Cypress CY5057 High-frequency flash programmable pll die with spread spectrum Datasheet

CY5057
High-Frequency Flash Programmable
PLL Die with Spread Spectrum
Features
Benefits
■
Flash programmable die for in-package programming of crystal
oscillators
■
■
High resolution phase-locked loop (PLL) with 10-bit multiplier
and 7-bit divider
Enables quick turnaround of custom oscillators and lowers
inventory costs through stocking blank parts. In addition, the
part may be Flash programmed up to 100 times. This reduces
programming errors and provides an easy upgrade path for
existing designs.
■
Flash programmable capacitor tuning array
■
■
Simple two-pin programming interface (excluding VDD and
VSS pins)
Enables synthesis of highly accurate and stable output clock
frequencies with zero or low PPM.
■
■
On-chip oscillator used with external 25.1 MHz fundamental
tuned crystal
Enables fine tuning of output clock frequency by adjusting the
load capacitance of the crystal.
■
Allows the device to go into standard 4 or 6-pin packages.
■
Flash programmable spread spectrum with spread
percentages between ± 0.25% and ± 2.00%
■
Lowers cost of oscillator, because PLL may be programmed to
a high frequency using a low frequency, low cost crystal.
■
Spread spectrum on/off function
■
Provides various spread percentage.
■
Operating frequency: 5 MHz to 170 MHz at 3.3 V ± 10%
■
■
Seven-bit linear post divider with divide options from
divide-by-2 to divide-by-127
Provides the ability to enable or disable spread spectrum with
an external pin.
■
Provides flexibility in output configurations and testing.
■
Programmable PD# or OE pin
■
Enables low power operation or output enable function.
■
Provides flexibility for system applications through selectable
instantaneous or synchronous change in outputs.
■
Suitable for most PC, consumer, and networking applications.
■
Has lower EMI than oscillators.
■
Easy to use software support for design entry.
■
Programmable asynchronous or synchronous OE and PD#
modes
■ Low jitter output: < 200 ps (pk-pk) at 3.3 V ± 10%
■
Controlled rise and fall times and output slew rate
■
Software configuration support
Logic Block Diagram
XIN
XOUT
SSON#
Crystal Osc
with 8-bit
Cap Array
7-bit
÷Q
10-bit
÷P
7-bit
Output
Divider
Block
100- to
400-MHz
PLL
OUT
Spread
Spectrum
PD#/OE
Cypress Semiconductor Corporation
Document #: 38-07363 Rev. *I
Flash Configuration/
Spread Spectrum Storage
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 21, 2011
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CY5057
Die Pad
Figure 1. Die Pad Diagram
Note
Active die size: X = 75.0 mils / 1907 μm
Y = 56.2 mils / 1428 μm
Scribe: X (vertical) = 3.4 mils / 86.2 μm
Y (horizontal) = 2.8 mils / 71 μm
Bond pad opening: 85 μm x 85 μm
Pad pitch: 125 μm x 125 μm
(pad center to pad center)
Wafer thickness: 11 mils typical
Table 1. Die Pad Definitions [Pad coordinates are referenced from the center of the die (X = 0, Y = 0)]
Name
Die Pad
Description
X Coordinate
Y Coordinate
–843.612
597.849, 427.266
883.743, 887.355
–563.304, –369.957
–843.612
–1.806
VDD
1,2
Power supply
VSS
6,7
Ground
XIN
4
Crystal gate pin
XOUT
3
Crystal drain pin
–843.612
236.565
5
Flash programmable to function as power down or output enable
in normal operating mode. Weak pull up is enabled by default.
–843.612
–424.662
834.183
589.848
PD#/OE
VPP
Super voltage when going into programming mode.
SDA
SSON#
Data pin when going into and when in programming mode.
10
SCL
Active low spread spectrum control. Asserting LOW turns the
internal modulation waveform on. Strong pull down is enabled by
default. Pull down is disabled in power down mode.
Clock pin in programming mode. Must be double bonded to the
OUT pad for pinouts not using the SSON# function. There is an
internal pull down resistor on this pad.
OUT
9
Clock output. There is an internal pull down resistor on this pad.
Weak pull down is enabled by default. Default output is from the
reference.
834.183
462.840
NC
8
No connect pin (do not connect this pad).
834.183
335.832
Document #: 38-07363 Rev. *I
Page 2 of 11
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CY5057
Functional Description
PLL Output Frequency
CY5057 is a Flash programmable, high accuracy, PLL-based die
designed for the crystal oscillator market. It also contains spread
spectrum circuitry that is enabled or disabled with an external
pin. The die is integrated with a low cost 25.1 MHz fundamental
tuned crystal in a 4 or 6-pin through hole or surface mount
package. The oscillator devices may be stocked as blank parts
and custom frequencies programmed in-package at the last
stage before shipping. This enables faster manufacturing of
custom and standard crystal oscillators without the need for
dedicated and expensive crystals.
