NICHIA STS-DA1-3168D <Cat.No.150527> NICHIA CORPORATION SPECIFICATIONS FOR AMBER LED NFSA172AT ● ● ● ● Pb-free Reflow Soldering Application Built-in ESD Protection Device RoHS Compliant TS16949 Compliant NICHIA STS-DA1-3168D <Cat.No.150527> SPECIFICATIONS (1) Absolute Maximum Ratings Symbol Absolute Maximum Rating Unit Forward Current Item IF 250 mA Pulse Forward Current IFP 350 mA Allowable Reverse Current IR 85 mA Power Dissipation PD 825 mW Operating Temperature Topr -40~125 °C Storage Temperature Tstg -40~125 °C Junction Temperature TJ 150 °C * Absolute Maximum Ratings at TS=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%. (2) Initial Electrical/Optical Characteristics Symbol Condition Typ Max Unit Forward Voltage Item VF IF=150mA 3.0 - V Luminous Flux Φv IF=150mA 27 - lm x - IF=150mA 0.57 - - y - IF=150mA 0.42 - - Chromaticity Coordinate Thermal Resistance RθJS_real - 24.6 32.0 °C/W RθJS_el - 19.8 25.7 °C/W * Characteristics at TS=25°C. * Luminous Flux value as per CIE 127:2007 standard. * Chromaticity Coordinates as per CIE 1931 Chromaticity Chart. * RθJS_real are decided by taking into account energy conversion efficiency. Please refer to JESD51. 1 NICHIA STS-DA1-3168D <Cat.No.150527> RANKS Item Forward Voltage Luminous Flux Rank - Min Max Unit V 2.7 3.3 P11 30.3 36.0 P10 25.5 30.3 P9 21.4 25.5 lm Color Rank Rank L3 x 0.576 0.549 0.562 0.589 y 0.407 0.425 0.438 0.411 * Ranking at TS=25°C. * Forward Voltage Tolerance: ±0.05V * Luminous Flux Tolerance: ±7% * Chromaticity Coordinate Tolerance: ±0.01 * LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia. 2 NICHIA STS-DA1-3168D <Cat.No.150527> CHROMATICITY DIAGRAM 0.50 580 585 0.45 y L3 590 0.40 595 600 0.35 0.30 0.45 0.50 0.55 0.60 0.65 x 3 NICHIA STS-DA1-3168D <Cat.No.150527> (2.3) 1 2.7 3 OUTLINE DIMENSIONS 4 NICHIA STS-DA1-3168D <Cat.No.150527> SOLDERING • Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec Pre-heat 180 to 200°C • Recommended Hand Soldering Condition Temperature 350°C Max Soldering Time 3sec Max 260°CMax 10sec Max 60sec Max Above 220°C 120sec Max 3 ● Recommended Soldering Pad Pattern * This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability. * Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once. * Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature. * Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * When soldering, do not apply stress to the LED while the LED is hot. * When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface and may also cause the LED not to illuminate. * The recommended soldering pad pattern is designed for attachment of the LED without problems. When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the LEDs. * Make sure that there are no issues with the type and amount of solder that is being used. 5 NICHIA STS-DA1-3168D <Cat.No.150527> TAPE AND REEL DIMENSIONS 3.5±0.05 Cathode Mark 4±0.1 Nxxx172x STS-DA7-0064C (単位 Unit: mm) 0.2±0.05 3.3±0.1 2±0.05 1.75±0.1 4±0.1 Φ 1.5+0.1 -0 管理番号 No. 8+0.3 -0.1 テーピング部 Tape Φ 1+0.25 -0 1.05±0.1 3.3±0.1 エンボスキャリアテープ Embossed Carrier Tape トレーラ部/リーダ部 Trailer and Leader トップカバーテープ Top Cover Tape 引き出し方向 Feed Direction トレーラ部MIN 160mm（空部） Trailer 160mm MIN (Empty Pockets) LED装着部 Loaded Pockets 引き出し部MIN 100mm（空部） Leader with Top Cover Tape 100mm MIN (Empty Pocket) リーダ部MIN 400mm Leader without Top Cover Tape 400mm MIN リール部 Reel 180+0 -3 11.4±1 9±0.3 * 数量は1リールにつき 4000個入りです。 Reel Size: 4000pcs Φ * JIS C 0806電子部品テーピングに準拠しています。 The tape packing method complies with JIS C 0806 (Packaging of Electronic Components on Continuous Tapes). 8 0. ± 21 8 ±0.2 ラベル Label Φ 13 ± 0. 2 f 13 Φ 60+1 -0 f2 1 ±0. * 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、 エンボスキャリアテープを強く(10N以上)締めないで下さい。 LEDがカバーテープに貼り付く可能性があります。 