Elpida HB52D48GB-A6FL 32 mb unbuffered sdram micro dimm 4-mword ã 64-bit, 100 mhz memory bus, 1-bank module (4 pcs of 4 m ã 16 components) pc100 sdram Datasheet

HB52D48GB-F
EO
32 MB Unbuffered SDRAM Micro DIMM
4-Mword × 64-bit, 100 MHz Memory Bus, 1-Bank Module
(4 pcs of 4 M × 16 components)
PC100 SDRAM
L
Description
E0011H10 (1st edition)
(Previous ADE-203-1149A (Z))
Jan. 19, 2001
Features
Pr
The HB 52D48GB is a 4M × 64 × 1 banks S ynchronous Dyna mic R AM Micro Dua l In- line Memory Module
(Micro DIMM), mounted 4 pieces of 64-Mbit SDRAM (HM5264165FTT) sealed in TSOP package and 1 piece
of ser ia l EEP RO M (2- kbit EEP RO M) for P rese nce De te ct (P D). An outline of the produc t is 144-pin Zig Za g
Dua l tabs socke t type compa ct and thin pac kage . The ref ore, it make s high density mounting possible without
surf ace mount tec hnology. It provide s common data inputs and outputs. De coupling ca pac itor s ar e mounted
beside TSOP on the module board.
t
uc
od
• 144-pin Zig Zag Dual tabs socket type (dual lead out)
⎯ Outline: 38.00 mm (Length) × 30.00 mm (Height) × 3.80 mm (Thickness)
⎯ Lead pitch: 0.50 mm
• 3.3 V power supply
• Clock frequency: 100 MHz (max)
• LVTTL interface
• Data bus width: × 64 Non parity
• Single pulsed RAS
• 4 Banks can operates simultaneously and independently
• Burst read/write operation and burst read/single write operation capability
• Programmable burst length : 1/2/4/8/full page
• 2 variations of burst sequence
⎯ Sequential (BL = 1/2/4/8/full page)
⎯ interleave (BL = 1/2/4/8)
This Product became EOL in October, 2005.
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.
HB52D48GB-F
L
EO
• Programmable CE latency : 2/3 (HB52D48GB-A6F/A6FL)
: 3 (HB52D48GB-B6F/B6FL)
• Byte control by DQMB
• Refresh cycles: 4096 refresh cycles/64 ms
• 2 variations of refresh
⎯ Auto refresh
⎯ Self refresh
• Low self refresh current: HB52D48GB-A6FL/B6FL (L-version)
• Full page burst length capability
⎯ Sequential burst
⎯ Burst stop capability
Ordering Information
Type No.
Pin Arrangement
CE latency
Package
Contact pad
100
100
100
100
2/3
3
2/3
3
Micro DIMM (144-pin)
Gold
MHz
MHz
MHz
MHz
uc
od
Pr
HB52D48GB-A6F
HB52D48GB-B6F
HB52D48GB-A6FL
HB52D48GB-B6FL
Frequency
Front Side
1pin
2pin
143pin
144pin
Back Side
t
Data Sheet E0011H10
2
HB52D48GB-F
Front side
Back side
Signal name Pin No.
Signal name Pin No.
Signal name Pin No.
Signal name
1
VSS
73
NC
2
VSS
74
CK1
3
DQ0
75
VSS
4
DQ32
76
VSS
5
DQ1
77
NC
6
DQ33
78
NC
7
DQ2
79
NC
8
DQ34
80
NC
9
DQ3
81
VCC
10
DQ35
82
VCC
11
VCC
83
DQ16
12
VCC
84
DQ48
13
DQ4
85
DQ17
14
DQ36
86
DQ49
15
DQ5
87
DQ18
16
DQ37
88
DQ50
17
DQ6
19
DQ7
21
VSS
23
DQMB0
25
L
EO
Pin No.