CY5057 contains a high resolution PLL with a 10-bit multiplier
and a 7-bit divider. The output frequency of the PLL is
determined by the following equation:
CY5057 contains an on-chip oscillator and unique oscillator
tuning circuit for fine tuning the output frequency. The crystal
Cload is selectively adjusted by programming a set of Flash
memory bits. This feature is used to compensate for crystal
variations or to obtain a more accurate synthesized frequency.
CY5057 uses a simple two-pin programming interface, excluding
the VSS and VDD pins.. Clock outputs are generated from 5 MHz
to 170 MHz at 3.3 V ± 10% operating voltage. You can reprogram
the entire Flash configuration multiple times to alter or reuse the
programmed inventory.
CY5057 PLL die is designed for very high resolution. It has a
10-bit feedback counter multiplier and a 7-bit reference counter
divider. This enables the synthesis of highly accurate and stable
output clock frequencies with zero or low PPM error. The output
of the PLL or the oscillator is further modified by a 7-bit linear
post divider with a total of 126 divider options (2 to 127).
CY5057 also contains flexible power management controls.
These parts include both power down mode (PD# = 0) and
output enable mode (OE = 1). The power down and output
enable modes have an additional setting to determine timing
(asynchronous or synchronous) with respect to the output signal.
Controlled rise and fall times, unique output driver circuits, and
innovative circuit layout techniques enables CY5057 to have low
jitter and accurate outputs. This makes it suitable for most PC,
networking, and consumer applications.
CY5057 also has an additional spread spectrum feature that is
disabled or enabled with an external pin. For more information,
refer the section Spread Spectrum.
Flash Configuration and Spread Spectrum
Storage Block
Table 2 summarizes the features configurable by the Flash
memory bits. Refer to “CY5057 Programming Specification” for
programming details. The specification can be obtained from
your Cypress factory representative.
Table 2. Flash Programmable Features
Adjust
Frequency
Feedback counter value (P)
Reference counter value (Q)
Output divider selection
Oscillator tuning (load capacitance values)
Oscillator direct output
Power management mode (OE or PD#)
Power management timing (synchronous or asynchronous)
Spread spectrum
Pull up and Pull down resistors
Document #: 38-07363 Rev. *I
2 • ( P BL + 4 ) + Po
F PLL = ---------------------------------------------- • F REF
(QL + 2)
Equation (1)
In this equation:
■
QL is the loaded or programmed reference counter value
(Q counter)
■
PBL is the loaded or programmed feedback counter value
(P counter)
■
Po is the P offset bit (is only 0 or 1)
In spread spectrum mode, the time averaged P value is used to
calculate the average frequency.
Power Management Features
CY5057 contains Flash programmable PD# (active LOW) and
OE (active HIGH) functions. If power down mode is selected
(PD# = 0), the oscillator and PLL are placed in a low supply
current standby mode and the output is tri-stated and weakly
pulled low. The oscillator and PLL circuits must relock when the
part leaves power down mode. If output enable mode is selected
(OE = 0), the output is tri-stated and weakly pulled low. In this
mode, the oscillator and PLL circuits continue to operate allowing
a rapid return to normal operation when the output is enabled.
In addition, the PD# and OE modes may be programmed to
occur synchronously or asynchronously with respect to the
output signal. When the asynchronous setting is used, the power
down or output disable occurs immediately (allowing for logic
delays) irrespective of the position in the clock cycle. However,
when the synchronous setting is used, the part waits for a falling
edge at the output before power down or output enable signal is
initiated. This prevents output glitches. In asynchronous or
synchronous setting, the output is always enabled
synchronously by waiting for the next falling edge of the output.
Spread Spectrum
CY5057 contains spread spectrum with Flash programmable
spread percentage and modulation frequency. Center spread
nonlinear “hershey kiss” modulation is obtained. Spread
percentage is programmed to values between ±0.25% and
±2.00%, in 0.25% intervals. Only one spread profile (for one
specific percentage spread and for one output frequency) may
be programmed into the device at a time.
CY5057 has a spread spectrum on and off function. The spread
spectrum is enabled or disabled through an external pin. Timing
this feature is explained in the section Switching Waveforms on
page 7.
