Fairchild MM74HC574 3-state octal d-type edge-triggered flip-flop Datasheet

Revised May 2005
MM74HC574
3-STATE Octal D-Type Edge-Triggered Flip-Flop
General Description
Features
The MM74HC574 high speed octal D-type flip-flops utilize
advanced silicon-gate P-well CMOS technology. They possess the high noise immunity and low power consumption
of standard CMOS integrated circuits, as well as the ability
to drive 15 LS-TTL loads. Due to the large output drive
capability and the 3-STATE feature, these devices are ideally suited for interfacing with bus lines in a bus organized
system.
■ Typical propagation delay: 18 ns
■ Wide operating voltage range: 2V–6V
■ Low input current: 1 PA maximum
■ Low quiescent current: 80 PA maximum
■ Compatible with bus-oriented systems
■ Output drive capability: 15 LS-TTL loads
These devices are positive edge triggered flip-flops. Data
at the D inputs, meeting the set-up and hold time requirements, are transferred to the Q outputs on positive going
transitions of the CLOCK (CK) input. When a high logic
level is applied to the OUTPUT CONTROL (OC) input, all
outputs go to a high impedance state, regardless of what
signals are present at the other inputs and the state of the
storage elements.
The 74HC logic family is speed, function, and pinout compatible with the standard 74LS logic family. All inputs are
protected from damage due to static discharge by internal
diode clamps to VCC and ground.
Ordering Code:
Order Number
Package Number
MM74HC574WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC574SJ
MM74HC574MTC
MM74HC574N
MTC20
N20A
Package Description
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Truth Table
Pin Assignments for DIP, SOIC, SOP and TSSOP
Output
Clock
Data
Output
H
Control
L
n
H
L
n
L
L
L
L
X
Q0
H
X
X
Z
H HIGH Level
L LOW Level
X Don't Care
n Transition from LOW-to-HIGH
Z High Impedance State
Q0
The level of the output before steady state input conditions were
established
Top View
© 2005 Fairchild Semiconductor Corporation
DS005213
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MM74HC574 3-STATE Octal D-Type Edge-Triggered Flip-Flop
September 1983
MM74HC574
Absolute Maximum Ratings(Note 1)
Recommended Operating
Conditions
(Note 2)
Supply Voltage (VCC)
DC Input Voltage (VIN)
DC Output Voltage (VOUT)
Clamp Diode Current (IIK, IOK)
DC Output Current, per pin (IOUT)
DC VCC or GND Current, per pin (ICC)
Storage Temperature Range (TSTG)
0.5 to 7.0V
1.5 to VCC 1.5V
0.5 to VCC 0.5V
r20 mA
r35 mA
r70 mA
65qC to 150qC
Min
Max
Supply Voltage (VCC)
2
6
V
DC Input or Output Voltage
0
VCC
V
40
85
qC
(VIN,VOUT)
Operating Temperature Range (TA)
Input Rise or Fall Times
(tr, tf)
Power Dissipation (PD)
(Note 3)
600 mW
S.O. Package only
500 mW
Symbol
VIH
VIL
VOH
Parameter
IOZ
ICC
'ICC
ns
500
ns
VCC
6.0V
400
ns
Note 3: Power Dissipation temperature derating — plastic “N” package: 12 mW/qC from 65qC to 85qC.
VCC
TA
25qC
Typ
TA
40 to 85qC TA 55 to 125qC
Guaranteed Limits
Minimum HIGH Level Input
2.0V
1.5
1.5
1.5
Voltage
4.5V
3.15
3.15
3.15
6.0V
4.2
4.2
4.2
Maximum LOW Level Input
2.0V
0.5
0.5
0.5
Voltage
4.5V
1.35
1.35
1.35
6.0V
1.8
1.8
1.8
Minimum HIGH Level Output
VIN
Voltage
|IOUT | d 20 PA
Units
V
V
VIH or VIL
2.0V
2.0
1.9
1.9
1.9
4.5V
4.5
4.4
4.4
4.4
6.0V
6.0
5.9
5.9
5.9
|IOUT | d 6.0 mA
4.5V
4.2
3.98
3.84
3.7
|IOUT | d 7.8 mA
6.0V
5.7
5.48
5.34
5.2
V
VIH or VIL
Maximum LOW Level Output
VIN
Voltage
|IOUT | d 20 PA
V
VIH or VIL
2.0V
0
0.1
0.1
0.1
4.5V
0
0.1
0.1
0.1
6.0V
0
0.1
0.1
0.1
|IOUT | d 6.0 mA
4.5V
0.2
0.26
0.33
0.4
|IOUT | d 7.8 mA
6.0V
0.2
0.26
0.33
0.4
Maximum Input Current
VIN
6.0V
r0.1
r1.0
r1.0
PA
6.0V
r0.5
r5.0
r10
PA
8.0
80
160
PA
1.5
1.8
2.0
VIN
IIN
1000
4.5V
(Note 4)
Conditions
VIN
VOL
2.0V
VCC
Note 2: Unless otherwise specified all voltages are referenced to ground.
260qC
DC Electrical Characteristics
VCC
Note 1: Maximum Ratings are those values beyond which damage to the
device may occur.
Lead Temperature (TL)
(Soldering 10 seconds)
Units
VIH or VIL
VCC or GND
Maximum 3-STATE
VOUT
Output Leakage Current
OC
VIH
Maximum Quiescent Supply
VIN
VCC or GND
Current
IOUT
0 PA
6.0V
Quiescent Supply Current
VCC
5.5V
OE
per Input Pin
VIN
V
V
VCC or GND
1.0
2.4V
CLK
0.6
0.8
1.0
1.1
or 0.4V (Note 4)
DATA
0.4
0.5
0.6
0.7
mA
Note 4: For a power supply of 5V r10% the worst-case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
designing with this supply. Worst-case VIH and VIL occur at VCC 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst-case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
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2
VCC
25qC, tr
5V, TA
tf 6 ns
Symbol
Parameter
Conditions
Guaranteed
Typ
Limit
Units
fMAX
Maximum Operating Frequency
60
33
MHz
tPHL, tPLH
Maximum Propagation Delay, Clock to Q
CL
45 pF
17
27
ns
tPZH, tPZL
Maximum Output Enable Time
RL
1 k:
19
28
ns
CL
45 pF
RL
1 k:
14
25
ns
CL
5 pF
ns
tPHZ, tPLZ
Maximum Output Disable Time
tS
Minimum Setup Time, Data to Clock
10
12
tH
Minimum Hold Time, Clock to Data
3
5
ns
tW
Minimum Pulse Clock Width
8
15
ns
AC Electrical Characteristics
VCC
2.0 6.0V, CL
Symbol
fMAX
tPHL, tPLH
tPZH, tPZL
tPHZ, tPLZ
tS
tH
tTHL, tTLH
50 pF, tr
tf 6 ns (unless otherwise specified)
Parameter
Maximum Operating Frequency
Conditions
CL
50 pF
tr,tf
CPD
CIN
TA
25qC
Typ
TA
40 to 85qC TA 55 to 125qC
Guaranteed Limits
2.0V
33
28
23
4.5V
30
24
20
6.0V
35
28
23
Maximum Propagation
CL
50 pF
2.0V
18
30
38
45
Delay, Clock to Q
CL
150 pF
2.0V
51
155
194
233
CL
50 pF
4.5V
13
23
29
35
CL
150 pF
4.5V
19
31
47
47
CL
50 pF
6.0V
12
20
25
30
CL
150 pF
6.0V
18
27
34
41
Maximum Output Enable
RL
1 k:
Time
CL
50 pF
2.0V
22
30
38
45
CL
150 pF
2.0V
59
180
225
270
CL
50 pF
4.5V
14
28
35
42
CL
150 pF
4.5V
20
36
45
54
CL
50 pF
6.0V
12
24
30
36
CL
150 pF
6.0V
18
31
39
47
RL
1 k:
2.0V
15
30
38
45
CL
50 pF
4.5V
12
25
31
38
6.0V
10
21
27
32
Minimum Setup Time
2.0V
6
12
15
18
Data to Clock
4.5V
20
25
30
6.0V
17
21
25
Maximum Output Disable Time
1
Minimum Hold Time
2.0V
5
6
8
Clock to Data
4.5V
0
0
0
6.0V
0
0
0
18
Maximum Output Rise
CL
50 pF
and Fall Time
tW
VCC
Minimum Clock Pulse Width
2.0V
6
12
15
4.5V
7
12
15
18
6.0V
6
10
13
15
2.0V
30
15
20
24
4.5V
9
16
20
24
6.0V
8
14
18
20
1000
Maximum Clock Input Rise
2.0V
1000
1000
and Fall Time
4.5V
500
500
500
6.0V
400
400
400
Power Dissipation Capacitance
OC
VCC
5
(Note 5) (per latch)
OC
GND
58
Maximum Input Capacitance
5
3
Units
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
pF
10
10
10
pF
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MM74HC574
AC Electrical Characteristics
MM74HC574
AC Electrical Characteristics
Symbol
COUT
Parameter
(Continued)
Conditions
VCC
Maximum Output
TA
25qC
Typ
15
TA
40 to 85qC TA 55 to 125qC
20
20
20
Capacitance
Note 5: CPD determines the no load dynamic power consumption, PD
IS CPD V CC f ICC.
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CPD VCC2 f ICC VCC, and the no load dynamic current consumption,
4
Units
Guaranteed Limits
pF
MM74HC574
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Package Number M20B
5
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MM74HC574
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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6
MM74HC574
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
7
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MM74HC574 3-STATE Octal D-Type Edge-Triggered Flip-Flop
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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