DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Future Technology Devices International Ltd. FT311D (USB Android Host IC) The FT311D is a Full Speed USB host specifically targeted at providing access to peripheral hardware from an Android platform with a USB device port. The device will bridge the USB port to six user selectable interface types and has the following advanced features: Interface options selectable via 3 mode select pins. Suitable for use on any Android platform supporting Android Open Accessory Mode (Typically 3.1 onwards, however some platforms may port Open Accessory Mode to version 2.3.4) 12MHz oscillator using external crystal. 7 GPIO lines interface option Integrated power-on-reset circuit. Basic UART interface with RXD, TXD, RTS, CTS pins option. +3V3 Single Supply Operation with 5V tolerant inputs. TX_ACTIVE signal for controlling transceivers on RS485 interfaces. USB 2.0 Full Speed compatible. 4 PWM channels option. Extended operating temperature range; -40⁰C to 85⁰C. I2C master interface option. SPI Slave interface option supporting modes 0, 1, 2 and 3 with MSB/LSB options Available in compact Pb-free 32 Pin LQFP and QFN packages (both RoHS compliant). SPI Master interface option supporting modes 0, 1, 2 and 3 with MSB/LSB options. USB error indicator pin Single chip USB to selectable interface. Entire USB protocol handled on the chip. No USB specific firmware programming required. Neither the whole nor any part of the information contained in, or the product described in this manual, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. This product and its documentation are supplied on an as-is basis and no warranty as to their suitability for any particular purpose is either made or implied. Future Technology Devices International Ltd will not accept any claim for damages howsoever arising as a result of use or failure of this product. Your statutory rights are not affected. This product or any variant of it is not intended for use in any medical appliance, device or system in which the failure of the product might reasonably be expected to result in personal injury. This document provides preliminary information that may be subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH United Kingdom. Scotland Registered Company Number: SC136640 Copyright © 2012 Future Technology Devices International Limited 1 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 1 Typical Applications Connecting Android phones to USB accessories Home automation via Android devices Connecting Android tablets to USB accessories Data logging from USB accessories Controlling instrumentation from Android devices. Connecting serial printing devices to Android devices 1.1 Part Numbers Part Number Package FT311D-32Q1C-x 32 Pin QFN FT311D-32L1C-x 32 Pin LQFP Note: Packing codes for x is: - R: Taped and Reel, QFN 3,000pcs per reel, LQFP 1500 pcs per reel. - (no suffix): Tray packing, 260pcs per tray QFN, 250 pcs per tray LQFP For example: FT311D-32Q1C-R is 3,000pcs QFN taped and reel packing 1.2 USB Compliant At the time of writing this datasheet, the FT311D was still to complete USB compliancy testing. Copyright © 2012 Future Technology Devices International Limited 2 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 2 FT311D Block Diagram UART PWMs USB Host USBDM SPI Master SPI Slave Input / Output Multiplexer USB Transceiver Peripheral Bus USBDP GPIOS I2C MASTER CNFG0 CNFG1 CNFG2 Figure 2.1 FT311D Block Diagram For a description of each function please refer to Section 4. Copyright © 2012 Future Technology Devices International Limited 3 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Table of Contents 1 Typical Applications ...................................................................... 2 1.1 Part Numbers...................................................................................... 2 1.2 USB Compliant .................................................................................... 2 2 FT311D Block Diagram ................................................................. 3 3 Device Pin Out and Signal Description .......................................... 6 3.1 Package Symbol.................................................................................. 6 3.1.1 3.2 Interface Selection ............................................................................. 8 3.2.1 4 Package PinOut Description ........................................................................................... 6 Interface pinout ........................................................................................................... 8 Function Description................................................................... 10 4.1 Key Features ..................................................................................... 10 4.2 Functional Block Descriptions ........................................................... 10 4.2.1 Peripheral Interface Modules ....................................................................................... 10 4.2.2 USB Transceivers ....................................................................................................... 10 4.2.3 USB Host .................................................................................................................. 10 4.3 I/O Peripherals Signal Names .......................................................... 10 4.4 Default Mode Strings ........................................................................ 11 5 Peripheral Interfaces ................................................................. 12 5.1 General Purpose Input Output .......................................................... 12 5.2 UART Interface ................................................................................. 12 5.2.1 UART Mode Signal Descriptions ................................................................................... 13 5.3 Pulse Width Modulation .................................................................... 13 5.4 I2C.................................................................................................... 13 5.5 Serial Peripheral Interface – SPI Modes ........................................... 14 5.5.1 SPI Clock Phase Modes ............................................................................................... 