = VIN - 50mV(Typ)
Disable LED Open Detection at VIN voltage
BD83732HFP-M : V M_OPEN = 7.65V (Typ)
BD83733HFP-M : V M_OPEN = 11.0V (Typ)
Figure 29. Guaranteed Range of Current Accuracy and LED Open Detection / Disable LED Open Detection range.
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BD83732HFP-M / BD83733HFP-M
How to Connect LED
If multiple rows of LEDs are connected, note that OPEN circuit may not be detected.
1st Level
2nd Level
3rd Level
1st Row
(1 series)
2nd Row
Nth Row
(2 or more parallel rows)
(matrix connection)
Figure 30. LED Connection Patterns
(Note1)
(Note2)
Connection Pattern
LED Short-circuit Detection
(GND short of IOUT terminal)
LED OPEN detection
1 Series
Detectable
Detectable-
2 parallels or more
Detectable
Non-detectable (Note 1)
2 parallels or more
(Matrix Connection)
Detectable
Non-detectable (Note 2)
: Detectable only when one or more LEDs become open in all rows.
: Detectable only when all LEDs on the same level become open.
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Datasheet
BD83732HFP-M / BD83733HFP-M
Recommended Application Circuit
D1
RVIN_F
VIN_F
IOUT
PWM_in
ZD1
CVIN
VIN
CIOUT
D2
D3
CRT
DC_in
RDCIN
RPBUS1
+B
CCRT
BD83732HFP-M
BD83733HFP-M
RCRT
DISC
ZD2
FIN
RPBUS2
PBUS
GND
RTHM
Figure 31. Recommended Application Circuit
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Component
Name
Component
Value
Product
Name
Company
D1
-
RFN1L6S
ROHM
RFN1L6S
ROHM
D2
D3
ZD1
ZD2
RFN1L6S
ROHM
TNR12H-220K
NIPPON CHEMICON
FTZ5.6E
ROHM
CVIN
4.7µF
GCM32ER71H475KA40
murata
RVIN_F
0.91Ω
LTR10 Series
ROHM
RPBUS1
1kΩ
ESR03 Series
ROHM
RPBUS2
13kΩ
ESR03 Series
ROHM
CCRT
0.033µF
GCM188R11H333KA40
murata
RCRT
3.9kΩ
MCR03 Series
ROHM
CIOUT
0.1µF
GCM188R11H104KA42
murata
RTHM
150kΩ
NTCG104LH154H
TDK
RDCIN
5.1kΩ
ESR03 Series
ROHM
Table 1. BOM List
PWM_in
DC_in
Mode
Low
Low
OFF
Low
PWM Dimming Mode
(14mA 6.7% ON duty@518Hz)
High
Linear Control Mode
(200mA 100% ON duty)
High
Linear Control Mode
(200mA 100% ON duty)
(Note1,Note2)
High
(Note2)
Low
(Note2)
High
(Note1) See Functional Description "3. PWM Dimming Operation."
(Note2) See Functional Description "2. Table of Operations."
Table 2. Table of Operations
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Thermal Loss
VIN_F_REF
Vf_diode
IOUT
D1
RVIN_F
VIN_F
IOUT
PWM_in
CVIN
ZD1
VIN
CIOUT
D2
Vf_led × N
D3
CRT
DC_in
+B
RDCIN
RPBUS1
CCRT
RCRT
BD83732HFP-M
BD83733HFP-M
DISC
ZD2
FIN
RPBUS2
PBUS
GND
RTHM
Figure 33. Application Circuit Diagram for Thermal Description
Thermal design should meet the following equation:
Pd > Pc
Pd = (1/θja) × (Tjmax - Ta) or (1/θjc) ×(Tjmax - Tc)
Pc = (+B – Vf_diode - VIN_F_REF – Vf_led×N)×IOUT + IVIN×VIN
where:
Pd is the Power Dissipation
Pc is the Power Consumption
+B is the Battery Voltage
Vf_diode is the Reverse Connection Preventing Diode Vf
VIN_F_REF is the VIN_F Terminal Voltage (VIN-VIN_F)
Vf_led is the LED Vf
N is the Number of LED Levels
IOUT is the Output Current
IVIN is the Circuit Current
VIN is the Power Supply Voltage
θja is the Thermal Resistance between Tj and Ta
θjc is the Thermal Resistance between Tj and Tc
Tjmax is the Max Joint Temperature (150°C)
Ta is the Ambient Temperature
Tc is the Case Surface Temperature
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BD83732HFP-M / BD83733HFP-M
HRP7 Package
5.0
2 layer copper foil 50mm x 50mm
θja = 30℃/W
4.16W
Power dissipation Pd [W]
4.0
2 layer copper foil 15mm x 15mm
θja = 54.4℃/W
1 layer
θja = 78.1℃/W
3.0
2.3W
2.0
1.6W
1.0
0.0
0
25
50
75
100
125
150
Temp Ta [℃]
(Caution1)
(Caution2)
(Caution3)
When mounted with 70.0mm X 70.0mm X 1.6mm glass epoxy substrate.