DQ19
18
DQ38
90
DQ51
91
VSS
20
DQ39
92
VSS
93
DQ20
22
VSS
94
DQ52
95
DQ21
24
DQMB4
96
DQ53
DQMB1
97
DQ22
26
DQMB5
98
DQ54
27
VCC
99
29
A0
101
31
A1
103
33
A2
105
35
VSS
107
37
DQ8
109
39
DQ9
111
41
DQ10
43
Pr
89
28
VCC
100
DQ55
VCC
30
A3
102
VCC
A6
32
A4
104
A7
A8
34
A5
106
A13 (BA0)
VSS
36
VSS
108
VSS
A9
38
DQ40
110
A12 (BA1)
A10 (AP)
40
DQ41
112
A11
113
VCC
42
DQ42
114
VCC
DQ11
115
DQMB2
44
DQ43
116
DQMB6
45
VCC
117
DQMB3
46
VCC
118
DQMB7
47
DQ12
119
VSS
48
DQ44
120
VSS
49
DQ13
121
DQ24
50
DQ45
122
DQ56
51
DQ14
123
DQ25
52
DQ46
124
DQ57
53
DQ15
125
DQ26
54
DQ47
126
DQ58
55
VSS
127
DQ27
56
VSS
128
DQ59
57
NC
129
VCC
58
NC
130
VCC
59
NC
131
DQ28
60
NC
132
DQ60
t
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od
DQ23
Data Sheet E0011H10
3
HB52D48GB-F
Front side
Back side
Signal name Pin No.
Signal name Pin No.
Signal name Pin No.
Signal name
61
CK0
133
DQ29
62
CKE0
134
DQ61
63
VCC
135
DQ30
64
VCC
136
DQ62
65
RE
137
DQ31
66
CE
138
DQ63
67
W
139
VSS
68
NC
140
VSS
69
S0
141
SDA
70
NC
142
SCL
71
NC
143
VCC
72
NC
144
VCC
Pin Description
Pin name
A0 to A11
L
EO
Pin No.
Function
Address input
⎯ Row address A0 to A11
⎯ Column address A0 to A7
DQ0 to DQ63
S0
RE
CE
W
Pr
A12/A13
Bank select address
BA1, BA0
Data-input/output
Chip select
Row address asserted bank enable
Column address asserted
Write enable
uc
od
DQMB0 to DQMB7
Byte input/output mask
CK0/CK1
Clock input
CKE0
Clock enable
SDA
Data-input/output for serial PD
SCL
Clock input for serial PD
VCC
Power supply
VSS
Ground
NC
No connection
t
Data Sheet E0011H10
4
HB52D48GB-F
Serial PD Matrix*1
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
0
Number of bytes used by
module manufacturer
1
0
0
0
0
0
0
0
80
128
1
Total SPD memory size
0
0
0
0
1
0
0
0
08
256 byte
2
Memory type
0
0
0
0
0
1
0
0
04
SDRAM
3
Number of row addresses bits 0
0
0
0
1
1
0
0
0C
12
4
Number of column addresses
bits
0
0
0
0
1
0
0
0
08
8
5
Number of banks
0
0
0
0
0
0
0
1
01
1
6
Module data width
0
1
0
0
0
0
0
0
40
64
7
Module data width (continued) 0
0
0
0
0
0
0
0
00
0 (+)
8
Module interface signal levels 0
0
0
0
0
0
0
1
01
LVTTL
9
L
EO
Byte No. Function described
SDRAM cycle time
(highest CE latency)
10 ns
0
1
0
0
0
0
0
A0
CL = 3
10
SDRAM access from Clock
(highest CE latency)
6 ns
11
Module configuration type
12
Refresh rate/type
13
1
Pr
0
1
1
0
0
0
0
0
60
0
0
0
0
0
0
0
0
00
Non parity
1
0
0
0
0
0
0
0
80
Normal
(15.625 µs)
Self refresh
SDRAM width
0
0
0
14
Error checking SDRAM width
0
0
0
15
0
SDRAM device attributes:
minimum clock delay for backto-back random column
addresses
0
0
16
SDRAM device attributes:
Burst lengths supported
1
0
0
17
SDRAM device attributes:
number of banks on SDRAM
device
0
0
0
18
SDRAM device attributes:
CE latency
0
0
0
19
SDRAM device attributes:
S latency
0
0
0
0
0
0
0
10
4M × 16
0
0
0
0
0
00
—
0
0
0
0
1
01
1 CLK
0
1
1
1
1
8F
1, 2, 4, 8, full
page