14 5.5.2 Serial Peripheral Interface – Slave ............................................................................... 16 5.5.3 Serial Peripheral Interface – SPI Master ........................................................................ 16 6 USB Error Detection.................................................................... 19 7 Absolute Maximum Ratings ........................................................ 20 7.1 DC Characteristics............................................................................. 20 7.2 ESD and Latch-up Specifications ....................................................... 22 8 Application Examples ................................................................. 23 8.1 USB to GPIO Converter ..................................................................... 23 8.2 USB to UART Converter ..................................................................... 24 8.3 USB to PWM Converter ..................................................................... 25 8.4 USB to I2C (Master) Converter .......................................................... 26 Copyright © 2012 Future Technology Devices International Limited 4 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 8.5 USB to SPI (Slave) Converter ........................................................... 27 8.6 USB to SPI (Master) Converter ......................................................... 28 9 Package Parameters ................................................................... 29 9.1 FT311D Package Markings ............................................................... 29 9.1.1 QFN-32 .................................................................................................................... 29 9.1.2 LQFP-32 ................................................................................................................... 30 9.2 9.2.1 QFN-32 Package Dimensions ....................................................................................... 31 9.2.2 LQFP-32 Package Dimensions ...................................................................................... 32 9.3 10 FT311D Package Dimensions ............................................................ 31 Solder Reflow Profile ........................................................................ 33 Contact Information ................................................................... 35 Appendix A – References ........................................................................... 36 Useful utilities and examples firmware...................................................... 36 Appendix B - List of Figures and Tables ..................................................... 37 Appendix C - Revision History .................................................................... 39 Copyright © 2012 Future Technology Devices International Limited 5 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 3 Device Pin Out and Signal Description 3.1 Package Symbol Figure 3.1 QFN Schematic Symbol Note the pinout is the same for the QFN and LQFP packages. 3.1.1 Package PinOut Description Note: # denotes an active low signal. Pin No. Name Type 2 3.3V VREGIN POWER Input 3 1.8V VCC PLL IN POWER 13, 22, 28 VCCIO 7 VREGOUT 1,6,16,19,27 GND Input POWER Input POWER Output POWER Input Description 3V3 supply to IC internal 1V8 regulator 1V8 supply to IC core 3V3 supply for the IO cells 1V8 output. May be used as input source for pin 3. 0V Ground input. Table 3.1 Power and Ground Copyright © 2012 Future Technology Devices International Limited 6 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Pin No. Name Type 17 USBDP INPUT/OUTPUT USB Data Signal Plus. 18 USBDM INPUT/OUTPUT USB Data Signal Minus. 4 XTIN INPUT 5 XTOUT OUTPUT 8 TEST1 INPUT For internal use. Pull to GND 9 TEST2 INPUT For factory use. Pull to 3V3. 10 RESET# INPUT Reset input (active low). 20, 21 NC - 11 TEST0 OUTPUT 12 CNFG0 14 CNFG1 Description Input to 12MHz Oscillator Cell. Connect 12MHz crystal across pins 4 and 5. Output from 12MHz Oscillator Cell. Connect 12MHz crystal across pins 4 and 5. No connect pins. Leave unterminated. Active low signal that may be used to control a switch for enabling power to the USB port pin 1 (VBUS). INPUT Configuration pin 0 used to select between GPIO,UART,PWM,I2C and SPI. Pull to Ground = Logic „0‟(No external resistor needed) Leave Open = Logic „1‟ (Internal Pull up is present) INPUT Configuration pin 1 used to select between GPIO,UART,PWM,I2C and SPI. Pull to Ground = Logic „0‟(No external resistor needed) Leave Open = Logic „1‟ (Internal Pull up is present) Configuration pin 2 used to select between GPIO,UART,PWM,I2C and SPI. Pull to Ground = Logic „0‟(No external resistor needed) Leave Open = Logic „1‟ (Internal Pull up is present) 15 CNFG2 INPUT 32 USB_ERROR# OUTPUT Output signal to indicate a problem with the USB connection Table 3.2 Common Function pins Pin No. Name Type 23 IOBUS0 INPUT/OUTPUT I/O signal. Function depends on CNFG pin setting. See table 3.4 24 IOBUS1 INPUT/OUTPUT I/O signal. Function depends on CNFG pin setting. See table 3.4 25 IOBUS2 INPUT/OUTPUT I/O signal. Function depends on CNFG pin setting. See table 3.4 26 IOBUS3 INPUT/OUTPUT I/O signal. Function depends on CNFG pin setting. See table 3.4 Description Copyright © 2012 Future Technology Devices International Limited 7 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 29 IOBUS4 INPUT/OUTPUT I/O signal. Function depends on CNFG pin setting. See table 3.4 30 IOBUS5 INPUT/OUTPUT I/O signal. Function depends on CNFG pin setting. See table 3.4 31 IOBUS6 INPUT/OUTPUT I/O signal. Function depends on CNFG pin setting. See table 3.4 Table 3.3 Interface Pins Notes: 1. When used in Input Mode, the input pins are pulled to VCCIO via internal 75kΩ (approx.) resistors. 3.2 Interface Selection The FT311D has multiple interfaces available for connecting to external devices. The resources available are GPIO, UART, PWM, I2C(Master), SPI(Slave) and SPI(Master). The selection of what interface the user requires is configured using the CNFG0, CNFG1 and CNFG2 input pins as per table 3.4. CNFG2 CNFG1 CNFG0 Mode GND GND GND GPIO GND GND Leave Open UART GND Leave Open GND PWM GND Leave Open Leave Open I2C (Master) Leave Open GND GND SPI (Slave) Leave Open GND Leave Open SPI (Master) Table 3.4 CBUS Configuration Control Note 1: When left open the pin is a logic 1. Note 2: Mode “110” is a factory test mode and should not be used. Note 3: Mode “111” will default to GPIO mode. 3.2.1 Interface pinout The actual pinout for each interface type is detailed in table 3.5 Pin No Pin Name GPIO UART PWM I2C (Master) SPI (Slave) SPI (Master) 23 IOBUS0 GPIO0 UART_TXD PWM0 I2C_CLK - - 24 IOBUS1 GPIO1 UART_RXD PWM1 I2C_DATA - - 25 IOBUS2 GPIO2 UART_RTS # PWM2 - - - 26 IOBUS3 GPIO3 UART_CTS # PWM3 - SPI_S_SS0 SPI_M_SS0 Copyright © 2012 Future Technology Devices International Limited 8 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Pin No Pin Name GPIO 29 IOBUS4 GPIO4 30 IOBUS5 GPIO5 31 IOBUS6 GPIO6 PWM I2C (Master) SPI (Slave) SPI (Master) - - SPI_S_CLK SPI_M_CLK - - - SPI_S_MOSI SPI_M_MOSI - - - SPI_S_MISO SPI_M_MISO UART UART_TX _ACTIVE Table 3.5 I/O Configuration Copyright © 2012 Future Technology Devices International Limited 9 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 4 Function Description FT311D is FTDIs Android Accessory Mode integrated circuit device or Android Host. The FT311D behaves like a bridge between an Android device and the various I/O available. Selection of various modes is performed using CNFGx pins. 4.1 Key Features Easy to use Android accessory IC translating the Device port of the android tablet into either GPIO, UART, PWM, I2C Master, SPI Slave or SPI Master capabilities 4.2 Functional Block Descriptions The following paragraphs describe each function within FT311D. Please refer to the block diagram shown in Figure 2.1. 4.2.1 Peripheral Interface Modules FT311D has six peripheral interface modules available for selection. Full descriptions of each module are described in Section 5. GPIO - General purpose I/O pins UART PWM I2C Master SPI Slave SPI Master 4.2.2 USB Transceivers USB transceiver cells provide the physical USB device interface supporting USB 1.1 and USB 2.0 standards. Low-speed and full-speed USB data rates are supported. The output driver provides +3.3V level slew rate control signalling, whilst a differential receiver and two single ended receivers provide USB DATA IN, SE0 and USB Reset condition detection. These cells also include integrated internal pull-down resistors as required for host mode. 4.2.3 USB Host These blocks handle the parallel-to-serial and serial-to-parallel conversion of the USB physical layer. This includes bit stuffing, CRC generation. 4.3 I/O Peripherals Signal Names Peripheral Signal Name Outputs Inputs Description GPIO gpio 7 7 General purpose I/O Transmit asynchronous data output UART PWM I2C SPI Slave uart_txd 1 0 uart_rts# 1 0 Request to send control output uart_rxd 0 1 Receive asynchronous data input uart_cts# 0 1 Clear to send control input uart_tx_active 0 1 UART active signal (typically used with RS485) pwm 4 0 Pulse width modulation I2c_scl 0 1 I2C bus serial clock line - slave I2c_sda 1 1 I2C bus serial data line - slave spi_s_clk 0 1 SPI clock input Copyright © 2012 Future Technology Devices International Limited 10 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 SPI Master spi_s_ss# 0 1 SPI slave select input spi_s_mosi 1 1 SPI master out serial in spi_s_miso 1 0 SPI master in slave out spi_m_clk 1 0 SPI clock input – master spi_m_mosi 1 1 Master out slave in - master spi_m_miso 0 1 Master in slave out - master spi_m_ss_0# 1 0 Active low slave select 0 from master to slave 0 Table 4.1 I/O Peripherals Signal Names Note: # is used to indicate an active low signal. 4.4 Default Mode Strings When the USB port is connected to the Android USB port, the Android platform will determine which application to load based on the strings read from the FT311D. These strings are configurable with a Windows utility: FT311Cofiguration.exe available for download from the FTDI website at: http://www.ftdichip.com/Android/FT311Configuration.zip Default values for the strings are set in the device as per Table 4.2 Descriptor String Default Value Manufacturer FTDI Model (depends on GPIO Mode selection): GPIO FTDIGPIODemo UART FTDIUARTDemo PWM FTDIPWMDemo I2C FTDII2CDemo SPI Slave FTDISPISlaveDemo SPI Master FTDISPIMasterDemo Version 1.0 Serial VinculumAccessory1 Description URL http://www.ftdichip.com Table 4.2 Default Descriptor Strings Copyright © 2012 Future Technology Devices International Limited 11 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 5 Peripheral Interfaces In addition to the USB Host, FT311D contains the following peripheral interfaces: General Purpose Input Output (GPIO) Universal Asynchronous Receiver Transmitter (UART) Four Pulse Width Modulation blocks (PWM) I2C Master Serial Peripheral Interface (SPI) Slave Serial Peripheral Interface (SPI) Master Note: Only one interface may be selected at any time. The modes are selected by setting the CNFGx pins. The following sections describe each peripheral in detail. 5.1 General Purpose Input Output FT311D provides up to 7 configurable Input/Output pins. All pins are independently configurable to be either inputs or outputs. 5.2 UART Interface When the peripheral interface is configured in UART mode, the interface implements a standard asynchronous serial UART port with flow control, for example RS232/422/485. The UART can support baud rates from 300 baud to 6 Mbaud. Data transfer uses NRZ (Non-Return to Zero) data format consisting of 1 start bit, 7 or 8 data bits, an optional parity bit, and one or two stop bits. When transmitting the data bits, the least significant bit is transmitted first. Transmit and receive waveforms are illustrated in Figure 5-1 and Figure 5-2: Figure 5-1 UART Receive Waveform Figure 5-2 UART Transmit Waveform Baud rate (default =9600 baud), flow control settings (default = RTS/CTS), number of data bits (default=8), parity (default is no parity) and number of stop bits (default=1) are all configurable from the Android application. Please refer to http://www.ftdichip.com/Support/Documents/ProgramGuides.htm/FT311_Android_Programmers_Guide.p df for further details. uart_tx_active is transmit enable, this output may be used in RS485 designs to control the transmit of the line driver. Copyright © 2012 Future Technology Devices International Limited 12 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 5.2.1 UART Mode Signal Descriptions The UART signals are fixed on the I/O pins. Table 5.1 UART Interface, details the pins for each of the UART