NCV8752 200 mA, Ultra-Low Quiescent Current, IQ 12 mA, Ultra-Low Noise, Low Dropout Regulator Noise sensitive RF applications such as Power Amplifiers in satellite radios, infotainment equipment, and precision instrumentation require very clean power supplies. The NCV8752 is 200 mA LDO that provides the engineer with a very stable, accurate voltage with ultra low noise and very high Power Supply Rejection Ratio (PSRR) suitable for RF applications. The device doesn’t require any additional noise bypass capacitor to achieve ultra low noise performance. In order to optimize performance for battery operated portable applications, the NCV8752 employs the Auto Low−Power Function for Ultra Low Quiescent Current consumption. http://onsemi.com XDFN6 CASE 711AE MARKING DIAGRAMS 1 Features • Operating Input Voltage Range: 2.0 V to 5.5 V • Available in Fixed Voltage Options: 0.8 to 3.5 V • • • • • • • • • • • • • 5 XXXAYWG G 1 TSOP−5 XXX A M Y W G PIN CONNECTIONS IN 1 EN 3 VIN PG GND 100k OUT COUT 1 mF VPG April, 2013 − Rev. 0 IN PG N/C GND EN XDFN6 (Top view) ORDERING INFORMATION Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2013 4 PG 1 OUT NCV8752 OUT TSOP−5 VOUT IN OFF 5 GND 2 • Satellite Radio Receivers, GPS • Rear View Camera, Electronic Mirrors, Lane Change Detectors • Portable Entertainment Systems ON = Specific Device Code = Assembly Location = Date Code = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) Typical Applications EN X MG G XDFN6 Contact Factory for Other Voltage Options Ultra Low Quiescent Current of Typ. 12 mA Ultra Low Noise: 11.5 mVRMS from 100 Hz to 100 kHz Very Low Dropout: 130 mV Typical at 200 mA ±2% Accuracy Over Load/Line/Temperature High PSRR: 68 dB at 1 kHz Power Good Output Internal Soft−Start to Limit the Inrush Current Thermal Shutdown and Current Limit Protections Stable with a 1 mF Ceramic Output Capacitor Available in TSOP−5 and XDFN 1.5 x 1.5 mm Package Active Output Discharge for Fast Turn−Off NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These are Pb−Free Devices CIN TSOP−5 CASE 483 See detailed ordering and shipping information in the package dimensions section on page 19 of this data sheet. 1 Publication Order Number: NCV8752/D NCV8752 IN ENABLE LOGIC EN BANDGAP REFERENCE UVLO 0.8 V − THERMAL SHUTDOWN MOSFET DRIVER WITH CURRENT LIMIT + OUT AUTO LOW POWER MODE PG − + ACTIVE DISCHARGE EN DELAY GND Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. XDFN 6 Pin No. TSOP−5 Pin Name Description 1 5 OUT Regulated output voltage pin. A small 1 mF ceramic capacitor is needed from this pin to ground to assure stability. 2 4 PG 3 2 GND 4 3 EN Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. N/C Not connected. This pin can be tied to ground to improve thermal dissipation. 5 6 1 IN Open Drain Power Good Output. Power supply ground. Connected to the die through the lead frame. Soldered to the copper plane allows for effective heat dissipation. Input pin. A small capacitor is needed from this pin to ground to assure stability. http://onsemi.com 2 NCV8752 ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN −0.3 V to 6 V V Output Voltage VOUT −0.3 V to VIN + 0.3 V V Enable Input VEN −0.3 V to VIN + 0.3 V V Power Good Output VPG −0.3 V to VIN + 0.3 V V Output Short Circuit Duration tSC Indefinite s TJ(MAX) 125 °C TSTG −55 to 125 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Input Voltage (Note 1) Maximum Junction Temperature Storage Temperature Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114), ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115), Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS (Note 3) Rating Symbol Value Unit Thermal Characteristics, TSOP−5, Thermal Resistance, Junction−to−Air RqJA 224 °C/W Thermal Characteristics, XDFN6 1.5x1.5mm Thermal Resistance, Junction−to−Air RqJA 149 °C/W 3. Single component mounted on 1 oz FR 4 PCB with 645 mm2 cu area. http://onsemi.com 3 NCV8752 ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 125 °C; VIN = VOUT(NOM) + 0.3 V or 2.0 V, whichever