CGY888C 34 dB, 870 MHz GaAs push-pull forward amplifier Rev. 03 — 14 October 2009 Product data sheet 1. Product profile 1.1 General description Hybrid amplifier module in a SOT115J package, operating at a supply voltage of 24 V Direct Current (DC), employing Hetero junction Field Effect Transistor (HFET) GaAs MMIC. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features n n n n n n n n n n High gain Excellent linearity Superior levels of ESD protection Extremely low noise Excellent return loss properties Gain compensation over temperature Rugged construction Unconditionally stable Thermally optimized design Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) n Integrated ring wave surge protection 1.3 Applications n CATV systems operating in the 40 MHz to 870 MHz frequency range CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 1.4 Quick reference data Table 1. Quick reference data Bandwidth to 870 MHz; VB = 24 V (DC); Tmb = 35 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Gp power gain f = 45 MHz - 34 - dB Itot total current f = 870 MHz [1] [1] 34.5 - 36.5 dB 260 280 300 mA Direct Current (DC). 2. Pinning information Table 2. Pinning Pin Description 1 input 2, 3 common 5 +VB 7, 8 common 9 output Simplified outline Graphic symbol 5 1 3 5 7 9 1 9 2 3 7 8 sym095 3. Ordering information Table 3. Ordering information Type number CGY888C Package Name Description Version - rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 × 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VB supply voltage Vi(RF) RF input voltage VESD electrostatic discharge voltage Human Body Model (HBM); According JEDEC standard 22-A114E single tone Biased; According IEC61000-4-2 Unit - 30 V - 70 dBmV - 2000 V - 2000 V Tstg storage temperature −40 +100 °C Tmb mounting base temperature −20 +100 °C CGY888C_3 Product data sheet Min Max © NXP B.V. 2009. All rights reserved. Rev. 03 — 14 October 2009 2 of 7 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 5. Characteristics Table 5. Characteristics Bandwidth to 870 MHz; VB = 24 V (DC); Tmb = 35 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit f = 45 MHz - 34 - dB Gp power gain 34.5 - 36.5 dB SLsl slope straight line f = 45 MHz to 870 MHz [1] - 1.5 - dB FL flatness of frequency response f = 45 MHz to 870 MHz [2] - 0.25 - dB 112 NTSC channels [3] - - −65 dBc 98 PAL channels [4] - −68 - dBc 112 NTSC channels [3] - - −63 dBc 98 PAL channels [4] - −66 - dBc 112 NTSC channels [3] - −72 - dB f = 870 MHz CTB CSO composite triple beat composite second-order distortion Xmod cross modulation RLin input return loss RLout NF output return loss noise figure f = 45 MHz to 320 MHz 20 - - dB f = 320 MHz to 870 MHz 18 - - dB f = 45 MHz to 320 MHz 20 - - dB f = 320 MHz to 870 MHz 17 - - dB f = 50 MHz - 3.5 4.0 dB f = 870 MHz - 4.0 5.0 dB 260 280 300 mA [5] total current Itot [1] Gp at 870 MHz minus Gp at 45 MHz. [2] Flatness straight line (peak to valley). [3] f = 55.25 MHz to 745.25 MHz; Vo = 44 dBmV, flat output level. [4] f = 49.75 MHz to 847.25 MHz; Vo = 44 dBmV, flat output level. [5] Direct Current (DC). CGY888C_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 14 October 2009 3 of 7 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 6. Package outline Rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J D E Z p A2 1 2 3 5 7 8 9 A L F S W c e b w M e1 d U2 q2 Q B y M B q1 x M B y M B p U1 q 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A2 A max. max. mm 20.8 9.1 OUTLINE VERSION b c d D E max. max. max. e e1 F L min. p 4.15 0.51 0.25 27.2 2.54 13.75 2.54 5.08 12.7 8.8 3.85 0.38 Q max. q JEDEC JEITA S U1 U2 W w x EUROPEAN PROJECTION y Z max. 0.1 3.8 ISSUE DATE 99-02-06 04-02-04 SOT115J Fig 1. q2 2.4 38.1 25.4 10.2 4.2 44.75 8.2 6-32 0.25 0.7 44.25 7.8 UNC REFERENCES IEC q1 Package outline SOT115J CGY888C_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 14 October 2009 4 of 7 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 7. Abbreviations Table 6. Abbreviations Acronym Description CATV Community Antenna TeleVision GaAs Gallium-Arsenide MMIC Monolithic Microwave Integrated Circuit NTSC National Television Standard Committee PAL Phase Alternating Line RF Radio Frequency UNC UNified Coarse 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes CGY888C_3 20091014 Product data sheet - CGY888C_2 Modifications: • • • Section 1.2 on page 1: some features were added. Table 5 on page 3: Xmod characteristic was added. Table 5 on page 3: Max values for NF were added. CGY888C_2 20090921 Product data sheet - CGY888C_1 CGY888C_1 20080619 Product data sheet - - CGY888C_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 14 October 2009 5 of 7 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 9.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] CGY888C_3 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 03 — 14 October 2009 6 of 7 CGY888C NXP Semiconductors 34 dB, 870 MHz GaAs push-pull forward amplifier 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 2 2 2 2 3 4 5 5 6 6 6 6 6 6 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 14 October 2009 Document identifier: CGY888C_3