Page 3 of 11
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CY5057
Figure 2. Crystal Oscillator Tuning Circuit
RF
XIN
XOUT
CXOUT
CXIN
C7
C6
C5
C4
C3
C2
C1
C0
Table 3. Crystal Oscillator Tuning Cap Values
Bit[1]
Capacitance per Bit (pF)
C7 (MSB)
24.32
C6
12.16
C5
6.08
C4
3.04
C3
1.52
C2
0.76
C1
0.38
C0 (LSB)
0.19
C0
C1
C2
C3
C4
C5
C6
C7
Inkless Die Pick Map (DPM) Format
Cypress ships inkless wafers to customers with an
accompanying die pick map, which is used to determine the good
die for assembly and programming. Customers can also access
individual DPM files at their convenience through
ftp.cypress.com with a valid user account login and password.
Contact your local Cypress Field Application Engineer (FAE) or
sales representative for a customer FTP account. The DPM files
are named using the fab lot number and wafer number scribed
on the wafer. The DPM files are transferred to the FTP account
of the customer when the factory ships out the wafers against
their purchase order (PO).
Note
1. CXIN, CXOUT, and parasitic capacitance due to fixture and package must be included when calculating the total capacitance.
Document #: 38-07363 Rev. *I
Page 4 of 11
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CY5057
Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. User guidelines are not tested.
Data retention at Tj = 125°C..................................> 10 years
Supply voltage .................................................. –0.5 to 7.0 V
Input voltage ............................................–0.5 V to VDD + 0.5
Static discharge voltage.......................................... > 2000 V
(per MIL-STD-883, method 3015)
Storage temperature (noncondensing) ......... –55°C to 125°C
Output (pad 9) sink or sources current ........20 mA maximum
Maximum non volatile programming cycles......................100
Junction temperature................................... –40°C to 125°C
Operating Conditions
Parameter
VDD
[2]
Description
Min
Max
Unit
Supply voltage (3.3 V)
3.0
3.6
V
–40
100
°C
–
15
pF
25.1
25.1
MHz
TAJ
Operating temperature, junction
CLC
Maximum capacitive load on the output (CMOS levels spec)
VDD = 3.0 V to 3.6 V, output frequency = 5 MHz to 170 MHz
XREF
Reference frequency with spread spectrum disabled. Fundamental tuned crystals
only
Cin
Input capacitance (except crystal pins)
–
7
pF
CXIN
Crystal input capacitance (all internal caps off)
10
14
pF
CXout
Crystal output capacitance (all internal caps off)
10
14
pF
TPSRT
Power up time for all VDDs to reach minimum specified voltage
(power ramps must be monotonic)
0.005
500
ms
Min
Max
Unit
DC Electrical Characteristics (Tj = -40 to 100°C)
Parameter
Description
Test Conditions
VIL
Input low voltage
PD#/OE and SSON# pins
VDD = 3.0 V–3.6 V
–
0.3*VDD
V
VIH
Input high voltage
PD#/OE and SSON# pins
VDD = 3.0 V–3.6 V
0.7*VDD
–
V
VOL
Output low voltage, OUT pin
VDD = 3.0 V–3.6 V, IOL = 8 mA
–
0.4
V
VOH
Output high voltage, CMOS
levels
VDD = 3.0 V–3.6 V, IOH = –8 mA
VDD – 0.4
–
V
IILPDOE
Input low current, PD#/OE pin
VIN = VSS
(Internal pull up = 3 MΩ typical)
–
10
μA
IIHPDOE
Input high current, PD#/OE pin
VIN = VDD
(Internal pull up = 100 kΩ typical)
–
10
μA
IILSR
Input low current, SSON# pin
VIN = VSS
(Internal pull down = 100 kΩ typical)
–
10
μA
IIHSR
Input high current, SSON# pin
VIN = VDD
(Internal pull down = 100 kΩ typical)
–
50
μA
IDD
Supply current
No load, VDD = 3.0 V–3.6 V, Fout = 170 MHz
–
50
mA
IOZ
Output leakage current, OUT pin VDD = 3.0 V–3.6 V, output disabled with OE
–
50
μA
IPD
Standby current
VDD = 3.0 V–3.6 V, device powered down with
PD#
–
50
μA
RUP
Pull up resistor on PD#/OE pin
VDD = 3.0 V–3.6 V, measured at VIN =VSS
VDD = 3.0 V–3.6 V, measured at VIN = 0.7 VDD
1
80
6
150
MΩ
kΩ
RDN
Pull down resistor on SSON#
and OUT pins
VDD = 3.0 V–3.6 V, measured at VIN = 0.5 VDD
80
150
kΩ
Rf
Crystal feedback resistor
VDD = 3.0 V–3.6 V, measured at XIN = 0
100
–
kΩ
Document #: 38-07363 Rev. *I