0
0
1
0
0
04
4
0
0
1
1
0
06
2, 3
0
0
0
0
1
01
0
t
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od
1
Data Sheet E0011H10
5
HB52D48GB-F
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
20
SDRAM device attributes:
W latency
0
0
0
0
0
0
0
1
01
0
21
SDRAM module attributes
0
0
0
0
0
0
0
0
00
Unbuffer
22
SDRAM device attributes:
General
0
0
0
0
1
1
1
0
0E
VCC ± 10%
23
SDRAM cycle time
(2nd highest CE latency)
(-A6F/A6FL) 10 ns
1
0
1
0
0
0
0
0
A0
CL = 2
1
1
1
1
0
0
0
0
F0
0
1
1
0
0
0
0
0
60
L
EO
Byte No. Function described
(-B6F/B6FL) 15 ns
24
SDRAM access from Clock
(2nd highest CE latency)
(-A6F/A6FL) 6 ns
(-B6F/B6FL) 8 ns
1
0
0
0
0
0
0
0
80
SDRAM cycle time
(3rd highest CE latency)
Undefined
0
0
0
0
0
0
0
0
00
26
SDRAM access from Clock (3rd 0
highest CE latency)
Undefined
0
0
0
0
0
0
0
00
27
Minimum row precharge time
0
0
0
1
0
1
0
0
14
20 ns
28
Row active to row active min
0
0
0
1
0
1
0
0
14
20 ns
29
RE to CE delay min
0
0
0
1
0
1
0
0
14
20 ns
30
Minimum RE pulse width
0
0
1
1
0
0
1
0
32
50 ns
31
Density of each bank on
module
0
0
0
0
1
0
0
0
08
32M byte
32
Address and command signal 0
input setup time
0
1
0
0
0
0
0
20
2 ns
33
Address and command signal 0
input hold time
0
0
1
0
0
0
0
10
1 ns
34
Data signal input setup time
0
0
1
0
0
0
0
0
20
2 ns
35
Data signal input hold time
0
0
0
1
0
0
0
0
10
1 ns
36 to 61 Superset information
0
0
0
0
0
0
0
0
00
Future use
62
SPD data revision code
0
0
0
1
0
0
1
0
12
Rev. 1.2A
63
Checksum for bytes 0 to 62
(-A6F/A6FL)
0
0
0
0
0
1
0
0
04
4
0
1
1
1
0
1
0
0
74
116
Manuf act urer’s J EDEC I D c ode 0
0
0
0
0
1
1
1
07
HITACHI
65 to 71 Manuf act urer’s J EDEC I D c ode 0
0
0
0
0
0
0
0
00
×
×
×
×
×
×
×
×
××
64
Manufacturing location
Data Sheet E0011H10
6
* 3 (ASCII-8bit
code)
t
72
uc
od
(-B6F/B6FL)
Pr
25
HB52D48GB-F
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
73
Manufacturer’s part number
0
1
0
0
1
0
0
0
48
H
74
Manufacturer’s part number
0
1
0
0
0
0
1
0
42
B
75
Manufacturer’s part number
0
0
1
1
0
1
0
1
35
5
76
Manufacturer’s part number
0
0
1
1
0
0
1
0
32
2
77
Manufacturer’s part number
0
1
0
0
0
1
0
0
44
D
78
Manufacturer’s part number
0
0
1
1
0
1
0
0
34
4
79
Manufacturer’s part number
0
0
1
1
1
0
0
0
38
8
80
Manufacturer’s part number
0
1
0
0
0
1
1
1
47
G
81
Manufacturer’s part number
0
1
0
0
0
0
1
0
42
B
82
Manufacturer’s part number
0
0
0
1
1
0
1
2D
—
83
L
1
Manufacturer’s part number
(-A6F/A6FL)
0
1
0
0
0
0
0
1
41
A
0
1
0
0
0
0
1
0
42
B
EO
Byte No. Function described
(-B6F/B6FL)
Manufacturer’s part number
0
0
1
1
0
1
1
0
36
6
85
Manufacturer’s part number
0
1
0
0
0
1
1
0
46
F
86
Manufacturer’s part number
(L-version)
0
1
0
0
1
1
0
0
4C
L
Manufacturer’s part number
0
0
1
0
0
0
0
0
20
(Space)
87
Manufacturer’s part number
0
0
1
0
0
0
0
0
20
(Space)
88
Manufacturer’s part number
0
0
1
0
0
0
0
0
20
(Space)
89
Manufacturer’s part number
0
0
1
