ETC IM13400 Cyntec ipm is integrated drive, protection and system control functions that is designed for high performance 3-phase motor driver Datasheet

LDIP-IPM IM13400
Description
Cyntec IPM is integrated drive, protection and system control
functions that is designed for high performance 3-phase motor driver
application like:
Home appliances applications.
Inverter drive parts for AC/DC motor driving.
Features
High latch-up immunity.
Low switching loss and higher short-circuit withstanding capability.
Low temperature coefficient effect both for driver and IGBT.
Integrated driver IC to reduce the PCB size and layout effort.
High noise rejection capability.
Under-voltage lockout protection both for high and low side IGBT.
High Vcc and Input signal port voltage rating.
Good thermal performance.
Matched propagation delay for three arms.
Automatic shut-off the high and low side IGBT to avoid shoot-through conduction in case the
driving signal is abnormal.
Provided a fault signal (FO pin) and shut-off internal IGBT, when OC/SC and under-voltage
situation are occurred.
HEAT SINK SIDE
Detail A
Detail B
(t=0.7)
Stand off
lrrgulor solder remains
Stand off
lrrgulor solder remains
1
1
1~5°
TERMINAL CODE
14 VCC
1 HIN1
15 GND
2 VCC
3 VB1
16 CIN
4 VS1
17 CFO
5 HIN2
18 FO
6 VCC
19 LIN1
7 VB2
20 LIN2
8 VS2
21 LIN3
9 HIN3
22 P
10 VCC
23 U
11 VSS
24 V
12 VB3
25 W
13 VS3
26 N
Detail C
(t=0.7)
Figure 1. Package Outlines
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
PAGE
REV.
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1
Table 1.
Pin Descriptions
No.
Symbol
1
HIN1
2
VCC
Supply Voltage Terminal for Driver IC
3
VB1
High -side Bias Voltage for U Phase IGBT Driving
4
VS1
High -side Bias Voltage Ground for U Phase IGBT Driving
5
HIN2
6
VCC
Supply Voltage Terminal for Driver IC
7
VB2
High -side Bias Voltage for V Phase IGBT Driving
8
VS2
High -side Bias Voltage Ground for V Phase IGBT Driving
9
HIN3
10
VCC
11
GND
12
VB3
High -side Bias Voltage for W Phase IGBT Driving
13
VS3
High -side Bias Voltage Ground for W Phase IGBT Driving
14
VCC
Supply Voltage Terminal for Driver IC
15
GND
Signal Ground
16
CIN
Comparator Input
17
CFO
Capacitor for Fault Output Duration Time Selection
18
FO
19
LIN1
Signal Input Terminal for Low-side U Phase
20
LIN2
Signal Input Terminal for Low-side V Phase
21
LIN3
Signal Input Terminal for Low-side W Phase
22
P
Positive DC-Bus Input Terminal
23
U
Output Terminal for U Phase
24
V
Output Terminal for V Phase
25
W
Output Terminal for W Phase
26
N
Negative DC-Bus Input Terminal
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
Pin Description
Signal Input Terminal for High-side U Phase
Signal Input Terminal for High-side V Phase
Signal Input Terminal for High-side W Phase
Supply Voltage Terminal for Driver IC
Signal Ground
Fault Output Terminal
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
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REV.
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LDIP-IPM Internal Block Diagram
VS1
VB1
VCC
VS2
VB2
VS3
VB3
VCC
4
3
2
8
7
13
12
6
1
5
9
+5V Logic
19
20
21
18
10
HIN1
HIN2
HIN3
LIN1
LIN2
LIN3
FO
VCC
Q1
Signal
Input
23
U
D2
Q2
Circuit
Fault
Logic
24
V
25
W
26
N
MOTOR
D3
Q3
GND
11
P
D1
Gate
Driver
22
D4
14
Protection
Circuit
VCC
Q4
D5
Q5
Supply
Circuit
+15V
D6
Q6
15
GND
17
CFO
CIN
16
Shunt
Resistor
Figure 2. LDIP-IPM Internal Block Diagram
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
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REV.
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MAXIMUM RATINGS (Tj = 25℃)
INVERTER PART
Item
Between collector to emitter voltage
Each IGBT collector current
Each IGBT collector current (peak)
Junction temperature
Symbol
VCES
± IC ( Tc = 25℃ )
± ICP ( Tc = 25℃, pulse )
Tj
Min.
-20
Max.
600
20
40
+150
Unit
V
A
A
℃
Symbol
VCC
VB1S1,B2S2,B3S3
VCIN
HIN1,HIN2,HIN3,
LIN1,LIN2,LIN3
VFO
Min.
