Agilent HCPL-9000/-0900, -9030/-0930, HCPL-9031/-0931, -900J/-090J, HCPL-901J/-091J, -902J/-092J High Speed Digital Isolators Data Sheet Features • +3.3V and +5V TTL/CMOS compatible • 3 ns max. pulse width distortion • 6 ns max. propagation delay skew • 15 ns max. propagation delay Description The HCPL-90xx and HCPL-09xx CMOS digital isolators feature high speed performance and excellent transient immunity specifications. The symmetric magnetic coupling barrier gives these devices a typical pulse width distortion of 2 ns, a typical propagation delay skew of 4 ns and 100 Mbaud data rate, making them the industry’s fastest digital isolators. The single channel digital isolators (HCPL-9000/-0900) features an active-low logic output enable. The dual channel digital isolators are configured as unidirectional (HCPL-9030/-0930) and bidirectional (HCPL-9031/-0931), operating in full duplex mode making it ideal for digital fieldbus applications. The quad channel digital isolators are configured as unidirec- tional (HCPL-900J/-090J), two channels in one direction and two channels in opposite direction (HCPL-901J/-091J), and one channel in one direction and three channels in opposite direction (HCPL-902J/-092J). These high channel density make them ideally suited to isolating data conversion devices, parallel buses and peripheral interfaces. They are available in 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC packages, and 16–pin SOIC narrow-body and wide-body packages. They are specified over the temperature range of -40° C to +100° C. • High speed: 100 MBd • 15 kV/µs min. common mode rejection • Tri-state output (HCPL-9000/-0900) • 2500 V RMS isolation • UL1577 and IEC 61010-1 approved Applications • Digital fieldbus isolation • Multiplexed data transmission • Computer peripheral interface • High speed digital systems • Isolated data interfaces • Logic level shifting CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD. Selection Guide Device Number Channel Configuration Package HCPL-9000 Single 8-pin DIP (300 Mil) HCPL-0900 Single 8-pin Small Outline HCPL-9030 Dual 8-pin DIP (300 Mil) HCPL-0930 Dual 8-pin Small Outline HCPL-9031 Dual, Bi-Directional 8-pin DIP (300 Mil) HCPL-0931 Dual, Bi-Directional 8-pin Small Outline HCPL-900J Quad 16-pin Small Outline, Wide Body HCPL-090J Quad 16-pin Small Outline, Narrow Body HCPL-901J Quad, 2/2, Bi-Directional 16-pin Small Outline, Wide Body HCPL-091J Quad, 2/2, Bi-Directional 16-pin Small Outline, Narrow Body HCPL-902J Quad, 1/3, Bi-Directional 16-pin Small Outline, Wide Body HCPL-092J Quad, 1/3, Bi-Directional 16-pin Small Outline, Narrow Body Ordering Information Specify Part Number followed by Option Number (if desired). Examples: HCPL-90xx-xxx xxx: No option = 300 Mil PDIP-8 package, 50 units per tube. 300 = Gull Wing Surface Mount Option, 50 units per tube. 500 = Tape and Reel Packaging Option, 1000 units per reel. HCPL-09xx-xxx xxx: No option = SO-8 package, 100 units per tube. 500 = Tape and Reel Packaging Option, 1500 units per reel. HCPL-90xJ-xxx xxx: No option = Wide Body SOIC-16 package, 50 units per tube. 500 = Tape and Reel Packaging Option, 1000 units per reel. HCPL-09xJ-xxx xxx: No option = Narrow Body SOIC-16 package, 50 per tube. 500 = Tape and Reel Packaging Option, 1000 