0
0
0
0
0
20
(Space)
90
Manufacturer’s part number
0
0
1
91
Revision code
0
0
1
92
Revision code
0
0
1
93
Manufacturing date
×
×
×
94
Manufacturing date
×
×
×
95 to 98 Assembly serial number
*6
99 t o 125 Manufacturer specific data
—
—
—
126
Intel specification frequency
0
1
1
127
Intel specification CE# latency 1
support
(-A6F/A6FL)
1
0
1
0
(-B6F/B6FL)
1
uc
od
Pr
84
0
0
0
0
0
20
(Space)
1
0
0
0
0
30
Initial
0
0
0
0
0
20
(Space)
×
×
×
×
×
××
Year code
(BCD)*4
×
×
×
×
×
××
Week code
(BCD)*4
—
—
—
—
—
—
*5
0
0
1
0
0
64
100 MHz
0
0
1
1
1
C7
CL = 2, 3
0
0
1
0
1
C5
CL = 3
t
Data Sheet E0011H10
7
HB52D48GB-F
L
EO
Notes: 1. All serial PD data are not protected. 0: Serial data, “driven Low”, 1: Serial data, “driven High” These
SPD are based on Intel specification (Rev.1.2A).
2. Regarding byte32 to 35, based on JEDEC Committee Ballot JC42.5-97-119.
3. Byte72 is manufacturing location code. (ex: In case of Japan, byte72 is 4AH. 4AH shows “J” on
ASCII code.)
4. Regarding byte93 and 94, based on JEDEC Committee Ballot JC42.5-97-135. BCD is “Binary
Coded Decimal”.
5. All bits of 99 through 125 are not defined (“1” or “0”).
6. Bytes 95 through 98 are assembly serial number.
t
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Pr
Data Sheet E0011H10
8
HB52D48GB-F
Block Diagram
EO
S0
W
CS
DQMB0
8 N0, N1
8 N8, N9
DQ0 to DQ7
DQ32 to DQ39
D0
D2
DQMB1
DQMB5
8 N2, N3
8 N10, N11
DQ8 to DQ15
DQ40 to DQ47
L
CS
DQMB2
8 N4, N5
8 N12, N13
DQ48 to DQ55
D1
D3
DQMB3
DQMB7
8 N6, N7
RE
RAS (D0 to D3)
CE
CAS (D0 to D3)
SCL
A0 to A11 (D0 to D3)
A0 to A11
A13 (D0 to D3)
BA1
A12 (D0 to D3)
CKE0
CKE (D0 to D3)
CLK (D0)
CLK (D1)
CK0
CLK (D2)
CLK (D3)
R0
CK1
C200
VCC
VCC (D0 to D3, U0)
C100-C103
Serial PD
SDA
SCL
A0
SDA
U0
A1
A2
uc
od
BA0
VSS
8 N14, N15
DQ56 to DQ63
Pr
DQ24 to DQ31
CS
DQMB6
DQ16 to DQ23
C0-C7
CS
DQMB4
VSS
Notes :
1. The SDA pull-up resistor is required due to
the open-drain/open-collector output.
2. The SCL pull-up resistor is recommended
because of the normal SCL line inacitve
"high" state.
* D0 to D3: HM5264165
U0: 2-kbit EEPROM
C0 to C7: 0.33 μF
C100 to C103: 0.1 μF
C200: 10 pF
N0 to N15: Network resistors (10 Ω)
R0: Resistor (10 Ω)
VSS (D0 to D3, U0)
t
Data Sheet E0011H10
9
HB52D48GB-F
Absolute Maximum Ratings
EO
Parameter
Symbol
Value
Unit
Note
Voltage on any pin relative to VSS
VT
–0.5 to VCC + 0.5
(≤ 4.6 (max))
V
1
Supply voltage relative to VSS
VCC
–0.5 to +4.6
V
1
Short circuit output current
Iout
50
mA
Power dissipation
PT
4.0
W
Operating temperature
Topr
0 to +65
°C
Storage temperature
Tstg
–55 to +125
°C
Note:
L
1. Respect to VSS .
DC Operating Conditions (Ta = 0 to +65°C)
Parameter
Symbol
Min
Max
Unit
Notes
Supply voltage
VCC
3.0
3.6
V
1, 2
Input low voltage
0
0
V
3
VIH
2.0
VCC + 0.3
V
1, 4, 5
VIL
–0.3
0.8
V
1, 6
All voltage referred to VSS
The supply voltage with all VCC pins must be on the same level.