signals. Pin No Name Type Description uart_txd Output Transmit asynchronous data output uart_rxd Input Receive asynchronous data input uart_rts# Output Request to send control output 26 uart_cts# Input Clear to send control input 29 uart_tx_active output Transmit enable (typically used for RS485 designs) 23 24 25 Table 5.1 UART Interface 5.3 Pulse Width Modulation FT311D provides 4 Pulse Width Modulation (PWM) outputs. These can be used to generate PWM signals which can be used to control motors, DC/DC converters, AC/DC supplies, etc. Further information is available in an Application Note AN_140 - Vinculum-II PWM Example. The features of the PWM module are as follows: - 4 PWM outputs - Variable frequency - Variable duty cycle 5.4 I2C I2C (Inter Integrated Circuit) is a multi-master serial bus invented by Philips. I2C uses two bi-directional open-drain wires called serial data (SDA) and serial clock (SCL). Common I²C bus speeds are the 100 kbit/s standard mode (SM), 400 kbit/s fast mode (FM), 1 Mbit/s Fast mode plus (FM+), and 3.4 Mbit/s High Speed mode (HS) An I2C bus node can operate either as a master or a slave: Master node – issues the clock and addresses slaves Slave node – receives the clock line and address. FT311D provides an I2C master interface for connection to other I2C Slave interfaces up to 125kbit/s. The master is initially in master transmit mode by sending a start bit followed by the 7-bit address of the slave it wishes to communicate with, which is finally followed by a single bit representing whether to write(0) to, or read(1) from the slave. Copyright © 2012 Future Technology Devices International Limited 13 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 If the slave exists on the bus then it will respond with an ACK bit (active low for acknowledged) for that address. The master then continues in either transmit or receive mode (according to the read/write bit it sent), and the slave continues in its complementary mode (receive or transmit, respectively). The address and the data bytes are sent most significant bit first. The start bit is indicated by a high-tolow transition of SDA with SCL high; the stop bit is indicated by a low-to-high transition of SDA with SCL high. If the master has to write to the slave then it repeatedly sends a byte with the slave sending an ACK bit. (In this situation, the master is in master transmit mode and the slave is in slave receive mode.) If the master has to read from the slave then it repeatedly receives a byte from the slave, the master sending an ACK bit after every byte but the last one. (In this situation, the master is in master receive mode and the slave is in slave transmit mode.) The master then ends transmission with a stop bit, or it may send another START bit if it wishes to retain control of the bus for another transfer (a "combined message"). I²C defines three basic types of message, each of which begins with a START and ends with a STOP: Single message where a master writes data to a slave; Single message where a master reads data from a slave; Combined messages, where a master issues at least two reads and/or writes to one or more slaves In a combined message, each read or write begins with a START and the slave address. After the first START, these are also called repeated START bits; repeated START bits are not preceded by STOP bits, which is how slaves know the next transfer is part of the same message. Please refer to the I2C specification for more information on the protocol. 5.5 Serial Peripheral Interface – SPI Modes The Serial Peripheral Interface Bus is an industry standard communications interface. Devices communicate in Master / Slave mode, with the Master initiating the data transfer. FT311D has one master module and one slave module. Both the SPI master and slave module has four signals – clock, slave select, MOSI (master out – slave in) and MISO (master in – slave out). Table 5.2 lists how the signals are named in each module. Module SPI Slave SPI Master Table 5.2 Signal Name Type Description spi_s_clk Input Clock input spi_s_ss# Input Active low slave select input spi_s_mosi Input Master out serial in spi_s_miso Output Master in slave out spi_m_clk Output Clock output – master spi_m_mosi Output Master out slave in - master spi_m_miso Input Master in slave out - master spi_m_ss_0# Output Active low slave select 0 from master to slave 0 SPI Signal Names The SPI slave protocol by default does not support any form of handshaking. It is simply transferring 8 bit data. 5.5.1 SPI Clock Phase Modes SPI interface has 4 unique modes of clock phase (CPHA) and clock polarity (CPOL), known as Mode 0, Mode 1, Mode 2 and Mode 3. Table 5.3 summarizes these modes and available interface and Figure 5-3 is the function timing diagram. For CPOL = 0, the base (inactive) level of SCLK is 0. Copyright © 2012 Future Technology Devices International Limited 14 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 In this mode: • When CPHA = 0, data is clocked in on the rising edge of SCLK, and data is clocked out on the falling edge of SCLK. • When CPHA = 1, data is clocked in on the falling edge of SCLK, and data is clocked out on the rising edge of SCLK For CPOL =1, the base (inactive) level of SCLK is 1. In this mode: • When CPHA = 0, data is clocked in on the falling edge of SCLK, and data is clocked out on the rising edge of SCLK • When CPHA =1, data is clocked in on the rising edge of SCLK, and data is clocked out on the falling edge of SCLK. Mode CPOL CPHA 0 0 0 1 0 1 2 1 0 3 1 1 Table 5.3 - Clock Phase/Polarity Modes Figure 5-3 - SPI CPOL CPHA Function Copyright © 2012 Future Technology Devices International Limited 15 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 5.5.2 Serial Peripheral Interface – Slave CLK SS# External - SPI Master MOSI FT311 - SPI Slave MISO Figure 5-4 SPI Slave block diagram FT311D has an SPI Slave module that uses four wire interfaces: MOSI, MISO, CLK and SS#. An SPI transfer can only be initiated by the SPI Master and begins with the slave select signal being asserted. This is followed by a data byte being clocked out with the master supplying CLK. The master always supplies the first byte, which is called a command byte. After this the desired number of data bytes are transferred before the transaction is terminated by the master de-asserting slave select. An SPI Master is able to abort a transfer at any time by de-asserting its SS# output. This will cause the Slave to end its current transfer and return to idle state. 