units per reel. 2 Functional Diagrams Symbol Description Single Channel VDD1 Power Supply 1 VDD2 Power Supply 2 INX Logic Input Signal OUTX Logic Output Signal GND1 Power Supply Ground 1 GND2 Power Supply Ground 2 VOE Logic Output Enable (Single Channel), Active Low NC Not Connected VDD1 1 IN1 2 NC 3 GND1 4 Galvanic Isolation Pin Description 8 VDD2 7 VOE 6 OUT1 5 GND2 Truth Table IN1 VOE OUT1 L L L H L L H H Z H H Z HCPL-9000/0900 1 IN1 2 IN2 3 GND1 4 8 VDD2 VDD1 1 7 OUT1 IN1 2 6 OUT2 OUT2 3 5 GND2 GND1 4 HCPL-9030/0930 Galvanic Isolation VDD1 Galvanic Isolation Dual Channel 8 VDD2 7 OUT1 6 IN2 5 GND2 HCPL-9031/0931 Quad Channel VDD2 VDD1 1 16 VDD2 VDD1 1 16 VDD2 GND1 2 15 GND2 GND1 2 15 GND2 GND1 2 15 GND2 IN1 3 14 OUT1 IN1 3 14 OUT1 IN1 3 14 OUT1 IN2 4 13 OUT2 IN2 4 13 OUT2 IN2 4 13 OUT2 IN3 5 12 OUT3 OUT3 5 12 IN3 IN3 5 12 OUT3 IN4 6 11 OUT4 OUT4 6 11 IN4 OUT4 6 11 IN4 NC 7 10 NC NC 7 10 NC NC 7 10 NC GND1 8 9 GND2 GND1 8 9 GND2 GND1 8 9 GND2 HCPL-900J/-090J 3 HCPL-901J/-091J Galvanic Isolation 16 Galvanic Isolation 1 Galvanic Isolation VDD1 HCPL-902J/-092J Package Outline Drawings HCPL-9000, HCPL-9030 and HCPL-9031 Standard DIP Packages 8 7 6 5 0.240 (6.096) 0.260 (6.604) 1 2 3 4 0.370 (9.398) 0.400 (10.160) 0.55 (1.397) 0.65 (1.651) 0.290 (7.366) 0.310 (7.874) 0.120 (3.048) 0.150 (3.810) 0.008 (0.203) 0.015 (0.381) 0.015 (0.381) 0.035 (0.889) 0.030 (0.762) 0.045 (1.143) 0.015 (0.380) 0.023 (0.584) 3° 8° 0.300 (7.620) 0.370 (9.398) 0.090 (2.286) 0.110 (2.794) 0.045 (1.143) 0.065 (1.651) DIMENSIONS: INCHES (MILLIMETERS) MIN MAX HCPL-9000, HCPL-9030 and HCPL-9031 Gull Wing Surface Mount Option 300 PAD LOCATION (for reference only) 0.040 (1.016) 0.047 (1.194) 0.370 (9.400) 0.390 (9.900) 8 7 6 5 0.190 TYP. (4.826) 0.240 (6.100) 0.260 (6.600) 1 2 3 0.370 (9.398) 0.390 (9.906) 4 0.047 (1.194) 0.070 (1.778) 0.045 (1.143) 0.065 (1.651) 0.030 (0.762) 0.045 (1.143) 0.370 (9.400) 0.390 (9.900) 0.290 (7.370) 0.310 (7.870) 0.008 (0.203) 0.013 (0.330) 0.120 (3.048) 0.150 (3.810) 0.030 (0.760) 0.056 (1.400) 0.015 (0.385) 0.035 (0.885) 0.100 (2.540) BSC 0.025 (0.632) 0.035 (0.892) MIN MAX LEAD COPLANARITY = 0.004 INCHES (0.10 mm) DIMENSIONS INCHES (MILLIMETERS) 4 0.015 (0.381) 0.025 (0.635) 12° NOM. HCPL-0900, HCPL-0930 and HCPL-0931 Small Outline SO-8 Package 0.189 (4.80) 0.197 (5.00) 8 7 6 5 0.228 (5.80) 0.244 (6.20) 0.150 (3.80) 0.157 (4.00) 1 2 3 4 0.013 (0.33) 0.020 (0.51) 0.010 (0.25) 0.020 (0.50) x 45° 0.008 (0.19) 0.010 (0.25) 0.004 (0.10) 0.010 (0.25) 0.054 (1.37) 0.069 (1.75) 0° 8° 0.040 (1.016) 0.060 (1.524) 0.016 (0.40) 0.050 (1.27) DIMENSIONS: INCHES (MILLIMETERS) MIN MAX HCPL-900J, HCPL-901J and HCPL-902J Wide Body SOIC-16 Package 0.397 (10.084) 0.413 (10.490) 8 Pin 1 indent 1 0.394 (10.007) 0.419 (10.643) 0.291 (7.391) 0.299 (7.595) 0.013 (0.330) 0.020 (0.508) 7° TYP 0.092 (2.337) 0.104 (2.642) 0.287 (7.290) 0.297 (7.544) 7° TYP 0.080 (2.032) 0.100 (2.54) 0° – 8° TYP 0.040 (1.016) 0.060 (1.524) DIMENSIONS: INCHES (MILLIMETERS) MIN MAX 5 0.010 (0.254) x 45° 0.020 (0.508) 0.004 (0.1016) 0.011 (0.279) 0.009 (0.229) 0.012 (0.305) 0.016 (0.40) 0.050 (1.27) HCPL-090J, HCPL-091J and HCPL-092J Narrow Body SOIC-16 Package 0.386 (9.802) 0.394 (9.999) 8 Pin 1 indent 1 0.228 (5.791) 0.244 (6.197) 0.152 (3.861) 0.157 (3.988) 0.013 (0.330) 