Material Content Data Sheet Sales Product Name BTM7750G Issued MA# MA001364448 Package PG-DSO-28-22 27. July 2015 Weight* 810.45 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper aluminium carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 11.033 1.36 0.072 0.01 0.288 0.04 355 5.754 0.71 7100 233.637 28.83 29.59 288282 295826 1.651 0.20 0.20 2037 2037 1.098 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.36 13614 13614 89 1355 78.542 9.69 469.602 57.94 67.77 579436 677702 4.975 0.61 0.61 6138 6138 0.678 0.08 0.08 836 836 0.546 0.07 2.573 0.32 96911 673 0.39 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3174 3847 1000000