MC10ELT24, MC100ELT24 5VTTL to Differential ECL Translator Description http://onsemi.com MARKING DIAGRAMS* 8 8 Features • • • • • 0.8 ns tPHL, 0.95 ns tPLH Typical Propagation Delay PNP TTL Inputs for Minimal Loading Flow Through Pinouts Operating Range: VCC = 4.5 V to 5.5 V; VEE = −4.2 V to −5.5 V with GND = 0 V Pb−Free Packages are Available 1 SOIC−8 D SUFFIX CASE 751 1 8 HLT24 ALYW G 8 8 1 1 1 8 HT24 ALYWG G 1 KT24 ALYWG G 5E MG G TSSOP−8 DT SUFFIX CASE 948R KLT24 ALYW G DFN8 MN SUFFIX CASE 506AA H K 5E 2T M = MC10 = MC100 = MC10 = MC100 = Date Code 2T MG G The MC10ELT/100ELT24 is a TTL to differential ECL translator. Because ECL levels are used a +5 V, −5.2 V (or −4.5 V) and ground are required. The small outline 8−lead package and the single gate of the ELT24 makes it ideal for those applications where space, performance and low power are at a premium. The 100 Series contains temperature compensation. 1 4 1 4 A L Y W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 December, 2006 − Rev. 9 1 Publication Order Number: MC10ELT24/D MC10ELT24, MC100ELT24 Table 1. PIN DESCRIPTION VEE 1 8 VCC Pin TTL D 2 7 Q ECL NC NC 3 6 4 5 Q Function Q, Q ECL Differential Outputs* D TTL Input VCC Positive Supply VEE Negative Supply GND Ground NC No Connect EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. GND *Output state undetermined when inputs are open. Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor N/A Internal Input Pullup Resistor ESD Protection N/A Human Body Model Machine Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC−8 TSSOP−8 DFN8 Flammability Rating Oxygen Index: 28 to 34 Transistor Count > 4 kV > 200 V Pb Pkg Pb−Free Pkg Level 1 Level 1 Level 1 Level 1 Level 3 Level 1 UL 94 V−0 @ 0.125 in 51 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. http://onsemi.com 2 MC10ELT24, MC100ELT24 Table 3. MAXIMUM RATINGS Rating Unit VCC Symbol Positive Power Supply Parameter GND = 0 V Condition 1 VEE = −5.0 V 7 V VEE Negative Power Supply GND = 0 V VCC = +5.0 V −8 V VIN Input Voltage GND = 0 V VI v VCC 0 to VCC V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SO−8 SO−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SO−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 $5% °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder <2 to 3 sec @ 248°C <2 to 3 sec @ 260°C 265 265 °C Pb Pb−Free Condition 2 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 4. 10ELT SERIES NECL OUTPUT DC CHARACTERISTICS VCC = 5.0 V; VEE = −5.0 V; GND = 0 V (Note 2) −40°C Symbol Characteristic Min Typ 25°C Max Min 85°C Typ Max Min Typ Max Unit ICC VCC Power Supply Current 7.0 4.5 7.0 7.0 mA IEE Power Supply Current 18 12.5 18 18 mA VOH Output HIGH Voltage (Note 3) −1080 −990 −890 −980 −895 −810 −910 −815 −720 mV VOL Output LOW Voltage (Note 3) −1950 −1800 −1650 −1950 −1790 −1630 −1950 −1773 −1595 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Output parameters vary 1:1 with GND. VCC can vary 4.5 V / 5.5 V. VEE can vary −4.2 V / −5.5 V. 3. Outputs are terminated through a 50 W resistor to GND − 2 V. Table 5. 