0.020 (0.508) 0.054 (1.372) 0.068 (1.727) 0.010 (0.245) x 45° 0.020 (0.508) 0.008 (0.191) 0.010 (0.249) 0.050 (1.270) 0.060 (1.524) 0° – 8° TYP 0.040 (1.016) 0.060 (1.524) 0.016 (0.406) 0.050 (1.270) 0.004 (0.102) 0.010 (0.249) DIMENSIONS: INCHES (MILLIMETERS) MIN MAX Package Characteristics Parameter Capacitance (Input-Output) Single Channel Dual Channel Quad Channel Symbol [1] Min. Typ. Max. CI-O Units Test Conditions pF f = 1 MHz °C/W Thermocouple located at center underside of package 1.1 2.0 4.0 Thermal Resistance 8-Pin PDIP 8-Pin SOIC θJCT Package Power Dissipation 8-Pin PDIP 8-Pin SOIC PPD 150 240 mW 150 150 Notes: 1. Single and dual channels device are considered two-terminal devices: pins 1-4 shorted and pins 5-8 shorted. Quad channel devices are considered two-terminal devices: pins 1-8 shorted and pins 9-16 shorted. This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, Agilent recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. 6 Insulation and Safety Related Specifications Parameters Condition Min. Typ. Max. Units Ω||pF Barrier Impedance >1014 ||3 >1014 ||3 >1014 ||7 Single Channel Dual Channel Quad Channel Creepage Distance (External) mm 8-Pin PDIP 8-Pin SOIC 16-Pin SOIC Narrow Body 16-Pin SOIC Wide Body Leakage Current 7.036 4.026 4.026 8.077 µA 0.2 240 VRMS 60 Hz Absolute Maximum Ratings Parameters Symbol Min. Max. Units TS –55 175 °C TA –55 125 °C Supply Voltage VDD1, VDD2 –0.5 7 V Input Voltage VIN –0.5 VDD1 +0.5 V Voltage Output Enable (HCPL-9000/-0900) VOE –0.5 VDD2 +0.5 V Output Voltage VOUT –0.5 VDD2 +0.5 V Output Current Drive IOUT 10 mA 260 °C Storage Temperature Ambient Operating Temperature [1] Lead Solder Temperature (10s) ESD 2 kV Human Body Model Notes: 1. Absolute Maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not guarantee performance. Recommended Operating Conditions Parameters Symbol Min. Max. Units Ambient Operating Temperature TA –40 100 °C Supply Voltage VDD1, VDD2 3.0 5.5 V Logic High Input Voltage VIH 2.4 VDD1 V Logic Low Input Voltage VIL 0 0.8 V Input Signal Rise and Fall Times tIR, tIF 1 µs This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, Agilent recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. 7 Electrical Specifications Test conditions that are not specified can be anywhere within the recommended operating range. All typical specifications are at TA=+25°C, VDD1 = VDD2 = +3.3 V. Parameter Symbol Quiescent Supply Current 1 IDD1 Min. HCPL-9000/-0900 HCPL-9030/-0930 HCPL-9031/-0931 HCPL-900J/-090J HCPL-901J/-091J HCPL-902J/-092J Quiescent Supply Current 2 Max. 0.008 0.008 1.5 0.016 3.3 1.5 0.01 0.01 2.0 0.02 4.0 2.0 3.3 3.3 1.5 5.5 3.3 3.0 4.0 4.0 2.0 8.0 4.0 6.0 IDD2 HCPL-9000/-0900 HCPL-9030/-0930 HCPL-9031/-0931 HCPL-900J/-090J HCPL-901J/-091J HCPL-902J/-092J Logic Input Current IIN Logic High Output Voltage VOH -10 VDD2 – 0.1 0.8 * VDD2 Logic Low Output Voltage Typ. VOL 10 VDD2 VDD2 – 0.5 Units Test Conditions mA VIN = 0V mA VIN = 0V µA V IOUT = -20 µA, VIN = VIH V IOUT = -4 mA, VIN = VIH 0 0.1 V IOUT = 20 µA, VIN = VIL 0.5 0.8 V IOUT = 4 mA, VIN = VIL MBd CL = 15 pF Switching Specifications Maximum Data Rate 100 110 Clock Frequency fmax 50 MHz Propagation Delay Time to Logic Low Output tPHL 12 18 ns Propagation Delay Time toLogic High Output tPLH 