-0.3
-0.3
-0.3
Max.
25
20
25
Unit
V
V
V
-0.3
25
V
-0.3
25
V
Min.
-20
-40
Max.
+100
+150
Unit
℃
℃
-
2500
Vrms
CONTROL PART
Item
Driver IC supply voltage
P- side floating supply voltage
Current sensing input voltage
Logic input voltage
Fault output voltage
TOTAL SYSTEM
Item
Module case operating temperature
Storage temperature
Isolation voltage (60Hz Sinusoidal, AC 1
minute, pins to heat-sink plate)
Symbol
TC
Tstg
(Note 1)
Viso
Note 1:Tc Measurement Point.
Control Terminals
Heat sink boundary
Tc
Power Terminals
Heat sink
Tc
Figure 3. Tc Measurement Point
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
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REV.
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OF
4
ELECTRICAL CHARACTERISTICS (Tj = 25℃)
INVERTER PART
Item
Collector-emitter saturation
voltage
FWD forward voltage drop
Symbol
Condition
=
V
VCC
B1S1,B2S2,B3S3 = 15V,
IC =20A, VCIN = 0V
Tj = 25℃, - IC = 20A, VCIN = 5V
VD = 300V,
VCC = VB1S1,B2S2,B3S3 = 15V,
IC = 20A, Tj =25℃,
VHIN =5V<―> 0V,
VCIN = 0V, Inductive Load
VCE (sat)
VF
Ton
Switching times
(Fig. 4)
Tr
Toff
Tf
Collector-emitter cut-off
current
ICES
Tj=25℃
VCE =VCES
Min.
Typ.
Max.
Unit
-
2.3
2.8
V
V
-
2.0
2.4
-
0.6
0.8
-
0.06
1.0
0.12
1.2
-
0.05
0.1
-
-
0.32
μs
mA
Figure 4. Switching Time Define
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
PAGE
REV.
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5
Test condition:Vdc =300V, Ic = 20A, Vcc = 15V, Vin = 0V→5V (Inductive Load), TC = 25℃
Vce:(100V/div)
Ic:(5A/div)
Figure 5. Testing Switching Waveform
CONTROL PART (Tj = 25℃)
Item
HIN1,2,3 , LIN1,2,3 ON
threshold voltage
HIN1,2,3 , LIN1,2,3 OFF
threshold voltage
Symbol
HIN1,2,3 input current
LIN1,2,3 input current
Driver IC supply voltage
P-side floating supply voltage
VCC terminal input current
Fault output voltage
Short circuit trip level
Fault output pulse width
Supply circuit under voltage
protection
Min.
Typ.
Max.
Unit
Vth(on)
1.4-
1.7
2.0
V
Vth(off)
2.2
2.5
2.8
V
13.5
13.5
4.9
0.37
10.4
10.6
-
15.0
15.0
0.46
1.8
10.9
11.1
0.2
220
300
220
300
16.5
16.5
2.3
200
0.55
11.4
11.6
-
IHIN(HI)
IHIN(LO)
ILIN(HI)
ILIN(LO)
VCC
VB1S1,B2S2,B3S3
IC
VFOH
VFOL
VSC(ref)
tFO
UVTVCC
UVRVCC
UVH
Condition
VHIN1,2,3 = 5V
VHIN1,2,3 = 0V
VLIN1,2,3 = 5V
VLIN1,2,3 = 0V
VCIN =0V
VCIN =1V
VCC=15V, Tj = 25℃
CF O =22nF ~ 33nF
Trip level
Reset level
Hysteresis
(Note 2)
(Note 2)
(Note 3)
μA
μA
V
V
mA
V
mV
V
ms
V
V
V
Note 2 : FO output is open collector type, so this signal line should be pulled up to the +5V power supply with
approximately 5.1KΩ.
Note 3:CFO need to adjust if output can not fit 1.8 ms demand.
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
PAGE
REV.
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6
OF
6
THERMAL RESISTANCE
Item
Junction to case thermal
resistance
Symbol
Rth(j-c)Q
Rth(j-c)F
Condition
IGBT part (1/6)
FWD part (1/6)
Min.
-
Typ.
-
Max.
