MAX3243E www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION FEATURES 1 DB, DW, OR PW PACKAGE (TOP VIEW) 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 30 29 C1+ V+ VCC GND C1− FORCEON FORCEOFF INVALID ROUT2B ROUT1 ROUT2 ROUT3 ROUT4 ROUT5 28 27 26 NC VCC V+ C1+ C2+ C2– V– NC 32 31 25 RIN1 1 24 GND RIN2 2 23 C1– RIN3 3 22 FORCEON RIN4 4 21 FORCEOFF 20 INVALID 6 19 ROUTB2 DOUT2 7 18 ROUT1 DOUT3 8 17 ROUT2 11 12 13 14 ROUT4 10 ROUT5 9 15 16 NC 5 ROUT3 RIN5 DOUT1 DIN1 Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment 28 2 DIN2 • • • • • • 1 QFN PACKAGE (TOP VIEW) NC APPLICATIONS C2+ C2− V− RIN1 RIN2 RIN3 RIN4 RIN5 DOUT1 DOUT2 DOUT3 DIN3 DIN2 DIN1 DIN3 • Single-Chip and Single-Supply Interface for IBM™ PC/AT™ Serial Port • ESD Protection for RS-232 Bus Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC61000-4-2, Contact Discharge – ±15-kV IEC61000-4-2, Air-Gap Discharge • Meets or Exceeds Requirements of TIA/EIA-232-F and ITU v.28 Standards • Operates With 3-V to 5.5-V VCC Supply • Always-Active Noninverting Receiver Output (ROUT2B) • Designed to Transmit at a Data Rate up to 500 kbit/s • Low Standby Current . . . 1 µA Typ • External Capacitors . . . 4 × 0.1 µF • Accepts 5-V Logic Input With 3.3-V Supply • Designed to Be Interchangeable With Maxim MAX3243E • Serial-Mouse Driveability • Auto-Powerdown Feature to Disable Driver Outputs When No Valid RS-232 Signal Is Sensed • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages 2 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. IBM, PC/AT are trademarks of International Business Machines Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2009, Texas Instruments Incorporated MAX3243E SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com DESCRIPTION The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with ±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge) protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. This combination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, or compatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting output (ROUT2B), which allows applications using the ring indicator to transmit data while the device is powered down. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate. Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high, and should be done when driving a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V or has been between –0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input voltages are between –0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels. The MAX3243EC is characterized for operation from 0°C to 70°C. The MAX3243EI is characterized for operation from –40°C to 85°C. ORDERING INFORMATION PACKAGE (1) (2) TA 0°C to 70°C –40°C to 85°C (1) (2) 2 SOIC – DW Tape and reel SSOP – DB Tape and reel TSSOP – PW Tape and reel QFN – RHB Tape and reel SSOP – DB Tape and reel SOIC – DW Tape and reel TSSOP – PW Tape and reel QFN – RHB Tape and reel ORDERABLE PART NUMBER MAX3243ECDW MAX3243ECDWR MAX3243ECDB MAX3243ECDBR MAX3243ECPW MAX3243ECPWR MAX3243ECRHBR MAX3243EIDB MAX3243EIDBR MAX3243EIDW MAX3243EIDWR MAX3243EIPW MAX3243EIPWR MAX3243EIRHBR TOP-SIDE MARKING MAX3243EC MAX3243EC MP243EC MP243E MAX3243EI MAX3243EI MP243EI MR243E Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E MAX3243E www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 FUNCTION TABLES ABC EACH DRIVER (1) INPUTS DIN (1) FORCEON FORCEOFF VALID RIN RS-232 LEVEL OUTPUT DOUT DRIVER STATUS X X L X Z Powered off L H H X H H H H X L Normal operation with auto-powerdown disabled L L H Yes H H L H Yes L L L H No Z H L H No Z Normal operation with auto-powerdown enabled Powered off by auto-powerdown feature H = high level, L = low level, X = irrelevant, Z = high impedance EACH RECEIVER (1) INPUTS (1) OUTPUTS RIN2 RIN1, RIN3–RIN5 FORCEOFF VALID RIN RS-232 LEVEL L X L H X L L L L H H ROUT2B ROUT2 ROUT1, ROUT3–5 RECEIVER STATUS X L Z Z X H Z Z Powered off while ROUT2B is active H YES L H H H YES L L L L H YES H H H H H H YES H L L Open Open H YES L H H Normal operation with auto-powerdown disabled/enabled H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E 3 MAX3243E SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com LOGIC DIAGRAM (POSITIVE LOGIC) DIN1 DIN2 DIN3 FORCEOFF FORCEON ROUT1 ROUT2B ROUT2 ROUT3 ROUT4 ROUT5 4 14 9 13 10 12 11 DOUT1 DOUT2 DOUT3 22 23 Auto-powerdown 19 21 4 INVALID RIN1 20 18 5 17 6 16 7 15 8 RIN2 RIN3 RIN4 Submit Documentation Feedback RIN5 Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E MAX3243E www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive output supply voltage range (2) –0.3 7 V 0.3 –7 V 13 V V– Negative output supply voltage range V+ – V– Output supply voltage difference (2) VI Input voltage range VO Output voltage range θJA Package thermal impedance (3) (4) (2) Driver (FORCEOFF, FORCEON) –0.3 6 Receiver –25 25 Driver Receiver (INVALID) –13.2 13.2 –0.3 VCC + 0.3 DB package 62 DW package 46 PW package 62 Lead temperature 1,6 mm (1/16 in) from case for 10 s Tstg (1) (2) (3) (4) Storage temperature range –65 UNIT V V C/W 260 C 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) See Figure 6 VCC = 3.3 V Supply voltage VCC = 5 V VIH Driver and control high-level input voltage DIN, FORCEOFF, FORCEON VIL Driver and control low-level input voltage DIN, FORCEOFF, FORCEON VI Driver and control input voltage DIN, FORCEOFF, FORCEON VI Receiver input voltage TA Operating free-air temperature (1) VCC = 3.3 V MIN NOM MAX UNIT 3 3.3 3.6 4.5 5 5.5 V 2 VCC = 5 V V 2.4 MAX3243EC MAX3243EI 0.8 V 0 5.5 V –25 25 V 0 70 –40 85 C Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. ELECTRICAL CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER II ICC (1) (2) Input leakage current Supply current (TA = 25°C) TEST CONDITIONS MIN FORCEOFF, FORCEON TYP (2) MAX UNIT 0.01 1 µA 0.3 1 mA Auto-powerdown disabled No load, FORCEOFF and FORCEON at VCC Powered off No load, FORCEOFF at GND 1 10 Auto-powerdown enabled No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded, All DIN are grounded 1 10 µA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E 5 MAX3243E SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com DRIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER MIN TYP (2) MAX TEST CONDITIONS UNIT VOH High-level output voltage All DOUT at RL = 3 kΩ to GND 5 5.4 V VOL Low-level output voltage All DOUT at RL = 3 kΩ to GND –5 –5.4 V VO Output voltage (mouse driveability) DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3, DOUT1 = DOUT2 = 2.5 mA ±5 IIH High-level input current VI = VCC ±0.01 ±1 µA IIL Low-level input current VI at GND ±0.01 ±1 µA Vhys Input hysteresis ±1 V ±60 mA ±25 µA VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V IOS Short-circuit output current (3) ro Output resistance VCC, V+, and V– = 0 V, VO = ±2 V Ioff Output leakage current FORCEOFF = GND, VO = ±12 V, (1) (2) (3) 300 V Ω 10M VCC = 0 to 5.5 V Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER MIN TYP (2) TEST CONDITIONS MAX Maximum data rate CL = 1000 pF, One DOUT switching, RL = 3 kΩ See Figure 1 tsk(p) Pulse skew (3) CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 Slew rate, transition region (see Figure 1) VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, PRR = 250 kbit/s CL = 150 pF to 1000 pF 6 30 SR(tr) CL = 150 pF to 2500 pF 4 30 (1) (2) (3) 250 UNIT 500 kbit/s 100 ns V/µs Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V + 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD Protection PARAMETER Driver outputs (pins 9–11) 6 TYP UNIT HBM TEST CONDITIONS ±15 kV IEC61000-4-2, Air-Gap Discharge ±15 kV IEC61000-4-2, Contact Discharge ±8 kV Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E MAX3243E www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 RECEIVER SECTION Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOH = 1.6 mA TYP (2) VCC – 0.6 VCC – 0.1 MAX VCC = 3.3 V 1.6 2.4 VCC = 5 V 1.9 2.4 Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT– ) Ioff Output leakage current (except ROUT2B) FORCEOFF = 0 V ri Input resistance VI = ±3 V or ±25 V VCC = 3.3 V 0.6 1.1 VCC = 5 V 0.8 1.4 UNIT V 0.4 VIT+ (1) (2) MIN V V V 0.5 V ±0.05 ±10 µA 5 7 kΩ 3 Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output ten Output enable time tdis Output disable time tsk(p) Puse skew (3) (1) (2) (3) CL = 150 pF, See Figure 3 CL = 150 pF, RL = 3 kΩ, See Figure 4 See Figure 3 TYP (2) UNIT 150 ns 150 ns 200 ns 200 ns 50 ns Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. ESD Protection PARAMETER Driver outputs (pins 4–8) TYP UNIT HBM TEST CONDITIONS ±15 kV IEC61000-4-2, Air-Gap discharge ±15 kV IEC61000-4-2, Contact Discharge ±8 kV Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E 7 MAX3243E SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com AUTO-POWERDOWN SECTION Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN VIT+(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC VIT–(valid) Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC –2.7 VT(invalid) Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC –0.3 VOH INVALID high-level output voltage IOH = -1 mA, FORCEON = GND, FORCEOFF = VCC VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND, FORCEOFF = VCC MAX UNIT 2.7 V V 0.3 V VCC – 0.6 V 0.4 V Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS TYP (1) UNIT tvalid Propagation delay time, low- to high-level output VCC = 5 V 1 µs tinvalid Propagation delay time, high- to low-level output VCC = 5 V 30 µs ten Supply enable time VCC = 5 V 100 µs (1) 8 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E MAX3243E www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) Input RS-232 Output 50 Ω RL CL (see Note A) 3V FORCEOFF TEST CIRCUIT 0V tTHL Output 6V SR(tr) + t THL or tTLH tTLH VOH 3V 3V −3 V −3 V VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL tPLH VOH 3V FORCEOFF 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3 V or 0 V FORCEON 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) tPHL 50 Ω 3V FORCEOFF tPLH CL (see Note A) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E 9 MAX3243E SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION 3V Input VCC 3 V or 0 V FORCEON 1.5 V GND S1 −3 V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V VOH Output 50% Output CL (see Note A) FORCEOFF Generator (see Note B) 50 Ω 0.3 V tPLZ (S1 at VCC) tPZL (S1 at VCC) 0.3 V Output 50% VOL TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. Figure 4. Receiver Enable and Disable Times 10 Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E MAX3243E www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 PARAMETER MEASUREMENT INFORMATION 2.7 V 2.7 V 0V Receiver Input 0V −2.7 V −2.7 V ROUT Generator (see Note B) 3V 50 Ω tinvalid tvalid 50% VCC 50% VCC −3 V VCC Autopowerdown ten INVALID ≈V+ V+ CL = 30 pF (see Note A) 0.3 V VCC 0V 0.3 V Supply Voltages FORCEOFF FORCEON 0V INVALID Output DIN DOUT V− TEST CIRCUIT ≈V− ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ VOLTAGE WAVEFORMS Valid RS-232 Level, INVALID High 2.7 V Indeterminate 0.3 V 0V −0.3 V If Signal Remains Within This Region For More Than 30 µs, INVALID Is Low† Indeterminate −2.7 V Valid RS-232 Level, INVALID High † Auto-powerdown disables drivers and reduces supply current to 1 µA. NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 5. INVALID Propagation Delay Timnes and Supply Enabling Time Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E 11 MAX3243E SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com APPLICATION INFORMATION C1+ 1 + C2 − 2 3 C2− VCC V− GND + C1− RIN1 RIN2 RS-232 Inputs RIN3 RIN4 RIN5 DOUT1 RS-232 Outputs DOUT2 4 27 + − 26 25 C3† + − + CBYPASS − = 0.1 µF C1 24 23 FORCEON 5 Autopowerdown C4 − V+ C2+ 28 6 7 22 FORCEOFF 8 21 9 20 10 19 INVALID ROUT2B ROUT1 5 kΩ DOUT3 11 18 ROUT2 5 kΩ DIN3 12 Logic Outputs 17 ROUT3 5 kΩ Logic Inputs DIN2 13 16 ROUT4 5 kΩ DIN1 14 15 ROUT5 5 kΩ † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, and C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF Figure 6. Typical Operating Circuit and Capacitor Values 12 Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E MAX3243E www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 APPLICATION INFORMATION ESD Protection TI MAX3243E devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of ±15-kV in all states: normal operation, shutdown, and powered down. The MAX3243E devices are designed to continue functioning properly after an ESD occurrence without any latchup. The MAX3243E devices have three specified ESD limits on the driver outputs and receiver inputs, with respect to GND: • ±15-kV Human Body Model (HBM) • ±15-kV IEC61000-4-2, Air-Gap Discharge (formerly IEC1000-4-2) • ±8-kV IEC61000-4-2, Contact Discharge ESD Test Conditions ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a reliability report that documents test setup, methodology, and results. Human Body Model (HBM) The Human Body Model of ESD testing is shown in Figure 7, while Figure 8 shows the current waveform that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of concern, and subsequently discharged into the DUT through a 1.5k-Ω resistor. RD 1.5 kΩ VHBM + − CS 100 pF DUT Figure 7. HBM ESD Test Circuit Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E 13 MAX3243E SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009................................................................................................................................................... www.ti.com APPLICATION INFORMATION 1.5 VHBM = 2 kV I DUT (A) 1.0 0.5 DUT = 10-V 1-Ω Zener Diode 0.0 0 50 100 150 200 Time (ns) Figure 8. Typical HBM Current Waveform IEC61000-4-2 (Formerly Known as IEC1000-4-2) Unlike the HBM, MM, and