Above copper foil area indicates backside copper foil area.
Value changes according to number of substrate layers and copper foil area. Note that this value is a measured value, not a guaranteed value.
Figure 34. Thermal Dissipation Curve
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BD83732HFP-M / BD83733HFP-M
Thermal Design for Small Number of LEDs
If there are few LED lamps, it is suggested to insert resistance between IOUT terminal and LED to reduce heat generation
in the IC and dissipate heat.
(This does not apply where amperage is low.)
In that case, the range of current accuracy will be as shown in the following equation:
+B ≥ Vf_diode + Vf_led × N + VIN_F_REF + VDR_IOUT +IOUT×R1
Vf_diode is the Reverse Connection Preventing Diode Vf
Vf_led is the LED Vf
N is the Number of LED Levels
VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F)
VDR_IOUT is the IOUT Terminal Drop Voltage
IOUT is the Output Current
R1 is the Thermal Dissipation Resistance
Thermal design should meet the following equation when inserting thermal dissipation resistance:
Pd = (1/θja) × (Tjmax - Ta) or (1/θjc) ×(Tjmax - Tc)
Pc = (+B – Vf_diode - VIN_F_REF – Vf_led×N)×IOUT + IVIN×VIN
Pd is the Power Dissipation
Pc is the Power Consumption
+B is the Battery Voltage
Vf_diode is the Reverse Connection Preventing Diode Vf
VIN_F_REF is the VIN_F Terminal Voltage (VIN - VIN_F)
Vf_led is the LED Vf
N is the Number of LED Levels
IOUT is the Output Current
R1 is the Thermal Dissipation Resistance
IVIN is the Circuit Current
VIN is the Power Supply Voltage
θja is the Thermal Resistance between Tj and Ta
θjc is the Thermal Resistance between Tj and Tc
Tjmax is the Max Joint Temperature (150°C)
Ta is the Ambient Temperature
Tc is the Case Surface Temperature
Vf_diode
Thermal Dissipation
Resistance
VIN_F_REF
D1
RVIN_F
R1
VIN_F
IOUT
Vf_led × N
PWM_in
ZD1
CVIN
VIN
IOUT
CIOUT
D2
D3
CRT
DC_in
+B
RDCIN
RPBUS1
CCRT
RCRT
DISC
ZD2
BD83732HFP-M
BD83733HFP-M
FIN
RPBUS2
PBUS
GND
RTHM
Figure 35. Example of How to Connect Thermal Dissipation Resistance
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Datasheet
BD83732HFP-M / BD83733HFP-M
I/O equivalence circuits
Number
Terminal Name
1
PBUS
Equivalence Circuit
VIN
(7pin)
2
DISC
DISC
(2pin)
RD2=
5kΩ(Typ)
RD1=
50Ω(Typ)
GND
(4pin)
3
CRT
4
GND
5
IOUT
6
VIN_F
7
VIN
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BD83732HFP-M / BD83733HFP-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11.
Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 36. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Input Voltage Fluctuation
In case input voltage fluctuations are fast, there is a possibility that rush current above the rated value will flow into the
output MOSFET. Therefore, please, set the capacity value of the capacitor connected to the VIN terminal after paying
enough attention to the actual application in accordance with specifications.
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Datasheet
BD83732HFP-M / BD83733HFP-M
Ordering Information
B
D
8
3
7
3
2
H
F
P
-
Package
HFP:HRP7
B
D
8
3
7
3
3
H
F
Package
HFP:HRP7
MTR
Packaging and forming specification
M: High Reliability Design
TR: Embossed tape and reel
(HRP7)
P
-
MTR
Packaging and forming specification
M: High Reliability Design
TR: Embossed tape and reel
(HRP7)
Marking Diagrams
HRP7 (TOP VIEW)
Part Number Marking
BD83732HFP
LOT Number
1PIN MARK
HRP7 (TOP VIEW)
Part Number Marking
BD83733HFP
LOT Number
1PIN MARK
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BD83732HFP-M / BD83733HFP-M
Physical Dimension, Tape and Reel Information
Package Name
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BD83732HFP-M / BD83733HFP-M
Revision History
Date
Revision
29.Aug.2014
10.Nov.2014
001
002
Changes
New Release
Page.1, 10, 11, 13, 17, 20, 21, 23
Application Circuit revised
Page.3 Recommended Operating Conditions
Change Rating PWM Minimum Pulse Width 20µs → 10µs
Change to Operating Conditions Parameter Current Setting Resistor ,Capacitor
connecting VIN terminal and Capacitor connecting IOUT terminal
Operating Conditions
Add Capacitor connecting CRT terminal and DC_IN pull-down resistor
parameter.
Page.20
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Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001