1.1
1.6
Unit
℃/W
RECOMMENDED OPERATION CONDITIONS
Item
DC_ Link Supply voltage
Control supply voltage
Control supply voltage
Input ON threshold voltage
Input OFF threshold voltage
Supply voltage ripple
Arm shoot-through blocking
time
PWM Input frequency
Symbol
VD
VCC
VB1S1,B2S2,B3S3
VCIN(ON)
VCIN(OFF)
ΔVD , ΔVDB
Condition
Applied between P-N
Applied between VCC - GND
Applied between VB1,2,3 – VS1,2,3
Applied between HIN1,2,3 - GND
and LIN1,2,3 - GND
Min.
0
13.5
13.5
-1
t dead
(Note 4)
Unit
V
V
V
V
V
V/μs
2
-
-
μs
-
15
-
kHz
Min.
Typ.
Max.
Unit
Recommended 1.18 N•m
0.98
1.18
1.37
N-m
---
-50
75
-
100
g
μm
TC≦100℃, Tj≦125℃
fPWM
Typ.
Max.
300
400
15.0
16.5
15.0
16.5
0 ~ 0.65
4.0 ~ 5.5
1
Note 4:To prevent high and low side IGBT occurred shoot-through.
MECHANICAL CHARACTERISTICS AND RATINGS
Item
Mounting torque
Condition
Mounting
screw:M4
Weight
Heat-sink flatness
(Note 5)
Note 5:Measurement point of heat-sink flatness.
DIP-IPM
Measurement point
Place to contact a heat sink
Heat sink
Heat sink
Figure 6. Measurement Point of Heat-sink Flatness
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
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REV.
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7
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7
Input/Output Timing Diagram
Figure 7. Input/Output Timing Diagram
Note 6:The shaded area indicates that both high-side and low-side switches are off and therefore the
half-bridge output voltage would be determined by the direction of current flow in the load.
Figure 8. Input/Output Signal Circuit
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
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REV.
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OF
8
LDIP-IPM Short-Circuit Protection Function
S1. Normal operation:IGBT ON and carrying current.
S2. Short circuit current detection (SC trigger).
S3. IGBT gate interrupt and FO signal starts.
S4. IGBT turns OFF.
S5. IGBT OFF state.
S6. FO signal reset.
S7. Normal operation.
Figure 9. Timing Chart of SC Operation
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
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REV.
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9
LDIP-IPM Under-Voltage Protection Function
S1. Normal operation:IGBT ON and carrying current.
S2. Under-Voltage detection.
S3. IGBT gate interrupt.
S4. IGBT OFF state.
S5. Under-Voltage reset.
S6. Normal operation.
Figure 10. Timing Chart of Under-Voltage Operation
Recommended CPU I/O Interface Circuit
Figure 11. I/O Interface Circuit
Note 7:Depending on the wiring impedances and the PWM control circuit of the application’s PCB,
the RC coupling at each input may be changed.
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
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REV.
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10
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10
Recommended Circuit Example When Using a Photo Coupler
5V
5V
15V
Vcc
P
IN
Microcomputer
GND
N
(a) IPM input pin (high-side 3-phase and low-side 3-phase)
5V
15V
Vcc
P
Microcomputer
FO
N
GND
(b) Fault output pin
Figure 12. I/O Interface Circuit When Using Photo Coupler
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
PAGE
REV.
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11
OF
11
Direct Input (without Photo-Coupler) Interface Example
+5V
D1
D1
R2x6
M
C2
R3
C5
C2
R3 C5
R3
D1
R1
C5
VS1
VB1
VCC
VS2
VB2
VS3
VB3
VCC
4
3
2
8
7
13
12
C2
6
10
HIN1
HIN2
HIN3
LIN1
LIN2
LIN3
FO
VCC
11
GND
14
VCC
1
C
5
9
19
U
20
21
18
C1
C1
Signal
Input
P
23
U
Driver
Circuit
24
Fault
Logic
V MOTOR
25
W
26
N
Protection
Circuit
C1
C1
Gate
22
C1
C1
Supply
Circuit
+15V
15
GND
17
C3
CFO
CIN
C4
16
Shunt
Resistor
R4
Figure 13. Typical Application Circuit Interface Example with Direct Input
Component selection :
1. R1:5.1KΩ ( FO output is open collector type. It is necessary to apply a resistor. )
2. R2:4.7KΩ
3. R3:20Ω ( It could be adjusted depending on the PWM frequency. )
4. R4:100Ω ( Recommended the time constant R4xC4 is 2μS. )
5. C1:100 ~ 1000pF ( Ceramic ) ( The capacitor could filter the noise, but should be careful to the dead time)
6. C2:10 ~ 100μF ( Electrolytic, low impendence )
7. C3:22nF ( Ceramic )
8. C4:0.02μF ( Ceramic )
9. C5:0.22 ~ 2μF ( Ceramic )
10. D1:600V/1A ( Ultra-Fast recovery diode )
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
PAGE
REV.
