Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered. CY74FCT163827 20-Bit Buffer SCCS049 - March 1997 - Revised March 2000 Features Functional Description • Low power, pin-compatible replacement for LCX and LPT families • 5V tolerant inputs and outputs • 24 mA & 6 mA balanced drive outputs • Power-off disable outputs permits live insertion • Edge-rate control circuitry for reduced noise • FCT-C speed at 4.1 ns • Latch-up performance exceeds JEDEC standard no. 17 • Typical output skew < 250 ps • Industrial temperature range of –40˚C to +85˚C • TSSOP (19.6-mil pitch) or SSOP (25-mil pitch) • Typical Volp (ground bounce) performance exceeds Mil Std 883D • VCC = 2.7V to 3.6V • ESD (HBM) > 2000V Logic Block Diagrams CY74FCT163827 The CY74FCT163827 is a 20-bit buffer/line driver that provides high-performance bus interface buffering for wide data/address paths or buses carrying parity. It can be used as a single 20-bit buffer or two 10-bit buffers. Each 10-bit buffer has a pair of NANDed OE for increased flexibility. The CY74FCT163827 has 24-mA balanced output drivers with current limiting resistors in the outputs. This reduces the need for external terminating resistors and provides for minimal undershoot and reduced ground bounce. The inputs and outputs were designed to be capable of being driven by 5.0V buses, allowing its use in mixed voltage systems as a translator. The outputs are also designed with a power-off disable feature enabling its use in applications requiring live insertion. Pin Configuration SSOP/TSSOP Top View 1OE1 1OE1 1 56 1OE2 1Y1 2 55 1A 1 1Y2 3 54 1A 2 GND 4 53 GND 1Y3 5 52 1A 3 1Y4 6 51 1A 4 VCC 7 50 VCC 8 49 1A 5 1Y6 9 48 1Y7 10 1A 7 GND 1Y8 11 47 46 45 1A 8 1Y9 12 13 44 1A 9 1Y10 14 43 1A 10 2OE1 2Y1 15 42 2A 1 2OE2 2Y2 16 41 2A 2 2Y3 17 40 2A 3 GND 18 39 GND 2Y4 19 38 2A 4 2Y5 20 37 2A 5 2Y6 21 36 2A 6 VCC 2Y7 22 35 VCC 23 34 2A 7 1OE2 1Y1 1A1 1Y5 TO 9 OTHER CHANNELS 2A1 FCT163827-1 2Y1 TO 9 OTHER CHANNELS FCT163827-2 1A 6 GND 2Y8 24 GND 25 33 32 2Y9 26 31 2A 9 2Y10 27 30 2A10 2OE1 28 29 2OE2 Copyright 2A 8 GND © 2000, Texas Instruments Incorporated CY74FCT163827 Maximum Ratings[2, 3] Pin Description Name Description OE Output Enable Inputs (Active LOW) A Data Inputs Y Three-State Outputs (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................ −55°C to +125°C Ambient Temperature with Power Applied............................................ −55°C to +125°C Supply Voltage Range ..................................... 0.5V to +4.6V Function Table[1] DC Input Voltage .................................................−0.5V to +7.0V Inputs Outputs DC Output Voltage ..............................................−0.5V to +7.0V OE1 OE2 A Y L L L L DC Output Current (Maximum Sink Current/Pin) ...........................−60 to +120 mA L L H H Power Dissipation .......................................................... 1.0W H X X Z Operating Range X H X Z Range Commercial Ambient Temperature VCC –40°C to +85°C 2.7V to 3.6V Electrical Characteristics Over the Operating Range VCC=2.7V to 3.6V Parameter Description Test Conditions VIH Input HIGH Voltage All Inputs VIL Input LOW Voltage VH Input Hysteresis[5] VIK Input Clamp Diode Voltage VCC=Min., IIN=–18 mA IIH Input HIGH Current IIL Min. Typ.