The supply voltage with all VSS pins must be on the same level.
CK, CKE, S, DQMB, DQ pins: VIH (max) = VCC + 0.5 V for pulse width ≤ 5 ns at VCC.
Others: VIH (max) = 4.6 V for pulse width ≤ 5 ns at VCC.
VIL (min) = –1.0 V for pulse width ≤ 5 ns at VSS .
t
uc
od
Notes: 1.
2.
3.
4.
5.
6.
Pr
Input high voltage
VSS
Data Sheet E0011H10
10
HB52D48GB-F
VIL/VIH Clamp (Component characteristic)
EO
This SDRAM component has VIL and VIH clamp for CK, CKE, S, DQMB and DQ pins.
Minimum VIL Clamp Current
I (mA)
–2
–32
–1.8
–25
–1.6
–19
–1.4
–13
L
VIL (V)
–1.2
–1
–0.9
–8
–4
–2
–0.8
–0.6
–0.6
0
Pr
–0.4
0
–0.2
0
0
0
0
I (mA)
–10
–15
–20
–25
–30
–35
–2
–1.5
–1
–0.5
0
uc
od
–5
VIL (V)
t
Data Sheet E0011H10
11
HB52D48GB-F
Minimum VIH Clamp Current
EO
VIH (V)
I (mA)
VCC + 2
10
VCC + 1.8
8
VCC + 1.6
5.5
VCC + 1.4
3.5
VCC + 1.2
1.5
VCC + 1
0.3
VCC + 0.8
0
L
VCC + 0.6
VCC + 0.4
VCC + 0.2
VCC + 0
I (mA)
8
6
4
2
0
0
VCC + 0.5
uc
od
0
VCC + 0
0
Pr
10
0
VCC + 1
VCC + 1.5
VCC + 2
VIH (V)
t
Data Sheet E0011H10
12
HB52D48GB-F
IOL/IOH Characteristics (Component characteristic)
EO
Output Low Current (I OL)
I OL
I OL
Vout (V)
Min (mA)
Max (mA)
0
0
0
0.4
27
71
0.65
41
108
0.85
51
134
58
70
188
72
194
1.65
L
151
75
203
1.8
77
209
1.95
77
212
3
80
220
3.45
81
223
1
1.4
1.5
IOL (mA)
200
150
uc
od
Pr
250
min
max
100
50
0
0
0.5
1
1.5
2
2.5
3
3.5
Vout (V)
t
Data Sheet E0011H10
13
HB52D48GB-F
Output High Current (I OH ) (Ta = 0 to 65˚C, VCC = 3.0 V to 3.45 V, VSS = 0 V)
EO
I OH
I OH
Vout (V)
Min (mA)
Max (mA)
3.45
—
–3
3.3
—
–28
3
0
–75
2.6
–21
–130
2.4
–34
–154
2
–59
–197
L
1.8
–227
–73
–248
–78
–270
–81
–285
1
–89
–345
0
–93
1.65
1.5
1.4
0
–200
0.5
1
–503
1.5
2
2.5
3
3.5
uc
od
IOH (mA)
–100
0
Pr
–67
min
–300
–400
–500
–600
max
Vout (V)
t
Data Sheet E0011H10
14
HB52D48GB-F
DC Characteristics (Ta = 0 to 65°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V)
EO
HB52D48GB
-A6F/B6F/A6FL/B6FL
Parameter
Symbol Min
Max
Unit
Test conditions
Notes
Operating current
I CC1
—
260
mA
Burst length = 1
t RC = min
1, 2, 3
Standby current in power down I CC2P
—
6
mA
CKE0 = VIL, t CK = 12 ns 6
Standby current in power down I CC2PS
(input signal stable)
—
4
mA
CKE0 = VIL, t CK = ∞
7
Standby current in non power
down
—
40
mA
CKE0, S = VIH,
t CK = 12 ns
4
I CC2N
L
—
16
mA
CKE0, S = VIH,
t CK = 12 ns
1, 2, 6
Active standby current in non
power down
I CC3N
—
72
mA
CKE0, S = VIH,
t CK = 12 ns
1, 2, 4
Burst operating current
I CC4
—
260
mA
t CK = 12 ns, BL = 4
1, 2, 5
Refresh current
I CC5
Self refresh current
I CC6
Self refresh current
(L-version)
I CC6
Input leakage current
I LI
Output leakage current
I LO
Output high voltage
Output low voltage
Pr
Active standby current in power I CC3P
down
440
mA
t RC = min
3
—
4
mA
VIH ≥ VCC – 0.2 V
VIL ≤ 0.2 V
8
—
2.2
mA
–10
10
µA
0 ≤ Vin ≤ VCC
–10
10
µA
0 ≤ Vout ≤ VCC
DQ = disable
VOH
2.4
—
V
I OH = –4 mA
VOL
—
0.4
V
I OL = 4 mA
uc
od
—
Notes: 1. I CC depends on output load condition when the device is selected. I CC (max) is specified at the output
open condition.
2. One bank operation.
3. Input signals are changed once per one clock.
4. Input signals are changed once per two clocks.
5. Input signals are changed once per four clocks.
6. After power down mode, CK0/CK1 operating current.
7. After power down mode, no CK0/CK1 operating current.
8. After self refresh mode set, self refresh current.
t
Data Sheet E0011H10
15
HB52D48GB-F
Capacitance (Ta = 25°C, VCC = 3.3 V ± 0.3 V)
EO
Parameter
Symbol
Max
Unit
Notes
Input capacitance (Address)
CIN
40
pF
1, 2, 4
Input capacitance (RE, CE, W, CK0/CK1, CKE0)
CIN
40
pF
1, 2, 4
Input capacitance (S0)
CIN
40
pF
1, 2, 4
Input capacitance (DQMB0 to DQMB7)
CIN
20
pF
1, 2, 4
Input/Output capacitance (DQ0 to DQ63)
CI/O
20
pF
1, 2, 3, 4
Capacitance measured with Boonton Meter or effective capacitance measuring method.
Measurement condition: f = 1 MHz, 1.4 V bias, 200 mV swing.
DQMB = VIH to disable Data-out.
This parameter is sampled and not 100% tested.
L
Notes: 1.
2.
3.
4.
t
uc
od
Pr
Data Sheet E0011H10
16
HB52D48GB-F
AC Characteristics (Ta = 0 to 65˚C, VCC = 3.3 V ± 0.3 V, VSS = 0 V)
EO
HB52D48GB
-A6F/A6FL
-B6F/B6FL
PC100
Symbol Symbol Min
Max
Min
Max
Unit
Notes
System clock cycle time
(CE latency = 2)
t CK
Tclk
10
—
15
—
ns
1
(CE latency = 3)
t CK
Tclk
10
—
10
—
ns
CK high pulse width
t CKH
Tch
3
—
3
—
ns
1
CK low pulse width
t CKL
Tcl
3
—
3
—
ns
1
t AC
Tac
—
6
—
8
ns
1, 2
t AC
Tac
—
6
—
6
ns
t OH
Toh
3
—
3
—
ns
1, 2
2
—
2
—
ns
1, 2, 3
Access time from CK
(CE latency = 2)
(CE latency = 3)
Data-out hold time
L
Parameter
CK to Data-out low impedance t LZ
Data-in setup time
Pr
CK to Data-out high impedance t HZ
t AS , t CS,
t DS, t CES
CKE setup time for power down t CESP
exit
—
6
—
6
ns
1, 4
Tsi
2
—
2
—
ns
1, 5, 6
Tpde
2
—
2
—
ns
1
—
1
—
ns
1, 5
t AH, t CH,
t DH, t CEH
Thi
1
Ref/Active to Ref/Active
command period
t RC
Trc
70
Active to Precharge command
period
t RAS
Tras
50
Active command to column
command (same bank)
t RCD
Trcd
20
Precharge to active command
period
t RP
Trp
20
Write recovery or data-in to
precharge lead time
t DPL
Tdpl
10
Active (a) to Active (b)
command period
t RRD
Trrd
20
Transition time (rise and fall)
tT
1
Refresh period
t REF
—
uc
od
Data-in hold time
—
70
—
ns
1
120000
50
120000
ns
1
—
20
—
ns
1
—
20
—
ns
1
—
10
—
ns
1
—
20
—
ns
1
5
1
5
ns
64
—
64
ms
t
Data Sheet E0011H10
17
HB52D48GB-F
AC measurement assumes t T = 1 ns. Reference level for timing of input signals is 1.5 V.