5.5.2.1 SPI Slave Signal Descriptions Pin No Name Type Description 29 spi_s0_clk Input Slave clock input 30 spi_s0_mosi Input Master Out Slave In 31 Synchronous data from master to slave Master In Slave Out spi_s0_miso Output Synchronous data from slave to master 26 spi_s0_ss# Input Slave select Table 5.4 Data and Control Bus Signal Mode Options - SPI Slave Interface 5.5.3 Serial Peripheral Interface – SPI Master CLK SS# FT311 - SPI Master MOSI External - SPI Slave MISO Figure 5-5 SPI Master block diagram The SPI Master interface is used to interface to applications such as Real time clocks and audio codecs. The SPI Master provides the following features: Copyright © 2012 Future Technology Devices International Limited 16 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Synchronous serial data link. Full and half duplex data transmission. Serial clock with programmable frequency, polarity and phase. One slave select output. 5.5.3.1 SPI Master Signal Descriptions. Table 5.5 shows the SPI master signals and the pins Pin No Name Type Description 29 spi_m_clk Output SPI master clock input 30 spi_m_mosi Output 31 spi_m_miso 26 spi_m_ss_0# Master Out Slave In Synchronous data from master to slave Master In Slave Out Input Synchronous data from slave to master Active low slave select 0 from master to Output slave Table 5.5 SPI Master Signal Names The main purpose of the SPI Master block is to transfer data between an external SPI interface and the FT311D. An SPI master interface transfer can only be initiated by the SPI Master and begins with the slave select signal being asserted. This is followed by a data byte being clocked out with the master supplying SCLK. The master typically supplies the first byte, which is called a command byte. After this the desired number of data bytes are transferred before the transaction is terminated by the master de-asserting slave select. However the FT311D is simply a data pipe and no command is required by the FT311D itself. Any command protocol would be defined by the Android application. The SPI Master will transmit on MOSI as well as receive on MISO during every data stage. Figure 5-6 Typical SPI Master Timing and Table 5.6 SPI Master Timing show an example of this. Copyright © 2012 Future Technology Devices International Limited 17 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Figure 5-6 Typical SPI Master Timing Time Description Minimum Typical Maximum t1 SCLK period 39.68 41.67 t2 SCLK high period 19.84 20.84 21.93 ns t3 SCLK low period 19.84 20.84 21.93 ns t4 SCLK driving edge to MOSI/SS -1.5 t5 MISO setup time to sample SCLK edge t6 MISO hold time from sample SCLK edge ns 3 6.5 0 Unit ns ns ns Table 5.6 SPI Master Timing Copyright © 2012 Future Technology Devices International Limited 18 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 6 USB Error Detection Pin 32 (IOBUS7) of the device is provided to indicate a problem has occurred with the USB connection. Typical errors include USB Device Not Supported, which would occur if the USB port was connected to a non-Android class device port e.g. the FT311D is not designed to host memory sticks or printers etc. USB Device Not Responding and Hub not supported would be reported also if connected to a hub. The signal states are as follows: Pin state Definition Logic 0 Device connected to USB and functional Logic 1 Device not connected One 50ms logic 0 pulse Device not responding. This pulse occurs at plug-in and then the signal returns to logic 1. This then repeats at a 1 second interval. Two 50ms logic 0 pulses Device not supported. These pulses occur at plugin and then the signal returns to logic 1. This then repeats at a 1 second interval. Three 50ms logic 0 pulses Hub not supported. These pulses occur at plug-in and then the signal returns to logic 1. This then repeats at a 1 second interval. Table 6.1 Error Detection Copyright © 2012 Future Technology Devices International Limited 19 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 7 Absolute Maximum Ratings The absolute maximum ratings for FT311D are shown in Table 7.1. These are in accordance with the Absolute Maximum Rating System (IEC 60134). Exceeding these may cause permanent damage to the device. Parameter Value Unit Storage Temperature -65°C to 150°C Degrees C 168 Hours Floor Life (Out of Bag) At Factory Ambient (IPC/JEDEC J-STD-033A MSL Level 3 ( 30°C / 60% Relative Humidity) Hours Compliant)* Degrees Ambient Temperature (Power Applied) -40°C to 85°C Vcc Supply Voltage 0 to +3.63 V VCC_IO 0 to +3.63 V VCC_PLL_IN 0 to + 1.98 V DC Input Voltage - USBDP and USBDM -0.5 to +(Vcc +0.5) V -0.5 to +5.00 V DC Input Voltage - All other Inputs -0.5 to +(Vcc +0.5) V DC Output Current - Outputs 4 mA 4 mA DC Input Voltage - High Impedance Bidirectional DC Output Current - Low Impedance Bidirectional Table 7.1 * C. Absolute Maximum Ratings If devices are stored out of the packaging beyond this time limit the devices should be baked before use. The devices should be ramped up to a temperature of 125°C and baked for up to 17 hours. 7.1 DC Characteristics DC Characteristics (Ambient Temperature -40˚C to +125˚C) Parameter Vcc1 Description VCC Operating Supply Voltage Minimum Typical Maximum Units 2.97 3.3 3.63 V Copyright © 2012 Future Technology Devices International Limited Conditions 20 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Vcc2 VCC_PLL VCCIO Operating Supply Voltage VCC_PLL Operating Supply Voltage 2.97 3.3 3.63 V 1.62 1.8 1.98 V Operating Supply Current Icc1 25 mA 128 µA 48MHz Icc2 Operating Supply Current Normal Operation USB Suspend Table 7.2 Operating Voltage and Current Parameter Description Minimum Voh Output Voltage High 2.4 Vol Output Voltage Low Vin Typical Maximum 0.4 Input Switching 1.5 Threshold Units Conditions V I source = 8mA V I sink = 8mA V Table 7.3 I/O Pin Characteristics Parameter UVoh UVol UVse UCom UVdif UDrvZ Description I/O Pins Static Output ( High) Minimum Typical 2.8 0.3 V 0.8 2.0 V 0.8 2.5 V ( Low ) Threshold Differential Common Mode Differential Input Sensitivity Driver Output Impedance Units 0.2 3 Conditions V I/O Pins Static Output Single Ended Rx Maximum V 6 9 Ohms Table 7.4 USB