[4] 2.0 Max. Unit 5.5 V 0.8 100 –0.7 V mV – 1.2 V VCC=Max., VI=5.5 ±1 µA Input LOW Current VCC=Max., VI=GND ±1 µA IOZH High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=5.5V ±1 µA IOZL High Impedance Output Current (Three-State Output pins) VCC=Max., VOUT=GND ±1 µA IOS Short Circuit Current[6] VCC=Max., VOUT=GND –240 mA IOFF Power-Off Disable VCC=0V, VOUT≤4.5V ±100 µA ICC Quiescent Power Supply Current VIN≤0.2V, VIN>VCC–0.2V VCC=Max. 0.1 10 µA ∆ICC Quiescent Power Supply Current (TTL inputs HIGH) VIN=VCC–0.6V[7] VCC=Max. 2.0 30 µA –60 –135 Note: 1. H = HIGH Voltage Level, L = LOW Voltage Level, X = Don’t Care, Z = HIGH Impedance. 2. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 4. Typical values are at VCC=3.3V, TA = +25˚C ambient. 5. This parameter is specified but not tested. 6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. 7. Per TTL driven input; all other inputs at VCC or GND. 2 CY74FCT163827 Electrical Characteristics For Balanced Drive Devices Over the Operating Range VCC=2.7V to 3.6V Parameter Test Conditions Typ.[4] Max. Unit IODL Output LOW Dynamic Current VCC=3.3V, VIN=VIH or VIL, VOUT=1.5V 45 180 mA IODH Output HIGH Dynamic Current[6] VCC=3.3V, VIN=VIH or VIL, VOUT=1.5V –45 –180 mA VOH Output HIGH Voltage VCC=Min., IOH= –0.1 mA VOL Description [6] Output LOW Voltage Min. VCC–0.2 V VCC=Min., IOH= –8 mA 2.4[8] 3.0 VCC=3.0V, IOH= –24 mA 2.0 3.0 VCC=Min., IOL= 0.1mA V V 0.2 VCC=Min., IOL= 24 mA 0.3 V 0.55 Capacitance[5](TA = +25˚C, f = 1.0 MHz) Parameter Description Test Conditions Typ.[4] Max. Unit CIN Input Capacitance VIN = 0V 4.5 6.0 pF COUT Output Capacitance VOUT = 0V 5.5 8.0 pF Note: 8. VOH=VCC–0.6V at rated current. Power Supply Characteristics Parameter Description Test Conditions Typ.[4] Max. Unit ICCD Dynamic Power Supply Current[9] VCC=Max., One Input Toggling, VIN=VCC or 50% Duty Cycle, VIN=GND Outputs Open, OE=GND 50 75 µA/MHz IC Total Power Supply Current[10] VCC=Max., f1=10 MHz, 50% VIN=VCC or Duty Cycle, Outputs Open, One VIN=GND Bit Toggling, OE=GND VIN=VCC–0.6V or VIN=GND 0.5 0.8 mA 0.5 0.8 mA VIN=VCC or VCC=Max., f1=2.5 MHz, 50% Duty Cycle, Outputs Open, Six- VIN=GND teen Bits Toggling, OE=GND VIN=VCC–0.6V or VIN=GND 2.0 3.0[11] mA 2.0 3.3[11] mA 3 CY74FCT163827 Switching Characteristics Over the Operating Range VCC=3.0V to 3.6V[12,13] CY74FCT163827A CY74FCT163827C Description Min. Max. Min. Max. Unit Fig. No.[14] tPLH tPHL Propagation Delay Data to Output 1.5 4.8 1.5 4.1 ns 1, 3 tPZH tPZL Output Enable Time 1.5 6.2 1.5 5.8 ns 1, 7, 8 tPHZ tPLZ Output Disable Time 1.5 5.6 1.5 5.2 ns 1, 7, 8 tSK(O) Output Skew[15] 0.5 ns — Parameter 0.5 Notes: 9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. 10. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC+∆ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) DH = Duty Cycle for TTL inputs HIGH NT = Number of TTL inputs at DH ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 N1 = Number of inputs changing at f1 All currents are in milliamps and all frequencies are in megahertz. 11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 12. Minimum limits are guaranteed but not tested on Propagation Delays. 13. For VCC =2.7, propagation delay, output enable and output disable times should be degraded by 20%. 14. See “Parameter Measurement Information” in the General Information section. 15. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design. Ordering Information CY74FCT163827 Speed (ns) 4.1 4.8 Ordering Code Package Name Package Type CY74FCT163827CPACT Z56 56-Lead (240-Mil) TSSOP CY74FCT163827CPVC/PVCT O56 56-Lead (300-Mil) SSOP CY74FCT163827APVC/PVCT O56 56-Lead (300-Mil) SSOP 4 Operating Range Commercial Commercial CY74FCT163827 Package Diagrams 56-Lead Shrunk Small Outline Package O56 56-Lead Thin Shrunk Small Outline Package Z56 5 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated