Sony CXG1027TM Driver amplifier for transmission Datasheet

CXG1027TM
Driver Amplifier for Transmission
Description
The CXG1027TM is a two-stage driver amplifier for
800 MHz and 1.5 GHz PDC. This is used to amplify
the transmission-side power of the RF signal.
Features
• Ultraminiature package (10 pin TSSOP)
• Low voltage operation
: 2.9 V (Min.)
• Low current consumption
: 45 mA (Typ.)
• High gain
: 27.5 dB (Typ.) (for 1.5 GHz)
29.5 dB (Typ.) (for 800 MHz)
• Low distortion (Adjacent channel leak power ratio)
: –50 dBc (Typ.) (30 kHz offset)
–69 dBc (Typ.) (50 kHz offset)
• Positive power supply operation
(Adjustment-free for VGG)
• Supports both 800 MHz and 1.5 GHz by the
external matching circuit
Applications
Power amplification between the quadrature
modulator IC for 800 MHz/1.5 GHz PDC transmitter
(approx. –15 dBm output) and the power module or
power amplifier MMIC (approx. +10 dBm input)
10 pin TSSOP (Plastic)
Absolute Maximum Ratings (Ta=25 °C)
• Supply voltage
VDD
6
• Operating temperature
Topr
–35 to +85
• Storage temperature
Tstg
–65 to +150
• Allowable power dissipation
PD
550
mW
• Voltage between gate and source
VGSO
15
• Drain current
150
V
mA
Operating Condition
Supply voltage
VDD
VGG
3.4
0.2
V
°C
°C
V
V
Structure
GaAs MMIC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E97223-TE
CXG1027TM
Electrical Characteristics
VGG=0.2 V, VDD=3.4 V, f=941.5 MHz
∗1
∗1
∗2
∗2
(Ta=25 °C)
Item
Current consumption
Output power
Power gain
Adjacent channel leak power ratio
(30 kHz offset)
Adjacent channel leak power ratio
(50 kHz offset)
Symbol
IDD
POUT
GP
Min.
Typ.
45
Max.
65
29.5
32
Unit
mA
dBm
dB
ACPR30
–50
–47
dBc
ACPR50
–69
–65
dBc
10
27
VGG=0.2 V, VDD=3.4 V, f=1.441 GHz
(Ta=25 °C)
Item
∗1 Current consumption
Output power
∗1 Power gain
∗2 Adjacent channel leak power ratio
(30 kHz offset)
∗2 Adjacent channel leak power ratio
(50 kHz offset)
∗1 : When +10 dBm output
Symbol
IDD
Min.
Typ.
45
Max.
65
27.5
30
Unit
mA
dBm
dB
POUT
GP
10
25
ACPR30
–50
–47
dBc
ACPR50
–69
–65
dBc
∗2 : When +10 dBm output, 21 kHz band width
Block Diagram
Package Description/Pin Configuration
1
VDD1
10
GND
GND
GND (CAP)
GND (CAP)
RFOUT/VDD2
RFIN
RFIN
RFOUT/VDD2
VGG
GND (1.5GHz) or
GND (IND) (800MHz)
VDD1
VGG
GND
10pin TSSOP (PLASTIC)
—2—
CXG1027TM
Recommended Circuit
(For 800 MHz)
1
Cp
1000pF
10
R1
15Ω
2
9
C2
10pF
C1
100pF
3
RFOUT
L1
33nH
8
RFIN
L4
12nH
Cp
1000pF
Cp
1000pF
L2
39nH
4
7
5
6
L3
8.2nH
R2
12Ω
VGG
Cp
1000pF
L5
5.6nH
VDD
Cp
1000pF
(For 1.5 GHz)
1
Cp
1000pF
10
R1
15Ω
2
9
C1
100pF
C2
4pF
3
RFOUT
L1
18nH
8
L4
4.7nH
Cp
1000pF
Cp
1000pF
4
7
5
6
RFIN
L2
18nH
L3
10nH
R2
12Ω
VGG
Cp
1000pF
VDD
Cp
1000pF
—3—
CXG1027TM
Recommended Evaluation Board
(For 800 MHz)
25mm
VDD
Cp
L4
Cp
L2
C1
C2
RFOUT
Cp
Cp
L1
R1
RFIN
L5
Cp
L3 R 2
GND
VGG
GND
(For 1.5 GHz)
GND
VDD
Cp
L3 R 2
VGG
Cp
L2
C1
C2
RFOUT
Cp
Cp
L1
R1
RFIN
L4
Cp
GND
Glass fabric-base epoxy 4-layer board (Thickness : 0.3 mm × 2)
GND for the overall 2nd, 3rd and 4th sides
—4—
CXG1027TM
Example of Representative Characteristics (Ta=25 °C)
POUT, Gain, IDD, ACPR vs. PIN
Freq.=1.441GHz, VDD=3.4V, VGG=0.2V
30
–20
Gain
10
–40
POUT
0
–50
60
ACPR50
ACPR30
–10
50
IDD
–20
–40
–30
ACPR [dBc]
–30
–20
–10
PIN [dBm]
0
IDD [mA]
POUT [dBm]
Gain [dB]
20
–60
–70
40
POUT, Gain, IDD, ACPR vs. VDD
Freq.=1.441GHz, VGG=0.2V, PIN=–18dBm
30
–20
Gain
POUT
–40
60
ACPR30
–10
50
IDD
ACPR50
–20
2.0
2.5
3.0
3.5
4.0
VDD [V]
4.5
–50
IDD [mA]
0
40
5.5
5.0
–70
Gain, ACPR vs. IDD
Freq.=1.441GHz, POUT=10dBm, VDD=3.4V, VGG=var.
30
–20
Gain
20
–40
ACPR30
0
–50
–10
–60
ACPR50
–20
20
30
40
50
IDD [mA]
60
—5—
70
80
–70
ACPR [dBc]
–30
10
–60
ACPR [dBc]
–30
10
Gain [dB]
POUT [dBm]
Gain [dB]
20
CXG1027TM
Unit : mm
10PIN TSSOP(PLASTIC)
1.2MAX
∗2.8 ± 0.1
0.1
10
6
+ 0.15
0.1 – 0.05
0.45 ± 0.15
3.2 ± 0.2
∗2.2 ± 0.1
5
1
0.5
0.22
0.1
0.25
0° to 10°
M
A
(0.1)
+ 0.025
0.12 – 0.015
Package Outline
(0.2)
+ 0.08
0.22 – 0.07
DETAIL A
NOTE: “∗” Dimensions do not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
LEAD MATERIAL
COPPER ALLOY
JEDEC CODE
PACKAGE MASS
0.02g
SONY CODE
TSSOP-10P-L01
—6—
Similar pages