Access time is measured at 1.5 V. Load condition is CL = 50 pF.
t LZ (min) defines the time at which the outputs achieves the low impedance state.
t HZ (max) defines the time at which the outputs achieves the high impedance state.
t CES define CKE setup time to CK rising edge except power down exit command.
t AS /tAH: Address, t CS/tCH: S, RE, CE, W, DQMB
t DS/tDH: Data-in, t CES/tCEH : CKE
EO
Notes: 1.
2.
3.
4.
5.
6.
Test Conditions
• Input and output timing reference levels: 1.5 V
L
• Input waveform and output load: See following figures
2.4 V
input
0.4 V
I/O
2.0 V
0.8 V
Pr
t
T
CL
tT
t
uc
od
Data Sheet E0011H10
18
HB52D48GB-F
Relationship Between Frequency and Minimum Latency
EO
HB52D48GB
Parameter
-A6F/A6FL/B6F/B6FL
Frequency (MHz)
100
tCK (ns)
Symbol
Active command to column command
(same bank)
PC100
Symbol
Notes
lRCD
2
1
Active command to active command
(same bank)
lRC
7
= [lRAS+ lRP]
1
Active command to precharge command
(same bank)
lRAS
5
1
Precharge command to active command
(same bank)
lRP
2
1
Write recovery or data-in to precharge
command (same bank)
lDPL
1
1
Active command to active command
(different bank)
lRRD
2
1
L
10
Last data in to active command
(Auto precharge, same bank)
Self refresh exit to command input
Pr
Self refresh exit time
Tdpl
lSREX
Tsrx
1
2
lAPW
Tdal
4
= [lDPL + lRP]
7
= [lRC]
3
lSEC
(CE latency = 3)
lHZP
lHZP
Last data out to active command
(auto precharge) (same bank)
lAPR
Last data out to precharge (early precharge)
(CE latency = 2)
(CE latency = 3)
lEP
lEP
Column command to column command
lCCD
Write command to data in latency
lWCD
DQMB to data in
lDID
DQMB to data out
lDOD
CKE to CK disable
lCLE
Register set to active command
lRSA
uc
od
Precharge command to high impedance
(CE latency = 2)
Troh
2
Troh
3
1
–1
–2
Tccd
1
Tdwd
0
Tdqm
0
Tdqz
2
Tcke
1
Tmrd
1
t
Data Sheet E0011H10
19
HB52D48GB-F
HB52D48GB
-A6F/A6FL/B6F/B6FL
Frequency (MHz)
100
EO
Parameter
PC100
Symbol
tCK (ns)
Symbol
S to command disable
lCDD
0
Power down exit to command input
lPEC
1
Burst stop to output valid data hold
(CE latency = 2)
lBSR
1
lBSR
2
(CE latency = 3)
(CE latency = 3)
L
Burst stop to output high impedance
(CE latency = 2)
Burst stop to write data ignore
10
lBSH
2
lBSH
3
lBSW
0
Notes
t
uc
od
Pr
Notes: 1. lRCD to lRRD are recommended value.
2. Be valid [DSEL] or [NOP] at next command of self refresh exit.
3. Except [DSEL] and [NOP].
Data Sheet E0011H10
20
HB52D48GB-F
Pin Functions
EO
CK0/CK1 (in pu t p in ): C K is the master cloc k input to this pin. The other input signals ar e re fe rre d at C K
rising edge.
S 0 (in pu t p in ): Whe n S is Low, the command input cyc le bec omes valid. Whe n S is High, all inputs ar e
ignored. However, internal operations (bank active, burst operations, etc.) are held.
