LIGITEK LPT11243-PF Npn silicon phototransistor led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
NPN SILICON PHOTOTRANSISTOR LED LAMPS
Pb
Lead-Free Parts
LPT11243-PF
DATA SHEET
DOC. NO :
QW0905-LPT11243-PF
REV.
:
A
DATE
:
29 - Oct. - 2009
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/3
PART NO. LPT11243-PF
Package Dimension
Features
. High illumination sensitivity
. Stable characteristics
. Spectrally and mechanically
matched with IR emitter
2.4
R1.7
3.3
1.8
1.6
3.0
Description
1.5MAX
The LPT11243 series are
silicon nitride
passivated NPN planar
phototransistors with exceptionally
stable characteristics and high
illumination sensitivity the cases of
LPT11243 are encapsulated in
water clear plastic T1 3/4 package
individuallt
25.0MIN
0.5
TYP
1.0MIN
1.EMITTER
2.COLLECTOR
2.54TYP
2
1
Note:1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted
2.Specifications are subject to change without notice
•MAXIMUM RATINGS(Ta=25℃)
PARAMETER
MAXIMUM RATINGS
UNIT
Power Dissipation
100
mw
Collector-Emitter Voltage
30
V
Emitter-Collector Voltage
5
V
Operating Temperature
-50℃ TO +100 ℃
Storage Temperature
-50℃ TO +100 ℃
260 ℃ for 3 seconds
Lead Soldering Temperature(1.6mm From Body)
•ELECTRICAL CHARACTERISTICS(Ta=25℃)
Typ.
Max.
SYMBOL
Min.
Collector-Emitter
Breakdown Voltage
V(BR)CEO
30
V
Ic=1mA
Ee=0mw/c ㎡
Emitter-Collector
Breakdown Voltage
V(BR)ECO
5
V
IE=100 μA
Ee=0mw/c ㎡
Collector-Emitter
Saturation Voltage
VCE(sat)
V
Ic=0.5mA
Ee=20mw/c ㎡
0.4
UNIT
TEST CONDITION
PARAMETER
Rise Time
Tr
5
μs
Fall Time
Tf
5
μs
Collector Dark
Current
On State Collector
Current
ICEO
Ip(on)
100
nA
1
2
mA
2
4
mA
4
8
mA
8
mA
VCE=30V
IC=800 μA,RL=1K Ω
VCE=10V
Ee=0mw/c ㎡
VCE =5v
Ee=1mw/c ㎡
λP=940nm
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT11243-PF
Page 2/3
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
50
100
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LPT11243-PF
Page 3/3
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=85 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
Similar pages