is greater; IOUT = 10 mA, CIN = COUT = 1 mF, unless otherwise noted. Typical values are at TJ = +25°C (Note 4) Symbol Min VIN 2.0 VIN rising UVLO 1.2 VOUT + 0.3 V ≤ VIN ≤ 5.5 V, IOUT = 0 − 200 mA VOUT −2 Line Regulation VOUT + 0.3 V ≤ VIN ≤ 5.5 V, IOUT = 10 mA RegLINE 300 mV/V Load Regulation IOUT = 0 mA to 200 mA RegLOAD 20 mV/mA IOUT = 1 mA to 200 mA or 200 mA to 1 mA in 1 ms, COUT = 1 ms TranLOAD ±90 mV IOUT = 200 mA, VOUT(nom) = 2.5 V VDO 130 200 mV VOUT = 90% VOUT(nom) ICL 400 550 mA IOUT = 0 mA IQ 12 25 mA IOUT = 200 mA IGND 150 mA VEN ≤ 0.4 V, TJ = +25°C IDIS 0.12 mA Parameter Test Conditions Operating Input Voltage Undervoltage lock−out Output Voltage Accuracy Load Transient Dropout voltage (Note 5) Output Current Limit Quiescent current Ground current Shutdown current EN Pin Threshold Voltage High Threshold Low Threshold EN Pin Input Current Turn−on Time 210 VEN ≤ 0 V, VIN = 5.5 V Typ 1.5 0.55 Max Unit 5.5 V 1.9 V +2 % 1 mA V VEN Voltage increasing VEN Voltage decreasing VEN_HI VEN_LO VEN = 5.5 V IEN 100 COUT = 1.0 mF, IOUT = 0 mA to 200 mA From VOUT = 10% VOUT(NOM) to 95% VOUT(NOM) tON1 80 ms COUT = 1.0 mF, IOUT = 0 mA to 200 mA From assertion of the EN to 95% VOUT(NOM) tON2 200 ms PSRR 70 68 53 dB 0.4 500 nA Power Supply Rejection Ratio VIN = 3 V, VOUT = 2.5 V IOUT = 150 mA Output Noise Voltage VOUT = 2.5 V, VIN = 3 V, IOUT = 200 mA f = 100 Hz to 100 kHz VN 11.5 mVrms Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C Temperature falling from TSD TSDH − 20 − °C VOUT decreasing VPG− 90 92 94 %VOUT VOUT increasing VPG+ 92 94 96 %VOUT Thermal Shutdown Hysteresis f = 100 Hz f = 1 kHz f = 10 kHz 0.9 POWER GOOD OUTPUT PG Threshold Voltage PG Threshold Voltage Hysteresis PG Output Low Voltage PG Pin Leakage Measured on VOUT 2 %VOUT IOUT(PG) = 1 mA 0.1 0.4 V VIN = VOUT(NOM) + 0.3 V 0.002 1 mA PG time−out delay NCV8752A NCV8752B tRD 2 200 ms PG reaction time NCV8752A NCV8752B tRR 2 5 ms 4. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.3 V. http://onsemi.com 4 NCV8752 VIN = 2 V VOUT = 0.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms 50 mV/div VIN = 2 V VOUT = 0.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VOUT = 0.8 V 100 mA/div 30 mA/div 50 mV/div TYPICAL CHARACTERISTICS IOUT = 30 mA IOUT = 1 mA VOUT = 0.8 V IOUT = 100 mA IOUT = 1 mA 50 ms/div 20 ms/div Figure 3. Load Transient Response, 1 mA − 30 mA NCV8752A/B, VOUT = 0.8 V Figure 4. Load Transient Response, 1 mA − 100 mA NCV8752A/B, VOUT = 0.8 V 100 mV/div 50 mV/div VIN = 2 V VOUT = 0.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VOUT = 0.8 V VIN = 2 V VOUT = 0.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VOUT = 0.8 V 200 mA/div IOUT = 10 mA IOUT = 1 mA 20 ms/div 50 ms/div Figure 5. Load Transient Response, 10 mA − 110 mA NCV8752A/B, VOUT = 0.8 V Figure 6. Load Transient Response, 1 mA − 200 mA NCV8752A/B, VOUT = 0.8 V VIN = 2 V VOUT = 0.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms 50 mV/div 100 mV/div 100 mA/div IOUT = 200 mA IOUT = 110 mA VOUT = 0.8 V VIN = 2 V VOUT = 0.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VOUT = 0.8 V IOUT = 200 mA 200 mA/div 200 mA/div IOUT = 210 mA IOUT = 10 mA IOUT = 1 mA 20 ms/div 50 ms/div Figure 7. Load Transient Response, 10 mA − 210 mA NCV8752A/B, VOUT = 0.8 V Figure 8. Load Transient Response, 1 mA − 100 mA NCV8752A/B, VOUT = 0.8 V http://onsemi.com 5 NCV8752 VIN = 2.3 V VOUT = 1.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms 50 mV/div VIN = 2.3 V VOUT = 1.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms 100 mA/div VOUT = 1.8 V IOUT = 30 mA 30 mA/div 50 mV/div TYPICAL CHARACTERISTICS IOUT = 1 mA VOUT = 1.8 V IOUT = 100 mA IOUT = 1 mA 20 ms/div 20 ms/div Figure 9. Load Transient Response, 1 mA − 30 mA NCV8752A/B, VOUT = 1.8 V 100 mV/div VIN = 2.3 V VOUT = 1.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms 50 mV/div VOUT = 1.8 V IOUT = 110 mA VIN = 2.3 V VOUT = 1.