1 of 3 Creation Date : May 08, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012CH1V273J060AC TDK item description C2012CH1V273JT**** Applications Commercial Grade Feature General General (Up to 50V) Series C2012 [EIA 0805] Status Production Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 0.60mm ±0.15mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 27nF ±5% Rated Voltage 35VDC Temperature Characteristic CH(0±60ppm/°C) Q (Min.) 1000 Insulation Resistance (Min.) 10000MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Punched (Paper)Taping [180mm Reel] Package Quantity 4000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors 2 of 3 Creation Date : May 08, 2017 (GMT) C2012CH1V273J060AC Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Multilayer Ceramic Chip Capacitors C2012CH1V273J060AC Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 08, 2017 (GMT)