When the tape is rewound due to work interruptions, no more than 10N should be applied to the embossed carrier tape. The LEDs may stick to the top cover tape. 6 NICHIA STS-DA1-3168D <Cat.No.150527> PACKAGING - TAPE & REEL 7 NICHIA STS-DA1-3168D <Cat.No.150527> LOT NUMBERING CODE Lot Number is presented by using the following alphanumeric code. YMxxxx - RRR Y - Year Year Y 2014 E 2015 F 2016 G 2017 H 2018 I 2019 J M - Month Month M Month M 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 A 5 5 11 B 6 6 12 C xxxx-Nichia's Product Number RRR-Ranking by Color Coordinates, Ranking by Luminous Flux 8 NICHIA STS-DA1-3168D <Cat.No.150527> DERATING CHARACTERISTICS NFSx172A 管理番号 No. STS-DA7-6241C 周囲温度-許容順電流特性 Ambient Temperature vs Allowable Forward Current Derating1 はんだ接合部温度(カソード側)-許容順電流特性 Solder Temperature(Cathode Side) vs Allowable Forward Current Derating2 RθJA =95°C/W 300 300 (125, 250) (75, 250) 250 許容順電流 200 150 100 (125, 83.0) 50 0 30 60 150 100 50 90 120 150 0 30 60 90 120 周囲温度 はんだ接合部温度(カソード側) Ambient Temperature(°C) Solder Temperature(Cathode Side)(°C) デューティー比-許容順電流特性 Duty Ratio vs Allowable Forward Current Duty 1000 Allowable Forward Current(mA) 200 0 0 許容順電流 Allowable Forward Current(mA) 許容順電流 Allowable Forward Current(mA) 250 150 T A =25°C 350 250 100 10 1 10 100 デューティー比 Duty Ratio(%) 9 NICHIA STS-DA1-3168D <Cat.No.150527> OPTICAL CHARACTERISTICS NFSA172A 管理番号 No. STS-DA7-6180B * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 発光スペクトル Spectrum TA =25°C IFP=150mA Spectrum 1.0 相対発光強度 Relative Emission Intensity(a.u.) 0.8 0.6 0.4 0.2 0.0 400 450 500 550 600 650 700 750 800 波長 Wavelength(nm) Directivity1 指向特性 Directivity -10° 0° TA =25°C IFP=150mA 10° -20° 20° 30° -30° 40° 放射角度 Radiation Angle -40° 50° -50° -60° 60° 70° -70° 80° -80° -90° 90° 1 0.5 0 0.5 1 相対照度 Relative Illuminance(a.u.) 10 NICHIA STS-DA1-3168D <Cat.No.150527> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NFSA172A 管理番号 No. STS-DA7-6181B * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 周囲温度-順電圧特性 Ambient Temperature vs Forward Voltage VfIf TA =25°C 1000 4.0 350 3.5 順電圧 Forward Voltage(V) 順電流 Forward Current(mA) 順電圧-順電流特性 Forward Voltage vs Forward Current 150 100 TaVf IFP=150mA 3.0 2.5 10 2.0 2.0 2.5 3.0 3.5 4.0 -60 -30 順電圧 Forward Voltage(V) 30 60 90 120 150 周囲温度 Ambient Temperature(°C) 周囲温度-相対光束特性 Ambient Temperature vs Relative Luminous Flux IfIv TA =25°C 2.5 1.4 2.0 1.2 相対光束 Relative Luminous Flux(a.u.) 相対光束 Relative Luminous Flux(a.u.) 順電流-相対光束特性 Forward Current vs Relative Luminous Flux 0 1.5 1.0 0.5 TaIv IFP=150mA 1.0 0.8 0.6 0.0 0.4 0 100 200 300 順電流 Forward Current(mA) 400 -60 -30 0 30 60 90 120 150 周囲温度 Ambient Temperature(°C) 11 NICHIA STS-DA1-3168D <Cat.No.150527> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NFSA172A 管理番号 No. STS-DA7-6182B * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 順電流-色度 特性 Forward Current vs Chromaticity Coordinate Ifxy TA =25°C 0.44 y 0.43 150mA 350mA 0.42 20mA 0.41 0.56 0.57 0.58 0.59 x 周囲温度-色度 特性 Ambient Temperature vs Chromaticity Coordinate Taxy IFP= 150mA 0.44 y 0.43 -40°C 0°C 0.42 25°C 125°C 0.41 0.56 0.57 0.58 0.59 x 12 NICHIA STS-DA1-3168D <Cat.No.150527> RELIABILITY (1) Tests and Results Reference Test Standard Resistance to Test Test Conditions Duration JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Reflow Soldering) 303 303A Lead-free Solder(Sn-3.0Ag-0.5Cu) Soldering Heat (Reflow Soldering) JEITA ED-4701 Thermal Shock 300 307 #2 0/22 100cycles #1 0/50 100cycles #1 0/50 10cycles #1 0/50 TA=125°C 1000hours #1 0/50 TA=60°C, RH=90% 1000hours #1 0/50 TA=-40°C 1000hours #1 0/50 1000hours #1 0/50 1000hours #1 0/50 1000hours #1 0/50 1000hours #1 0/50 1time #1 0/22 48minutes #1 0/10 #1 0/22 -40°C to 100°C, 1min dwell, 10sec transfer, Precondition: 30°C, 70%RH, 168hr -40°C(30min)~25°C(5min)~ 100°C(30min)~25°C(5min) Moisture Resistance JEITA ED-4701 25°C~65°C~-10°C, 90%RH, (Cyclic) 200 203 24hr per cycle High Temperature JEITA ED-4701 Storage 200 201 Temperature Humidity JEITA ED-4701 Storage 100 103 Low Temperature JEITA ED-4701 Storage 200 202 Room Temperature TA=25°C, IF=250mA Operating Life Test board: See NOTES below High Temperature TA=125°C, IF=80mA Operating Life Test board: See NOTES below Temperature Humidity 60°C, RH=90%, IF=200mA Operating Life Test board: See NOTES below Low Temperature TA=-40°C, IF=150mA Operating Life Test board: See NOTES below Vibration Electrostatic Discharges Failed/Tested 0/22 100 105 Permanence of Marking # Units #1 JEITA ED-4701 Temperature Cycle Failure Criteria JEITA ED-4701 Isopropyl Alcohol, 23±5°C, 500 501 Dipping Time: 5min JEITA ED-4701 200m/s2, 100~2000~100Hz, 400 403 4cycles, 4min, each X, Y, Z JEITA ED-4701 HBM, 2kV, 1.5kΩ, 100pF, 3pulses, 300 304 alternately positive or negative NOTES: 1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈95°C/W 2) Measurements are performed after allowing the LEDs to return to room temperature. (2) Failure Criteria Criteria # #1 #2 Items Conditions Failure Criteria Forward Voltage(VF) IF=150mA >Initial value×1.1 Luminous Flux(ΦV) IF=150mA <Initial value×0.7 Solderability - Less than 95% solder coverage 13 NICHIA STS-DA1-3168D <Cat.No.150527> CAUTIONS (1) Storage Conditions Storage Temperature Humidity Time Before Opening Aluminum Bag ≤30°C ≤90%RH Within 1 Year from Delivery Date After Opening Aluminum Bag ≤30°C ≤70%RH ≤168hours 65±5°C - ≥24hours Baking ● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details. ● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. Products are packed in moisture-proof aluminum bags to minimize moisture absorption during transportation and storage. Included silica gel desiccants change from blue to red if moisture had penetrated bags. ● After opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants in a hermetically sealed container, preferably the original moisture-proof bags for storage. ● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. Baking should only be done once. ● Although the leads or electrode pads (anode and cathode) of the product are plated with gold, prolonged exposure to a corrosive environment might cause the gold plated the leads or electrode pads to tarnish, and thus leading to difficulties in soldering. If unused LEDs remain, they must be stored in a hermetically sealed container. Nichia recommends using the original moisture-proof bag for storage. ● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur. The contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. ● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions. ● Do not store the LEDs in a dusty environment. ● Do not expose the LEDs to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) Directions for Use ● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating. Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended. If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation in Forward Voltage characteristics of the LEDs. ... ... ● This product should be operated using forward current. Ensure that the product is not subjected to either forward or reverse voltage while it is not in use. In particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the LED die. When used in displays that are not used for a long time, the main power supply should be switched off for safety. ● It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics. ● Ensure that excessive voltages such as lightning surges are not applied to the LEDs. ● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. 14 NICHIA STS-DA1-3168D <Cat.No.150527> (3) Handling Precautions ● Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics: it might cause the LED to be deformed and/or the wire to break, which will cause the LED not to illuminate. ● When handling the product with tweezers, be careful not to apply excessive force to the resin. Otherwise, The resin can be cut, chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures. ● Dropping the product may cause damage. ● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures. (4) Design Consideration ● PCB warpage after mounting the products onto a PCB can cause the package to break. The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist. ● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines. The LED should be placed in a way to minimize the stress on the LEDs due to board flexing. ● Board separation must be performed using special jigs, not using hands. ● If an aluminum PCB is used, customer is advised to verify the PCB with the products before use. Thermal stress during use can cause the solder joints to crack. (5) Electrostatic Discharge (ESD) ● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials ● Ensure that tools (e.g. soldering irons), jigs and machines that are being used are properly grounded and that proper grounding techniques are used in work areas. For devices/equipment that mount the LEDs, protection against surge voltages should also be used. ● If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers ● The customer is advised to check if the LEDs are damaged by ESD when performing the characteristics inspection of the LEDs in the application. Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA). ● ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current. Failure Criteria: VF<2.0V at IF=0.5mA 15 NICHIA STS-DA1-3168D <Cat.No.150527> (6) Thermal Management ● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature does not exceed the maximum Junction Temperature (TJ). ● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product. ● The following equations can be used to calculate the junction temperature of the products. 1) TJ=TA+RθJA･W 2) TJ=TS+RθJS･W *TJ=LED junction temperature: °C TA=Ambient temperature: °C TS=Soldering temperature (cathode side): °C RθJA=Thermal resistance from junction to ambient: °C/W RθJS=Thermal resistance from junction to TS measuring point: °C/W W=Input power(IF×VF): W (7) Cleaning ● The LEDs should not be cleaned with water, benzine, and/or thinner. ● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs due to the damage to the resin portion. The effects of such solvents should be verified prior to use. In addition, the use of CFCs such as Freon is heavily regulated. ● When dust and/or dirt adheres to the LEDs, soak a cloth with Isopropyl alcohol (IPA), then squeeze it before wiping the LEDs. ● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs depending on the ultrasonic power and how LED is assembled. If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning. (8) Eye Safety ● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps and lamp systems, which added LEDs in its scope. On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope. However, please be advised that some countries and regions have adopted standards based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope. Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1. High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2. Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs with optical instruments which may greatly increase the damages to your eyes. ● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) Others ● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). ● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis. ● The specifications and appearance of this product may change without notice; Nichia does not guarantee the contents of this specification. Both the customer and Nichia will agree on the official specifications of supplied products before the volume production of a program begins. 16