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VOUT = 1.8 V IOUT = 200 mA 200 mA/div 100 mA/div Figure 10. Load Transient Response, 1 mA − 100 mA NCV8752A/B, VOUT = 1.8 V IOUT = 10 mA IOUT = 1 mA 20 ms/div 20 ms/div Figure 12. Load Transient Response, 1 mA − 200 mA NCV8752A/B, VOUT = 1.8 V VIN = 2.3 V VOUT = 1.8 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VIN = 2.3 V VOUT = 1.8 V CIN = COUT = 1 mF tRISE = tFALL = 10 ms 50 V/div 100 mV/div Figure 11. Load Transient Response, 1 mA − 30 mA NCV8752A/B, VOUT = 1.8 V VOUT = 1.8 V VOUT = 1.8 V IOUT = 200 mA 200 mA/div 200 mA/div IOUT = 210 mA IOUT = 10 mA IOUT = 1 mA 100 ms/div 20 ms/div Figure 13. Load Transient Response, 10 mA − 210 mA NCV8752A/B, VOUT = 1.8 V Figure 14. Load Transient Response, 1 mA − 200 mA NCV8752A/B, VOUT = 1.8 V http://onsemi.com 6 NCV8752 TYPICAL CHARACTERISTICS VIN = 3.8 V VOUT = 3.3 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms 50 mV/div VOUT = 3.3 V IOUT = 30 mA 100 mA/div 30 mA/div 50 mV/div VIN = 3.8 V VOUT = 3.3 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms IOUT = 1 mA VOUT = 3.3 V IOUT = 100 mA IOUT = 1 mA 100 ms/div 20 ms/div Figure 15. Load Transient Response, 1 mA − 30 mA NCV8752A/B, VOUT = 3.3 V Figure 16. Load Transient Response, 1 mA − 100 mA NCV8752A/B, VOUT = 3.3 V 100 mV/div 50 mV/div VIN = 3.8 V VOUT = 3.3 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VOUT = 3.3 V VIN = 3.8 V VOUT = 3.3 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VOUT = 3.3 V 200 mA/div 100 mA/div IOUT = 200 mA IOUT = 110 mA IOUT = 10 mA IOUT = 1 mA 20 ms/div 20 ms/div Figure 17. Load Transient Response, 10 mA − 110 mA NCV8752A/B, VOUT = 3.3 V Figure 18. Load Transient Response, 1 mA − 200 mA NCV8752A/B, VOUT = 3.3 V IOUT = 10 mA VIN = 3.8 V VOUT = 3.3 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms 50 mV/div 100 mV/div VOUT = 3.3 V 200 mA/div VIN = 3.8 V VOUT = 3.3 V CIN = COUT = 1 mF tRISE = tFALL = 1 ms VOUT = 3.3 V IOUT = 200 mA 200 mA/div IOUT = 200 mA IOUT = 1 mA 20 ms/div 100 ms/div Figure 19. Load Transient Response, 10 mA − 200 mA NCV8752A/B, VOUT = 3.3 V Figure 20. Load Transient Response, 1 mA − 200 mA NCV8752A/B, VOUT = 3.3 V http://onsemi.com 7 NCV8752 IOUT = 1 mA VOUT = 0 V VPG = 0 V IOUT = 1 mA 100 ms/div 100 ms/div VPG = 1.8 V VOUT = 0 V VPG = 0 V IOUT = 1 mA VEN = 0 V VIN = 2.3 V CIN = COUT = 1 mF VOUT = 1.8 V VOUT = 0 V VPG = 0 V VPG = 1.8 V IOUT = 1 mA 100 ms/div 100 ms/div VOUT = 3.3 V VIN = 2.3 V CIN = COUT = 1 mF VPG = 3.3 V 1 V/div VEN = 1.2 V Figure 24. Turn−On Response After Asserting EN NCV8752B, VOUT = 1.8 V 100 mA/div 2 V/div 1 V/div 1 V/div 1 V/div Figure 23. Turn−On Response After Asserting EN NCV8752A, VOUT = 1.8 V VEN = 0 V VEN = 1.2 V VOUT = 0 V VPG = 0 V IOUT = 1 mA 2 V/div VOUT = 1.8 V VIN = 2.3 V CIN = COUT = 1 mF 1 V/div VEN = 1.2 V Figure 22. Turn−On Response After Asserting EN NCV8752B, VOUT = 0.8 V 100 mA/div 1 V/div 500 mV/div 500 mV/div 1 V/div Figure 21. Turn−On Response After Asserting EN NCV8752A, VOUT = 0.8 V VEN = 0 V VIN = 2 V CIN = COUT = 1 mF 400 mV/div VIN = 2 V CIN = COUT = 1 mF 100 mA/div VOUT = 0 V VPG = 0 V VPG = 0.8 V VEN = 0 V VEN = 1.2 V VIN = 3.8 V CIN = COUT = 1 mF VOUT = 3.3 V VPG = 3.3 V VOUT = 0 V VPG = 0 V IOUT = 1 mA 100 ms/div 2 V/div 200 mA/div VPG = 0.8 V VOUT = 0.8 V VEN = 0 V 100 mA/div VOUT = 0.8 V VEN = 1.2 V 100 mA/div VEN = 0 V 1 V/div VEN = 1.2 V 100 mA/div 400 mV/div 200 mA/div 1 V/div TYPICAL CHARACTERISTICS 200 ms/div Figure 25. Turn−On Response After Asserting EN NCV8752A, VOUT = 3.3 V Figure 26. Turn−On Response After Asserting EN NCV8752B, VOUT = 3.3 V http://onsemi.com 8 NCV8752 TYPICAL CHARACTERISTICS VPG = 0.8 V VOUT = 0 V VPG = 0 V VIN = 2.0 V CIN = COUT = 1 mF VEN = 0 V VOUT = 1.8 V VPG = 1.8 V VIN = 2.3 V CIN = COUT = 1 mF Figure 28. Turn−Off Response After De−asserting EN NCV8752A/B, VOUT = 1.8 V VOUT = 3.3 V VEN = 0 V VPG = 3.3 V VOUT = 0 V VPG = 0 V 400 mV/div 200 mV/div Figure 27. Turn−Off Response After De−asserting EN NCV8752A/B, VOUT = 0.8 V 1 V/div 500 ms/div 2 V/div 1 V/div 500 ms/div VEN = 1.2 V VPG = 0.8 V VOUT = 0 V VPG = 0 V 500 ms/div Thermal Shutdown 500 ms/div