Page 5 of 11
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CY5057
AC Electrical Characteristics (Tj = –40 to 100°C)
Parameter[2]
Description
Test Conditions
Min
Max
Unit
Fout
Output frequency
VDD = 3.0 V–3.6 V, CL = 15 pF
5
170
MHz
tr
OUT rise time
VDD = 3.0 V–3.6 V, 20% to 80% VDD, CL = 15 pF
–
2.7
ns
tf
OUT fall time
VDD = 3.0 V–3.6 V, 80% to 20% VDD, CL = 15 pF
–
2.7
ns
DC
OUT duty cycle
Divider output, measured at VDD/2
Crystal direct output, measured at VDD/2
45
40
55
60
%
%
tJ1
Peak-to-peak period jitter Fout >133 MHz, VDD/2, SS off
25 MHz < Fout< 133 MHz, VDD/2, SS off
–
200
ps
400
ps
1% of 1/Fout
s
Fout< 25 MHz, VDD/2, SS off
tJ2
Cycle-to-cycle jitter
Fout >133 MHz, VDD/2, SS on
–
25 MHz < Fout< 133 MHz, VDD/2, SS on
Fout< 25 MHz, VDD/2, SS on
FMOD
Modulation frequency
DL
Crystal drive level
–R
Negative resistance
200
ps
400
ps
1% of 1/Fout
s
30
33
kHz
Measured at 25.1 MHz, with crystal ESR = 20Ω,
cap setting = hex16, DL = program code [1,0]
–
540
μW
Measured at 25.1 MHz, cap setting = hex 3F
–
–200
Ω
Min
Max
Unit
Timing Parameters
Parameter[2]
Description
TSSON1
Time from steady state spread to steady state nonspread
--
600
μs
TSSON2
Time from steady state non spread to steady state spread
--
100
μs
TSSON3
Minimum SSON# pulse width (positive or negative)
250
–
μs
TMOD
Spread spectrum modulation period
30
33.33
μs
TSTP,SYNC
Time from falling edge on PD# to stopped outputs, synchronous mode, T = 1/Fout
--
1.5T + 350
ns
TSTP,ASYNC
Time from falling edge on PD# to stopped outputs, asynchronous mode
--
350
ns
TPU,SYNC
Time from rising edge on PD# to outputs at valid frequency, synchronous mode
--
3
ms
TPU,ASYNC
Time from rising edge on PD# to outputs at valid frequency, asynchronous mode
--
3
ms
TPXZ,SYNC
Time from falling edge on OE to high impedance outputs, synchronous mode,
T = 1/Fout
--
1.5T+350
ns
TPXZ,ASYNC
Time from falling edge on OE to high impedance outputs, asynchronous mode
--
350
ns
TPZX,SYNC
Time from rising edge on OE to running outputs, synchronous mode, T=1/Fout
--
1.5T + 350
ns
TPZX,ASYNC
Time from rising edge on OE to running outputs, asynchronous mode
--
350
ns
TLOCK
PLL lock time (from 0.9 VDD to valid output clock frequency)
--
10
ms
Note
2. In Cypress standard TSSOP packages with external crystal.
Document #: 38-07363 Rev. *I
Page 6 of 11
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CY5057
Switching Waveforms
Figure 3. Duty Cycle Timing (dc)
t1A
t1B
t 1A
Duty = -------- × [ 100% ]
t 1B
OUTPUT
Figure 4. Output Rise/Fall Time
VDD
OUTPUT
0V
tr
tf
Figure 5. Power Down Timing (Synchronous and Asynchronous Modes)
VDD
POWER DOWN (PD#)
VIH
VIL
High Impedance Weakly
Pulled Low
CLKOUT
(synchronous)
TSTP
CLKOUT
(asynchronous)
TPU
High Impedance
Weakly Pulled Low
TPU
TSTP
Figure 6. Output Enable Timing (Synchronous and Asynchronous Modes)
VDD
VIH
OUTPUT ENABLE (OE)
VIL
High Impedance Weakly
Pulled Low
CLKOUT
(synchronous)
TPXZ
CLKOUT
(asynchronous)
TPZX
High Impedance
Weakly Pulled Low
TPZX
TPXZ
Document #: 38-07363 Rev. *I
Page 7 of 11
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CY5057
Figure 7. Power Up Timing
VDD
0.9VDD
Power Up
0V
TPSRT
TLOCK
CLKOUT
Valid CLKOUT
Figure 8. Spread Spectrum On and OFF Timing
SSON#
T SSON3
+100%
Internal
Modulation
W aveform
T SSON1
T SSON2
0%
-100%
Ordering Information
Ordering Code
CY5057-11WAF-IL
Status
Active
Type
Inkless wafer (background to 11 mils)
Operating Range
–40 °C to 100 °C
Ordering Code Definitions
CY5057 -11WAF -IL
Inkless
Wafer background to 11 mils
Base part number
Document #: 38-07363 Rev. *I
Page 8 of 11
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CY5057
Acronyms
Acronym
Description
CLKOUT
Clock output
CMOS
Complementary metal oxide semiconductor
DPM
Die pick map
EMI
Electromagnetic interference
EPROM
Erasable programmable read only memory
FAE
Field Application Engineer
FTP
File transfer protocol
OE
Output enable
PAL
Phase alternate line
PD
