ON NSR20F20NXT5G Schottky barrier diode Datasheet

NSR20F20
Schottky Barrier Diode
These Schottky barrier diodes are optimized for low forward
voltage drop and low leakage current and are offered in a Chip Scale
Package (CSP) to reduce board space. The low thermal resistance
enables designers to meet the challenging task of achieving higher
efficiency and meeting reduced space requirements.
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Features
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Low Forward Voltage Drop − 450 mV @ 2.0 A
Low Reverse Current − 30 mA @ 10 V VR
2.0 A of Continuous Forward Current
Power Dissipation of 665 mW with Minimum Trace
ESD Rating − Human Body Model: Class 3B
ESD Rating − Machine Model: Class C
High Switching Speed
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
20 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
MARKING
DIAGRAM
PIN 1
Typical Applications
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1
20F20
YYY
DSN2
(0603)
CASE 152AB
LCD and Keypad Backlighting
Camera Photo Flash
Buck and Boost dc−dc Converters
Reverse Voltage and Current Protection
Clamping & Protection
20F20
YYY
= Specific Device Code
= Year Code
Markets
•
•
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ORDERING INFORMATION
Mobile Handsets
MP3 Players
Digital Camera and Camcorders
Notebook PCs & PDAs
GPS
Device
NSR20F20NXT5G
Symbol
Value
Unit
Reverse Voltage
VR
20
V
Forward Current (DC)
IF
2.0
A
Forward Surge Current (60 Hz @ 1 cycle)
IFSM
28
A
Repetitive Peak Forward Current
(Pulse Wave = 1 sec, Duty Cycle = 66%)
IFRM
4.0
A
ESD Rating:
ESD
>8
> 400
kV
V
Human Body Model
Machine Model
Shipping†
DSN2
5000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
Package
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
© Semiconductor Components Industries, LLC, 2016
April, 2016 − Rev. 3
1
Publication Order Number:
NSR20F20/D
NSR20F20
THERMAL CHARACTERISTICS
Characteristic
Max
Unit
RqJA
PD
213
586
°C/W
mW
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ TA = 25°C
RqJA
PD
80
1.56
°C/W
W
Storage Temperature Range
Tstg
−40 to +125
°C
Junction Temperature
TJ
+150
°C
Max
Unit
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ TA = 25°C
Symbol
Min
Typ
1. Mounted onto a 4 in square FR−4 board 50 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Characteristic
Reverse Leakage
(VR = 10 V)
(VR = 20 V)
IR
Forward Voltage
(IF = 1.0 A)
(IF = 2.0 A)
VF
Reverse Recovery Time
(IF = IR = 10 mA, IR(REC) = 1.0 mA, Figure 4)
trr
Min
Typ
mA
30
150
V
0.390
0.450
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2
80
0.420
0.470
ns
NSR20F20
100,000
IR, REVERSE CURRENT (mA)
IF, FORWARD CURRENT (A)
10
150°C
10,000
TJ = 125°C
1
0.1
TJ = 150°C
75°C
0.01
25°C
100
75°C
10
25°C
1
0.1
0.01
−25°C
0.001
0
125°C
1,000
−25°C
0.001
0.05 0.1
0.15 0.2
0.25 0.3
0.35 0.4
0.45 0.5
0
4
8
12
16
VF, FORWARD VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 1. Forward Voltage
Figure 2. Typical Reverse Current
20
500
C, CAPACITANCE (pF)
TA = 25°C
400
300
200
100
0
0
4
8
12
16
20
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Capacitance
820 W
+10 V
2.0 k
100 mH
tr
0.1 mF
IF
tp
t
IF
trr
10%
t
0.1 mF
90%
D.U.T.
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
iR(REC) = 1.0 mA
IR
VR
INPUT SIGNAL
OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 4. Recovery Time Equivalent Test Circuit
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3
NSR20F20
PACKAGE DIMENSIONS
DSN2, 1.6x0.8, 0.9P, (0603)
CASE 152AB
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
0.05 C
A B
D
DIM
A
A1
b
D
E
L
L2
L3
E
0.05 C
TOP VIEW
0.05 C
MILLIMETERS
MIN
MAX
0.25
0.31
−−−
0.05
0.55
0.65
1.60 BSC
0.80 BSC
1.45
1.55
0.90
1.00
0.25
0.35
A
0.05 C
CATHODE BAND MONTH CODING
A1
C
SEATING
PLANE
DEC
SIDE VIEW
NOV OCT
SEP
0.05 C A B
XXXX
YYY
JUN
L
L/2
MAR
FEB
JAN
b
1
DEVICE CODE
YEAR CODE
0.05 C A B
XXXX
Y09
L2
L3
BOTTOM VIEW
(EXAMPLE)
MOUNTING FOOTPRINT*
INDICATES AUG 2009
1.70
0.52
0.80
PIN 1
0.70
1.05
DIMENSIONS: MILLIMETERS
See Application Note AND8464/D for more mounting details
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NSR20F20/D
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