VOUT = 1.8 V VPG = 1.8 V VOUT = 0 V VPG = 0 V 2 V/div VIN = 2.3 V CIN = COUT = 1 mF Figure 30. Turn−Off Response Due to Thermal Shutdown NCV8752A/B, VOUT = 0.8 V 1 V/div Figure 29. Turn−Off Response After De−asserting EN NCV8752A/B, VOUT = 3.3 V Normal Operation VIN = 2.0 V CIN = COUT = 1 mF VOUT = 0.8 V Normal Operation VIN = 3.8 V CIN = COUT = 1 mF 1 V/div 500 mV/div VOUT = 0 V VPG = 0 V VOUT = 3.3 V VPG = 3.3 V Normal Operation Thermal Shutdown VIN = 3.8 V CIN = COUT = 1 mF 500 ms/div VOUT = 0 V VPG = 0 V Thermal Shutdown 500 ms/div Figure 31. Turn−Off Response Due to Thermal Shutdown, VOUT = 1.8 V Figure 32. Turn−Off Response Due to Thermal Shutdown, VOUT = 3.3 V http://onsemi.com 9 1 V/div VOUT = 0.8 V 1 V/div 500 mV/div VEN = 1.2 V VEN = 0 V 2 V/div 400 mV/div 200 mV/div VEN = 1.2 V NCV8752 VIN = 2.0 V CIN = COUT = 1 mF IOUT = 1 mA VPG = 0.8 V VIN = 2.0 V CIN = COUT = 1 mF IOUT = 1 mA 500 ms/div 500 ms/div Normal Operation VOUT = 1.8 V VPG = 1.8 V VOUT = 0 V VPG = 0 V IOUT = 1 mA 500 ms/div VIN = 2.3 V CIN = COUT = 1 mF 100 mA/div VIN = 2.3 V CIN = COUT = 1 mF IOUT = 1 mA 500 ms/div Figure 35. Recovery from Thermal Shutdown NCV8752A, VOUT = 1.8 V VOUT = 3.3 V VPG = 3.3 V VOUT = 0 V VPG = 0 V Thermal Shutdown 2 V/div 1 V/div Normal Operation Figure 36. Recovery from Thermal Shutdown NCV8752B, VOUT = 1.8 V VOUT = 3.3 V VPG = 3.3 V VOUT = 0 V VPG = 0 V VIN = 3.8 V CIN = COUT = 1 mF IOUT = 1 mA Normal Operation VIN = 3.8 V CIN = COUT = 1 mF 100 mA/div Thermal Shutdown 1 V/div 500 mV/div VPG = 1.8 V VOUT = 0 V VPG = 0 V Thermal Shutdown 100 mA/div VOUT = 1.8 V IOUT = 1 mA 500 ms/div 500 ms/div Figure 37. Recovery from Thermal Shutdown NCV8752A, VOUT = 3.3 V Figure 38. Recovery from Thermal Shutdown NCV8752B, VOUT = 3.3 V http://onsemi.com 10 2 V/div 1 V/div Normal Operation Figure 34. Recovery from Thermal Shutdown NCV8752B, VOUT = 0.8 V 1 V/div 500 mV/div Figure 33. Recovery from Thermal Shutdown NCV8752A, VOUT = 0.8 V Thermal Shutdown VOUT = 0.8 V 100 mA/div VOUT = 0 V VPG = 0 V Normal Operation 400 mV/div 200 mV/div VPG = 0.8 V Thermal Shutdown 100 mA/div Normal Operation VOUT = 0.8 V 100 mA/div Thermal Shutdown 400 mV/div 200 mV/div TYPICAL CHARACTERISTICS NCV8752 TYPICAL CHARACTERISTICS 100 mA/div VIN = VEN = 2.0 V 1 V/div 500 mV/div 1 V/div500 mV/div VIN = VEN = 2.0 V VOUT = 0.8 V VPG = 0.8 V VOUT = 0 V VPG = 0 V VIN = VEN = 0 V VOUT = 0.8 V VPG = 0.8 V IOUT = 1 mA 2 ms/div 500 ms/div Figure 40. Input Voltage Turn−off Response NCV8752B, VOUT = 0.8 V 1 V/div 500 mV/div Figure 39. Input Voltage Turn−on Response NCV8752B, VOUT = 0.8 V 100 mA/div 1 V/div500 mV/div VIN = VEN = 2.3 V VOUT = 1.8 V VPG = 1.8 V VOUT = 0 V VPG = 0 V VIN = VEN = 0 V VIN = VEN = 2.3 V VOUT = 1.8 V IOUT = 1 mA 500 ms/div Figure 41. Input Voltage Turn−on Response NCV8752B, VOUT = 1.8 V Figure 42. Input Voltage Turn−off Response NCV8752B, VOUT = 1.8 V 2 V/div 1 V/div VIN = VEN = 2.3 V 2 V/div 1 V/div VOUT = 0 V VPG = 0 V VIN = VEN = 0 V VPG = 1.8 V 500 ms/div 100 mA/div VOUT = 0 V VPG = 0 V VIN = VEN = 0 V VOUT = 1.8 V VPG = 1.8 V VIN = VEN = 3.8 V VOUT = 3.3 V VOUT = 0 V VPG = 0 V VIN = VEN = 0 V VPG = 3.3 V VOUT = 0 V VPG = 0 V VIN = VEN = 0 V 1 ms/div 500 ms/div Figure 43. Input Voltage Turn−on Response NCV8752B, VOUT = 3.3 V Figure 44. Input Voltage Turn−off Response NCV8752B, VOUT = 3.3 V http://onsemi.com 11 NCV8752 VOUT = 0 V VPG = 0 V VIN = 0 V VEN = 0 V VOUT = 2.0 V VPG = 0.8 V VIN = VEN = 2.0 V VOUT = 2.0 V VPG = 0.8 V VOUT = 0 V VPG = 0 V VIN = 0 V VEN = 0 V IOUT = 1 mA 500 ms/div 500 ms/div VOUT = 3.3 V 100 mA/div VPG = 3.8 V 2 V/div 1 V/div VIN = VEN = 3.8 V VOUT = 0 V VPG = 0 V VIN = 0 V VEN = 0 V Figure 46. Input Voltage Turn−off Response NCV8752B, VOUT = 0.8 V 2 V/div 1 V/div Figure 45. Input Voltage Turn−on Response NCV8752B, VOUT = 0.8 V VIN = VEN = 3.8 V VOUT = 3.3 V VPG = 3.8 V VOUT = 0 V VPG = 0 V VIN = 0 V VEN = 0 V IOUT = 1 mA 500 ms/div 500 ms/div 2 V/div 1 V/div Figure 47. Input Voltage Turn−on Response NCV8752B, VOUT = 3.3 V Figure 48. Input Voltage