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OF
12
Interface Example when a Photo-Coupler is used
+5V
R2
U1 R5
R2
U1 R5
R1
Q1
C1
D1
R1
D1
Q1 C1
D1
C5
C2
R3
C5
C2
R3 C5
R3
4
3
C2
2
8
7
13
12
6
10
HIN1
HIN2
HIN3
LIN1
LIN2
LIN3
FO
VCC
11
GND
14
VCC
1
5
9
R2
M
U1 R5
C
R6
U
C6
R1
19
20
21
Q1 C1
18
R7
VS1
VB1
VCC
VS2
VB2
VS3
VB3
VCC
Signal
U1 R5
Circuit
R2
C1
U1 R5
V MOTOR
25
W
26
N
Supply
Circuit
+15V
15
GND
R1
Q1
C1
CFO
CIN
C3
16
C4
Shunt
Resistor
R4
+5V
R2
U
Protection
Circuit
17
U1 R5
23
24
Fault
Logic
R1
Q1
P
Driver
U1
R2
Gate
Input
22
R1
Q1
C1
Figure 14. Typical Application Circuit Interface Example with Photo Coupler
Component selection :
1. R1:4.7KΩ
2. R2:150Ω
3. R3:20Ω ( It could be adjusted depending on the PWM frequency. )
4. R4:100Ω ( Recommended the time constant R4xC4 is 2μS. )
5. R5:1KΩ
6. R6:1KΩ
7. R7:1KΩ
8. C1:0.1μF
9. C2:10 ~ 100μF ( Electrolytic, low impendence )
10. C3:22nF ( Ceramic )
11. C4:0.02μF ( Ceramic )
12. C5:0.22 ~ 2μF ( Ceramic )
13. C6:0.1μF
14. D1:600V/1A ( Ultra-Fast recovery diode )
15. Q1:NPN transistor 2N3904
16. U1:Photo coupler TLP521
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
PAGE
REV.
IM13400
PAGE
A6
13
OF
13
Precautions on Electrostatic Electricity
(1) Operators must wear anti-static clothing and conductive shoes (or a leg or heel strap).
(2) Operators must wear a wrist strap grounded to earth via a resistor of about 1 MΩ.
(3) Soldering irons must be grounded from iron tip to earth, and must be used only at low voltages.
(4) If the tweezers you use are likely to touch the device terminals, use anti-static tweezers and in particular
avoid metallic tweezers. If a charged device touches a low-resistance tool, rapid discharge can occur. When
using vacuum tweezers, attach a conductive chucking pat to the tip, and connect it to a dedicated ground
used especially for anti-static purposes (suggested resistance value: 104 to 108Ω).
(5) Do not place devices or their containers near sources of strong electrical fields (such as above a CRT).
(6) When storing printed circuit boards which have devices mounted on them, use a board container or bag
that’s protected against static charge. To avoid the occurrence of static charge or discharge due to friction,
keep the boards separate from one other and do not stack them directly on top of one another.
(7) Ensure, if possible, that any articles (such as clipboards) which are brought to any location where the level
of static electricity must be closely controlled are constructed of anti-static materials.
(8) In cases where the human body comes into direct contact with a device, be sure to wear anti-static finger
covers or gloves (suggested resistance value: 108Ω or less).
(9) Equipment safety covers installed near devices should have resistance ratings of 109Ω or less.
(10) If a wrist strap cannot be used for some reason, and there is a possibility of imparting friction to devices, use
an ionizer.
UNLESS OTHERWISE SPECIFIED
TOLERQNCES ON ﹕
X
= ±
X.X
= ±
X.XX
= ±
ANGLES ± HOLE DIA. ±
DRAWN
BY ﹕
DESIGNED
BY ﹕
CHECKED
BY ﹕
APPROVED
BY ﹕
SCALE ﹕
X
UNIT ﹕ X
TITLE: ENGINEERING SPEC. OF LDIP IPM 600V 20A
CYNTEC CO., LTD.
THIS DRAWINGS AND SPECIFICATIONS ARE THE PROPERTY OF CYNTEC CO., LTD.
AND SHALL NOT BE REPRODUCED OR USED AS THE BASIS FOR THE
MANUFACTURE OR SALE OF APPARATUS OR DEVICES WITHOUT PERMISSION
DOCUMENT
NO.
PAGE
REV.
IM13400
PAGE
A6
14
OF
14
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