I/O Pin (USBDP, USBDM) Characteristics Copyright © 2012 Future Technology Devices International Limited 21 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Parameter Description Minimum Typical Maximum Units 1.62 1.8 1.98 V 1.62 1.8 1.98 V -40 25 125 °C -10 ±1 10 µA -10 ±1 10 µA Power supply of internal VCCK core cells and I/O to core interface VCC18IO Power supply of 1.8V OSC pad Operating junction TJ temperature Iin Input leakage current Ioz Tri-state output leakage current Conditions 1.8V power supply 1.8V power supply Iin = VCC18IO or 0V Table 7.5 Crystal Oscillator 1.8 Volts DC Characteristics 7.2 ESD and Latch-up Specifications Description Specification Human Body Mode (HBM) ± 2000V Machine mode (MM) ± 200V Charged Device Mode (CDM) ± 500V Latch-up > ± 200mA Table 7.6 ESD and Latch-up Specifications Copyright © 2012 Future Technology Devices International Limited 22 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 8 Application Examples The following sections illustrate possible applications of the FT311D. 8.1 USB to GPIO Converter P Channel Power MOSFET 5V_SW Switched 5V Power to USB 5V 3V3 REGULATOR 0.1uF 3V3 0.1uF 3V3 Ferrite Bead 1 VCC VBUSCTRL# 470R 470R 470R 470R VCCIO 5V_SW IOBUS0 RESET# 27R 2 USBDM IOBUS1 3 USBDP 27R 4 IOBUS2 5 47pF 47pF IOBUS3 SHIELD FT311D 100nF IOBUS4 CNFG2 GND CNFG1 IOBUS5 CNFG0 GND GND IOBUS6 1V8 PLL VCC IN IOBUS7 3V3 GN D AG ND VREGOUT GND 100nF + 4.7uF 100nF GND GND Figure 8.1 Application Example showing USB to GPIO Converter This example shows the CNFGx pins set for mode 000 – GPIO. IOBUS0-3 are configured as outputs by the Android application to control the LEDs. IOBUS4-6 pins are configured as inputs to allow the buttons to control actions in the Android application. Power to the USB port is enabled by the VBUSCTRL# signal Copyright © 2012 Future Technology Devices International Limited 23 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 8.2 USB to UART Converter P Channel Power MOSFET 5V_SW Switched 5V Power to USB 5V 3V3 REGULATOR 0.1uF 3V3 Ferrite Bead 1 VCC VBUSCTRL# VCCIO 5V_SW 0.1uF UART_TXD IOBUS0 RESET# 27R 2 USBDM IOBUS1 3 UART_RXD USBDP 27R 4 IOBUS2 5 47pF 47pF IOBUS3 SHIELD FT311D 100nF CNFG1 UART_CTS# UART_TX_ACTIVE IOBUS5 CNFG0 GND MCU/FPGA IOBUS4 CNFG2 GND UART_RTS# GND IOBUS6 1V8 PLL VCC IN 10k IOBUS7 3V3 3V3 100nF + 4.7uF GN D AG ND VREGOUT 100nF GND GND Figure 8.2 Application Example showing USB to UART Converter This example shows the CNFGx pins set for mode 001 - UART. The UART signals are at 3V3 level and may be used to drive directly into a FPGA or MCU with a 3V3 interface, or could be level shifted with an RS232, RS422 or RS485 transceiver. The UART_TX_ACTIVE signal is used mostly with RS485 transceivers to enable the transmit drivers. The unused pins may be left unterminated. Power to the USB port is enabled by the VBUSCTRL# signal Copyright © 2012 Future Technology Devices International Limited 24 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 8.3 USB to PWM Converter P Channel Power MOSFET 5V_SW Switched 5V Power to USB 5V 3V3 REGULATOR 0.1uF 3V3 Ferrite Bead 1 VCC VBUSCTRL# VCCIO 5V_SW PWM_0 IOBUS0 RESET# 27R 2 0.1uF MOTOR CONTROLLER 3V3 USBDM 3 IOBUS1 PWM_1 IOBUS2 PWM_2 USBDP 27R 4 5 47pF 47pF IOBUS3 SHIELD 470R PWM_3 FT311D 100nF IOBUS4 CNFG2 GND CNFG1 IOBUS5 CNFG0 GND IOBUS7 10k 3V3 + 4.7uF GN D AG ND VREGOUT 3V3 100nF IOBUS6 1V8 PLL VCC IN GND 100nF GND GND Figure 8.3 Application Example showing USB to PWM Converter This example shows the CNFGx pins set for mode 010 – Pulse Width Modulation (PWM). PWM channel 0 has been wired to a motor controller. This is typical of applications with robotic arms or moving machinery. PWM channel 3 has been connected to an LED. This allows the LED to either flash or by altering the PWM switching frequency the controller can act as a “dimmer switch” to the LED. The unused channels may be left unterminated. Power to the USB port is enabled by the VBUSCTRL# signal Copyright © 2012 Future Technology Devices International Limited 25 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 8.4 USB to I2C (Master) Converter P Channel Power MOSFET 5V_SW Switched 5V Power to USB 5V 3V3 REGULATOR 0.1uF 3V3 0.1uF 3V3 10k Ferrite Bead 1 VCC VCCIO 5V_SW 10k VBUSCTRL# I2C_CLK IOBUS0 RESET# 27R 2 USBDM I2C_DATA IOBUS1 3 I2C Peripheral e.g. Memory, RTC, CODECs USBDP 27R 4 IOBUS2 5 47pF 47pF IOBUS3 SHIELD FT311D 100nF IOBUS4 CNFG2 GND CNFG1 IOBUS5 CNFG0 GND IOBUS7 10k 3V3 + 4.7uF GN D AG ND VREGOUT 3V3 100nF IOBUS6 1V8 PLL VCC IN GND 100nF GND GND Figure 8.4 Application Example showing USB to I2C (Master) Converter This example shows the CNFGx pins set for mode 011 – I2C (Master). Only two signal lines are required for I2C interfacing. The clock is an output from the FT311D while the data line is bi-directional. Examples of I2C peripherals include EEPROMs, Real time Clocks (RTC) and audio or video codecs. The unused pins may be left unterminated. Power to the USB port is enabled by the VBUSCTRL# signal Copyright © 2012 Future Technology Devices International Limited 26 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 8.5 USB to SPI (Slave) Converter P Channel Power MOSFET 5V_SW Switched 5V Power to USB 5V 3V3 REGULATOR 0.1uF 3V3 Ferrite Bead 1 VCC 0.1uF VBUSCTRL# VCCIO 5V_SW IOBUS0 RESET# 27R 2 USBDM IOBUS1 3 USBDP 27R 4 3V3 IOBUS2 5 47pF 10k 47pF IOBUS3 SHIELD FT311D 100nF SPI_S_CLK IOBUS4 CNFG2 GND SPI_S_SS# SPI_S_MOSI CNFG1 IOBUS5 CNFG0 GND SPI MASTER e.g. MCU, FPGA SPI_S_MISO IOBUS6 1V8 PLL VCC IN GND IOBUS7 3V3 100nF + 4.7uF GN D AG ND VREGOUT 100nF GND GND Figure 8.5 Application Example showing USB to SPI (Slave) Converter This example shows the CNFGx pins set for mode 100 – SPI (Slave). The external SPI Master controls the slave select line and the clock to the FT311D. SPI_S_MOSI is the FT311D data input line which may be Most or Least Significant Bit first. SPI_S_MISO is the FT311D data output line which may be Most or Least Significant Bit first. Example SPI masters include MCU‟s and FPGA‟s The unused pins may be left unterminated. Power to the USB port is enabled by the VBUSCTRL# signal Copyright © 2012 Future Technology Devices International Limited 27 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 8.6 USB to SPI (Master) Converter P Channel Power MOSFET 5V_SW Switched 5V Power to USB 5V 3V3 REGULATOR 0.1uF 3V3 Ferrite Bead 