Turn−off Response NCV8752B, VOUT = 3.3 V Short−Circuit removed from the output VOUT = 3.3 V VPG = 3.8 V VOUT pulled to ground due to output short−circuit VOUT = 0 V VPG = 0 V VPG = 3.8 V VPG = 0 V 200 mA/div 200 mA/div VOUT = 0 V IOUT = 360 mA VOUT = 3.3 V VIN = 3.8 V ISC = 360 mA 500 ms/div IOUT = 1 mA 500 ms/div Figure 49. Short−Circuit Response NCV8752B, VOUT = 3.3 V Figure 50. Recovery from Short−Circuit NCV8752B, VOUT = 3.3 V http://onsemi.com 12 2 V/div 1 V/div 100 mA/div 500 mV/div VIN = VEN = 2.0 V 500 mV/div 1 V/div 1 V/div 500 mV/div TYPICAL CHARACTERISTICS NCV8752 TYPICAL CHARACTERISTICS IOUT = 10 mA VIN = 3.0 V VIN = 2.5 V 20 mV/div 500 mV/div 20 mV/div 500 mV/div IOUT = 10 mA VIN = 2.0 V VOUT = 0.8 V COUT = 1 mF tRISE = tFALL = 1 ms VIN = 2.0 V VOUT = 0.8 V COUT = 1 mF tRISE = tFALL = 1 ms 200 ms/div 200 ms/div Figure 51. Line Transient 2 V − 2.5 V NCV8752A/B, VOUT = 0.8 V Figure 52. Line Transient 2 V − 3 V NCV8752A/B, VOUT = 0.8 V IOUT = 10 mA 1 V/div VIN = 3.3 V VIN = 2.8 V VIN = 2.3 V 20 mV/div 20 mV/div 500 mV/div IOUT = 10 mA VOUT = 1.8 V COUT = 1 mF tRISE = tFALL = 1 ms VIN = 2.3 V VOUT = 1.8 V COUT = 1 mF tRISE = tFALL = 1 ms 200 ms/div 200 ms/div Figure 53. Line Transient 2.3 V − 2.8 V NCV8752A/B, VOUT = 1.8 V Figure 54. Line Transient 2.3 V − 3.3 V NCV8752A/B, VOUT = 1.8 V IOUT = 10 mA 20 mV/div 500 mV/div VIN = 4.2 V 20 mV/div 500 mV/div IOUT = 10 mA VIN = 4.8 V VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF tRISE = tFALL = 1 ms VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF tRISE = tFALL = 1 ms 200 ms/div 200 ms/div Figure 55. Line Transient 3.8 V − 4.2 V NCV8752A/B, VOUT = 3.3 V Figure 56. Line Transient 3.8 V − 4.8 V NCV8752A/B, VOUT = 3.3 V http://onsemi.com 13 NCV8752 TYPICAL CHARACTERISTICS 0.810 1.820 VIN = 2 V COUT = COUT = 1 mF IOUT = 10 mA 0.806 1.810 0.804 1.805 0.802 0.800 1.800 0.798 1.795 0.796 1.790 0.794 1.785 0.792 0.790 −40 −20 0 20 40 60 80 100 120 140 1.780 −40 VDO, DROPOUT VOLTAGE (mV) VOUT, OUTPUT VOLTAGE (V) 3.300 3.295 3.290 3.285 −20 0 20 40 60 80 100 120 140 60 80 100 120 140 VOUT = 1.8 V COUT = COUT = 1 mF 0.35 0.3 0.25 TJ = 125°C 0.2 TJ = 25°C 0.15 0.1 TJ = −40°C 0.05 0 0 20 40 60 80 100 120 140 160 180 200 TJ, JUNCTION TEMPERATURE (°C) IOUT, OUTPUT CURRENT (mA) Figure 59. Output Voltage vs. Temperature VOUT = 3.3 V Figure 60. Dropout Voltage vs. Load Current VOUT = 1.8 V 50 0.2 VOUT = 3.3 V COUT = COUT = 1 mF 0.18 IQ, QUIESCENT CURRENT (mA) VDO, DROPOUT VOLTAGE (mV) 40 Figure 58. Output Voltage vs. Temperature VOUT = 1.8 V 3.305 3.280 −40 20 Figure 57. Output Voltage vs. Temperature VOUT = 0.8 V VIN = 3.8 V COUT = COUT = 1 mF IOUT = 10 mA 3.310 0 TJ, JUNCTION TEMPERATURE (°C) 0.4 3.315 −20 TJ, JUNCTION TEMPERATURE (°C) 3.320 0.16 0.14 TJ = 125°C 0.12 TJ = 25°C 0.1 0.08 TJ = −40°C 0.06 0.02 0 VIN = 2.3 V COUT = COUT = 1 mF IOUT = 10 mA 1.815 VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) 0.808 0 20 40 60 80 100 120 140 160 180 200 45 TJ = 125°C 40 35 TJ = 25°C 30 25 TJ = −40°C 20 15 10 VOUT = 0.8 V COUT = COUT = 1 mF 5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 IOUT, OUTPUT CURRENT (mA) VIN, INPUT VOLTAGE (V) Figure 61. Dropout Voltage vs. Load Current VOUT = 3.3 V Figure 62. Quiescent Current vs. Input Voltage VOUT = 0.8 V http://onsemi.com 14 5.5 NCV8752 TYPICAL CHARACTERISTICS 50 TJ = 125°C 40 35 TJ = 25°C 30 25 TJ = −40°C 20 15 10 VOUT = 1.8 V COUT = COUT = 1 mF 5 0 5 VLINE_REG, LINE REGULATION (mV) IQ, QUIESCENT CURRENT (mA) 45 4.5 4 3.