RE, CE and W (input pins): Although these pin names are the same as those of conventional DRAM modules,
they func tion in a diffe re nt wa y. The se pins def ine oper ation commands (r ea d, wr ite , etc .) depe nding on the
combination of their voltage levels. For details, refer to the command operation section.
L
A0 to A11 (in pu t p in s): R ow addr ess (A X0 to AX11) is dete rmined by A0 to A11 leve l at the bank ac tive
command cycle CK rising edge. Column address (AY0 to AY7) is determined by A0 to A7 level at the read or
wr ite command cyc le C K rising edge . And this column addr ess bec omes burst ac ce ss start addr ess. A10
def ines the pre cha rge mode. Whe n A10 = High at the pre cha rge command cyc le, both banks ar e pre cha rged.
B ut whe n A10 = Low at the pre cha rge command cyc le, only the bank that is sele cted by A12/A13 (B A) is
precharged.
Pr
A12/A13 (input pin): A12/A13 is a bank select signal (BA). The memory array is divided into bank0, bank1,
bank2 and bank3. If A12 is Low and A13 is Low, bank0 is selected. If A12 is High and A13 is Low, bank1 is
selected. If A12 is Low and A13 is High, bank2 is selected. If A12 is High and A13 is HIgh, bank3 is selected.
CKE0 (input pin): This pin determines whether or not the next CK is valid. If CKE is High, the next CK rising
edge is valid. If CKE is Low, the next CK rising edge is invalid. This pin is used for power-down mode, clock
suspend mode and self refresh mode.
uc
od
DQMB 0 to DQMB 7 (in pu t p in s): R ea d oper ation: If DQMB is High, the output buff er bec omes High-Z. If
the DQMB is Low, the output buffer becomes Low-Z (The latency of DQMB during reading is 2 clocks).
Wr ite oper ation: If DQMB is High, the pre vious data is held (the new data is not wr itten) . If DQMB is Low,
the data is written (The latency of DQMB during writing is 0 clock).
DQ0 to DQ63 (DQ pins): Data is input to and output from these pins.
VCC (power supply pins): 3.3 V is applied.
VSS (power supply pins): Ground is connected.
Detailed Operation Part
Refer to the HM5264165F/HM5264805F/HM5264405F-75/A60/B60 datasheet.
t
Data Sheet E0011H10
21
HB52D48GB-F
Physical Outline
EO
Unit: mm
(38.0)
1
A
17.625
3.80 Max
B
;;
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;;
;;
;;
;;
;;
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;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
;;
3.5 Min
3.5 Min
1.0 Min
2.5 Min
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
Component area
;;;;;;;;;;;;;;;;;;;;;;
(front)
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
L
15.0
30.0
1.0 Min
42.0 Max
0.80 ± 0.08
35.50
0.875
Pr
37.0 ± 0.08
35.50
17.875
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
Component area
;;;;;;;;;;;;;;;;;;;;;;
(back)
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
;;;;;;;;;;;;;;;;;;;;;;
2
1.0 Min
uc
od
4-R1.0 ± 0.1
0.625
4.0 ± 0.1
R1.0 ± 0.1
1.0 Min
Detail B
Detail A
0.37 ± 0.03
Data Sheet E0011H10
22
t
1.0 ± 0.08
0.25 Max
5.0 ± 0.1
2.00 Min
0.50
HB52D48GB-F
Cautions
EO
L
1. Elpida Memory, Inc. neither warrants nor grants licenses of any rights of Elpida Memory, Inc.’s or any third
party’s patent, copyright, trademark, or other intellectual property rights for information contained in this
document. Elpida Memory, Inc. bears no responsibility for problems that may arise with third party’s rights,
including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability.
However, contact Elpida Memory, Inc. before using the product in an application that demands especially
high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic,
safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Elpida Memory, Inc.
particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when
used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so
that the equipment incorporating Elpida Memory, Inc. product does not cause bodily injury, fire or other
consequential damage due to operation of the Elpida Memory, Inc. product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Elpida Memory, Inc..
7. Contact Elpida Memory, Inc. for any questions regarding this document or Elpida Memory, Inc.
semiconductor products.
t
uc
od
Pr
Data Sheet E0011H10
23
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