1 VCC 0.1uF VBUSCTRL# VCCIO 5V_SW IOBUS0 RESET# 27R 2 USBDM IOBUS1 3 USBDP 27R 4 3V3 IOBUS2 10k IOBUS3 5 47pF 47pF SHIELD FT311D 100nF SPI_M_CLK IOBUS4 CNFG2 GND SPI_M_SS# SPI_M_MOSI CNFG1 IOBUS5 CNFG0 GND SPI SLAVE e.g. EEPROM, RTC, CODECs SPI_M_MISO IOBUS6 1V8 PLL VCC IN GND IOBUS7 3V3 100nF + 4.7uF GN D AG ND VREGOUT 100nF GND GND Figure 8.6 Application Example showing USB to SPI (Master) Converter This example shows the CNFGx pins set for mode 101 – SPI (Master). The FT311D SPI Master controls the slave select line and the clock to the external SPI slave. SPI_M_MOSI is the FT311D data output line which may be Most or Least Significant Bit first. SPI_M_MISO is the FT311D data input line which may be Most or Least Significant Bit first. Example SPI Slave devices include memory, RTC, and codec devices. The unused pins may be left unterminated. Power to the USB port is enabled by the VBUSCTRL# signal Copyright © 2012 Future Technology Devices International Limited 28 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 9 Package Parameters FT311D is available in RoHS Compliant packages, QFN package (32QFN) and an LQFP package (32LQFP). The packages are lead (Pb) free and use a „green‟ compound. The package is fully compliant with European Union directive 2002/95/EC. The mechanical drawings of the packages are shown in sections 9.2- all dimensions are in millimetres. The solder reflow profile for all packages can be viewed in Section 9.3. 9.1 FT311D Package Markings 9.1.1 QFN-32 An example of the markings on the QFN package are shown in Figure 9-1. The FTDI part number is too long for the 32 QFN package so in this case the last two digits are wrapped down onto the date code line. FTDI II XXXXXXXX FT311D-32Q 1C YYWW 32 Line 1 – FTDI Logo Line 2 – Wafer Lot Number Line 3 – FTDI Part Number Line 4 – Revision and Date Code 1 Figure 9-1 QFN Package Markings 1C should be printed on line 4, then a space and then the Date Code. 1. YYWW = Date Code, where YY is year and WW is week number 2. Marking alignment should be centre justified 3. Laser Marking should be used 4. All marking dimensions should be marked proportionally. Marking font should be using Unisem standard font (Roman Simplex) Copyright © 2012 Future Technology Devices International Limited 29 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 9.1.2 LQFP-32 An example of the markings on the LQFP package are shown in Figure 9-2. FTD I XXXXXXXXXX FT311D-L 1C YYWW 32 Line 1 – FTDI Logo Line 2 – Wafer Lot Number Line 3 – FTDI Part Number Line 4 – Date Code 1 Figure 9-2 LQFP Package Markings Notes: 1. YYWW = Date Code, where YY is year and WW is week number 2. Marking alignment should be centre justified 3. Laser Marking should be used 4. All marking dimensions should be marked proportionally. Marking font should be using Unisem standard font (Roman Simplex) Copyright © 2012 Future Technology Devices International Limited 30 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 9.2 FT311D Package Dimensions 9.2.1 QFN-32 Package Dimensions FTDl XXXXXXXX FT311D-32Q 1C YYWW 1 1 Figure 9-3 QFN-32 Package Dimensions Note: Dimensions are in mm Copyright © 2012 Future Technology Devices International Limited 31 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Note: The centre pad should be connected to the GND plane for improved thermal conduction and noise immunity. 9.2.2 LQFP-32 Package Dimensions FTDl XXXXXXXX FT311D-32L 1C YYWW PIN #32 PIN #1 Figure 9-4 LQFP-32 Package Dimensions Note: Dimensions are in mm Copyright © 2012 Future Technology Devices International Limited 32 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 9.3 Solder Reflow Profile Figure 9-5 All packages Reflow Solder Profile Copyright © 2012 Future Technology Devices International Limited 33 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Pb Free Solder Process SnPb Eutectic and Pb free (non (green material) green material) Solder Process 3°C / second Max. 3°C / Second Max. Profile Feature Average Ramp Up Rate (Ts to Tp) Preheat - Temperature Min (Ts Min.) 150°C 100°C - Temperature Max (Ts Max.) 200°C 150°C - Time (ts Min to ts Max) 60 to 120 seconds 60 to 120 seconds 217°C 183°C 60 to 150 seconds 60 to 150 seconds 260°C see Figure 9-5 30 to 40 seconds 20 to 40 seconds Ramp Down Rate 6°C / second Max. 6°C / second Max. Time for T= 25°C to Peak Temperature, Tp 8 minutes Max. 6 minutes Max. Volume mm3 < 350 Volume mm3 >=350 < 2.5 mm 235 +5/-0 deg C 220 +5/-0 deg C ≥ 2.5 mm 220 +5/-0 deg C 220 +5/-0 deg C Time Maintained Above Critical Temperature TL: - Temperature (TL) - Time (tL) Peak Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Table 9.1 Reflow Profile Parameter Values SnPb Eutectic and Pb free (non green material) Package Thickness Pb Free (green material) = 260 +5/-0 deg C Table 9.2 Package Reflow Peak Temperature Copyright © 2012 Future Technology Devices International Limited 34 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 10 Contact Information Head Office – Glasgow, UK Future Technology Devices International Limited Unit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HH United Kingdom Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) [email protected] [email protected] [email protected] Branch Office – Taipei, Taiwan Future Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu Road Taipei 114 Taiwan, R.O.C. Tel: +886 (0) 2 8791 3570 Fax: +886 (0) 2 8791 3576 E-mail (Sales) E-mail (Support) E-mail (General Enquiries) [email protected] [email protected] [email protected] Branch Office – Hillsboro, Oregon, USA Future Technology Devices International Limited (USA) 7235 NW Evergreen Parkway, Suite 600 Hillsboro, OR 97123-5803 USA Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 E-Mail (Sales) E-Mail (Support) E-Mail (General Enquiries) [email protected] [email protected] [email protected] Branch Office – Shanghai, China Room 1103, No. 666 West Huaihai Road, Shanghai, 200052 China Tel: +86 21 62351596 Fax: +86 21 62351595 E-mail (Sales) [email protected] [email protected] E-mail (Support) E-mail (General Enquiries) [email protected] Copyright © 2012 Future Technology Devices International Limited 35 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Appendix A – References Useful Application Notes http://www.ftdichip.com/Documents/White_Papers/WP_001_Connecting_Peripherals_to_an_Android_Plat form.pdf http://www.ftdichip.com/Support/Documents/ProgramGuides.htm/FT311_Android_Programmers_Guide.p df Useful utilities and examples firmware http://www.ftdichip.com/Android/FT311Configuration.zip http://www.ftdichip.com/Android/SampleApps.zip Copyright © 2012 Future Technology Devices International Limited 36 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Appendix B - List of Figures and Tables List of Figures Figure 2.1 FT311D Block Diagram ................................................................................................... 