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 25 TJ = −40°C 20 15 10 VOUT = 3.3 V COUT = COUT = 1 mF 5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Figure 64. Quiescent Current vs. Input Voltage VOUT = 3.3 V 10 VIN = VOUT + 0.5 V or 2 V Up to 5.5 V COUT = COUT = 1 mF IOUT = 10 mA VOUT = 3.3 V 1.5 VOUT = 0.8 V 1 0.5 0 −40 −20 0 20 40 60 80 100 120 VIN = VOUT + 0.5 V COUT = COUT = 1 mF IOUT = 0 mA − 200 mA 9 8 7 6 5 4 VOUT = 3.3 V 3 2 VOUT = 0.8 V 1 0 −40 140 −20 0 20 40 80 100 120 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 66. Load Regulation vs. Temperature 450 VEN, ENABLE THRESHOLD (V) 1 VOUT = 3.3 V VOUT = 1.8 V VOUT = 0.8 V 350 VIN = VOUT + 0.5 V or 2 V COUT = COUT = 1 mF VOUT = GND 200 −40 60 Figure 65. Line Regulation vs. Temperature 500 ISC, SHORT−CIRCUIT (mA) TJ = 25°C 30 Figure 63. Quiescent Current vs. Input Voltage VOUT = 1.8 V 2 250 35 VIN, INPUT VOLTAGE (V) 2.5 300 TJ = 125°C 40 VIN, INPUT VOLTAGE (V) 3 400 45 0 5.5 VLOAD_REG, LOAD REGULATION (mV) IQ, QUIESCENT CURRENT (mA) 50 −20 0 20 40 60 80 100 120 VIN = VOUT + 0.5 V or 2 V COUT = COUT = 1 mF VOUT = GND 0.9 0.8 VEN Increasing 0.7 0.6 VEN Decreasing 0.5 0.4 0.3 −40 140 −20 0 20 40 60 80 100 120 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 67. Short−Circuit vs. Temperature Figure 68. Enable Threshold vs. Temperature http://onsemi.com 15 140 140 NCV8752 TYPICAL CHARACTERISTICS 1 VIN = VEN COUT = COUT = 1 mF VOUT = GND 1.8 1.7 1.6 VIN Increasing 1.5 1.4 VIN Decreasing 1.3 1.2 1.1 1 −40 −20 0 20 40 60 80 100 120 0.3 0.2 0.1 0 −40 −20 0 20 40 VOUT = 0.8 V 200 VOUT = 3.3 V 180 VIN = VOUT + 0.5 V or 2 V COUT = COUT = 1 mF VEN = 0 V to 1 V IOUT = 10 mA −20 0 20 40 60 80 100 120 VPG, POWER GOOD THRESHOLD (%VOUT) 100 60 80 100 120 98 97 96 95 VOUT Rising 94 93 VOUT Falling 92 91 −20 0 20 40 60 80 100 120 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 71. Turn−on Time vs. Temperature Figure 72. PG Threshold vs. Temperature 5 VIN = VOUT + 0.5 V or 2 V COUT = COUT = 1 mF 4.5 4 3.5 3 2.5 2 1.5 1 0.5 −20 0 20 40 60 80 100 120 100 140 90 80 140 VPG = 5.5 V COUT = COUT = 1 mF 70 60 50 40 30 20 10 0 −40 −20 0 20 40 60 80 100 120 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 73. PG Threshold Hysteresis vs. Temperature Figure 74. PG Pin Leakage vs. Temperature http://onsemi.com 16 140 VIN = VOUT + 0.5 V or 2 V COUT = COUT = 1 mF 99 90 −40 140 IPG_LEAK, POWER GOOD LEAKAGE (nA) tON, TURN−ON TIME (ms) VPG_HYST, POWER GOOD HYSTERESIS (%VOUT) 0.4 Figure 70. Disable Current vs. Temperature 220 0 −40 0.5 Figure 69. UVLO Threshold vs. Temperature 240 100 −40 0.6 TJ, JUNCTION TEMPERATURE (°C) 260 120 0.7 TJ, JUNCTION TEMPERATURE (°C) 280 140 0.8 140 300 160 VEN = VOUT + 0.5 V COUT = COUT = 1 mF VEN = 0 V 0.9 IDIS, DISABLE CURRENT (mA) VUVLO, UVLO THRESHOLD (V) 2 1.9 140 NCV8752 100 5 90 4.5 80 tRD, tRR, PG TIMING (ms) VPG_LOW, POWER GOOD VOLTAGE (mV) TYPICAL CHARACTERISTICS 70 60 50 40 30 VIN = 2 V COUT = 1 mF IPG = 1 mA 20 10 0 −40 −20 0 20 40 60 80 100 120 4 3.5 3 PG Timeout Delay 2.5 2 1.5 PG Reaction Time 1 0.5 140 0 −40 −20 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 75. PG Low Voltage vs. Temperature Figure 76. NCV8752A PG Reaction Time, Delay Timing 200 100 180 PG Timeout Delay 160 140 120 VIN = VOUT + 0.5 V COUT = CIN = 1 mF NCV8752B 100 80 60 40 20 CAPACITOR ESR (W) tRD, tRR, PG TIMING (ms) VIN = VOUT + 0.5 V COUT = CIN = 1 mF NCV8752A PG Reaction Time 0 −40 −20 0 20 40 60 80 100 120 140 Unstable Operation 10 1 VOUT = 3.3 V Stable Operation 0.1 0.01 VIN = VOUT + 0.3 V or 2.0 V COUT = CIN = 1 mF 0 50 100 150 TJ, JUNCTION TEMPERATURE (°C) OUTPUT CURRENT (mA) Figure 77. NCV8752B PG Reaction Time, Delay Timing Figure 78. Stability vs. Output Capacitors ESR http://onsemi.com 17 200 NCV8752 APPLICATION INFORMATION The NCV8752 is a high performance, 200 mA LDO voltage regulator with open−drain PG flag. This device delivers excellent noise and dynamic performance. Thanks to its adaptive ground current feature the device consumes only 12 mA of quiescent current at no−load condition. The regulator features very−low noise of 11.5 mVRMS, PSRR of typ. 68 dB at 1 kHz and very good load/line transient response. The device is an ideal choice for battery powered portable applications. A logic EN input provides ON/OFF control of the output voltage. When the EN is low the device consumes as low as typ. 120 nA from the IN pin. The device is fully protected in case of output overload, output short circuit condition and overheating, assuring a very robust design. to GND through a 1 kΩ resistor. In the