Power down
PLL
Phase locked loop
PPM
Parts per million
TSSOP
Thin shrunk small outline package
TTL
Transistor transistor logic
Document Conventions
Units of Measure
Symbol
Unit of Measure
°C
degrees Celsius
mA
milli Amperes
mm
milli meters
ms
milli seconds
ns
nano seconds
ps
pico seconds
ppm
parts per million
Ω
ohms
kΩ
kilo ohms
MHz
Mega Hertz
MΩ
Mega Ohms
µA
micro Amperes
µF
micro Farads
µm
micro meters
pF
pico Farads
pp
peak-to-peak
V
Volts
%
percent
Document #: 38-07363 Rev. *I
Page 9 of 11
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CY5057
Document History Page
Document Title: CY5057 High-Frequency Flash Programmable PLL Die with Spread Spectrum
Document Number: 38-07363
Revision
ECN
Orig. of
Change
Submission
Date
Description of Change
**
112486
CKN
See ECN
New data sheet
*A
121373
CKN
See ECN
Added scribe lines to die pad description
Added wafer thickness to die pad description
Added X and Y coordinates to die pad description
Removed list of discrete frequencies and discrete spread percentages
Removed references to discrete frequencies and profile tables
Replaced with description of software for full programmability
Operating frequency changed to 5 MHz–170 MHz
Removed C0 and C1 from crystal oscillator tuning circuit; renumbered other
capacitors
Changed maximum junction temperature to 125°C
Changed PDOE internal pull up value to 1–6 Mohm when VIN = VSS
Changed IILPDOE to 10 μA
Changed Rf spec to 100 kohm, at condition XIN = 0
Change DL spec to 540 μW, at condition cap setting = hex16, DL=10
Added power up timing diagram separate from power down timing diagram
Removed die information table
*B
127414
RGL
See ECN
Added –11 and other details to ordering Information
Added tPU details to operating conditions
Changed max TSSON1 value to 600 in timing parameters table
Changed parameter TPU under timing parameters to TLOCK with the description
“PLL lock time”
Altered minimum and maximum values in power up timing figure
*C
2143928
FGA/PYRS
See ECN
Modified power down timing diagram
Changed power up timing from min. of 50 μs to 5 μs
Added output sink/source current specification in the absolute max ratings
Change cap array from 10 to 8-bit
Add MSB and LSB in the crystal oscillator tuning cap values table
Fixed power up timing diagram
Added -R cap setting value FF
Added Inkless die information before Absolute Maximum Ratings
Added new part number (CY5057-11WAF-IL) with note
*D
2541797
AESA
07/24/08
Updated template. Added Note “Not recommended for new designs.”
Added part number CY5057K-11WAF-IL in ordering information table.
*E
2600816
KVM/AESA
11/04/08
Updated to match data sheet labeled “Rev *C November 16, 2004” (added logo
and die number to die drawing; added pull up & pull down resistors to features
table; revised –R spec and conditions; added missing labels to waveform
drawings)
Removed CY5057K-11WAF-IL from ordering information table.
Updated die dimensions (page 2) with 29 mil thickness; corrected scribe
variables
*F
2621902
KVM/AESA
*G
2897373
CXQ
*H
3068367
CXQ
10/21/2010 Removed CY5057-11WAF part from Ordering Information.
Added Ordering Code Definitions.
*I
3201346
CXQ
03/21/2011 Sunset review. No material changes to document. Fixed various typos.
Included Acronyms and units tables.
Updated template and styles.
Document #: 38-07363 Rev. *I
12/15/2008 Corrected typos on p. 1 (spread amount) & p. 5 (VIL & VIH test conditions).
Connected text frames.
03/22/10
Removed part number CY5057-29WAF-IL from Ordering information table.
Updated copyright section.
Page 10 of 11
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CY5057
Sales, Solutions, and Legal Information
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closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2002-2011. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 38-07363 Rev. *I
Revised March 21, 2011
Page 11 of 11
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