CDM ESD tests that apply to component level integrated circuits, the IEC61000-4-2 is a system-level ESD testing and performance standard that pertains to the end equipment. The MAX3243E is designed to enable the manufacturer in meeting the highest level (Level 4) of IEC61000-4-2 ESD protection with no further need of external ESD protection circuitry. The more stringent IEC test standard has a higher peak current than the HBM, due to the lower series resistance in the IEC model. Figure 9 shows the IEC61000-4-2 model, and Figure 10 shows the current waveform for the corresponding ±8-kV Contact-Discharge (Level 4) test. This waveform is applied to a probe that has been connected to the DUT. On the other hand, the corresponding ±15-kV (Level 4) Air-Gap Discharge test involves approaching the DUT with an already energized probe. High-Voltage DC Source + − 50−100 MΩ 330 Ω RC RD CS 150 pF DUT Figure 9. Simplified IEC61000-4-2 ESD Test Circuit 14 Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E MAX3243E www.ti.com................................................................................................................................................... SLLS657C – APRIL 2005 – REVISED FEBRUARY 2009 APPLICATION INFORMATION I (30A) 100% (Vcontact = 8 kV) I Peak 90% (16A) (8A) 10% t 30 ns 60 ns tr = 0.7 ns to 1 ns Figure 10. Typical Current Waveform of IEC61000-4-2 ESD Generator Machine Model The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins. Submit Documentation Feedback Copyright © 2005–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3243E 15 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3243ECDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDBE4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDBG4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDBRE4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDW ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDWG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECDWRG4 ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECPW ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECPWE4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECPWR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECPWRE4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243ECRHBR ACTIVE QFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR MAX3243ECRHBRG4 ACTIVE QFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR MAX3243EIDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243EIDBG4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243EIDBRG4 ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243EIDW ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243EIDWG4 ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3243EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX3243EIDWRG4 ACTIVE SOIC DW 28 MAX3243EIPW ACTIVE TSSOP PW 28 50 MAX3243EIPWE4 ACTIVE TSSOP PW 28 MAX3243EIPWG4 ACTIVE TSSOP PW 28 MAX3243EIPWR ACTIVE TSSOP PW MAX3243EIPWRE4 ACTIVE TSSOP MAX3243EIPWRG4 ACTIVE MAX3243EIRHBR MAX3243EIRHBRG4 1000 Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE QFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR ACTIVE QFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 16-Feb-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device MAX3243ECDBR Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 MAX3243ECDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 MAX3243ECPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1 MAX3243ECPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1 MAX3243ECRHBR QFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 MAX3243EIDBR SSOP DB 28 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 MAX3243EIDWR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 MAX3243EIPWR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1 MAX3243EIPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1 MAX3243EIRHBR QFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Feb-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3243ECDBR SSOP DB 28 2000 346.0 346.0 33.0 MAX3243ECDWR SOIC DW 28 1000 346.0 346.0 49.0 MAX3243ECPWR TSSOP PW 28 2000 346.0 346.0 33.0 MAX3243ECPWR TSSOP PW 28 2000 346.0 346.0 33.0 MAX3243ECRHBR QFN RHB 32 3000 346.0 346.0 29.0 MAX3243EIDBR SSOP DB 28 2000 346.0 346.0 33.0 MAX3243EIDWR SOIC DW 28 1000 346.0 346.0 49.0 MAX3243EIPWR TSSOP PW 28 2000 346.0 346.0 33.0 MAX3243EIPWR TSSOP PW 28 2000 346.0 346.0 33.0 MAX3243EIRHBR QFN RHB 32 3000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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