disable state the device consumes as low as typ. 120 nA from the VIN. If the EN pin voltage > 0.9 V the device is guaranteed to be enabled. The NCV8752 regulates the output voltage and the active discharge transistor is turned−off. The EN pin has an internal pull*down current source with typ. value of 100 nA which assures that the device is turned−off when the EN pin is not connected. A build in deglitch time in the EN block prevents from periodic on/off oscillations that can occur due to noise on EN line. In the case that the EN function isn’t required the EN pin should be tied directly to IN. Reverse Current The PMOS pass transistor has an inherent body diode which will be forward biased in the case that VOUT > VIN. Due to this fact in cases where the extended reverse current condition is anticipated the device may require additional external protection. Input Capacitor Selection (CIN) It is recommended to connect a minimum of 1 mF Ceramic X5R or X7R capacitor close to the IN pin of the device. Larger input capacitors may be necessary if fast and large load transients are encountered in the application. There is no requirement for the min./max. ESR of the input capacitor but it is recommended to use ceramic capacitors for their low ESR and ESL. Output Current Limit Output Current is internally limited within the IC to a typical 400 mA. The NCV8752 will source this amount of current measured with the output voltage 100 mV lower than the nominal VOUT. If the Output Voltage is directly shorted to ground (VOUT = 0 V), the short circuit protection will limit the output current to 410 mA (typ). The current limit and short circuit protection will work properly up to VIN = 5.5 V at TA = 25°C. There is no limitation for the short circuit duration. Output Capacitor Selection (COUT) The NCV8752 is designed to be stable with small 1.0 mF and larger ceramic capacitors on the output. The minimum effective output capacitance for which the LDO remains stable is 500 nF. The safety margin is provided to account for capacitance variations due to DC bias voltage, temperature, initial tolerance. There is no requirement for the minimum value of Equivalent Series Resistance (ESR) for the COUT but the maximum value of ESR should be less than 700 mΩ. Larger output capacitors could be used to improve the load transient response or high frequency PSRR characteristics. It is not recommended to use tantalum capacitors on the output due to their large ESR. The equivalent series resistance of tantalum capacitors is also strongly dependent on the temperature, increasing at low temperature. The tantalum capacitors are generally more costly than ceramic capacitors. When the die temperature exceeds the Thermal Shutdown threshold (TSD − 160°C typical), Thermal Shutdown event is detected and the device is disabled. The IC will remain in this state until the die temperature decreases below the Thermal Shutdown Reset threshold (TSDU − 140°C typical). Once the IC temperature falls below the 140°C the LDO is enabled again. The thermal shutdown feature provides protection from a catastrophic device failure due to accidental overheating. This protection is not intended to be used as a substitute for proper heat sinking. No−load Operation Power Dissipation Thermal Shutdown As power dissipated in the LDO increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. The maximum power dissipation the NCV8752 can handle is given by: The regulator remains stable and regulates the output voltage properly within the ±2% tolerance limits even with no external load applied to the output. Enable Operation The NCV8752 uses the EN pin to enable/disable its output and to control the active discharge function. If the EN pin voltage is < 0.4 V the device is guaranteed to be disabled. The pass transistor is turned−off so that there is virtually no current flow between the IN and OUT. In case of the option equipped with active discharge − the active discharge transistor is turned−on and the output voltage VOUT is