HSMC HMBT5086 Pnp epitaxial planar transistor Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6849
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 1/3
HMBT5086
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT5086 is designed for low noise , high gain , general
purpose amplifier applications.
Absolute Maximum Ratings
SOT-23
• Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 °C
Junction Temperature .................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ................................................................................ 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ........................................................................................ -50 V
VCEO Collector to Emitter Voltage ..................................................................................... -50 V
VEBO Emitter to Base Voltage ............................................................................................. -3 V
IC Collector Current......................................................................................................... -50 mA
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO1
ICBO2
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
*hFE3
fT
Cob
Min.
-50
-50
-3
150
150
150
40
-
Typ.
-
Max.
-10
-50
-300
-850
500
4.0
Unit
V
V
V
nA
nA
mV
mV
MHz
pF
Test Conditions
IC=-100uA
IC=-1mA
IE=-10uA
VCB=-10V
VCB=-35V
IC=-10mA, IB=-1mA
IC=-10mA, IB=-1mA
VCE=-5V, IC=-0.1mA
VCE=-5V, IC=-1mA
VCE=-5V, IC=-10mA
VCE=-5V, IC=-0.5mA, f=100MHz
VCB=-5V, f=100KHz
*Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%
HMBT5086
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6849
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 2/3
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
Saturation Voltage (mV)
hFE
1000
hFE @ VCE=5V
100
100
VCE(sat) @ IC=10IB
10
0.1
1
10
100
1
10
Collector Current (mA)
100
Collector Current (mA)
On Voltage & Collector Current
Cutoff Frequency & Collector Current
1000
1000
On Voltage (mV)
Cutoff Frequency (MHZ)
VBE(on) @ VCE=5V
100
fT @ VCE=5V
100
10
0.1
1
10
100
0.1
1
Collector Current (mA)
10
100
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
Safe Operating Area
10
10000
PT=1ms
Collector Current (mA)
Capacitance (pF)
1000
Cob
PT=100ms
PT=1s
100
10
1
1
1
10
Reverse-Biased Voltage (V)
HMBT5086
100
1
10
100
Forward Voltage (v)
HSMC Product Specification
HI-SINCERITY
Spec. No. : HE6849
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 3/3
MICROELECTRONICS CORP.
SOT-23 Dimension
Marking:
A
L
2 P
3
B S
1
V
Rank Code
Control Code
2
G
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Inches
Min.
Max.
0.1102
0.1204
0.0472
0.0630
0.0335
0.0512
0.0118
0.0197
0.0669
0.0910
0.0005
0.0040
DIM
A
B
C
D
G
H
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034
0.0070
0.0128
0.0266
0.0335
0.0453
0.0830
0.1083
0.0098
0.0256
Millimeters
Min.
Max.
0.085
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT5086
HSMC Product Specification
Similar pages