3 Figure 3.1 QFN Schematic Symbol .................................................................................................. 6 Figure 5-1 UART Receive Waveform .............................................................................................. 12 Figure 5-2 UART Transmit Waveform ............................................................................................ 12 Figure 5-4 - SPI CPOL CPHA Function ............................................................................................ 15 Figure 5-5 SPI Slave block diagram............................................................................................... 16 Figure 5-6 SPI Master block diagram ............................................................................................. 16 Figure 5-7 Typical SPI Master Timing ............................................................................................ 18 Figure 7.1 Application Example showing USB to GPIO Converter ....................................................... 23 Figure 8.2 Application Example showing USB to UART Converter ...................................................... 24 Figure 8.3 Application Example showing USB to PWM Converter ....................................................... 25 Figure 8.4 Application Example showing USB to I2C (Master) Converter ............................................. 26 Figure 8.5 Application Example showing USB to SPI (Slave) Converter .............................................. 27 Figure 8.6 Application Example showing USB to SPI (Master) Converter ............................................ 28 Figure 9-1 QFN Package Markings ................................................................................................. 29 Figure 9-2 LQFP Package Markings ................................................................................................ 30 Figure 9-4 LQFP-32 Package Dimensions ....................................................................................... 32 Figure 9-5 All packages Reflow Solder Profile ................................................................................. 33 List of Tables Table 3.1 Power and Ground .......................................................................................................... 6 Table 3.2 Common Function pins .................................................................................................... 7 Table 3.3 Interface Pins ................................................................................................................. 8 Table 3.4 CBUS Configuration Control ............................................................................................. 8 Table 3.5 I/O Configuration ............................................................................................................ 9 Table 4.1 I/O Peripherals Signal Names ......................................................................................... 11 Table 4.2 Default Descriptor Strings .............................................................................................. 11 Table 5.1 UART Interface ............................................................................................................ 13 Table 5.2 SPI Signal Names ....................................................................................................... 14 Table 5.3 - Clock Phase/Polarity Modes ....................................................................................... 15 Table 5.4 Data and Control Bus Signal Mode Options - SPI Slave Interface ...................................... 16 Table 5.5 SPI Master Signal Names ............................................................................................... 17 Table 5.6 SPI Master Timing........................................................................................................ 18 Table 6.1 Error Detection ............................................................................................................ 19 Table 7.1 Absolute Maximum Ratings .......................................................................................... 20 Table 7.2 Operating Voltage and Current ....................................................................................... 21 Table 7.3 I/O Pin Characteristics ................................................................................................... 21 Table 7.4 USB I/O Pin (USBDP, USBDM) Characteristics .................................................................. 21 Table 7.5 Crystal Oscillator 1.8 Volts DC Characteristics .................................................................. 22 Table 7.6 ESD and Latch-up Specifications .................................................................................... 22 Copyright © 2012 Future Technology Devices International Limited 37 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Table 9.1 Reflow Profile Parameter Values ................................................................................... 34 Table 9.2 Package Reflow Peak Temperature ................................................................................ 34 Copyright © 2012 Future Technology Devices International Limited 38 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Appendix C - Revision History Document Title: USB Android Host IC FT311D Document Reference No.: FT_000660 Clearance No.: FTDI# 305 Product Page: http://www.ftdichip.com/FTProducts.htm Document Feedback: Send Feedback Version 1.0 Initial Release July 2012 Copyright © 2012 Future Technology Devices International Limited 39 DS_FT311D USB ANDROID HOST IC Datasheet Version 1.0 Document No.: FT_000660 Clearance No.: FTDI# 305 Copyright © 2012 Future Technology Devices International Limited 40