12 18 ns Pulse Width tPW Pulse Width Distortion [1] |PWD| 2 3 ns Propagation Delay Skew [2] tPSK 4 6 ns Output Rise Time (10 – 90%) tR 2 4 ns Output Fall Time (10 – 90%) tF 2 4 ns 3 5 ns tPLZ 3 5 ns 10 ns |tPHL – tPLH| Propagation Delay Enable to Output (Single Channel) High to High Impedance tPHZ Low to High Impedance High Impedance to High tPZH 3 5 ns High Impedance to Low tPZL 3 5 ns Channel-to-Channel Skew (Dual and Quad Channels) tCSK 2 3 ns Common Mode Transient Immunity (Output Logic High or Logic Low) [3] |CMH| |CML| 15 18 kV/µs Vcm = 1000V Notes: 1. PWD is defined as |tPHL -tPLH|. %PWD is equal to the PWD divided by the pulse width. 2. tPSK is equal to the magnitude of the worst case difference in tPHL and/or tPLH that will be seen between units at 25°C. 3. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining VOUT > 0.8VDD2. CML is the maximum common mode input voltage that can be sustained while maintaining VOUT < 0.8V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, Agilent recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. 8 Electrical Specifications Test conditions that are not specified can be anywhere within the recommended operating range. All typical specifications are at TA=+25°C, VDD1 = VDD2 = +5.0 V. Parameter Symbol Quiescent Supply Current 1 IDD1 Min. HCPL-9000/-0900 HCPL-9030/-0930 HCPL-9031/-0931 HCPL-900J/-090J HCPL-901J/-091J HCPL-902J/-092J Quiescent Supply Current 2 Max. 0.012 0.012 2.5 0.024 5.0 2.5 0.018 0.018 3.0 0.036 6.0 3.0 5.0 5.0 2.5 8.0 5.0 6.0 6.0 6.0 3.0 12.0 6.0 9.0 IDD2 HCPL-9000/-0900 HCPL-9030/-0930 HCPL-9031/-0931 HCPL-900J/-090J HCPL-901J/-091J HCPL-902J/-092J Logic Input Current IIN Logic High Output Voltage VOH -10 VDD2 – 0.1 0.8 * VDD2 Logic Low Output Voltage Typ. VOL 10 VDD2 VDD2 – 0.5 Units Test Conditions mA VIN = 0V mA VIN = 0V µA V IOUT = -20 µA, VIN = VIH V IOUT = -4 mA, VIN = VIH 0 0.1 V IOUT = 20 µA, VIN = VIL 0.5 0.8 V IOUT = 4 mA, VIN = VIL MBd CL = 15 pF Switching Specifications Maximum Data Rate 100 Clock Frequency fmax Propagation Delay Time to Logic Low Output tPHL Propagation Delay Time to Logic High Output tPLH 110 50 MHz 10 15 ns 10 15 ns Pulse Width tPW Pulse Width Distortion [1] |tPHL – tPLH| |PWD| 10 2 3 ns Propagation Delay Skew [2] tPSK 4 6 ns Output Rise Time (10 – 90%) tR 1 3 ns Output Fall Time (10 – 90%) tF 1 3 ns 3 5 ns Propagation Delay Enable to Output (Single Channel) High to High Impedance tPHZ ns Low to High Impedance tPLZ 3 5 ns High Impedance to High tPZH 3 5 ns High Impedance to Low tPZL 3 5 ns Channel-to-Channel Skew (Dual and Quad Channels) tCSK 2 3 ns Common Mode Transient Immunity (Output Logic High or Logic Low) [3] |CMH| |CML| 15 18 kV/µs Vcm = 1000V Notes: 1. PWD is defined as |tPHL -tPLH|. %PWD is equal to the PWD divided by the pulse width. 2. tPSK is equal to the magnitude of the worst case difference in tPHL and/or tPLH that will be seen between units at 25°C. 3. CMH is the maximum common mode voltage slew rate that can be sustained while maintaining VOUT > 0.8VDD2. CML is the maximum common mode input voltage that can be sustained while maintaining VOUT < 0.8V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, Agilent recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. 