100ELT SERIES NECL OUTPUT DC CHARACTERISTICS VCC = 5.0 V; VEE = −5.0 V; GND = 0 V (Note 4) −40°C Symbol Characteristic Min Typ 25°C Max Min 85°C Typ Max Min Typ Max Unit ICC VCC Power Supply Current 7.0 4.5 7.0 7.0 mA IEE Power Supply Current 18 12.5 18 18 mA VOH Output HIGH Voltage (Note 5) −1085 −1005 −880 −1025 −955 −880 −1025 −955 −880 mV VOL Output LOW Voltage (Note 5) −1830 −1695 −1555 −1810 −1705 −1620 −1810 −1705 −1620 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Output parameters vary 1:1 with GND. VCC can vary 4.5 V / 5.5 V. VEE can vary −4.2 V / −5.5 V. 5. Outputs are terminated through a 50 W resistor to GND − 2 V. http://onsemi.com 3 MC10ELT24, MC100ELT24 Table 6. TTL INPUT DC CHARACTERISTICS VCC = 4.5 V to 5.5 V; VEE = −4.2 V to −5.5 V; GND = 0.0 V; TA = −40°C to +85°C Symbol Characteristic Condition Min Typ Max Unit IIH Input HIGH Current VIN = 2.7 V 20 mA IIHH Input HIGH Current VIN = 7.0 V 100 mA IIL Input LOW Current VIN = 0.5 V −0.6 mA VIK Input Clamp Diode Voltage IIN = −18 mA −1.2 V VIH Input HIGH Voltage VIL Input LOW Voltage 2.0 V 0.8 V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 7. AC CHARACTERISTICS VCC = 4.5 V to 5.5 V; VEE = −4.2 V to −5.5 V; GND = 0.0 V −40°C Symbol Min Characteristic Typ 25°C Max Min 85°C Typ Max Min Typ Max 400 Unit fmax Maximum Toggle Frequency MHz tPLH Propagation Delay (Note 6) 1.5 V to 50% 0.5 2.0 0.5 0.95 2.0 0.5 2.0 ns tPHL Propagation Delay (Note 6) 1.5 V to 50% 0.5 2.0 0.5 0.8 2.0 0.5 2.0 ns tJITTER Random Clock Jitter (RMS) tr/tf Output Rise/Fall Time (20−80%) 2.5 0.25 1.25 ps 0.25 1.25 0.25 1.25 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Specifications for standard TTL input signal. Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) http://onsemi.com 4 MC10ELT24, MC100ELT24 ORDERING INFORMATION Package Shipping† SOIC−8 98 Units / Rail MC10ELT24DG SOIC−8 (Pb−Free) 98 Units / Rail MC10ELT24DR2 SOIC−8 2500 / Tape & Reel MC10ELT24DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC10ELT24DT TSSOP−8 100 Units / Rail MC10ELT24DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC10ELT24DTR2 TSSOP−8 2500 / Tape & Reel MC10ELT24DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC10ELT24MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel SOIC−8 98 Units / Rail MC100ELT24DG SOIC−8 (Pb−Free) 98 Units / Rail MC100ELT24DR2 SOIC−8 2500 / Tape & Reel MC100ELT24DR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel MC100ELT24DT TSSOP−8 100 Units / Rail MC100ELT24DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100ELT24DTR2 TSSOP−8 2500 / Tape & Reel MC100ELT24DTR2G TSSOP−8 (Pb−Free) 2500 / Tape & Reel MC100ELT24MNR4 DFN8 1000 / Tape & Reel DFN8 (Pb−Free) 1000 / Tape & Reel Device MC10ELT24D MC10ELT24MNR4G MC100ELT24D MC100ELT24MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 5 MC10ELT24, MC100ELT24 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10ELT24, MC100ELT24 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF S M T U V S 0.25 (0.010) B −U− 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S M A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E http://onsemi.com 7 DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ MC10ELT24, MC100ELT24 PACKAGE DIMENSIONS DFN8 CASE 506AA−01 ISSUE D D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C ÇÇÇ ÇÇÇ ÇÇÇ ÇÇÇ TOP VIEW 0.08 C SEATING PLANE MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.00 BSC 1.10 1.30 2.00 BSC 0.70 0.90 0.50 BSC 0.20 −−− 0.25 0.35 A 0.10 C 8X DIM A A1 A3 b D D2 E E2 e K L E (A3) SIDE VIEW A1 C D2 e e/2 4 1 8X L E2 K 8 5 8X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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