pulled P D(MAX) + http://onsemi.com 18 ƪTJ(MAX) * TAƫ q JA (eq. 1) NCV8752 Output Noise The power dissipated by the NCV8752 for given application conditions can be calculated as follows: P D(MAX) + V INI GND ) I OUTǒV IN * V OUTǓ The IC is designed for very−low output voltage noise. The typical noise performance of 11.5 mVRMS makes the device suitable for noise sensitive applications. (eq. 2) Internal Soft Start Load Regulation The Internal Soft−Start circuitry will limit the inrush current during the LDO turn−on phase. Please refer to typical characteristics section for typical inrush current values. The soft−start function prevents from any output voltage overshoots and assures monotonic ramp−up of the output voltage. The NCV8752 features very good load regulation of typical 4 mV in the 0 mA to 200 mA range. In order to achieve this very good load regulation a special attention to PCB design is necessary. The trace resistance from the OUT pin to the point of load can easily approach 100 mW which will cause a 20 mV voltage drop at full load current, deteriorating the excellent load regulation. PCB Layout Recommendations To obtain good transient performance and good regulation characteristics place CIN and COUT capacitors close to the device pins and make the PCB traces wide. In order to minimize the solution size use 0402 capacitors. Larger copper area connected to the pins will also improve the device thermal resistance. The actual power dissipation can be calculated by the formula given in Equation 2. Line Regulation The IC features very good line regulation of 0.3 mV/V measured from VIN = VOUT + 0.5 V to 5.5 V. Power Supply Rejection Ratio At low frequencies the PSRR is mainly determined by the feedback open−loop gain. At higher frequencies in the range 100 kHz − 10 MHz it can be tuned by the selection of COUT capacitor and proper PCB layout. ORDERING INFORMATION Device VOUT Option Marking Rotation NCV8752AMX18TCG 1.8 V A 90° NCV8752AMX28TCG 2.8 V D 90° NCV8752AMX30TCG 3.0 V E 90° NCV8752AMX33TCG 3.3 V F 90° NCV8752ASN18T1G 1.8 V EDA NCV8752ASN28T1G 2.8 V EDC NCV8752ASN30T1G 3.0 V EDD NCV8752ASN33T1G 3.3 V EDE NCV8752BMX18TCG 1.8 V A 270° NCV8752BMX28TCG 2.8 V D 270° NCV8752BMX30TCG 3.0 V E 270° NCV8752BMX33TCG 3.3 V F 270° NCV8752BSN18T1G 1.8 V EEA NCV8752BSN28T1G 2.8 V EEC NCV8752BSN30T1G 3.0 V EED NCV8752BSN33T1G 3.3 V EEE Description Package Shipping† XDFN6 (Pb−Free) Ver. A PG Time-out Delay: 2 ms (Typ) PG Reaction Time: 2 ms (Typ) TSOP−5 (Pb−Free) 3000 / Tape & Reel XDFN6 (Pb−Free) Ver. B PG Time-out Delay: 200 ms (Typ) PG Reaction Time: 5 ms (Typ) TSOP−5 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 19 NCV8752 PACKAGE DIMENSIONS XDFN6 1.5x1.5, 0.5P CASE 711AE ISSUE O D L A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.10 AND 0.20mm FROM TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C 2X 2X 0.10 C ÍÍÍ ÍÍÍ ÍÍÍ DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E DIM A A1 A3 b D E e L L1 L2 ÉÉÉ ÉÉÉ EXPOSED Cu TOP VIEW MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS A DETAIL B A3 0.05 C RECOMMENDED MOUNTING FOOTPRINT* A1 0.05 C C SIDE VIEW DETAIL A e 1 6X SEATING PLANE 5X 0.35 5X 0.73 1.80 L 3 MILLIMETERS MIN MAX 0.35 0.45 0.00 0.05 0.13 REF 0.20 0.30 1.50 BSC 1.50 BSC 0.50 BSC 0.40 0.60 --0.15 0.50 0.70 L2 0.83 0.50 PITCH DIMENSIONS: MILLIMETERS 6 4 6X *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. b 0.10 C A BOTTOM VIEW 0.05 C B NOTE 3 http://onsemi.com 20 NCV8752 PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE J D 5X NOTE 5 2X 0.10 T 2X 0.20 T NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. 0.20 C A B M 5 1 4 2 L 3 B S K DETAIL Z G A DIM A B C D G H J K L M S DETAIL Z J C 0.05 SEATING PLANE H T SOLDERING FOOTPRINT* 0.95 0.037 MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Bluetooth is a registered trademark of Bluetooth SIG. ZigBee is a registered of ZigBee Alliance. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 21 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCV8752/D