9 Applications Information Power Consumption The HCPL-90xx and HCPL-09xx CMOS digital isolators achieves low power consumption from the manner by which they transmit data across isolation barrier. By detecting the edge transitions of the input logic signal and converting this to a narrow current pulse, which drives the isolation barrier, the isolator then latches the input logic state in the output latch. Since the current pulses are narrow, about 2.5 ns wide, the power consumption is independent of mark-to-space ratio and solely dependent on frequency. The approximate power supply current per channel is: I(Input) = 40(f/fmax)(1/4) mA where f = operating frequency, fmax = 50 MHz. VDD1 VDD2 C2 NC 3 HCPL-9000 or HCPL-0900 2 GND1 to be connected directly to the inputs and outputs. As shown in Figure 1, the only external components required for proper operation are two 47 nF ceramic capacitors for decoupling the power supplies. For each capacitor, the total lead length between both ends of the capacitor and the power-supply pins should not exceed 20 mm. Figure 2 illustrates the recommended printed circuit board layout for the HCPL-9000 or HCPL-0900. For data rates in excess of 10MBd, use of ground planes for both GND1 and GND2 is highly recommended. Bypassing and PC Board Layout The HCPL-90xx and HCPL-09xx digital isolators are extremely easy to use. No external interface circuitry is required because the isolators use high-speed CMOS IC technology allowing CMOS logic 8 1 C1 IN1 Signal Status on Start-up and Shut Down To minimize power dissipation, the input signals to the channels of HCPL-90xx and HCPL-09xx digital isolators are differentiated and then latched on the output side of the isolation barrier to reconstruct the signal. This could result in an ambiguous output state depending on power up, shutdown and power loss sequencing. Therefore, the designer should consider the inclusion of an initialization signal in this start-up circuit. 4 7 VOE OUT1 6 5 GND2 Note: C1, C2 = 47 nF ceramic capacitors Figure 1. Functional Diagram of Single Channel HCPL-0900 or HCPL-0900. VDD1 VDD2 C1 HCPL-9000 or HCPL-0900 IN1 GND1 Figure 2. Recommended Printed Circuit Board Layout. 10 VOE C2 OUT1 GND2 Propagation Delay, Pulse Width Distortion and Propagation Delay Skew Propagation Delay is a figure of merit, which describes how quickly a logic signal propagates through a system as illustrated in Figure 3. The propagation delay from low to high, tPLH , is the amount of time required for an input signal to propagate to the output, causing the output to change from low to high. Similarly, the propagation delay from high to low, tPHL, is the amount of time required for the input signal to propagate to the output, causing the output to change from high to low. Pulse Width Distortion, PWD, is the difference between tPHL and tPLH and often determines the maximum data rate capability of a transmission system. PWD can be expressed in percent by dividing the PWD (in ns) by the minimum pulse width (in ns) being transmitted. Typically, PWD on the order of 20 – 30% of the minimum pulse width is tolerable. Propagation Delay Skew, tPSK, and Channel-to-Channel Skew, tCSK, are critical parameters to consider in parallel data transmission applications where synchronization of signals on parallel data lines is a concern. 5 V CMOS INPUT VIN 50% 0V tPLH OUTPUT VOUT tPHL 90% 90% 10% 10% VOH 2.5 V CMOS VOL 50% DATA INPUTS VOUT 2.5 V CMOS CLOCK tPSK DATA VIN 50% OUTPUTS tPSK CLOCK tPSK VOUT 2.5 V CMOS Figure 5. Parallel Data Transmission. Figure 4. Timing Diagrams to Illustrate Propagation Delay Skew. 11 tPSK is defined as the difference between the minimum and maximum propagation delays, either tPLH or tPHL, among two or more devices which are operating under the same conditions (i.e., the same drive current, supply voltage, output load, and operating temperature). tCSK is defined as the difference between the minimum and maximum propagation delays, either tPLH or tPHL, among two or more channels within a single device (applicable to dual and quad channel devices) which are operating under the same conditions. As illustrated in Figure 4, if the inputs of two or more devices are switched either ON or OFF at the same time, tPSK is the difference between the minimum propagation delay, either tPLH or tPHL, and the maximum propagation delay, either tPLH or tPHL. Figure 3. Timing Diagrams to Illustrate Propagation Delay, tPLH and tPHL. VIN If the parallel data is being sent through channels of the digital isolators, differences in propagation delays will cause the data to arrive at the outputs of the digital isolators at different times. If this difference in propagation delay is large enough, it will limit the maximum transmission rate at which parallel data can be sent through the digital isolators. As mentioned earlier, tPSK, can determine the maximum parallel data transmission rate. Figure 5 shows the timing diagram of a typical parallel data transmission application with both the clock and data lines being sent through the digital isolators. The figure shows data and clock signals at the inputs and outputs of the digital isolators. In this case, the data is clocked off the rising edge of the clock. Propagation delay skew represents the uncertainty of where an edge might be after being sent through a digital isolator. Figure 5 shows that there will be uncertainty in both the data and clock lines. It is important that these two areas of uncertainty not overlap, otherwise the clock signal might arrive before all of the data outputs have settled, or some of the data outputs may start to change before the clock signal has arrived. From these considerations, the absolute minimum pulse width that can be sent through digital isolators in a parallel application is twice tPSK. A cautious design should use a slightly longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem. Figure 6 shows the minimum pulse width, rise and fall time, and propagation delay enable to output waveforms for HCPL-9000 or HCPL-0900. 50% VIN 90% tPZL 90% tPLZ 50% VOUT tPZH 10% tPW tPHZ 10% tF tR VOE tPW tPLZ tPZH Minimum Pulse Width Propagation Delay, Low to High Impedance Propagation Delay, High Impedance to High tPHZ tPZL tR tF Propagation Delay, High to High Impedance Propagation Delay, High Impedance to Low Rise Time Fall Time Figure 6. Timing Diagrams to Illustrate the Minimum Pulse Width, Rise and Fall Time, and Propagation Delay Enable to Output Waveforms for HCPL-9000 or HCPL-0900. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. October 31, 2002 5988-5626EN